CN109054717A - A kind of synthesis technology of PESD function water-based polyurethane adhesive - Google Patents
A kind of synthesis technology of PESD function water-based polyurethane adhesive Download PDFInfo
- Publication number
- CN109054717A CN109054717A CN201810749947.0A CN201810749947A CN109054717A CN 109054717 A CN109054717 A CN 109054717A CN 201810749947 A CN201810749947 A CN 201810749947A CN 109054717 A CN109054717 A CN 109054717A
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- CN
- China
- Prior art keywords
- polyurethane adhesive
- electronic component
- pesd
- based polyurethane
- synthesis technology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
- C08G73/026—Wholly aromatic polyamines
- C08G73/0266—Polyanilines or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Abstract
The present invention provides a kind of synthesis technology of PESD function water-based polyurethane adhesive, reactivity synthesis PESD binder, in-situ polymerization synthesis of electroactive PANi prepares acrylate adhesive, as electronic component ESD function convered structure in the circuit board, it is contacted with the input and output pin of electronic component, it is in parallel with electronic component internal circuit on circuit, ESD function polyurethane adhesive is in high resistant state of insulation, when electronic component overvoltage condition, the conducting of ESD function polyurethane adhesive seepage flow, protection electronic component can effectively save wiring board area, reduce manufacturing cost, promote device circuit reliability.
Description
Technical field
The invention belongs to electronic material and adhesive to synthesize field, be related to a kind of PESD function water-based polyurethane adhesive
Synthesis technology.
Background technique
Static discharge (ESD) problem is the important harm that each electronic product faces, and polymer matrix ESD element (PESD) is anti-
Protection element is more and more widely used due to its low capacitor feature, and PESD protective element is in parallel with by protection component, this
It is in high resistant state of value, component is worked normally without influence, when generating transient high voltages, ESD protection element becomes rapidly
For low-resistance conducting, protective effect is realized.Electronic component just develops towards multi-functional, miniaturization, flexibility direction, dedicated antistatic
Element needs to tie up the valuable area on wiring board, and in addition the factors such as the welding of discrete component, route design also will increase entirety
The manufacturing cost of device.
Summary of the invention
For prior art defect, the purpose of the present invention is to provide a kind of conjunctions of PESD function water-based polyurethane adhesive
At technique, which comprises the steps of:
(1) aniline monomer and p-methyl benzenesulfonic acid are added in isopropanol, ultrasonic agitation dissolution；
(2) in aqueous polyurethane emulsion be added persulfate oxidation agent, stirring and mixing clarification, be slowly added to first part it is different
It in propanol solution, is persistently stirred in adition process, obtains mixing mother liquor；
(3) successively room temperature~50 DEG C stand reaction 12~24 hours in mixing mother liquor, and curing agent and defoaming agent, stirring is added
Thickening obtains PESD function aqueous adhesive.
It is 0.05~0.3molL that institute's aniline monomer mixes the concentration equivalent in mother liquor before the reaction-1；P-methyl benzenesulfonic acid concentration
It is 0.8~1.2 times of aniline monomer.
It is characterized in that, the persulfate includes one of ammonium persulfate, potassium peroxydisulfate, sodium peroxydisulfate or its group
It closes, mixes 0.05~0.3molL of concentration in mother liquor-1。
The curing agent is amine curing agent, including one in ethylenediamine, m-phenylene diamine (MPD), p-phenylenediamine, m-xylene diamine
Kind, defoaming agent includes one of mineral oil antifoam agent and Siloxane-Oxyalkylene Copolymers defoaming agent.
Insulation bonding of the PESD function water-based polyurethane adhesive of preparation for electronic component in the circuit board, with electronics
The input and output pin of element has a contact, in parallel with electronic component internal circuit on circuit, and ESD function polyurethane adhesive is in high resistant
State of insulation, when electronic component overvoltage condition, electronic component is protected in the conducting of ESD function polyurethane adhesive seepage flow.
The present invention is reactivity synthesis PESD binder, and in-situ polymerization synthesis of electroactive PANi prepares acrylate gluing
Agent can effectively save wiring board area as electronic component ESD function convered structure in the circuit board, reduce manufacturing cost,
Promote device circuit reliability.
The contents of the present invention and feature have revealed that as above, however the present invention that describes of front only briefly or pertains only to this
The specific part of invention, feature of the invention may be more than what content disclosed herein was related to.Therefore, protection model of the invention
The revealed content of embodiment should be not limited to by enclosing, and should include the combination of all the elements embodied in different piece, with
And it is various without departing substantially from replacement and modification of the invention, and covered by claims of the present invention.
Specific embodiment
Embodiment 1:
(1) by 0.025molL-1Aniline monomer and 0.025molL-1P-methyl benzenesulfonic acid is added in 100mL isopropanol, ultrasound
Stirring and dissolving；
(2) 0.025molL is added in 100mL aqueous polyurethane emulsion-1Ammonium persulfate, stirring and mixing clarification, slowly adds
Enter in first part of aqueous isopropanol, persistently stirred in adition process, obtains mixing mother liquor；
(3) successively 50 DEG C of standings are reacted 24 hours in mixing mother liquor, and ethylenediamine and mineral oil antifoam agent, stirring thickening is added
Obtain PESD function aqueous adhesive, adhesive tensile strength: 29Mpa, ESD performance reach IEC6100-4-2.
Embodiment 2:
(1) by 0.15molL-1Aniline monomer and 0.15molL-1P-methyl benzenesulfonic acid is added in 100mL isopropanol, and ultrasound is stirred
Mix dissolution；
(2) 0.15molL is added in 100mL aqueous polyurethane emulsion-1Potassium peroxydisulfate, stirring and mixing clarification, is slowly added to
It in first part of aqueous isopropanol, is persistently stirred in adition process, obtains mixing mother liquor；
(3) it mixes and is successively stored at room temperature reaction 24 hours in mother liquor, m-phenylene diamine (MPD) is added and Siloxane-Oxyalkylene Copolymers disappear
Infusion, stirring thickening obtain PESD function aqueous adhesive, and adhesive tensile strength: 27Mpa, ESD performance reach IEC6100-
4-2。
Embodiment 3:
(1) by 0.1molL-1Aniline monomer and 0.08molL-1P-methyl benzenesulfonic acid is added in 100mL isopropanol, ultrasonic agitation
Dissolution；
(2) 0.1molL is added in 100mL aqueous polyurethane emulsion-1Ammonium persulfate, stirring and mixing clarification, is slowly added to
It in first part of aqueous isopropanol, is persistently stirred in adition process, obtains mixing mother liquor；
(3) it mixes and is successively stored at room temperature reaction 24 hours in mother liquor, p-phenylenediamine is added and Siloxane-Oxyalkylene Copolymers disappear
Infusion, stirring thickening obtain PESD function aqueous adhesive, and adhesive tensile strength: 33Mpa, ESD performance reach IEC6100-
4-2。
Embodiment 4:
(1) by 0.1molL-1Aniline monomer and 0.12molL-1P-methyl benzenesulfonic acid is added in 100mL isopropanol, ultrasonic agitation
Dissolution；
(2) 0.1molL is added in 100mL aqueous polyurethane emulsion-1Sodium peroxydisulfate, stirring and mixing clarification, is slowly added to
It in first part of aqueous isopropanol, is persistently stirred in adition process, obtains mixing mother liquor；
(3) successively 50 DEG C of standings are reacted 12 hours in mixing mother liquor, and m-xylene diamine and mineral oil antifoam agent, stirring is added
Thickening obtains PESD function aqueous adhesive, and adhesive tensile strength: 33Mpa, ESD performance reach IEC6100-4-2.
Claims (5)
1. a kind of synthesis technology of PESD function water-based polyurethane adhesive, which comprises the steps of:
(1) aniline monomer and p-methyl benzenesulfonic acid are added in isopropanol, ultrasonic agitation dissolution；
(2) persulfate oxidation agent is added in aqueous polyurethane emulsion, stirring and mixing clarification is slowly added to first part of isopropanol
It in solution, is persistently stirred in adition process, obtains mixing mother liquor；
(3) successively room temperature~50 DEG C stand reaction 12~24 hours in mixing mother liquor, and curing agent and defoaming agent is added, and stirring is thickened
Obtain PESD function aqueous adhesive.
2. a kind of synthesis technology of PESD function water-based polyurethane adhesive according to claim 1, which is characterized in that institute's benzene
It is 0.05~0.3molL that amine monomers mix the concentration equivalent in mother liquor before the reaction-1；P-methyl benzenesulfonic acid concentration is aniline monomer
0.8~1.2 times.
3. a kind of synthesis technology of PESD function water-based polyurethane adhesive according to claim 1, which is characterized in that described
Persulfate includes one of ammonium persulfate, potassium peroxydisulfate, sodium peroxydisulfate or combinations thereof, mix concentration in mother liquor 0.05~
0.3molL-1。
4. a kind of synthesis technology of PESD function water-based polyurethane adhesive according to claim 1, which is characterized in that described
Curing agent is one of amine curing agent, including ethylenediamine, m-phenylene diamine (MPD), p-phenylenediamine, m-xylene diamine, and defoaming agent includes
One of mineral oil antifoam agent and Siloxane-Oxyalkylene Copolymers defoaming agent.
5. a kind of synthesis technology of the PESD function water-based polyurethane adhesive as described in Claims 1 to 4 any one is made
Standby PESD function water-based polyurethane adhesive, it is defeated with electronic component for the insulation bonding of electronic component in the circuit board
Entering output pin has a contact, in parallel with electronic component internal circuit on circuit, and ESD function polyurethane adhesive insulate shape in high resistant
State, when electronic component overvoltage condition, electronic component is protected in the conducting of ESD function polyurethane adhesive seepage flow.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810749947.0A CN109054717A (en) | 2018-07-02 | 2018-07-02 | A kind of synthesis technology of PESD function water-based polyurethane adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810749947.0A CN109054717A (en) | 2018-07-02 | 2018-07-02 | A kind of synthesis technology of PESD function water-based polyurethane adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109054717A true CN109054717A (en) | 2018-12-21 |
Family
ID=64819375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810749947.0A Withdrawn CN109054717A (en) | 2018-07-02 | 2018-07-02 | A kind of synthesis technology of PESD function water-based polyurethane adhesive |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1127267A (en) * | 1995-08-29 | 1996-07-24 | 北京燕山石油化工公司研究院 | Preparing method for thermoplastic conductive composite material |
| CN1632021A (en) * | 2004-11-25 | 2005-06-29 | 西安交通大学 | Method for preparing conductive polyaniline electromagnetic interference screening paint |
| CN1786304A (en) * | 2005-12-05 | 2006-06-14 | 西安交通大学 | Preparation method of conductive polymer polyanilinc nano fiber |
| CN101496113A (en) * | 2006-07-29 | 2009-07-29 | 肖克科技有限公司 | Voltage switchable dielectric material having high aspect ratio particles |
-
2018
- 2018-07-02 CN CN201810749947.0A patent/CN109054717A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1127267A (en) * | 1995-08-29 | 1996-07-24 | 北京燕山石油化工公司研究院 | Preparing method for thermoplastic conductive composite material |
| CN1632021A (en) * | 2004-11-25 | 2005-06-29 | 西安交通大学 | Method for preparing conductive polyaniline electromagnetic interference screening paint |
| CN1786304A (en) * | 2005-12-05 | 2006-06-14 | 西安交通大学 | Preparation method of conductive polymer polyanilinc nano fiber |
| CN101496113A (en) * | 2006-07-29 | 2009-07-29 | 肖克科技有限公司 | Voltage switchable dielectric material having high aspect ratio particles |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181221 |
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| WW01 | Invention patent application withdrawn after publication |