CN106009529A - Modified epoxy resin for heat-resistant and easy-to-impregnate circuit board - Google Patents
Modified epoxy resin for heat-resistant and easy-to-impregnate circuit board Download PDFInfo
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- CN106009529A CN106009529A CN201610463528.1A CN201610463528A CN106009529A CN 106009529 A CN106009529 A CN 106009529A CN 201610463528 A CN201610463528 A CN 201610463528A CN 106009529 A CN106009529 A CN 106009529A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses modified epoxy resin for a heat-resistant and easy-to-impregnate circuit board. The modified epoxy resin is prepared from raw materials in parts by weight as follows: 12-25 parts of bisphenol AD epoxy resin, 5-15 parts of bisphenol S epoxy resin, 5-15 parts of resorcinol epoxy resin, 20-30 parts of diglycidyl biphenol ether, 15-30 parts of a modified soybean adhesive, 5-12 parts of a 4,4'-methylenebis(phenyl isocyanate) derivative, 0.2-0.6 parts of phthalic anhydride, 0.5-1.2 parts of 1-cyanoethyl substituted imidazole, 0.4-1 part of polybutadiene modified maleic anhydride, 0.4-1.2 parts of methylhexahydrophthalic anhydride, 1-2 parts of tertiary amine, 5-15 parts of polyimide, 5-15 parts of aramid fibers, 10-30 parts of polytetrafluoroethylene, 10-20 parts of calcium silicate, 5-15 parts of beryllium oxide, 5-12 parts of boron nitride, 10-20 parts of crystal silicon micro-powder, 5-10 parts of brominated styrene, 5-15 parts of antimony trioxide and 30-50 parts of ethylene glycol glycidyl ether. The modified epoxy resin is low in viscosity, easy to impregnate, good in mechanical property and excellent in heat resistance.
Description
Technical field
The present invention relates to composition epoxy resin technical field, particularly relate to a kind of heat-resisting easy impregnation wiring board and use
Modified epoxy.
Background technology
Along with electric the whole world fast development, electronic and electrical equipment garbage and electric in have
The harm of poisonous substance confrontation environment is increasingly severe, and in the face of the pressure of protection environment, wiring board material is processed
Journey needs in the face of more harsh reliability test, and along with the development of electronic information technology, electronic devices and components are short
Little frivolous trend requires that the circuit of printed wiring board is finer, wiring density is higher, and the thing followed is then wanted
Board substrate is asked to have more excellent mechanical property and heat resistance.
Summary of the invention
The technical problem existed based on background technology, the present invention proposes a kind of heat-resisting easy impregnation wiring board with changing
Property epoxy resin, viscosity is low, is easily impregnated with, and mechanical property is good, Good Heat-resistance.
The heat-resisting easy impregnation wiring board modified epoxy of one that the present invention proposes, its raw material wraps by weight
Include: bisphenol-A D-ring epoxy resins 12-25 part, bisphenol-s epoxy resin 5-15 part, resorcinol epoxy
Resin 5-15 part, '-biphenyl diphenol diglycidyl ether 20-30 part, modified soybean adhesive 15-30 part, 4,4'-
Methylene two (phenyl isocyanate) derivant 5-12 part, phthalic anhydride 0.2-0.6 part, 1-cyanoethyl
Substituted imidazole 0.5-1.2 part, polybutadiene-modified maleic anhydride 0.4-1 part, methylhexahydrophthaacid acid
Acid anhydride 0.4-1.2 part, tertiary amine 1-2 part, polyimides 5-15 part, aramid fiber 5-15 part, politef 10-30
Part, calcium silicates 10-20 part, beryllium oxide 5-15 part, boron nitride 5-12 part, silicon metal micropowder 10-20 part,
Brominated styrene 5-10 part, antimony trioxide 5-15 part, diglycidyl ether of ethylene glycol 30-50 part.
Preferably, modified soybean adhesive uses following technique to prepare: by weight by cloudy for 0.5-1.5 part from
Sub-emulsifying agent, 0.5-1.5 part initiator potassium persulfate, 40-80 part deionized water mix homogeneously, add 5-15
Part soybean protein, 1.5-2.5 part modified with reduction agent sodium sulfite, stirred under nitrogen atmosphere, add ammonia regulation
System pH continues stirring to 9-9.6, adds 0.5-1.5 part styrene, 1-2 part butyl acrylate room temperature
Stir, heat up and continue stirring, be cooled to room temperature, obtain modified soybean adhesive.
Preferably, bisphenol-A D-ring epoxy resins, bisphenol-s epoxy resin, resorcinol type epoxy, connection
The weight ratio of resorcinol diglycidyl ether is 15-22:8-12:10-13:22-25.
Preferably, phthalic anhydride, 1-cyanoethyl substituted imidazole, polybutadiene-modified maleic anhydride, first
Base hexahydrophthalic anhydride, the weight ratio of tertiary amine are 0.3-0.5:0.8-1:0.5-0.7:0.6-1:
1.2-1.5。
Preferably, polyimides, aramid fiber, politef, calcium silicates, beryllium oxide, boron nitride, crystallization
The weight ratio of silicon powder is 6-10:8-12:20-25:14-17:11-13:6-10:15-17.
Preferably, modified soybean adhesive, the weight ratio of diglycidyl ether of ethylene glycol are 22-25:40-45.
Preferably, brominated styrene, the weight ratio of antimony trioxide are 6-10:11-13.
Preferably, described heat-resisting easy impregnation wiring board modified epoxy, its raw material includes by weight:
Bisphenol-A D-ring epoxy resins 15-22 part, bisphenol-s epoxy resin 8-12 part, resorcinol type epoxy
10-13 part, '-biphenyl diphenol diglycidyl ether 22-25 part, modified soybean adhesive 22-25 part, 4,4'-
Methylene two (phenyl isocyanate) derivant 6-10 part, phthalic anhydride 0.3-0.5 part, 1-cyanoethyl
Substituted imidazole 0.8-1 part, polybutadiene-modified maleic anhydride 0.5-0.7 part, methylhexahydrophthaacid acid
Acid anhydride 0.6-1 part, tertiary amine 1.2-1.5 part, polyimides 6-10 part, aramid fiber 8-12 part, politef
20-25 part, calcium silicates 14-17 part, beryllium oxide 11-13 part, boron nitride 6-10 part, silicon metal micropowder 15-17
Part, brominated styrene 6-10 part, antimony trioxide 11-13 part, diglycidyl ether of ethylene glycol 40-45 part.
Viscosity of the present invention impregnation low, easy, reactive good, the circuit board good reliability manufactured with it, processing
Property and Good Heat-resistance, bisphenol-A D-ring epoxy resins, bisphenol-s epoxy resin, resorcinol asphalt mixtures modified by epoxy resin
Fat, '-biphenyl diphenol diglycidyl ether coordinate the compatibility fabulous, with tertiary amine as accelerator, and through adjacent benzene two
Formic anhydride, 1-cyanoethyl substituted imidazole, polybutadiene-modified maleic anhydride, methylhexahydrophthalic anhydride
After collaborative solidification, glass transition temperature is high, and thermostability is fabulous, and after solidification, crosslink density is moderate, is ensureing firmly
On the premise of degree meets demand, good toughness, excellent in mechanical performance, goods have the thermostability of excellence and resistance to leaching
Weldering property, with diglycidyl ether of ethylene glycol, modified soybean adhesive mating reaction, not only viscosity is low, and mixing
Uniformity is good, and effect of impregnation is good, can be effectively improved system toughness, and polyimides, aramid fiber, polytetrafluoroethyl-ne
Alkene, calcium silicates, beryllium oxide, boron nitride, the dispersion wherein of silicon metal micropowder are the most excellent with effect of impregnation
Different, can effectively reduce the thermal coefficient of expansion of system, improve the through hole reliability of system, thermostability of the present invention,
Humidity resistance is good, good-toughness, and working (machining) efficiency is high；In modified soybean adhesive, due to soybean protein viscosity
Higher, through sodium sulfite treatment, disulfide bonds, strand produces a large amount of active group, with benzene second
Alkene, butyl acrylate anion emulsifier, potassium peroxydisulfate effect under, there is polyreaction and with raw
Becoming partially grafted polymer, goods are ensureing to bond under moderate premise, with bisphenol-A D-ring epoxy resins, bis-phenol
S type epoxy resin, resorcinol type epoxy, '-biphenyl diphenol diglycidyl ether mixing uniformity are fabulous, tough
Property further enhances, and is easily impregnated with, and heat stability is fabulous, low cost, and environmental pollution is little.
Detailed description of the invention
Below, by specific embodiment, technical scheme is described in detail.
Embodiment 1
A kind of heat-resisting easy impregnation wiring board modified epoxy, its raw material includes by weight: bisphenol-A D type
Epoxy resin 12 parts, bisphenol-s epoxy resin 15 parts, resorcinol type epoxy 5 parts, '-biphenyl diphenol
Diglycidyl ether 30 parts, modified soybean adhesive 15 parts, 4,4'-methylene two (phenyl isocyanate) spread out
Biological 12 parts, phthalic anhydride 0.2 part, 1-cyanoethyl substituted imidazole 1.2 parts, polybutadiene-modified horse
Come 0.4 part of anhydride, methylhexahydrophthalic anhydride 1.2 parts, tertiary amine 1 part, polyimides 15 parts, virtue
5 parts of synthetic fibre, politef 30 parts, calcium silicates 10 parts, beryllium oxide 15 parts, boron nitride 5 parts, silicon metal
Micropowder 20 parts, brominated styrene 5 parts, antimony trioxide 15 parts, diglycidyl ether of ethylene glycol 30 parts.
Embodiment 2
A kind of heat-resisting easy impregnation wiring board modified epoxy, its raw material includes by weight: bisphenol-A D type
Epoxy resin 25 parts, bisphenol-s epoxy resin 5 parts, resorcinol type epoxy 15 parts, '-biphenyl diphenol
Diglycidyl ether 20 parts, modified soybean adhesive 30 parts, 4,4'-methylene two (phenyl isocyanate) spread out
Biological 5 parts, phthalic anhydride 0.6 part, 1-cyanoethyl substituted imidazole 0.5 part, polybutadiene-modified horse
Come 1 part of anhydride, methylhexahydrophthalic anhydride 0.4 part, tertiary amine 2 parts, polyimides 5 parts, aramid fiber
15 parts, politef 10 parts, calcium silicates 20 parts, beryllium oxide 5 parts, boron nitride 12 parts, silicon metal is micro-
10 parts of powder, brominated styrene 10 parts, antimony trioxide 5 parts, diglycidyl ether of ethylene glycol 50 parts.
Embodiment 3
A kind of heat-resisting easy impregnation wiring board modified epoxy, its raw material includes by weight: bisphenol-A D type
Epoxy resin 15 parts, bisphenol-s epoxy resin 12 parts, resorcinol type epoxy 10 parts, '-biphenyl diphenol
Diglycidyl ether 25 parts, modified soybean adhesive 22 parts, 4,4'-methylene two (phenyl isocyanate) spread out
Biological 10 parts, phthalic anhydride 0.3 part, 1-cyanoethyl substituted imidazole 1 part, polybutadiene-modified Malaysia
0.5 part of anhydride, methylhexahydrophthalic anhydride 1 part, tertiary amine 1.2 parts, polyimides 10 parts, aramid fiber
8 parts, politef 25 parts, calcium silicates 14 parts, beryllium oxide 13 parts, boron nitride 6 parts, silicon metal is micro-
17 parts of powder, brominated styrene 6 parts, antimony trioxide 13 parts, diglycidyl ether of ethylene glycol 40 parts.
Modified soybean adhesive use following technique prepare: by weight by 1.5 parts of anion emulsifiers, 0.5
Part initiator potassium persulfate, 80 parts of deionized water mix homogeneously, add 5 portions of soybean proteins, 2.5 parts of reduction
Modifying agent sodium sulfite, stirred under nitrogen atmosphere 10min, add ammonia regulation system pH value and continue to 9.6
Stirring 20min, adds 1.5 parts of styrene, 1 part of butyl acrylate stirring room temperature stirs, liter high-temperature
Continue stirring 20min to 70 DEG C, be cooled to room temperature, obtain modified soybean adhesive.
Embodiment 4
A kind of heat-resisting easy impregnation wiring board modified epoxy, its raw material includes by weight: bisphenol-A D type
Epoxy resin 22 parts, bisphenol-s epoxy resin 8 parts, resorcinol type epoxy 13 parts, '-biphenyl diphenol
Diglycidyl ether 22 parts, modified soybean adhesive 25 parts, 4,4'-methylene two (phenyl isocyanate) spread out
Biological 6 parts, phthalic anhydride 0.5 part, 1-cyanoethyl substituted imidazole 0.8 part, polybutadiene-modified horse
Carry out 0.7 part of anhydride, methylhexahydrophthalic anhydride 0.6 part, tertiary amine 1.5 parts, polyimides 6 parts,
Aramid fiber 12 parts, politef 20 parts, calcium silicates 17 parts, beryllium oxide 11 parts, boron nitride 10 parts, knot
Crystal silicon micropowder 15 parts, brominated styrene 10 parts, antimony trioxide 11 parts, diglycidyl ether of ethylene glycol 45 parts.
Modified soybean adhesive use following technique prepare: by weight by 0.5 part of anion emulsifier, 1.5
Part initiator potassium persulfate, 40 parts of deionized water mix homogeneously, add 15 portions of soybean proteins, 1.5 parts of reduction
Modifying agent sodium sulfite, stirred under nitrogen atmosphere 20min, add ammonia regulation system pH value and continue to stir to 9
Mix 40min, add 0.5 part of styrene, 2 parts of butyl acrylate stirring room temperatures stir, and rise high-temperature extremely
60 DEG C are continued stirring 40min, are cooled to room temperature, obtain modified soybean adhesive.
Embodiment 5
A kind of heat-resisting easy impregnation wiring board modified epoxy, its raw material includes by weight: bisphenol-A D type
Epoxy resin 18 parts, bisphenol-s epoxy resin 10 parts, resorcinol type epoxy 12 parts, '-biphenyl diphenol
Diglycidyl ether 23 parts, modified soybean adhesive 23 parts, 4,4'-methylene two (phenyl isocyanate) spread out
Biological 8 parts, phthalic anhydride 0.42 part, 1-cyanoethyl substituted imidazole 0.9 part, polybutadiene-modified horse
Carry out 0.6 part of anhydride, methylhexahydrophthalic anhydride 0.8 part, tertiary amine 1.35 parts, polyimides 8 parts,
Aramid fiber 10 parts, politef 23 parts, calcium silicates 16 parts, beryllium oxide 12 parts, boron nitride 9 parts, knot
Crystal silicon micropowder 16 parts, brominated styrene 8 parts, antimony trioxide 12 parts, diglycidyl ether of ethylene glycol 43 parts.
Modified soybean adhesive use following technique prepare: by weight by 1.4 parts of anion emulsifiers, 1.2
Part initiator potassium persulfate, 60 parts of deionized water mix homogeneously, adds 12 portions of soybean proteins, 1.85 parts and also
Former modifying agent sodium sulfite, stirred under nitrogen atmosphere 16min, add ammonia regulation system pH value and continue to 9.4
Continuous stirring 32min, adds 1.2 parts of styrene, 1.5 parts of butyl acrylate stirring room temperatures stir, rising
Temperature continues stirring 32min to 66 DEG C, is cooled to room temperature, obtains modified soybean adhesive.
The above, the only present invention preferably detailed description of the invention, but protection scope of the present invention not office
Being limited to this, any those familiar with the art is in the technical scope that the invention discloses, according to this
The technical scheme of invention and inventive concept thereof in addition equivalent or change, all should contain the protection in the present invention
Within the scope of.
Claims (7)
1. a heat-resisting easy impregnation wiring board modified epoxy, it is characterised in that its raw material is by weight
Including: bisphenol-A D-ring epoxy resins 12-25 part, bisphenol-s epoxy resin 5-15 part, resorcinol ring
Epoxy resins 5-15 part, '-biphenyl diphenol diglycidyl ether 20-30 part, modified soybean adhesive 15-30 part,
4,4'-methylene two (phenyl isocyanate) derivant 5-12 parts, phthalic anhydride 0.2-0.6 part, 1-
Cyanoethyl substituted imidazole 0.5-1.2 part, polybutadiene-modified maleic anhydride 0.4-1 part, methyl hexahydro neighbour's benzene
Dicarboxylic acid anhydride 0.4-1.2 part, tertiary amine 1-2 part, polyimides 5-15 part, aramid fiber 5-15 part, polytetrafluoro
Ethylene 10-30 part, calcium silicates 10-20 part, beryllium oxide 5-15 part, boron nitride 5-12 part, silicon metal is micro-
Powder 10-20 part, brominated styrene 5-10 part, antimony trioxide 5-15 part, diglycidyl ether of ethylene glycol 30-50
Part.
Heat-resisting easy impregnation wiring board modified epoxy the most according to claim 1, it is characterised in that
Bisphenol-A D-ring epoxy resins, bisphenol-s epoxy resin, resorcinol type epoxy, '-biphenyl diphenol two shrink
The weight ratio of glycerin ether is 15-22:8-12:10-13:22-25.
3. according to the heat-resisting easy impregnation wiring board modified epoxy described in any one of claim 1-3, its
It is characterised by, phthalic anhydride, 1-cyanoethyl substituted imidazole, polybutadiene-modified maleic anhydride, methyl
Hexahydrophthalic anhydride, the weight ratio of tertiary amine are 0.3-0.5:0.8-1:0.5-0.7:0.6-1:1.2-1.5.
4. according to the heat-resisting easy impregnation wiring board modified epoxy described in any one of claim 1-3, its
It is characterised by, polyimides, aramid fiber, politef, calcium silicates, beryllium oxide, boron nitride, silicon metal
The weight ratio of micropowder is 6-10:8-12:20-25:14-17:11-13:6-10:15-17.
5. according to the heat-resisting easy impregnation wiring board modified epoxy described in any one of claim 1-4, its
Being characterised by, modified soybean adhesive, the weight ratio of diglycidyl ether of ethylene glycol are 22-25:40-45.
6. according to the heat-resisting easy impregnation wiring board modified epoxy described in any one of claim 1-5, its
Being characterised by, brominated styrene, the weight ratio of antimony trioxide are 6-10:11-13.
7. according to the heat-resisting easy impregnation wiring board modified epoxy described in any one of claim 1-6, its
Being characterised by, its raw material includes by weight: bisphenol-A D-ring epoxy resins 15-22 part, bisphenol S type epoxy
Resin 8-12 part, resorcinol type epoxy 10-13 part, '-biphenyl diphenol diglycidyl ether 22-25 part,
Modified soybean adhesive 22-25 part, 4,4'-methylene two (phenyl isocyanate) derivant 6-10 parts are adjacent
Phthalate anhydride 0.3-0.5 part, 1-cyanoethyl substituted imidazole 0.8-1 part, polybutadiene-modified maleic anhydride
0.5-0.7 part, methylhexahydrophthalic anhydride 0.6-1 part, tertiary amine 1.2-1.5 part, polyimides 6-10
Part, aramid fiber 8-12 part, politef 20-25 part, calcium silicates 14-17 part, beryllium oxide 11-13 part,
Boron nitride 6-10 part, silicon metal micropowder 15-17 part, brominated styrene 6-10 part, antimony trioxide 11-13
Part, diglycidyl ether of ethylene glycol 40-45 part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610463528.1A CN106009529A (en) | 2016-06-23 | 2016-06-23 | Modified epoxy resin for heat-resistant and easy-to-impregnate circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610463528.1A CN106009529A (en) | 2016-06-23 | 2016-06-23 | Modified epoxy resin for heat-resistant and easy-to-impregnate circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106009529A true CN106009529A (en) | 2016-10-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610463528.1A Pending CN106009529A (en) | 2016-06-23 | 2016-06-23 | Modified epoxy resin for heat-resistant and easy-to-impregnate circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108219379A (en) * | 2018-02-06 | 2018-06-29 | 合肥东恒锐电子科技有限公司 | A kind of integrated circuit plate modified epoxy and preparation method thereof |
| CN114479347A (en) * | 2020-10-27 | 2022-05-13 | 合肥杰事杰新材料股份有限公司 | Modified epoxy resin composition and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1788053A (en) * | 2003-04-17 | 2006-06-14 | 互应化学工业株式会社 | Flame-retarded epoxy resin composition, prepregs containing the same, laminated sheets and printed wiring boards |
| CN101910238A (en) * | 2008-01-08 | 2010-12-08 | 陶氏环球技术公司 | Be used for the high Tg epoxy systems that matrix material is used |
| CN101928444A (en) * | 2010-08-20 | 2010-12-29 | 广东生益科技股份有限公司 | Halogen-free thermosetting resin composition, prepreg and metal clad foil laminated plate manufactured by using same |
| CN104610909A (en) * | 2015-02-26 | 2015-05-13 | 许丽萍 | Aldehyde-free vegetable protein-based wood adhesive as well as preparation and application methods thereof |
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2016
- 2016-06-23 CN CN201610463528.1A patent/CN106009529A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1788053A (en) * | 2003-04-17 | 2006-06-14 | 互应化学工业株式会社 | Flame-retarded epoxy resin composition, prepregs containing the same, laminated sheets and printed wiring boards |
| CN101910238A (en) * | 2008-01-08 | 2010-12-08 | 陶氏环球技术公司 | Be used for the high Tg epoxy systems that matrix material is used |
| CN101928444A (en) * | 2010-08-20 | 2010-12-29 | 广东生益科技股份有限公司 | Halogen-free thermosetting resin composition, prepreg and metal clad foil laminated plate manufactured by using same |
| CN104610909A (en) * | 2015-02-26 | 2015-05-13 | 许丽萍 | Aldehyde-free vegetable protein-based wood adhesive as well as preparation and application methods thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108219379A (en) * | 2018-02-06 | 2018-06-29 | 合肥东恒锐电子科技有限公司 | A kind of integrated circuit plate modified epoxy and preparation method thereof |
| CN114479347A (en) * | 2020-10-27 | 2022-05-13 | 合肥杰事杰新材料股份有限公司 | Modified epoxy resin composition and preparation method thereof |
| CN114479347B (en) * | 2020-10-27 | 2023-12-12 | 合肥杰事杰新材料股份有限公司 | Modified epoxy resin composition and preparation method thereof |
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Application publication date: 20161012 |