CN108875250A - A kind of ameliorative way, electronic equipment, the storage medium of electroplating mild alloy uniformity - Google Patents
A kind of ameliorative way, electronic equipment, the storage medium of electroplating mild alloy uniformity Download PDFInfo
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- CN108875250A CN108875250A CN201810710232.4A CN201810710232A CN108875250A CN 108875250 A CN108875250 A CN 108875250A CN 201810710232 A CN201810710232 A CN 201810710232A CN 108875250 A CN108875250 A CN 108875250A
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- Prior art keywords
- lead wire
- deleted
- conductive lead
- package substrate
- lead
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
Abstract
The invention discloses a kind of ameliorative ways of electroplating mild alloy uniformity, include the following steps：It modifies to the former conductive lead wire exposure file of IC package substrate, the former conductive lead wire for needing to expose that is set as in part is deleted；Dry film on the conductive lead wire corresponding region of deletion is developed, so that the copper on the deleted conductive lead wire is etched, retains the dry film on not deleted conductive lead wire corresponding region, so that the corresponding copper of the not deleted conductive lead wire is not etched.The present invention is by modification conductive network, so that the nickel thickness at four angles of IC package substrate is obviously optimized, thick very poor 8.3 before improvement μm of nickel drop to 5.2 μm, and uniformity obtains conspicuousness optimization；Whole process does not increase additional process, reduces gold salt cost.
Description
Technical field
The present invention relates to a kind of integrated circuit more particularly to a kind of ameliorative way of electroplating mild alloy uniformity, electronic equipment,
Storage medium.
Background technique
Currently, medium of the package substrate as chip and the interconnection of PCB signal, because its I/O number is more, therefore when being connected with chip
The mode of wire bonding is mostly used to be bonded.The relatively other surface treatment modes of electroplating mild alloy have superior wire
Bonding matching, especially alloy wire and copper wire bonding.Therefore the type products such as CSP, SIP, FMC mostly use electroplating mild alloy to make
For surface treatment mode.Because of the features such as package substrate has size small, and fingerpitch is thin, therefore the nickel of electroplating mild alloy, gold are uniformly
Property unavoidably become restrict finished product yield a big obstacle.Electroplating mild alloy process：Pre-treatment, electronickelling, the thin gold of flash, plating
Gold, wherein electronickelling thickness uniformity is most difficult to control.
But existing electro-plating method has the following defects：
(1) electroplating mild alloy product is small by plating area, and finger joint is away from relatively carefully, and image distribution is intensive, and electronickelling often has obviously
Edge effect, the thickness by plating plate surrounding nickel is blocked up, and optimization of the industry for electroplating mild alloy uniformity, especially electronickelling is uniform
Property optimization, often with conventional baffle adjustment, increase based on the area Pei Du shunted, but product two sides is by plating area ratio difference
Excessive, product nickel thickness uniformity is difficult to meet, although the increase area Pei Du uniformity improvement is more obvious, in subsequent plating
Golden process will increase excessive gold salt consumption, lead to that cost has risen considerably；As the face product A, B area ratio > 5, traditional adjustment
Method is difficult to meet the requirement of 5-15 μm of nickel thickness or other spec.
Summary of the invention
For overcome the deficiencies in the prior art, one of the objects of the present invention is to provide the improvement sides of electroplating mild alloy uniformity
The improvement to nickel thickness uniformity may be implemented in method.
The second object of the present invention is to provide a kind of electronic equipment, and the improvement to nickel thickness uniformity may be implemented.
The third object of the present invention is to provide a kind of storage medium, and the improvement to nickel thickness uniformity may be implemented.
An object of the present invention adopts the following technical scheme that realization：
A kind of ameliorative way of electroplating mild alloy uniformity is applied to IC package substrate, includes the following steps：
Lead amendment step：It modifies to the former conductive lead wire exposure file of IC package substrate, part original is set as
The conductive lead wire for needing to expose is deleted；
Lead reduces step：Dry film on the conductive lead wire corresponding region of deletion is developed, so that this is deleted
Copper on conductive lead wire is etched, and retains the dry film on not deleted conductive lead wire corresponding region, so that the not deleted conduction
The corresponding copper of lead is not etched.
It further, is specially that will account for original to be set as needing " by the former conductive lead wire deletion for being set as needs and exposing in part "
The conductive lead wire of the conductive lead wire total quantity half of exposure is deleted.
Further, in lead amendment step, pass through CAM software former conductive lead wire exposure text corresponding to nickel thickness region
Part is modified.
It further, further include following steps after having executed lead reduction step：
Take off film step：Whole dry films of IC package substrate are taken off and are removed；
Welding resistance step：Green oil is coated to IC package substrate, and carries out exposure development.
The second object of the present invention is implemented with the following technical solutions：
A kind of electronic equipment, the meter run on a memory and on a processor including memory, processor and storage
Calculation machine program, the processor realize following steps when executing the computer program：
Lead amendment step：It modifies to the former conductive lead wire exposure file of IC package substrate, part original is set as
The conductive lead wire for needing to expose is deleted；
Lead reduces step：Dry film on region corresponding to conductive lead wire by deletion develops, so that this is deleted
Conductive lead wire on copper be etched, retain the dry film on not deleted conductive lead wire corresponding region, so that this not deleted is led
The corresponding copper of electrical lead is not etched.
Further, in lead amendment step, " deleting the former conductive lead wire for needing to expose that is set as in part " is specific
It is deleted for the former conductive lead wire for being set as needing the conductive lead wire total quantity half exposed will be accounted for.
Further, in lead amendment step, pass through CAM software former conductive lead wire exposure text corresponding to nickel thickness region
Part is modified.
Further, further comprising the steps of after having executed lead reduction step：
Take off film step：Whole dry films of IC package substrate are taken off and are removed；
Welding resistance step：Green oil is coated to IC package substrate, and carries out exposure development.
The third object of the present invention is implemented with the following technical solutions：
A kind of storage medium is stored thereon with computer program, realizes such as when the computer program is executed by processor
The described in any item ameliorative ways of one of the object of the invention.
Compared with prior art, the beneficial effects of the present invention are：
(1) present invention is by modification conductive network, so that the nickel thickness at four angles of IC package substrate is obviously optimized, nickel is thick
Very poor 8.3 before improvement μm drop to 5.2 μm, and uniformity obtains conspicuousness optimization；
(2) whole process does not increase additional process, reduces gold salt cost.
Detailed description of the invention
Fig. 1 is a kind of flow chart of the ameliorative way of electroplating mild alloy uniformity of the invention.
Specific embodiment
In the following, being described further in conjunction with attached drawing and specific embodiment to the present invention, it should be noted that not
Under the premise of conflicting, new implementation can be formed between various embodiments described below or between each technical characteristic in any combination
Example.
As shown in Figure 1, the present invention provides a kind of ameliorative way of the soft golden uniformity of IC package electroplating substrate, it is specific to wrap
Include following steps：
S1：It modifies to the former conductive lead wire exposure file of IC package substrate, part original is set as what needs exposed
Conductive lead wire is deleted；
In this step, CAM software is informed into nickel thickness region by staff, and passes through CAM software for nickel thickness region
Former conductive lead wire exposure file modify, need the route that exposes to delete by will originally be set as, reduce conductive lead wire
Quantity.
The former conductive lead wire for being set as needing the conductive lead wire total quantity half exposed will be specially accounted for delete, it is such as former
First there are four electroplate lead wires for being supplied to the region to reduce to 2 simultaneously.
S2：Dry film on the conductive lead wire corresponding region of deletion is developed, so that on the deleted conductive lead wire
Copper be etched, retain the dry film on not deleted conductive lead wire corresponding region, so that the not deleted conductive lead wire is corresponding
Copper is not etched.
This step includes development and moment, unexposed dry film it is developed fall, the dry film of exposure leaves, developing process
In, IC package substrate normal development, without doing any change.It is not etched by the copper that dry film covers, is covered by dry film later
Copper be not etched, in etching process, product normal etches are same without doing other any changes.
S3：Whole dry films of IC package substrate are taken off and are removed；It fades away and finally shows the conductive lead wire in nickel thickness region after dry film
Quantity is reduced.
S4：Green oil is coated to IC package substrate, and carries out exposure development.
Nickel thickness of the present invention region is because conductive lead wire quantity is reduced, thus the zone current is reduced, so that nickel thickness declines, is realized
Improvement to nickel thickness uniformity.
On the other hand, the present invention also provides a kind of electronic equipment, including memory, processor and storage are on a memory
And the computer program run on a processor, the processor realize following steps when executing the computer program：
Lead amendment step：It modifies to the former conductive lead wire exposure file of IC package substrate, part original is set as
The conductive lead wire for needing to expose is deleted；
Lead reduces step：Dry film on region corresponding to conductive lead wire by deletion develops, so that this is deleted
Conductive lead wire on copper be etched, retain the dry film on not deleted conductive lead wire corresponding region, so that this not deleted is led
The corresponding copper of electrical lead is not etched.
In lead amendment step, " by the former conductive lead wire deletion for being set as needs and exposing in part " is specially that will account for original to set
It is set to and the conductive lead wire of the conductive lead wire total quantity half exposed is needed to delete.It is soft by CAM in lead amendment step
Part former conductive lead wire exposure file corresponding to nickel thickness region is modified.It further include following after having executed lead reduction step
Step：
Take off film step：Whole dry films of IC package substrate are taken off and are removed；
Welding resistance step：Green oil is coated to IC package substrate, and carries out exposure development.
The present invention also provides a kind of computer storage mediums, are stored thereon with computer program, the computer program quilt
Processor realizes ameliorative way as described in the present invention when executing.
The above embodiment is only the preferred embodiment of the present invention, and the scope of protection of the present invention is not limited thereto,
The variation and replacement for any unsubstantiality that those skilled in the art is done on the basis of the present invention belong to institute of the present invention
Claimed range.
Claims (9)
1. a kind of ameliorative way of electroplating mild alloy uniformity is applied to IC package substrate, which is characterized in that include the following steps：
Lead amendment step：It modifies to the former conductive lead wire exposure file of IC package substrate, part original is set as needing
The conductive lead wire of exposure is deleted；
Lead reduces step：Dry film on region corresponding to conductive lead wire by deletion develops, so that this deleted is led
Copper on electrical lead is etched, and retains the dry film on not deleted conductive lead wire corresponding region, so that the not deleted conduction is drawn
The corresponding copper of line is not etched.
2. ameliorative way as described in claim 1, which is characterized in that in lead amendment step, " be set as needing by part original
The conductive lead wire to be exposed is deleted " it is specially that will account for the former conduction for being set as needing the conductive lead wire total quantity half exposed
Lead is deleted.
3. ameliorative way as described in claim 1, which is characterized in that in lead amendment step, by CAM software to nickel thickness
The corresponding former conductive lead wire exposure file in region is modified.
4. ameliorative way as described in claim 1, which is characterized in that further include following step after having executed lead reduction step
Suddenly：
Take off film step：Whole dry films of IC package substrate are taken off and are removed；
Welding resistance step：Green oil is coated to IC package substrate, and carries out exposure development.
5. a kind of electronic equipment, the calculating run on a memory and on a processor including memory, processor and storage
Machine program, which is characterized in that the processor realizes following steps when executing the computer program：
Lead amendment step：It modifies to the former conductive lead wire exposure file of IC package substrate, part original is set as needing
The conductive lead wire of exposure is deleted；
Lead reduces step：Dry film on region corresponding to conductive lead wire by deletion develops, so that this deleted is led
Copper on electrical lead is etched, and retains the dry film on not deleted conductive lead wire corresponding region, so that the not deleted conduction is drawn
The corresponding copper of line is not etched.
6. electronic equipment as claimed in claim 5, which is characterized in that in lead amendment step, " be set as needing by part original
The conductive lead wire to be exposed is deleted " it is specially that will account for the former conduction for being set as needing the conductive lead wire total quantity half exposed
Lead is deleted.
7. electronic equipment as claimed in claim 5, which is characterized in that in lead amendment step, by CAM software to nickel thickness
The corresponding former conductive lead wire exposure file in region is modified.
8. electronic equipment as claimed in claim 5, which is characterized in that further include following step after having executed lead reduction step
Suddenly：
Take off film step：Whole dry films of IC package substrate are taken off and are removed；
Welding resistance step：Green oil is coated to IC package substrate, and carries out exposure development.
9. a kind of storage medium, is stored thereon with computer program, which is characterized in that the computer program is executed by processor
Shi Shixian ameliorative way according to any one of claims 1-4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810710232.4A CN108875250B (en) | 2018-07-02 | 2018-07-02 | Method for improving uniformity of electroplated soft gold, electronic equipment and storage medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810710232.4A CN108875250B (en) | 2018-07-02 | 2018-07-02 | Method for improving uniformity of electroplated soft gold, electronic equipment and storage medium |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108875250A true CN108875250A (en) | 2018-11-23 |
| CN108875250B CN108875250B (en) | 2023-03-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810710232.4A Active CN108875250B (en) | 2018-07-02 | 2018-07-02 | Method for improving uniformity of electroplated soft gold, electronic equipment and storage medium |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1567552A (en) * | 2003-06-30 | 2005-01-19 | 美龙翔微电子科技（深圳）有限公司 | Method for handling electroplating lead layout of IC packaging base plate and electroplating lead structure |
| JP2005089820A (en) * | 2003-09-17 | 2005-04-07 | Sanyo Electric Co Ltd | Etching method, and method for manufacturing circuit device by using it |
| JP2005215989A (en) * | 2004-01-29 | 2005-08-11 | Sharp Corp | Design method for printed circuit board, plated lead evaluation program for realizing this design method, evaluation device with computer-readable recording medium recording this plated lead evaluation program, and printed circuit board designed by use of this design method, plated lead evaluation program or evaluation device |
| US20080027698A1 (en) * | 2002-06-07 | 2008-01-31 | Cadence Design Systems, Inc. | Method and System for Handling Process Related Variations for Integrated Circuits Based Upon Reflections |
| CN102421255A (en) * | 2011-08-08 | 2012-04-18 | 高德（无锡）电子有限公司 | Processing method of electroplated lead applied to LED printed circuit board |
| US8627243B1 (en) * | 2012-10-12 | 2014-01-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods for optimizing conductor patterns for ECP and CMP in semiconductor processing |
-
2018
- 2018-07-02 CN CN201810710232.4A patent/CN108875250B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080027698A1 (en) * | 2002-06-07 | 2008-01-31 | Cadence Design Systems, Inc. | Method and System for Handling Process Related Variations for Integrated Circuits Based Upon Reflections |
| CN1567552A (en) * | 2003-06-30 | 2005-01-19 | 美龙翔微电子科技（深圳）有限公司 | Method for handling electroplating lead layout of IC packaging base plate and electroplating lead structure |
| JP2005089820A (en) * | 2003-09-17 | 2005-04-07 | Sanyo Electric Co Ltd | Etching method, and method for manufacturing circuit device by using it |
| JP2005215989A (en) * | 2004-01-29 | 2005-08-11 | Sharp Corp | Design method for printed circuit board, plated lead evaluation program for realizing this design method, evaluation device with computer-readable recording medium recording this plated lead evaluation program, and printed circuit board designed by use of this design method, plated lead evaluation program or evaluation device |
| CN102421255A (en) * | 2011-08-08 | 2012-04-18 | 高德（无锡）电子有限公司 | Processing method of electroplated lead applied to LED printed circuit board |
| US8627243B1 (en) * | 2012-10-12 | 2014-01-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods for optimizing conductor patterns for ECP and CMP in semiconductor processing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108875250B (en) | 2023-03-24 |
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