CN108982109A - Full ceramic device is used for heat flow transducer signal test system under hyperthermal environments - Google Patents
Full ceramic device is used for heat flow transducer signal test system under hyperthermal environments Download PDFInfo
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- CN108982109A CN108982109A CN201810526873.4A CN201810526873A CN108982109A CN 108982109 A CN108982109 A CN 108982109A CN 201810526873 A CN201810526873 A CN 201810526873A CN 108982109 A CN108982109 A CN 108982109A
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- Prior art keywords
- heat flow
- ceramic
- flow transducer
- temperature
- test system
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M15/00—Testing of engines
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K17/00—Measuring quantity of heat
- G01K17/06—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device
Abstract
The invention discloses a kind of full ceramic devices for heat flow transducer signal test system under hyperthermal environments, comprising: temperature hot-fluid inductive component, signal lead, alumina ceramic tube, insulating assembly, encapsulating housing and ceramic substrate circuit；Wherein, temperature hot-fluid inductive component and ceramic substrate circuit are respectively arranged at the both ends of alumina ceramic tube, the side wall of encapsulating housing coated aluminum oxide ceramic tube, and insulating assembly is arranged between alumina ceramic tube side wall and encapsulating housing；Signal lead is arranged along alumina ceramic tube side wall, connects temperature hot-fluid inductive component and ceramic substrate circuit, temperature and heat flow signal that temperature hot-fluid inductive component senses are transferred to ceramic substrate circuit.The present invention is using complete ceramic integrated design, temp-sensitive sensor is integrated on heat flow transducer surface and uses full ceramic device structure, and lead failure when can effectively solve the problem that heat flow transducer signal detection under superhigh temperature adverse circumstances can not work long hours and the problem of the reliability of high-temperature soldering not can guarantee.
Description
Technical field
The present invention relates to the hot-fluids under hyperthermal environments that is used for of thermal-flow sensor field more particularly to a kind of full ceramic device to pass
Sensor signal test macro.
Background technique
The combustion chamber of aerospace engine and exhaust outlet will appear local superelevation warm area, big hot-fluid higher than 1200 DEG C
Environment.Hot-fluid monitoring to aerospace engine interior, the type selecting of design and material for engine have very heavy
The meaning wanted.Traditional heat flow transducer is under hyperthermal environments adverse circumstances, when using wired mode measuring signal, often
Lead Problem of Failure occurs, while also bringing the problem of high-temperature soldering reliability, sensor can not long-time work at high temperature
Make, therefore application is significantly limited in the high temperature environment.In recent years, with the development of aeronautical and space technology, under hyperthermal environments
Testing requirement it is more and more extensive, can be permanently effective acquisition sensor signal become aerospace Engine Block Test pass
Key.
Summary of the invention
There is provided it is an object of the invention to avoid in place of the deficiencies in the prior art a kind of full ceramic device for superelevation
Heat flow transducer signal test system under warm environment.
The purpose of the present invention can be realized by using following technical measures, design a kind of being used for for full ceramic device
Heat flow transducer signal test system includes: temperature hot-fluid inductive component, signal lead, aluminium oxide ceramics under hyperthermal environments
Pipe, insulating assembly, encapsulating housing and ceramic substrate circuit；Wherein, temperature hot-fluid inductive component and ceramic substrate circuit are set respectively
It is placed in the both ends of alumina ceramic tube, the side wall of encapsulating housing coated aluminum oxide ceramic tube, and alumina ceramic tube side wall and envelope
Insulating assembly is set between dress shell；Signal lead along alumina ceramic tube side wall be arranged, connection temperature hot-fluid inductive component and
Temperature and heat flow signal that temperature hot-fluid inductive component senses are transferred to ceramic substrate circuit by ceramic substrate circuit.
Wherein, temperature hot-fluid component includes the substrate of center setting lead via hole, and is symmetrically disposed on substrate two sides
Temperature thermal flow sensor.
Wherein, temperature thermal flow sensor is to print hot water radiation wire and platinum filament obtained on substrate using platinum/1% rhodium slurry,
The two serpentine-like setting in thermoelectricity resistance layer；Hot water radiation wire and platinum filament are connected to signal lead by lead via hole.
Wherein, insulating assembly is mullite thermal insulation material.
Wherein, sealing-in is carried out by high temperature glue and fixed pad between encapsulating housing and alumina ceramic tube to fix, encapsulate
It is fixedly connected between shell and temperature hot-fluid inductive component by screw.
Wherein, signal lead is set to alumina ceramic tube side wall by way of silk-screen printing.
Wherein, ceramic substrate circuit includes that the sensor signal sequentially connected receives circuit, differential amplifier circuit, high pass filter
Wave circuit and data acquisition circuit, sensor signal receive circuit and connect temperature hot-fluid inductive component by signal lead.
Wherein, one cooling fin is set in the position of alumina ceramic tube and ceramic substrate circuit connection, to obstruct high temperature
Heat source and ceramic substrate circuit.
Wherein, the plane of heat sink is identical as the area of encapsulating housing inner section and shape.
Wherein, encapsulating housing includes encapsulation tube body and encapsulation cover plate, encapsulation cover plate are heat sink, encapsulates tube body and cap
Board group closes the encapsulation completed to alumina ceramic tube.
It is different from the prior art, full ceramic device of the invention is used for heat flow transducer signal testing under hyperthermal environments
System includes: temperature hot-fluid inductive component, signal lead, alumina ceramic tube, insulating assembly, encapsulating housing and ceramic substrate electricity
Road；Wherein, temperature hot-fluid inductive component and ceramic substrate circuit are respectively arranged at the both ends of alumina ceramic tube, encapsulating housing packet
The side wall of alumina ceramic tube is covered, and insulating assembly is set between alumina ceramic tube side wall and encapsulating housing；Signal lead edge
The setting of alumina ceramic tube side wall, connects temperature hot-fluid inductive component and ceramic substrate circuit, by temperature hot-fluid inductive component
The temperature and heat flow signal sensed is transferred to ceramic substrate circuit.The present invention is passed using complete ceramic integrated design in hot-fluid
Sensor surfaces integrate temp-sensitive sensor and use full ceramic device structure, can effectively solve the problem that hot-fluid passes under superhigh temperature adverse circumstances
Lead failure when sensor signal detects can not work long hours and the problem of the reliability of high-temperature soldering not can guarantee.
Detailed description of the invention
Fig. 1 is a kind of full ceramic device provided by the invention for heat flow transducer signal testing system under hyperthermal environments
The structural schematic diagram of system；
Fig. 2 is a kind of full ceramic device provided by the invention for heat flow transducer signal test system temperature under hyperthermal environments
Spend the structural schematic diagram of hot-fluid inductive component；
Fig. 3 is a kind of full ceramic device provided by the invention for heat flow transducer signal test system under hyperthermal environments
The structural schematic diagram of ceramic substrate circuit.
Specific embodiment
Further more detailed description is made to technical solution of the present invention With reference to embodiment.Obviously, it is retouched
The embodiment stated is only a part of the embodiments of the present invention, instead of all the embodiments.Based on the embodiments of the present invention,
Those of ordinary skill in the art's every other embodiment obtained without creative labor, all should belong to
The scope of protection of the invention.
Refering to fig. 1, Fig. 1 is a kind of believing for heat flow transducer under hyperthermal environments for full ceramic device provided by the invention
The structural schematic diagram of number test macro.The heat flow transducer 1 includes temperature hot-fluid inductive component 2, signal lead 3, aluminium oxide pottery
Porcelain tube 5, insulating assembly 6, encapsulating housing and ceramic substrate circuit 8.Wherein, temperature hot-fluid inductive component 2 is disposed in proximity to heat source
Position, to incude heat source temperature.The structure of temperature hot-fluid inductive component 2 is as shown in Fig. 2, include substrate 20, and be set to
The temperature thermal flow sensor 21 of 20 two sides of substrate.It in the present invention, is by printing platinum/1% rhodium respectively in different temperatures gradient
Slurry preparation temperature sensor utilizes platinum/1% rhodium resistance versus temperature sensitivity characteristic, test sensing as superhigh temperature sensitive resistance
The temperature T of device upper and lower surface1、T2, thermal compensation is carried out to heat flow transducer.Specifically, using in type metal resistance, design
For serpentine resistive, a platinum resistance covers ceramic layer, another is exposed on a ceramic substrate, is distinguished using the temperature change of the two
Test the temperature T in hot-fluid gradient1、T2.In Fig. 2,10,14,15 and 16 be platinum filament, 11 and 12 be hot water radiation wire, wherein 11,14,
16 are covered by thermoresistance layer, so that the platinum filament and hot water radiation wire on substrate 20 form different temperature ladders because of the barrier of thermoresistance layer
Degree.13 be lead via hole, and four square shapes of connecting lead wire via hole 13 are wiring point, and platinum filament and hot water radiation wire are connected to wiring
Point, and the side that substrate 20 connects alumina ceramic tube 5 is extended to from lead via hole by wiring point, it is further attached to letter
Number lead 3.
Resistance is connected to signal lead 3 by the lead via hole on substrate 20.Signal lead 3 is by way of silk-screen printing
It is set to the side wall of alumina ceramic tube 5, the side wall along alumina ceramic tube 5 extends from one end of setting hot-fluid inductive component 2
To the other end, it is connected to ceramic substrate circuit 8, temperature and the heat flow signal transmission that temperature hot-fluid inductive component 2 is sensed
To ceramic substrate circuit 8.A cooling fin is arranged in the position that alumina ceramic tube 5 and ceramic substrate circuit 8 connect, to obstruct height
The plane of temperature-heat-source and ceramic substrate circuit 8, heat sink is identical as the area of encapsulating housing inner section and shape.Preferably, it seals
Filling shell includes encapsulation tube body 7 and encapsulation cover plate 9, and encapsulation cover plate 9 is heat sink, encapsulates tube body 7 and the combination of encapsulation cover plate 9 is completed
Encapsulation to alumina ceramic tube 5.
Encapsulating housing, the side wall of encapsulating housing coated aluminum oxide ceramic tube 5 are prepared using alumina powder powder stock, and is aoxidized
Insulating assembly 6 is set between 5 side wall of aluminium ceramic tube and encapsulating housing.In the present invention, insulating assembly 6 uses the heat-insulated material of mullite
Material.Encapsulating housing is cylindrical in shape, and inner section can be arbitrary shape, preferably circular.Inside setting passes through mullite thermal insulation material
The alumina ceramic tube 5 of cladding.Sealing-in is carried out by high temperature glue and fixed pad between encapsulating housing and alumina ceramic tube 5 to consolidate
It is fixed, it is fixedly connected between encapsulating housing and temperature hot-fluid inductive component 2 by screw.
The structure of ceramic substrate circuit 8 is as shown in figure 3, include that the sensor signal sequentially connected receives circuit, differential puts
Big circuit, high-pass filtering circuit and data acquisition circuit, sensor signal receive circuit and connect temperature hot-fluid by signal lead
Inductive component 2 receives temperature hot-fluid inductive component 2 and passes through the hot fluid temperature signal that signal lead 3 transmits, successively transmits after reception
It amplifies and is filtered to differential amplifier circuit and high-pass filtering circuit, be acquired after the completion by data acquisition circuit
It is used so that subsequent analysis monitors.
It is different from the prior art, full ceramic device of the invention is used for heat flow transducer signal testing under hyperthermal environments
System includes: temperature hot-fluid inductive component, signal lead, alumina ceramic tube, insulating assembly, encapsulating housing and ceramic substrate electricity
Road；Wherein, temperature hot-fluid inductive component and ceramic substrate circuit are respectively arranged at the both ends of alumina ceramic tube, encapsulating housing packet
The side wall of alumina ceramic tube is covered, and insulating assembly is set between alumina ceramic tube side wall and encapsulating housing；Signal lead edge
The setting of alumina ceramic tube side wall, connects temperature hot-fluid inductive component and ceramic substrate circuit, by temperature hot-fluid inductive component
The temperature and heat flow signal sensed is transferred to ceramic substrate circuit.The present invention is passed using complete ceramic integrated design in hot-fluid
Sensor surfaces integrate temp-sensitive sensor and use full ceramic device structure, can effectively solve the problem that hot-fluid passes under superhigh temperature adverse circumstances
Lead failure when sensor signal detects can not work long hours and the problem of the reliability of high-temperature soldering not can guarantee.
The above is only embodiments of the present invention, are not intended to limit the scope of the invention, all to utilize the present invention
Equivalent structure or equivalent flow shift made by specification and accompanying drawing content is applied directly or indirectly in other relevant technologies
Field is included within the scope of the present invention.
Claims (10)
1. a kind of full ceramic device is used for heat flow transducer signal test system under hyperthermal environments characterized by comprising
Temperature hot-fluid inductive component, signal lead, alumina ceramic tube, insulating assembly, encapsulating housing and ceramic substrate circuit；Wherein,
The temperature hot-fluid inductive component and the ceramic substrate circuit are respectively arranged at the both ends of the alumina ceramic tube, the envelope
Dress shell coats the side wall of the alumina ceramic tube, and is arranged between the alumina ceramic tube side wall and the encapsulating housing
Insulating assembly；The signal lead is arranged along the alumina ceramic tube side wall, connects the temperature hot-fluid inductive component and pottery
Temperature and heat flow signal that temperature hot-fluid inductive component senses are transferred to ceramic substrate circuit by porcelain substrate circuit.
2. full ceramic device according to claim 1 is used for heat flow transducer signal test system under hyperthermal environments,
It is characterized in that, the temperature hot-fluid component includes the substrate of center setting lead via hole, and it is symmetrically disposed on the substrate
The temperature thermal flow sensor of two sides.
3. full ceramic device according to claim 2 is used for heat flow transducer signal test system under hyperthermal environments,
It is characterized in that, the temperature thermal flow sensor is to print hot water radiation wire and platinum obtained on substrate using platinum/1% rhodium slurry
Silk, the two serpentine-like setting in thermoelectricity resistance layer；The hot water radiation wire and platinum filament are connected to signal lead by lead via hole.
4. full ceramic device according to claim 1 is used for heat flow transducer signal test system under hyperthermal environments,
It is characterized in that, the insulating assembly is mullite thermal insulation material.
5. full ceramic device according to claim 1 is used for heat flow transducer signal test system under hyperthermal environments,
Consolidate it is characterized in that, carrying out sealing-in by high temperature glue and fixed pad between the encapsulating housing and the alumina ceramic tube
It is fixed, it is fixedly connected between the encapsulating housing and the temperature hot-fluid inductive component by screw.
6. full ceramic device according to claim 1 is used for heat flow transducer signal test system under hyperthermal environments,
It is characterized in that, the signal lead is set to the alumina ceramic tube side wall by way of silk-screen printing.
7. full ceramic device according to claim 1 is used for heat flow transducer signal test system under hyperthermal environments,
It is characterized in that, the ceramic substrate circuit includes that the sensor signal sequentially connected receives circuit, differential amplifier circuit, high pass
Filter circuit and data acquisition circuit, the sensor signal receive circuit and connect temperature hot-fluid sense group by signal lead
Part.
8. full ceramic device according to claim 1 is used for heat flow transducer signal test system under hyperthermal environments,
It is characterized in that, a cooling fin is arranged in the position of alumina ceramic tube and ceramic substrate circuit connection, to obstruct high warm
Source and the ceramic substrate circuit.
9. full ceramic device according to claim 8 is used for heat flow transducer signal test system under hyperthermal environments,
It is characterized in that, the plane of the heat sink is identical as the area of the encapsulating housing inner section and shape.
10. full ceramic device according to claim 8 is used for heat flow transducer signal test system under hyperthermal environments,
It is characterized in that, the encapsulating housing includes encapsulation tube body and encapsulation cover plate, the encapsulation cover plate is heat sink, the package tube
Body and encapsulation cover plate combination complete the encapsulation to the alumina ceramic tube.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810228651 | 2018-03-20 | ||
| CN2018102286514 | 2018-03-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108982109A true CN108982109A (en) | 2018-12-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810526873.4A Pending CN108982109A (en) | 2018-03-20 | 2018-05-29 | Full ceramic device is used for heat flow transducer signal test system under hyperthermal environments |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109827674A (en) * | 2019-03-27 | 2019-05-31 | 电子科技大学 | A kind of flexibility temperature sensor of integrated high-accuracy and preparation method thereof |
| CN110265543A (en) * | 2019-06-17 | 2019-09-20 | 中北大学 | Differential capacitance type ceramic high-temperature resistant chip varistor and its high-temp pressure sensor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109827674A (en) * | 2019-03-27 | 2019-05-31 | 电子科技大学 | A kind of flexibility temperature sensor of integrated high-accuracy and preparation method thereof |
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| CN110265543A (en) * | 2019-06-17 | 2019-09-20 | 中北大学 | Differential capacitance type ceramic high-temperature resistant chip varistor and its high-temp pressure sensor |
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