CN108975920A - A kind of high-temperature heat flux sensor and preparation method thereof based on HTCC - Google Patents
A kind of high-temperature heat flux sensor and preparation method thereof based on HTCC Download PDFInfo
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- CN108975920A CN108975920A CN201810526801.XA CN201810526801A CN108975920A CN 108975920 A CN108975920 A CN 108975920A CN 201810526801 A CN201810526801 A CN 201810526801A CN 108975920 A CN108975920 A CN 108975920A
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
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- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
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- C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
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Abstract
The present invention provides a kind of high-temperature heat flux sensor and preparation method thereof based on HTCC, according to the sensitive mechanism of thermoelectric pile heat flow transducer, multiple filling holes are arranged on aluminium nitride green band to integrate multiple thermocouples, increase the arrangement density of thermocouple, the output potential of thermocouple is increased, while substantially increasing the measurement sensitivity of sensor；According to the difference of the coefficient of heat conduction of heat-resisting material, select aluminium nitride as the substrate of sensor structure and the dielectric material of middle layer, aluminium nitride material, platinum/15% iridium alloy, porpezite these three materials selection so that the response time of sensor greatly promoted；Manufacturing process is easy, and high sensitivity, response block, stability are good, and installation is more convenient, and the detection of the high temperature such as aerospace craft and engine interior, the heat flow in big hot-fluid environment may be implemented.
Description
Technical field
The present invention relates to thermal-flow sensor fields more particularly to a kind of based on the high-temperature heat flux sensor of HTCC and its preparation side
Method.
Background technique
Operational performance requirement of the modern war to aircraft high speed, high-precision, high maneuverability, causes countries in the world and competitively opens
Open up the development work of supersonic aircraft.With increasing substantially for supersonic aircraft flying speed, generated by Aerodynamic Heating
High-temperature heat flux environment become more and more harsher.
It is high that the positions such as aerospace flight vehicle inner cone end, combustion chamber and exhaust outlet will appear the part higher than 1200 DEG C
Warm area and big hot-fluid environment.Under exceedingly odious superhigh temperature, big hot-fluid environmental condition, carry out aerospace flight vehicle surface and
The hot-fluid of its engine combustion chamber interior monitors, for the design of aerospace flight vehicle structure, security performance and component life
There is vital effect.Aerospace flight vehicle and its engine do not only exist in the adverse circumstances of high temperature, big hot-fluid, and
With complex environments such as Gao Xuan, vibration, centrifugal force and compound motions, in terms of pneumatic property, the test equipment of installation is being weighed
The various aspects such as amount, volume have stringent limitation, in the case where not influencing its Primordial Qi dynamic characteristic and loading conditions, to realization aerospace
Real-time, the precise measurement of aircraft surface and aero-engine internal heat flows characterisitic parameter propose huge challenge.
The existing heat flow transducer applied towards high temperature, big hot-fluid extreme environment mainly includes round foil thermal-flow sensor
Device and diaphragm type heat flow transducer.Limitation existing for circular foil heat flux transducer are as follows: sensitivity coefficient is lower, the response time compared with
It is long, be not suitable for detection transient heat flow；And such sensor, under high temperature environment in use, water-cooling pattern need to be used, volume is larger.
And diaphragm type heat flow transducer is due to can only being integrated in certain area relative to three-dimensional structure using two-dimensional plane layout
Less thermocouple, sensitivity are lower, it is difficult to meet the requirement tested under superhigh temperature (1000 DEG C of >) adverse circumstances.
Summary of the invention
A kind of high-temperature heat flux biography based on HTCC is provided it is an object of the invention to avoid the deficiencies in the prior art place
Sensor and preparation method thereof.
The purpose of the present invention can be realized by using following technical measures, design a kind of high warm based on HTCC
The preparation method of flow sensor, comprising: provide first to fourth aluminium nitride green band, and in addition to the first aluminium nitride green band
Punching is formed accordingly in the filling hole of array setting on other aluminium nitride green bands；Close to right on the second aluminium nitride green band
Thermocouple line is arranged in the bore edges in two filling holes of Angle Position, using the first aluminium nitride green band as substrate and second
Aluminium nitride green band carries out lamination and obtains the first aluminium nitride green band lamination, and fills out in the filling hole of the second aluminium nitride green band
Fill porpezite slurry；Third layer aluminium nitride green band is affixed on the first aluminium nitride green band lamination progress lamination and obtains the second aluminium nitride
Green band lamination, in each filling hole of third aluminium nitride green band, parallel along hole wall and unconnected porpezite of filling respectively,
Platinum/15% iridium alloy slurry, the two are contacted with the porpezite in the second aluminium nitride green band filling hole；By the 4th layer of aluminium nitride green
Band is affixed on the second aluminium nitride green band lamination and carries out lamination, and porpezite slurry is filled in each filling hole of the 4th aluminium nitride green band
Material；Wherein, the filling metal in each filling hole of the 4th aluminium nitride green band with third layer aluminium nitride green band is two neighboring fills out
Two kinds of metals contact in hole is filled, the aluminium nitride tile containing array thermopile structure is obtained；Array thermopile structure will be contained
Aluminium nitride tile carry out pressurized layer, cutting and high temperature sintering, obtain high-temperature heat flux sensor.
Wherein, the step of metal paste is filled in the filling hole to second, third and the 4th layer of aluminium nitride green band it
Afterwards, further include high temperature drying, and be placed under microscope work platform the step of observation and amendment for carrying out structure.
Wherein, the temperature of high temperature drying is 100 DEG C, time 10min.
Wherein, after the step of being laminated to the aluminium nitride green band containing array thermopile structure, comprising steps of
Aluminium nitride tile after the completion of lamination to be wrapped up using pellosil, setting laminating machine temperature is 70 DEG C, and static pressure size is 21MPa,
The aluminium nitride tile containing array thermopile structure after package is placed in laminating machine and carries out equal static pressure lamination, lamination times are
20min。
It wherein, is to each independent battle array after being cut from aluminium nitride ceramic on piece in the step of carrying out high temperature sintering
Column thermoelectric pile sensing arrangement, which is placed in the high temperature furnace of hydrogen shield, carries out high temperature co-firing.
Wherein, the filling hole on aluminium nitride green band is square hole.
Wherein, in the step of providing the rectangular aluminium nitride green band of four kinds of different-thickness, comprising steps of by aluminum nitride powder
End, water, dispersing agent are mixed according to certain proportion, with the pH value of ammonia water conditioning system for 9.0, and carry out the ball milling of first time,
Time is 24 hours；Binder is added and plasticiser carries out second of ball milling mixing, defrother is added and carries out froth in vacuum, is made
Blank；The edge height and curtain coating speed for adjusting casting machine, are dried blank and demoulding processing obtains four kinds of different-thickness
Cast sheet, and cast sheet is sliced.
It wherein, is using screen printing technique, in the second aluminium nitride green band pair in the step of thermocouple line is set
The filling bore edges of Angle Position form thermocouple line, and the metal being arranged in thermocouple line and filling hole using platinum brush system
Connection.
The purpose of the present invention can be realized by using following technical measures, design a kind of high warm based on HTCC
Flow sensor, high-temperature heat flux sensor are made by the preparation method of high-temperature heat flux sensor described in preceding solution.
Wherein, the thickness of the first, second, third and fourth aluminium nitride green band is respectively 100 μm, 20 μm, 100 μm and 20
μm。
It is different from the prior art, the preparation method of the high-temperature heat flux sensor of the invention based on HTCC is according to thermoelectric pile heat
Multiple filling holes are arranged on aluminium nitride green band and integrate multiple thermocouples, increase for the sensitive mechanism of flow sensor
The arrangement density of thermocouple, increases the output potential of thermocouple, while substantially increasing the measurement sensitivity of sensor；According to
The difference of the coefficient of heat conduction of heat-resisting material selects aluminium nitride as the substrate of sensor structure and the medium material of middle layer
Material, aluminium nitride material, platinum/15% iridium alloy, porpezite these three materials selection so that the response time of sensor obtain greatly
It is promoted；Manufacturing process is easy, and high sensitivity, response block, stability are good, install it is more convenient, may be implemented aerospace craft and
The detection of the high temperature such as engine interior, heat flow in big hot-fluid environment.
Detailed description of the invention
Fig. 1 is a kind of process flow signal of the preparation method of high-temperature heat flux sensor based on HTCC provided by the invention
Figure；
Fig. 2 is a kind of flow diagram of the preparation method of high-temperature heat flux sensor based on HTCC provided by the invention；
Fig. 3 is the overall structure and the 4th aluminium nitride green band of a kind of high-temperature heat flux sensor based on HTCC provided by the invention
Front plan view；
Fig. 4 is the structural schematic diagram of the Section A-A in Fig. 3 provided by the invention；
Fig. 5 is a kind of side of each of high-temperature heat flux sensor based on HTCC provided by the invention thermocouple cellular construction
Depending on structure chart；
Fig. 6 is that the vertical view of the third aluminium nitride green band in a kind of high-temperature heat flux sensor based on HTCC provided by the invention is shown
It is intended to；
Fig. 7 is that the vertical view of the second aluminium nitride green band in a kind of high-temperature heat flux sensor based on HTCC provided by the invention is shown
It is intended to.
Specific embodiment
Further more detailed description is made to technical solution of the present invention With reference to embodiment.Obviously, it is retouched
The embodiment stated is only a part of the embodiments of the present invention, instead of all the embodiments.Based on the embodiments of the present invention,
Those of ordinary skill in the art's every other embodiment obtained without creative labor, all should belong to
The scope of protection of the invention.
- Fig. 2 refering to fig. 1, Fig. 1 are a kind of preparation methods of high-temperature heat flux sensor based on HTCC provided by the invention
Process flow diagram；Fig. 2 is a kind of process of the preparation method of high-temperature heat flux sensor based on HTCC provided by the invention
Schematic diagram.The step of this method includes:
S110: first to fourth aluminium nitride green band is provided, and in other aluminium nitride greens in addition to the first aluminium nitride green band
Punching is taken to be formed accordingly in the filling hole of array setting.
The rectangular aluminium nitride green band of four kinds of different-thickness is provided, finished product specifically can be directly used, or prepares aluminium nitride life
Porcelain band.Specific preparation method is: aluminium nitride powder, water, dispersing agent being mixed according to certain proportion, with ammonia water conditioning system
PH value is 9.0, and carries out the ball milling of first time, and the time is 24 hours；Binder is added and plasticiser carries out second of ball milling and mixes
It closes, defrother is added and carries out froth in vacuum, blank is made；The edge height and curtain coating speed for adjusting casting machine, carry out blank
The processing of dry and demoulding obtains the cast sheet of four kinds of different-thickness, and cast sheet is sliced.
By slice, the aluminium nitride green band of four kinds of different-thickness is obtained, in present invention one of which embodiment, four kinds
The thickness of aluminium nitride green band is respectively 100 μm, 20 μm, 100 μm and 20 μm.In second, third and the 4th aluminium nitride green band
Upper punching forms filling hole, in the present invention, is set to the filling Kong Juncheng array setting of aluminium nitride green band, and fill hole
Section is preferably rectangular, and each aluminium nitride green band is set as 9 cun of side length of square.
S120: the bore edges setting thermoelectricity in two filling holes on the second aluminium nitride green band close to diagonal position is coupled
The first aluminium nitride green band is carried out lamination as substrate and the second aluminium nitride green band and obtains the first aluminium nitride green by line
Band lamination, and porpezite slurry is filled in the filling hole of the second aluminium nitride green band.
It sets the first aluminium nitride green band that thickness in monolayer is 100 μm to the substrate of high-temperature heat flux sensor, takes a list
Layer is placed in screen process press with a thickness of 20 μm of the second aluminium nitride green band, is starched using platinum at the place of the second aluminium nitride green band
In two filling bore edges brush metal lead wire structures of diagonal position, thermocouple line is formed, after screen process press taking-up
It is placed in 100 DEG C of environment and keeps the temperature 10min, be then aligned by the filling hole on the second aluminium nitride green band, by
Nitride aluminium green band carries out lamination with the first aluminium nitride green band as substrate, later filling out in the second aluminium nitride green band
It fills in hole and carries out the filling of porpezite slurry, obtain thermoelectric pile bottom after the completion of filling, be placed in 100 DEG C of environment and keep the temperature 10min,
Take out the observation and amendment for being placed under microscope work platform and carrying out structure.Wherein, thermocouple line and close filling Kong Lishe
The porpezite filler connection set.
S130: third layer aluminium nitride green band is affixed on the first aluminium nitride green band lamination progress lamination and obtains the second nitridation
Aluminium green band lamination, it is parallel along hole wall and unconnected fill palladium respectively in each filling hole of third aluminium nitride green band
Gold, platinum/15% iridium alloy slurry, the two are contacted with the porpezite in the second aluminium nitride green band filling hole.
Taking thickness in monolayer is 100 μm of third aluminium nitride green band, lamination is carried out, specifically, with the second aluminium nitride green
Band side carries out lamination.After the completion of lamination, porpezite slurry and platinum/15% iridium alloy slurry are taken, in filling out for third aluminium nitride green band
It fills in hole and is filled.Since the filling hole being set on third aluminium nitride green band is square, in filling process, slurry edge is filled out
The opposite surface setting of hole inner wall is filled, so that the two kinds of different slurries filled in same filling hole is mutually not in contact with each other, third aluminium nitride
The filling hole on filling the second aluminium nitride of hole face green band on green band, so that in third aluminium nitride green band filling hole
Two kinds of slurries are contacted with the porpezite filled in filling corresponding on the second aluminium nitride green band hole respectively.After the completion of filling, it is placed in 100
DEG C environment in keep the temperature 10min, take out the observation and amendment for being placed under microscope work platform and carrying out structure.
S140: the 4th layer of aluminium nitride green band is affixed on the second aluminium nitride green band lamination and carries out lamination, in the 4th nitridation
Porpezite slurry is filled in each filling hole of aluminium green band；Wherein, the filling gold in each filling hole of the 4th aluminium nitride green band
Belong to and being contacted with two kinds of metals in the two neighboring filling hole of third layer aluminium nitride green band, is obtained containing array thermopile structure
Aluminium nitride tile.
Taking thickness in monolayer is 20 μm of the 4th aluminium nitride green band, carries out lamination, tool with structure obtained in previous step
The surface of body and third aluminium nitride green band carries out lamination.When lamination, it is set on third aluminium nitride green band by comparison
The relative position in filling hole and the filling hole being set on the 4th aluminium nitride green band, determines the position of overlapping.In this embodiment party
In formula, by adjusting the position of the 4th aluminium nitride green band, making can be simultaneously in the filling hole being arranged on the 4th aluminium nitride green band
See the porpezite slurry and platinum/15% iridium alloy slurry curing being arranged in the filling hole of two adjacent third aluminium nitride green bands
The metal structure formed afterwards.It should be noted that in the present embodiment, being set on second, third and the 4th aluminium nitride green band
The filling hole set is identical.In other embodiments, the shape in the filling hole on each aluminium nitride green band and area can appoint
Meaning setting, but need to guarantee that third aluminium nitride green band is filled in the filling hole of the two kinds of metals and the second aluminium nitride green band in hole
Metal contact, and the 4th aluminium nitride green band filling hole in metal and third aluminium nitride green band on two neighboring filling hole
In two kinds of metals contact.It after the completion of filling, is placed in 100 DEG C of environment and keeps the temperature 10min, taking-up is placed under microscope work platform
Carry out the observation and amendment of structure.
S150: the aluminium nitride tile containing array thermopile structure is subjected to pressurized layer, cutting and high temperature sintering, obtains high temperature
Heat flow transducer.
After the completion of each layer aluminium nitride green band lamination, thermoelectric pile is obtained.Thermoelectric pile is laminated, benefit after the completion of lamination
It is wrapped up with coating, the temperature that laminating machine is arranged is 70 DEG C, and static pressure size is 21MPa, the tile after coating is wrapped up
It is placed in laminating machine and carries out the equal static pressure of 20min and be laminated.After the completion of lamination, by the tile comprising multiple array thermopile structures from
It is taken out in laminating machine, is placed in laser-beam drilling machine and is cut, be partitioned into high-temperature heat flux sensor unit.When specific cutting, need
Guarantee a filling hole in each sensor comprising second, third and the 4th aluminium nitride green band, makes high-temperature heat flux sensor
Inside has metal structure as shown in Figure 4.The sensor structure prepared is placed in the high temperature furnace of hydrogen shield and is carried out
High temperature co-firing finally prepares multiple high-temperature heat flux sensor structures.
The production process of high-temperature heat flux sensor of the present invention based on HTCC is as shown in Figure 1, passing through step
After aluminium nitride green band is made in aluminium nitride green band preparation method in S110, it is sliced, in embodiments of the present invention,
100 μm and 20 μm of aluminium nitride green band of preparation, it is 9 cun that when slice, which is cut into side length,.On aluminium nitride green band after slice
Multiple groups array hole is arranged in punching.As shown in Figure 1, four group pattern holes are arranged on aluminium nitride green band.It is carried out according to abovementioned steps
Lead preparation, lamination and metal filling, lamination obtain aluminium nitride lamination after the completion, carry out pressurized layer, cutting and high temperature sintering, obtain
High-temperature heat flux sensor.
The present invention according to the sensitive mechanism of thermoelectric pile heat flow transducer, using HTCC microwave assembly technology by multiple thermocouples into
Row is integrated, increases the arrangement density of thermocouple, increases the output potential of thermocouple, while substantially increasing the survey of sensor
Try sensitivity；
According to the difference of the coefficient of heat conduction of heat-resisting material in the present invention, select aluminium nitride as the substrate of sensor structure and
The dielectric material of middle layer, the two kinds of metal materials selection porpezite and platinum/15% iridium alloy of thermocouple, are by two kinds of metal materials
Seebeck coefficient determine that the selection of aluminium nitride material, platinum/15% iridium alloy, porpezite these three materials is so that high-temperature heat flux passes
The response time of sensor is greatly promoted, and may ultimately reach 500 microseconds or less；
Two kinds of metal materials of the thermopile structure selected in the present invention are porpezite and platinum/15% iridium alloy, the middle layer of thermoelectric pile
Dielectric material is aluminium nitride, and the fuse metal material of high-temperature heat flux sensor is platinum, and stable operating temperature is all at 1500 DEG C
More than, ensure that the maximum operating temperature for the high-temperature heat flux sensor prepared is greater than 1200 DEG C；
Rationally, manufacturing process is easy, and high sensitivity, stability are good, and installation is more convenient for sensor structure design of the present invention,
The detection of the high temperature such as aerospace craft and engine interior, the heat flow in big hot-fluid environment may be implemented.
It is a kind of structural representation in the section of high-temperature heat flux sensor based on HTCC provided by the invention refering to Fig. 4, Fig. 4
Figure.The high-temperature heat flux sensor is prepared by the preparation method of the high-temperature heat flux sensor of preceding solution.Specifically
Including the first aluminium nitride green band 1 as substrate；As thermoelectric pile bottom the second aluminium nitride green band 2 and be set to second
Thermocouple line 9,10 on aluminium nitride green band, the thermoelectric pile underlying metal being set in the second aluminium nitride green band filling hole
Material 8, as shown in fig. 6, being the schematic top plan view of the second aluminium nitride green band 2；Third aluminium nitride as thermoelectric pile middle layer is raw
Porcelain band 3 and the thermoelectric pile middle layer metal A material 6 and metal B material 7 being set in filling hole, as shown in fig. 7, being nitrogenized for third
The schematic top plan view of aluminium green band 3；As thermoelectric pile top layer the 4th aluminium nitride green band and be set to filling hole in thermoelectricity
Heap top-level metallic material 5, as shown in Figure 1, being the schematic top plan view of the 4th aluminium nitride green band 4.
Wherein, thermoelectric pile top-level metallic material 5 and thermoelectric pile underlying metal material 8 are that porpezite slurry curing obtains, heat
Pile middle layer metal A material 6 and metal B material 7 are that porpezite and platinum/15% iridium alloy slurry curing obtain, thermocouple line 9,10
To be formed using screen printing technique using platinum brush system.The opposite of hole is filled by adjusting the structure and different layers for filling hole
Position makes third aluminium nitride green band 3 fill the metal in the filling hole of two kinds of metals in hole and the second aluminium nitride green band 2
Contact, and on the metal and third aluminium nitride green band 3 in the 4th aluminium nitride green band 4 filling hole in two neighboring filling hole
Two kinds of metal contacts, to form the thermoelectric pile of cellular construction section such as Fig. 5.
It is different from the prior art, the preparation method of the high-temperature heat flux sensor of the invention based on HTCC is according to thermoelectric pile heat
Multiple filling holes are arranged on aluminium nitride green band and integrate multiple thermocouples, increase for the sensitive mechanism of flow sensor
The arrangement density of thermocouple, increases the output potential of thermocouple, while substantially increasing the measurement sensitivity of sensor；According to
The difference of the coefficient of heat conduction of heat-resisting material selects aluminium nitride as the substrate of sensor structure and the medium material of middle layer
Material, aluminium nitride material, platinum/15% iridium alloy, porpezite these three materials selection so that the response time of sensor obtain greatly
It is promoted；Manufacturing process is easy, and high sensitivity, response block, stability are good, install it is more convenient, may be implemented aerospace craft and
The detection of the high temperature such as engine interior, heat flow in big hot-fluid environment.
The above is only embodiments of the present invention, are not intended to limit the scope of the invention, all to utilize the present invention
Equivalent structure or equivalent flow shift made by specification and accompanying drawing content is applied directly or indirectly in other relevant technologies
Field is included within the scope of the present invention.
Claims (10)
1. a kind of preparation method of the high-temperature heat flux sensor based on HTCC characterized by comprising
First to fourth aluminium nitride green band is provided, and is beaten on other aluminium nitride green bands in addition to the first aluminium nitride green band
Hole forms the corresponding filling hole in array setting；
Thermocouple line is arranged in the bore edges in two filling holes on the second aluminium nitride green band close to diagonal position, will be described
First aluminium nitride green band carries out lamination as substrate and the second aluminium nitride green band and obtains the first aluminium nitride green band lamination, and
Porpezite slurry is filled in the filling hole of the second aluminium nitride green band；
Third layer aluminium nitride green band is affixed on the first aluminium nitride green band lamination progress lamination and obtains the second aluminium nitride green band
Lamination, in each filling hole of third aluminium nitride green band, parallel along hole wall and unconnected filling porpezite, platinum/15% respectively
Iridium alloy slurry, the two are contacted with the porpezite in the second aluminium nitride green band filling hole；
4th layer of aluminium nitride green band is affixed on the second aluminium nitride green band lamination and carries out lamination, in the 4th aluminium nitride green band
Porpezite slurry is filled in each filling hole；Wherein, the filling metal and third layer in each filling hole of the 4th aluminium nitride green band
Two kinds of metals contact in the two neighboring filling hole of aluminium nitride green band, obtains the aluminium nitride ceramic containing array thermopile structure
Piece；
Aluminium nitride tile containing array thermopile structure is subjected to pressurized layer, cutting and high temperature sintering, obtains high-temperature heat flux sensing
Device.
2. the preparation method of the high-temperature heat flux sensor according to claim 1 based on HTCC, which is characterized in that
It two, further include high temperature drying after the step of filling metal paste in the filling hole of third and fourth layer of aluminium nitride green band, and
The step of observation and amendment for carrying out structure, is placed under microscope work platform.
3. the preparation method of the high-temperature heat flux sensor according to claim 2 based on HTCC, which is characterized in that high temperature dries
Dry temperature is 100 DEG C, time 10min.
4. the preparation method of the high-temperature heat flux sensor according to claim 1 based on HTCC, which is characterized in that containing
After having the step of aluminium nitride green band of array thermopile structure is laminated, comprising steps of by the nitridation after the completion of lamination
Aluminium tile is wrapped up using pellosil, and setting laminating machine temperature is 70 DEG C, and static pressure size is 21MPa, will contain array after package
The aluminium nitride tile of thermopile structure, which is placed in laminating machine, carries out equal static pressure lamination, lamination times 20min.
5. the preparation method of the high-temperature heat flux sensor according to claim 1 based on HTCC, which is characterized in that carrying out
It in the step of high temperature sintering, is placed in from each independent array thermoelectric pile sensing arrangement after the cutting of aluminium nitride ceramic on piece
Have and carries out high temperature co-firing in the high temperature furnace of hydrogen shield.
6. the preparation method of the high-temperature heat flux sensor according to claim 1 based on HTCC, which is characterized in that aluminium nitride
Filling hole on green band is square hole.
7. the preparation method of the high-temperature heat flux sensor according to claim 1 based on HTCC, which is characterized in that providing
In the step of rectangular aluminium nitride green band of four kinds of different-thickness, comprising steps of
Aluminium nitride powder, water, dispersing agent are mixed according to certain proportion, with the pH value of ammonia water conditioning system for 9.0, and carried out
The ball milling of first time, time are 24 hours；Binder is added and plasticiser carries out second of ball milling mixing, defrother is added and carries out
Blank is made in froth in vacuum；The edge height and curtain coating speed for adjusting casting machine, are dried blank and demoulding processing obtains
The cast sheet of four kinds of different-thickness, and cast sheet is sliced.
8. the preparation method of the high-temperature heat flux sensor according to claim 1 based on HTCC, which is characterized in that be arranged
It is using screen printing technique, in filling bore edges of the second aluminium nitride green with diagonal position in the step of thermocouple line
Thermocouple line is formed using platinum brush system, and the metal being arranged in thermocouple line and filling hole is connect.
9. a kind of high-temperature heat flux sensor based on HTCC, which is characterized in that high-temperature heat flux sensor is by claim 1-8
The preparation method of the high-temperature heat flux sensor is made.
10. the high-temperature heat flux sensor according to claim 9 based on HTCC, which is characterized in that first, second, third
Thickness with the 4th aluminium nitride green band is respectively 100 μm, 20 μm, 100 μm and 20 μm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810199493 | 2018-03-12 | ||
| CN2018101994934 | 2018-03-12 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110926637A (en) * | 2019-11-07 | 2020-03-27 | 无锡英特派金属制品有限公司 | Preparation method of industrial anti-attenuation platinum and platinum-rhodium thermocouple |
| CN112284572A (en) * | 2020-10-14 | 2021-01-29 | 杭州仰仪科技有限公司 | Thermopile type heat flow sensor for tower structure differential scanning calorimeter |
| CN114112087A (en) * | 2021-11-12 | 2022-03-01 | 中国航空工业集团公司沈阳空气动力研究所 | Array type atomic layer thermopile heat flow sensor |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7189360B1 (en) * | 2002-01-24 | 2007-03-13 | Sandia Corporation | Circular chemiresistors for microchemical sensors |
| US20100150205A1 (en) * | 2008-12-15 | 2010-06-17 | Delphi Technologies, Inc. | Combined sensor |
| CN101769795A (en) * | 2010-01-30 | 2010-07-07 | 中北大学 | Round chaff type large-scale high-temperature heat flux sensor |
| CN103674405A (en) * | 2013-12-13 | 2014-03-26 | 中北大学 | Differential type HTCC wireless passive high-temperature pressure sensor and manufacturing method thereof |
| CN107085015A (en) * | 2017-04-11 | 2017-08-22 | 中北大学 | Wireless and passive gas, temperature biparameter sensor and preparation method thereof |
| CN107101739A (en) * | 2017-06-09 | 2017-08-29 | 北京世纪建通科技股份有限公司 | A kind of high temperature heat-resistant flow sensor and its manufacture method based on K-type thermopile |
| CN107402031A (en) * | 2017-06-19 | 2017-11-28 | 中北大学 | Temperature, pressure biparameter sensor and preparation method based on microwave scattering principle |
| CN107421654A (en) * | 2017-03-27 | 2017-12-01 | 中北大学 | Superhigh temperature passive film temperature sensor and preparation method thereof |
-
2018
- 2018-05-29 CN CN201810526801.XA patent/CN108975920B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7189360B1 (en) * | 2002-01-24 | 2007-03-13 | Sandia Corporation | Circular chemiresistors for microchemical sensors |
| US20100150205A1 (en) * | 2008-12-15 | 2010-06-17 | Delphi Technologies, Inc. | Combined sensor |
| CN101769795A (en) * | 2010-01-30 | 2010-07-07 | 中北大学 | Round chaff type large-scale high-temperature heat flux sensor |
| CN103674405A (en) * | 2013-12-13 | 2014-03-26 | 中北大学 | Differential type HTCC wireless passive high-temperature pressure sensor and manufacturing method thereof |
| CN107421654A (en) * | 2017-03-27 | 2017-12-01 | 中北大学 | Superhigh temperature passive film temperature sensor and preparation method thereof |
| CN107085015A (en) * | 2017-04-11 | 2017-08-22 | 中北大学 | Wireless and passive gas, temperature biparameter sensor and preparation method thereof |
| CN107101739A (en) * | 2017-06-09 | 2017-08-29 | 北京世纪建通科技股份有限公司 | A kind of high temperature heat-resistant flow sensor and its manufacture method based on K-type thermopile |
| CN107402031A (en) * | 2017-06-19 | 2017-11-28 | 中北大学 | Temperature, pressure biparameter sensor and preparation method based on microwave scattering principle |
Non-Patent Citations (2)
| Title |
|---|
| J. KITA ET AL.: ""Ceramic Alumina Substrates for High-temperature Gas Sensors – Implications for Applicability"", 《PROCEDIA ENGINEERING》 * |
| 闫艳 等: ""热流密度测量技术现状和发展概述"", 《节能》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110926637A (en) * | 2019-11-07 | 2020-03-27 | 无锡英特派金属制品有限公司 | Preparation method of industrial anti-attenuation platinum and platinum-rhodium thermocouple |
| CN112284572A (en) * | 2020-10-14 | 2021-01-29 | 杭州仰仪科技有限公司 | Thermopile type heat flow sensor for tower structure differential scanning calorimeter |
| CN114112087A (en) * | 2021-11-12 | 2022-03-01 | 中国航空工业集团公司沈阳空气动力研究所 | Array type atomic layer thermopile heat flow sensor |
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