CN109054699A - A kind of synthesis technology of PESD function water-base cement - Google Patents
A kind of synthesis technology of PESD function water-base cement Download PDFInfo
- Publication number
- CN109054699A CN109054699A CN201810755218.6A CN201810755218A CN109054699A CN 109054699 A CN109054699 A CN 109054699A CN 201810755218 A CN201810755218 A CN 201810755218A CN 109054699 A CN109054699 A CN 109054699A
- Authority
- CN
- China
- Prior art keywords
- base cement
- electronic component
- parts
- water
- function water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Abstract
The present invention provides a kind of synthesis technology of PESD function water-base cement; reactivity synthesis PESD binder; in-situ polymerization synthesis ZnO, which is supported on electroactive PANi, prepares aqueous adhesive; the convered structure that insulate in the circuit board as electronic component is contacted with the input and output pin of electronic component; it is in parallel with electronic component internal circuit on circuit; ESD function water-base cement is in high resistant state of insulation; when electronic component overvoltage condition; the conducting of ESD function water-base cement seepage flow; electronic component is protected, device circuit reliability can be promoted.
Description
Technical field
The invention belongs to electronic materials and adhesive to synthesize field, be related to a kind of synthesis technology of PESD function water-base cement.
Background technique
Static discharge (ESD) problem is the important harm that each electronic product faces, ESD protection element with protected first device
Part is in parallel, itself is in high resistant state of value, works normally component without influence, when generating transient high voltages, ESD protection member
Part rapidly goes to low-resistance conducting, realizes protective effect.The protection of electronic component transient high voltages, the scheme generallyd use have pressure-sensitive
Resistance (MOV), Transient Suppression Diode (TVS) and macromolecule ESD protective element (PESD).By the medium of ESD defencive function
It insulate in the circuit board convered structure as electronic component, can effectively save wiring board area, reduce manufacturing cost, can be promoted
Device circuit reliability.
Summary of the invention
For prior art defect, the purpose of the present invention is to provide a kind of synthesis technology of PESD function water-base cement,
It is characterized in that, includes the following steps:
(1) aniline monomer, p-methyl benzenesulfonic acid and zinc salt are added in deionized water；
(2) acrylic emulsion, ingredient and mass ratio are prepared are as follows:
100 parts of deionized water
40-50 parts of butyl acrylate
10-15 parts of methacrylic acid
5-8 parts of acrylic acid
10-20 parts of potassium peroxydisulfate
0.5-1 parts of lauryl sodium sulfate
(3) colloidal sol for obtaining step (1) is added in the acrylic emulsion of step (2), and reaction 2-5 hours is stirred at room temperature,
Curing agent is added, stirring thickening obtains water-base cement.
The additional amount of aniline monomer is 0.1~0.5molL of concentration in step (3) mixed emulsion-1, p-methyl benzenesulfonic acid plus
Entering amount is in step (3) 0.05~0.2molL of mixed emulsion concentration-1。
The zinc salt includes one of zinc chloride, zinc nitrate, zinc acetate or combinations thereof, in step (3) mixed emulsion
0.5~1molL of concentration-1。
The curing agent is one of amine curing agent, including ethylenediamine, m-xylene diamine.
Insulation bonding of the PESD function water-base cement for electronic component in the circuit board, the input and output with electronic component are drawn
Foot has a contact, in parallel with electronic component internal circuit on circuit, and ESD function water-base cement is in high resistant state of insulation, when electronics member
When part overvoltage condition, electronic component is protected in the conducting of ESD function water-base cement seepage flow.
The present invention is reactivity synthesis PESD binder, and in-situ polymerization synthesis ZnO, which is supported on electroactive PANi, prepares water
Property adhesive, insulate convered structure in the circuit board as electronic component, and ESD function can promote device circuit reliability.
The contents of the present invention and feature have revealed that as above, however the present invention that describes of front only briefly or pertains only to this
The specific part of invention, feature of the invention may be more than what content disclosed herein was related to.Therefore, protection model of the invention
The revealed content of embodiment should be not limited to by enclosing, and should include the combination of all the elements embodied in different piece, with
And it is various without departing substantially from replacement and modification of the invention, and covered by claims of the present invention.
Specific embodiment
Embodiment 1:
(1) by 0.1molL-1Aniline monomer, 0.05molL-1P-methyl benzenesulfonic acid and 0.05molL-1Deionization is added in zinc chloride
In water；
(2) acrylic emulsion, ingredient and mass ratio are prepared are as follows:
100 parts of deionized water
40-50 parts of butyl acrylate
10-15 parts of methacrylic acid
5-8 parts of acrylic acid
10-20 parts of potassium peroxydisulfate
0.5-1 parts of lauryl sodium sulfate
(3) colloidal sol for obtaining step (1) is added in the acrylic emulsion of step (2), and reaction 2-5 hours is stirred at room temperature,
Ethylenediamine is added, stirring thickening obtains water-base cement, and water-base cement tensile strength: 20Mpa, ESD performance reach IEC6100-4-2.
Embodiment 2:
(1) by 0.5molL-1Aniline monomer, 0.2molL-1P-methyl benzenesulfonic acid and 0.2molL-1Deionized water is added in zinc nitrate
In；
(2) acrylic emulsion, ingredient and mass ratio are prepared are as follows:
100 parts of deionized water
40-50 parts of butyl acrylate
10-15 parts of methacrylic acid
5-8 parts of acrylic acid
10-20 parts of potassium peroxydisulfate
0.5-1 parts of lauryl sodium sulfate
(3) colloidal sol for obtaining step (1) is added in the acrylic emulsion of step (2), and reaction 2-5 hours is stirred at room temperature,
M-xylene diamine is added, stirring thickening obtains water-base cement, and water-base cement tensile strength: 25Mpa, ESD performance reach IEC6100-4-
2。
Embodiment 3:
(1) by 0.4molL-1Aniline monomer, 0.1molL-1P-methyl benzenesulfonic acid and 0.1molL-1Deionized water is added in zinc acetate
In；
(2) acrylic emulsion, ingredient and mass ratio are prepared are as follows:
100 parts of deionized water
40-50 parts of butyl acrylate
10-15 parts of methacrylic acid
5-8 parts of acrylic acid
10-20 parts of potassium peroxydisulfate
0.5-1 parts of lauryl sodium sulfate
(3) colloidal sol for obtaining step (1) is added in the acrylic emulsion of step (2), and reaction 2-5 hours is stirred at room temperature,
Ethylenediamine is added, stirring thickening obtains water-base cement, and water-base cement tensile strength: 22Mpa, ESD performance reach IEC6100-4-2.
Embodiment 4:
(1) by 0.2molL-1Aniline monomer, 0.1molL-1P-methyl benzenesulfonic acid and 0.15molL-1Deionization is added in zinc chloride
In water；
(2) acrylic emulsion, ingredient and mass ratio are prepared are as follows:
100 parts of deionized water
40-50 parts of butyl acrylate
10-15 parts of methacrylic acid
5-8 parts of acrylic acid
10-20 parts of potassium peroxydisulfate
0.5-1 parts of lauryl sodium sulfate
(3) colloidal sol for obtaining step (1) is added in the acrylic emulsion of step (2), and reaction 2-5 hours is stirred at room temperature,
M-xylene diamine is added, stirring thickening obtains water-base cement, and water-base cement tensile strength: 19Mpa, ESD performance reach IEC6100-4-
2。
Claims (5)
1. a kind of synthesis technology of PESD function water-base cement, which comprises the steps of:
(1) aniline monomer, p-methyl benzenesulfonic acid and zinc salt are added in deionized water；
(2) acrylic emulsion, ingredient and mass ratio are prepared are as follows:
100 parts of deionized water
40-50 parts of butyl acrylate
10-15 parts of methacrylic acid
5-8 parts of acrylic acid
10-20 parts of potassium peroxydisulfate
0.5-1 parts of lauryl sodium sulfate
(3) colloidal sol for obtaining step (1) is added in the acrylic emulsion of step (2), and reaction 2-5 hours is stirred at room temperature, and is added
Curing agent, stirring thickening obtain water-base cement.
2. a kind of synthesis technology of PESD function water-base cement according to claim 1, which is characterized in that the addition of aniline monomer
Amount is 0.1~0.5molL of concentration in step (3) mixed emulsion-1, the additional amount of p-methyl benzenesulfonic acid is to mix cream in step (3)
0.05~0.2molL of liquid concentration-1。
3. a kind of synthesis technology of PESD function water-base cement according to claim 1, which is characterized in that the zinc salt includes chlorine
Change one of zinc, zinc nitrate, zinc acetate or combinations thereof, 0.5~1molL of concentration in step (3) mixed emulsion-1。
4. a kind of synthesis technology of PESD function water-base cement according to claim 1, which is characterized in that the curing agent is amine
One of class curing agent, including ethylenediamine, m-xylene diamine.
5. PESD function prepared by a kind of synthesis technology of the PESD function water-base cement as described in Claims 1 to 4 any one
Energy water-base cement contacts, electricity for the insulation bonding of electronic component in the circuit board with the input and output pin of electronic component
Road is in parallel with electronic component internal circuit, and ESD function water-base cement is in high resistant state of insulation, when electronic component overvoltage condition,
The conducting of ESD function water-base cement seepage flow, protects electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810755218.6A CN109054699A (en) | 2018-07-05 | 2018-07-05 | A kind of synthesis technology of PESD function water-base cement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810755218.6A CN109054699A (en) | 2018-07-05 | 2018-07-05 | A kind of synthesis technology of PESD function water-base cement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109054699A true CN109054699A (en) | 2018-12-21 |
Family
ID=64815896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810755218.6A Withdrawn CN109054699A (en) | 2018-07-05 | 2018-07-05 | A kind of synthesis technology of PESD function water-base cement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109054699A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1276388A (en) * | 1999-06-04 | 2000-12-13 | 罗姆和哈斯公司 | Process for preparing intrinsic conductive copolymer and copolymer composition thereby |
| CN1328074A (en) * | 2000-06-14 | 2001-12-26 | 北京燕山石油化工公司研究院 | Composite aqueous latex containing electrically conducting polymer and insulating components and its preparing process and application |
| JP2016150977A (en) * | 2015-02-17 | 2016-08-22 | 日東電工株式会社 | Adhesive sheet and optical member |
-
2018
- 2018-07-05 CN CN201810755218.6A patent/CN109054699A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1276388A (en) * | 1999-06-04 | 2000-12-13 | 罗姆和哈斯公司 | Process for preparing intrinsic conductive copolymer and copolymer composition thereby |
| CN1328074A (en) * | 2000-06-14 | 2001-12-26 | 北京燕山石油化工公司研究院 | Composite aqueous latex containing electrically conducting polymer and insulating components and its preparing process and application |
| JP2016150977A (en) * | 2015-02-17 | 2016-08-22 | 日東電工株式会社 | Adhesive sheet and optical member |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| WW01 | Invention patent application withdrawn after publication | ||
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Application publication date: 20181221 |