CN102421255A - Processing method of electroplated lead applied to LED printed circuit board - Google Patents
Processing method of electroplated lead applied to LED printed circuit board Download PDFInfo
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- CN102421255A CN102421255A CN2011102261197A CN201110226119A CN102421255A CN 102421255 A CN102421255 A CN 102421255A CN 2011102261197 A CN2011102261197 A CN 2011102261197A CN 201110226119 A CN201110226119 A CN 201110226119A CN 102421255 A CN102421255 A CN 102421255A
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Abstract
The invention discloses a processing method of an electroplated lead applied to an LED printed circuit board. The processing method comprises the following steps of: 1, manufacturing an outer-layer exposure negative film and a welding-prevention exposure negative film; and 2, carrying out outer-layer pretreatment on a plate which is subjected to copper plating through vertical and continuous electroplating wires, pressing a dry film on the plate through a dry film laminator, drawing the plate subjected to dry film pressing to form the outer-layer exposure negative film and exposing the outer-layer exposure negative film through an exposure machine, developing an outer-layer developing line, making a required outer-layer lead through an acid etching line, carrying out welding-prevention pretreatment, printing ink by a double-table-board printer, prebaking through a frame-type oven, exposing the drawn negative film through the exposure machine, developing the welding-prevention developing line and finally obtaining the electroplated lead required by soft gold electroplating. According to the processing method disclosed by the invention, evenness of an electronickelling gold film is increased, scrap caused by electronickelling over-thickness and poor evenness can be prevented, consumption of gold and nickel is reduced by adjusting current density of electronickelling and electrogilding, production cost is controlled, pollution is reduced, and environment friendliness is facilitated.
Description
Technical field
The present invention relates to a kind of processing method that is applied to the effective printed substrate electroplate lead wire of light-emitting diodes, especially need carry out the light emitting diode printed circuit board manufacture field that soft golden plate surface is handled.
Background technology
Along with popularizing of global green energy conservation notion, country encourages exploitation LED source technology, and increasing light-emitting diode producer occurs at home.In the printed wire board machining process of the effective support plate of light-emitting diodes; It is one important procedure that the light-emitting diode printed substrate is made that soft gold is electroplated; Cost accounts for the 50-70% of the total manufacturing cost of light-emitting diode printed substrate, and soft gold is electroplated good and bad product reliability and the fine ratio of product of making of directly influencing.
Because the particularity of encapsulation process of light-emitting diode, light-emitting diode printed substrate client is to printed substrate thickness requirement and strictness thereof, and the tolerance demand is controlled at ± 0.04mm.And the electroplate lead wire processing method of generally using now soft gold electroplate have the electric current of light-emitting diode wiring board around edges of boards are electroplated folder point zone and printed substrate plate angle in the manufacturing process distribution density than plate in height; Cause areas of high current density coating epithelium blocked up; Printed wire plate thickness and thickness evenness thereof exceed requirement of client, and generation is scrapped.And the common way of industry be around the high Current Zone at plate angle add the mode that false plating plate shares electric current and electroplate because false plating plate can have been increased production cost by electric plated with nickel gold equally.
Summary of the invention
The purpose of this invention is to provide a kind of light-emitting diode printed substrate electroplate lead wire processing method that is applied to overcome above-mentioned weak point; Improve the blocked up problem of high current density region coating in the soft golden electroplating technology; Improve the uniformity of plate thickness and appearance luster, reduce the cost that soft gold is electroplated.
According to technical scheme provided by the invention, a kind of processing method that is applied to light-emitting diode printed substrate electroplate lead wire, characteristic are to adopt following two main procedure of processings:
The first step: the making of outer exposure egative film and anti-welding exposure egative film
(1) minor face is arranged two-layer electroplate lead wire; Live width 1mm; Conduction limit and minor face ground floor electroplate lead wire, minor face ground floor electroplate lead wire and minor face second layer electroplate lead wire be 2mm at interval, and on lead, whenever arranges the false copper facing skin of an outside protrusion at a distance from the distance of 1cm; Copper sheet width 1mm, length 1.5mm; Be connected with the conduction limit at the minor face lead that the position of 14～15cm is provided with two width 1mm of being separated by between two parties; Second layer electroplate lead wire evenly is provided with three leads and is connected conductor width 1mm with the ground floor electroplate lead wire; Two leads that connect conduction limit and ground floor electroplate lead wire, overlapping can not appear in three leads that connect ground floor and second layer electroplate lead wire, and the ground floor electroplate lead wire can not directly be connected with the conduction limit with second layer electroplate lead wire two ends;
(2) grow the limit and arrange one deck electroplate lead wire; With the conduction limit at a distance of 2mm; Live width 1mm; And every distance at a distance from 1cm is arranged the false copper facing skin to outer lug on lead-in wire; Copper sheet width 1mm; Length 1.5mm, the lead that a 1.5mm width is set in the centre position on long limit makes long limit electroplate lead wire link to each other with the conduction limit;
(3) except that the circular optics point that anti-welding exposure aligning is used, outer contraposition optics point and section hole can not isolate existence, need to be connected with the conduction limit with lead; The first, two layer of electroplate lead wire that one deck electroplate lead wire and minor face are electroplated in long limit can not cover anti-solder ink.
(4) electroplate lead wire is to the plating area connected mode: four limits, plating area evenly are provided with three leads conducting electric current in plate; False copper facing skin is arranged on the lead of conducting electric current in plate, and width is 3mm; The electroplate lead wire crosspoint is set as the false copper facing skin of putting 3 х 3mm crosses, and the remainder electroplate lead wire around the plating area covers anti-solder ink;
Second step: the processing of electroplate lead wire
(1) will pass through the vertical continuous of producing and electroplate the scientific and technological preliminary treatment line microetch of making of the outer inferior intelligence photoelectricity of light-emitting diode printed substrate process that copper cash is accomplished electro-coppering by Mechanology Inc. of Baolong, washing, pickling, washing is dried and is cleaned; Cleaning pan feeding linear speed: 1.8-2.2m/min; Microetch speed: 30-50 microinch; The microetch spray is pressed: 1.5-2.5kg/cm
2Two circulation washing pressure: 0.4-0.8 kg/cm
2, flow of inlet water: 5-7L/min; Descaling bath sulfuric acid volumetric concentration: 2-4%; Three circulation washing pressure: 0.4-0.8 kg/cm
2, flow of inlet water: 5-7L/min; Bake out temperature: 75-85 ℃;
(2) will pass through pretreated light-emitting diode printed substrate and press dry film through Zhisheng Industrial stock Co., Ltd's production press mold machine; Use ORC automatic exposure machine and the exposure of outer exposure egative film; The development line of inferior intelligence photoelectricity science and technology production develops, and making through the acid line etching of Yang Bo science and technology production then needs outer electroplate lead wire;
Press dry film: preheating divides three sections, and three sections temperature are respectively 100-110 ℃, and 100-110 ℃, 80-100 ℃, speed 1.5-4.0 m/min; Paste the dry film wheel speeds: 1.8-2.2m/min, roller temperature: 110-120 ℃, roller pressure: 0.3-0.5MPa;
Exposure: energy uniformity is the 10-12 level greater than 85%, 25 grade of exposure level numerical table test progression;
Develop: development Na
2CO
3Mass concentration 0.8-1.2%, 1.5-1.7 kg/cm is pressed in spray
2, speed 3.0-4.0 m/min, temperature 28-32 ℃; Middle setting-out is washed pressure: 1.2-2.5 kg/cm
2, inflow: 5-10L/min; The compound washing pressure of middle pressure: 1.6-2.0 kg/cm
2, inflow: 5-10L/min; Bake out temperature: 50-65 ℃;
Acid etching: operation is acid etching, washing, striping, washing, oven dry; Etching solution proportion 1.26-1.33, HCl concentration 2.0-2.8mol/L, NaClO
3Concentration 15-50g/L, Cu
2+Concentration 95-140g/L, etch temperature 45-55 ℃, last spray spray is pressed: 2.2 ± 0.8 kg/cm
2, following spray spray is pressed: 1.8 ± 0.8 kg/cm
2Washing inflow 4-6L/min, washing pressure: 0.5-3.0 kg/cm
2Striping groove NaOH mass concentration 3-6%, speed: 1.0-2.0m/min, temperature 45-55 ℃; Washing flow of inlet water: 4-6L/min, nozzle exit pressure: 0.5-3.0kg/cm
2Bake out temperature: 55-65 ℃;
(3) the light emitting diode printed wire boards half-finished product of accomplishing through acid etching is handled through the anti-welding preliminary treatment line of inferior intelligence photoelectricity science and technology production; The two table top printing machines that join the production of permanent precision optical machinery limited company carry out ink printing; It is roasting in advance that Qunyi Industry Co., Ltd. produces the frame-type baking box; Use ORC automatic exposure machine and the anti-welding exposure egative film exposure of making; The development line of inferior intelligence photoelectricity science and technology production develops, and obtains the electroplate lead wire that the plating of final soft gold needs;
Anti-welding preliminary treatment linear speed: 2.5-3.5m/min, microetch speed: 30-50 microinch, circulation washing inflow: 3-7L/min, bake out temperature: 80-90 ℃;
Anti-solder ink printing: print speed printing speed 3.0 ± 2.5m/min, half tone height < 20mm, squeegee pressure: 0.5 ± 0.3MPa, < 20 ° of scraper angles;
Roasting in advance: 75 ± 3 ℃ of temperature, roasting in advance time: 20min;
Exposure: pitch value ± 40um, exposure energy uniformity>80%;
Develop: speed 3.5-3.8m/min, temperature 28-32 ℃, pressure 1.0-2.0kg/cm
2, K
2CO
3Concentration 8-12g/L, washing inflow: 3-6L/min, bake out temperature 50-70 ℃.
The wiring board of making according to light-emitting diode printed substrate electroplate lead wire processing method provided by the invention is used for direct soft gold plating, and following advantage is arranged:
1. improved the uniformity of electronickelling gold plate, the maximum of nickel coating thickness subtracts minimum value 400 microinch, makes in the special plank plate thickness maximum with edges of boards and subtracts minimum value and can reach and be reduced to 150 microinch more than 800 microinch; Gold-plated maximum subtracts minimum value and is reduced to 3 microinch by 6 microinch, is satisfying under the situation of customer requirement, can be through adjustment plating electronickelling; The current density of electrogilding reduces the consumption of golden nickel; Can well control production cost, reduce and pollute, be beneficial to environmental protection.
2. edges of boards need not be spread copper sheet and Ban Jiao and add the appearance color homogeneous homegeneous production that false copper facing skin can obtain the nickel plating gold, have improved the gold-plated blocked up problem of edges of boards nickel plating, prevent that electronickelling is blocked up to scrap with lack of homogeneity causes; Practice thrift the consumption of edges of boards and false copper facing skin simultaneously, reduce and pollute, be beneficial to environmental protection potassium auricyanide and electronickelling gold liquid medicine.
Description of drawings:
Fig. 1 is an electroplate lead wire construction drawing of the present invention.
Fig. 2 connects wire producing figure for electroplate lead wire of the present invention to the plating area.
Embodiment
Below in conjunction with specific embodiment the present invention is described further.
At first make circuit and be depicted as the egative film that skin makes public and anti-welding exposure needs, make concrete mode and see (Fig. 1) and (Fig. 2) explanation according to outer electroplate lead wire graphics request.
(1) minor face 1 is arranged two-layer electroplate lead wire; Live width 1mm; Conduction limit 12 and minor face ground floor electroplate lead wire 3, minor face ground floor electroplate lead wire 3 and minor face second layer electroplate lead wire 4 be 2mm at interval, and on lead every false copper facing skin 16 of arranging an outside protrusion at a distance from the distance of 1cm; Copper sheet width 1mm, length 1.5mm; Be connected with conduction limit 12 at the minor face lead 6,8 that the position of 14～15cm is provided with two width 1mm of being separated by between two parties; Second layer electroplate lead wire 4 evenly is provided with three leads 5,7,9 and is connected conductor width 1mm with ground floor electroplate lead wire 3; Two leads that connect conduction limit and ground floor electroplate lead wire, overlapping can not appear in three leads that connect ground floor and second layer electroplate lead wire, and the ground floor electroplate lead wire can not directly be connected with the conduction limit with second layer electroplate lead wire two ends;
(2) grow limit 2 and arrange one deck electroplate lead wire 10; With the conduction limit at a distance of 2mm; Live width 1mm; And every distance at a distance from 1cm is arranged the false copper facing skin 16 to outer lug on lead-in wire; Copper sheet width 1mm; Length 1.5mm, the lead 11 that a 1.5mm width is set in the centre position on long limit makes long limit electroplate lead wire link to each other with the conduction limit;
(3) the circular optics point that uses except that anti-welding exposure aligning is 13, and outer contraposition optics point 14 can not isolate existence with the hole 15 of cutting into slices, need with lead with conduct electricity the limit and be connected; The first, two layer of electroplate lead wire 3,4 that one deck electroplate lead wire 10 and minor face are electroplated in long limit can not cover anti-solder ink.
(4) electroplate lead wire is to plating area 17 connected modes: four limits, plating area evenly are provided with three leads 20 conducting electric current in plate; False copper facing skin 18 is arranged on the lead of conducting electric current in plate, and width is 3mm; The electroplate lead wire crosspoint is set as the false copper facing skin 19 of putting 3 х 3mm crosses, and the remainder electroplate lead wire around the plating area covers anti-solder ink;
Certain double-deck light-emitting diode printed substrate, sheet material are white BT material, and be following by method implementation step of the present invention:
Embodiment one:A kind of processing method that is applied to light-emitting diode printed substrate electroplate lead wire of the present invention, adopt following procedure of processing:
1, will pass through the preliminary treatment line microetch of electroplating the outer inferior intelligence photoelectricity science and technology of the light-emitting diode printed substrate process production of copper cash completion electro-coppering by the vertical continuous of Mechanology Inc. of Baolong production, washing, pickling, washing is cleaned; Cleaning pan feeding linear speed: 1.8m/min; Microetch speed: 30 microinch; The microetch spray is pressed: 1.5kg/cm
2Two circulation washing pressure: 0.4kg/cm
2, flow of inlet water: 5L/min; Acid rinse bath sulfuric acid volumetric concentration: 2%; Three circulation washing pressure: 0.4kg/cm
2, flow of inlet water: 5/min; Bake out temperature: 75 ℃;
2, will pass through pretreated light-emitting diode printed substrate and press dry film through the press mold machine of Zhisheng Industrial stock Co., Ltd's production; Use ORC automatic exposure machine and the skin exposure exposure of making; The development line of inferior intelligence photoelectricity science and technology production develops, and making through the acid line etching of Yang Bo science and technology production then needs outer electroplate lead wire;
Press dry film: preheating divides three sections, and temperature is respectively 100 ℃, and 100 ℃, 80 ℃, speed 1.5m/min; Paste dry film wheel speeds: 1.8m/min, the roller temperature: 110 ℃, roller pressure: 0.3MPa;
Exposure: energy uniformity is 10 grades greater than 85%, 25 grade of exposure level numerical table test progression;
Develop: development Na
2CO
3Mass concentration 0.8%, 1.5kg/cm is pressed in spray
2, speed 3.0m/min, 28 ℃ of temperature; Middle setting-out is washed pressure: 1.2kg/cm
2, inflow: 5L/min; Middle compound washing pressure: the 1.6kg/cm that presses
2, inflow: 5L/min; Bake out temperature: 50 ℃;
Acid etching: operation is acid etching → washing → striping → washing → oven dry; Etching solution proportion 1.26, HCl concentration 2.0mol/L, NaClO
3Concentration 15g/L, Cu
2+Concentration 95g/L, 45 ℃ of etch temperature, last spray spray is pressed: 1.4kg/cm
2, following spray spray is pressed: 1.0 kg/cm
2Washing inflow 4L/min, washing pressure: 0.5kg/cm
2Striping groove NaOH mass concentration 3%, speed: 1.0m/min, 45 ℃ of temperature; Washing flow of inlet water: 4L/min, nozzle exit pressure: 0.5kg/cm
2Bake out temperature: 55 ℃;
3, the light emitting diode printed wire boards half-finished product of etching completion is handled through the anti-welding preliminary treatment line of inferior intelligence; The two table top printing machines that join the production of permanent precision optical machinery limited company carry out ink printing; The frame-type baking box of Qunyi Industry Co., Ltd.'s production is roasting in advance; Use ORC automatic exposure machine and the anti-welding exposure egative film exposure of making; The development line of inferior intelligence photoelectricity science and technology production develops, and obtains the electroplate lead wire that the plating of final soft gold needs;
Anti-welding preliminary treatment linear speed: 2.5m/min, microetch speed: 30 microinch, circulation washing inflow: 3L/min, bake out temperature: 80 ℃;
Anti-solder ink printing: print speed printing speed 1.5m/min, half tone height < 20mm, squeegee pressure: 0.3MPa, < 20 ° of scraper angles;
Roasting in advance: 72 ℃ of temperature, roasting in advance time: 20min;
Exposure: pitch value ± 40um, exposure energy uniformity>80%;
Develop: speed 3.5m/min, 28 ℃ of temperature, pressure 1.0kg/cm
2, K
2CO
3Concentration 8g/L, washing inflow: 3L/min, 50 ℃ of bake out temperatures.
Embodiment two:
A kind of processing method that is applied to light-emitting diode printed substrate electroplate lead wire of the present invention, adopt following procedure of processing:
1, will pass through the outer inferior intelligence photoelectricity science and technology preliminary treatment line microetch of light-emitting diode printed substrate process of electroplating copper cash completion electro-coppering by the vertical continuous of Mechanology Inc. of Baolong production, washing, pickling, washing is cleaned; Cleaning pan feeding linear speed: 2.0 m/min; Microetch speed: 40 microinch; The microetch spray is pressed: 2.0 kg/cm
2Two circulation washing pressure: 0.6 kg/cm
2, flow of inlet water: 6 L/min; Descaling bath sulfuric acid volumetric concentration: 3 %; Three circulation washing pressure: 0.6 kg/cm
2, flow of inlet water: 6 L/min; Bake out temperature: 80 ℃;
2, will pass through pretreated light-emitting diode printed substrate and press dry film through the press mold machine of Zhisheng Industrial stock Co., Ltd's production; Use ORC automatic exposure machine and the skin exposure egative film exposure of making; The development line of Asia intelligence Electro-optical Technology, INC. (US) 62 Martin Road, Concord, Massachusetts 017 production develops, and making through the acid line etching of Yang Bo science and technology production then needs outer electroplate lead wire;
Press dry film: preheating divides three sections, and temperature is respectively 105 ℃, and 105 ℃, 90 ℃, speed 3.0m/min; Paste the dry film wheel speeds: 2.0 m/min, the roller temperature: 115 ℃, roller pressure: 0.4 MPa;
Exposure: energy uniformity is 11 grades greater than 85%, 25 grade of exposure level numerical table test progression;
Develop: development Na
2CO
3Mass concentration 1.0%, 1.6 kg/cm are pressed in spray
2, speed 3.5 m/min, 30 ℃ of temperature; Middle setting-out is washed pressure: 2.9 kg/cm
2, inflow: 7.5 L/min; The compound washing pressure of middle pressure: 1.8 kg/cm
2, inflow: 7.5 L/min; Bake out temperature: 58 ℃;
Acid etching: operation is acid etching → washing → striping → washing → oven dry; Etching solution proportion 1.29, HCl concentration 2.4 mol/L, NaClO
3Concentration 35g/L, Cu
2+Concentration 115g/L, 50 ℃ of etch temperature, last spray spray is pressed: 2.2 kg/cm
2, following spray spray is pressed: 1.8kg/cm
2Washing inflow 5L/min, washing pressure: 2.0 kg/cm
2Striping groove NaOH mass concentration 4.5%, speed: 1.5 m/min, 50 ℃ of temperature; Washing flow of inlet water: 5 L/min, nozzle exit pressure: 2.0 kg/cm
2Bake out temperature: 60 ℃;
3, the light emitting diode printed wire boards half-finished product of etching completion is handled through the anti-welding preliminary treatment line of inferior intelligence photoelectricity science and technology production; The two table top printing machines that join the production of permanent precision optical machinery limited company carry out ink printing; The frame-type baking box of Qunyi Industry Co., Ltd.'s production is roasting in advance; Use ORC automatic exposure machine and the anti-welding exposure egative film exposure of making; The development line of inferior intelligence photoelectricity science and technology production develops, and obtains the electroplate lead wire that the plating of final soft gold needs;
Anti-welding preliminary treatment linear speed: 3.0 m/min, microetch speed: 40 microinch, circulation washing inflow: 5L/min, bake out temperature: 85 ℃;
Anti-solder ink printing: print speed printing speed 3.0m/min, half tone height < 20mm, squeegee pressure: 0.4MPa, < 20 ° of scraper angles;
Roasting in advance: 75 ℃ of temperature, roasting in advance time: 20min;
Exposure: pitch value ± 40um, exposure energy uniformity>80%;
Develop: speed 3.65m/min, 30 ℃ of temperature, pressure 1.5kg/cm
2, K
2CO
3Concentration 10g/L, washing inflow: 4.5L/min, 60 ℃ of bake out temperatures.
Embodiment three:
A kind of processing method that is applied to light-emitting diode printed substrate electroplate lead wire of the present invention, adopt following procedure of processing:
1, will pass through the outer inferior intelligence preliminary treatment line microetch of light-emitting diode printed substrate process of electroplating copper cash completion electro-coppering by the vertical continuous of Mechanology Inc. of Baolong production, washing, pickling, washing is cleaned; Cleaning pan feeding linear speed: 2.2m/min; Microetch speed: 50 microinch; The microetch spray is pressed: 2.5kg/cm
2Two circulation washing pressure: 0.8 kg/cm
2, flow of inlet water: 7L/min; Descaling bath sulfuric acid volumetric concentration: 4%; Three circulation washing pressure: 0.8 kg/cm
2, flow of inlet water: 7L/min; Bake out temperature: 85 ℃;
2, will pass through pretreated light-emitting diode printed substrate and press dry film through the holy press mold machine of will, and use ORC automatic exposure machine and the skin exposure egative film exposure of making, inferior intelligence development line develops, and making through the acid line etching of Yang Bo then needs outer electroplate lead wire;
Press dry film: preheating divides three sections, and temperature is respectively 110 ℃, and 110 ℃, 100 ℃, speed 4.0 m/min; Paste dry film wheel speeds: 2.2m/min, the roller temperature: 120 ℃, roller pressure: 0.5MPa;
Exposure: energy uniformity is 12 grades greater than 85%, 25 grade of exposure level numerical table test progression;
Develop: development Na
2CO
3Mass concentration 1.2%, 1.7 kg/cm are pressed in spray
2, speed 4.0 m/min, 32 ℃ of temperature; Middle setting-out is washed pressure: 2.5 kg/cm
2, inflow: 10L/min; The compound washing pressure of middle pressure: 2.0 kg/cm
2, inflow: 10L/min; Bake out temperature: 65 ℃;
Acid etching: operation is acid etching → washing → striping → washing → oven dry; Etching solution proportion 1.33, HCl concentration 2.8mol/L, NaClO
3Concentration 50g/L, Cu
2+Concentration 140g/L, 55 ℃ of etch temperature, last spray spray is pressed: 3 kg/cm
2, following spray spray is pressed: 2.6kg/cm
2Washing inflow 6L/min, washing pressure: 3.0 kg/cm
2Striping groove NaOH mass concentration 6%, speed: 2.0m/min, 55 ℃ of temperature; Washing flow of inlet water: 6L/min, nozzle exit pressure: 3.0kg/cm
2Bake out temperature: 65 ℃;
3, the light emitting diode printed substrate of etching completion is handled through the anti-welding preliminary treatment line of inferior intelligence; Join permanent two table top printing machine and carry out ink printing; Crowd's assist frame-type baking box is roasting in advance; Use ORC automatic exposure machine and the anti-welding exposure egative film exposure of making; Inferior intelligence development line develops, and obtains the electroplate lead wire that the plating of final soft gold needs;
Anti-welding preliminary treatment linear speed: 3.5m/min, microetch speed: 50 microinch, circulation washing inflow: 7L/min, bake out temperature: 90 ℃;
Anti-solder ink printing: print speed printing speed 4.5m/min, half tone height < 20mm, squeegee pressure: 0.8MPa, < 20 ° of scraper angles;
Roasting in advance: 78 ℃ of temperature, roasting in advance time: 20min;
Exposure: pitch value ± 40um, exposure energy uniformity>80%;
Develop: speed 3.8m/min, 32 ℃ of temperature, pressure 2.0kg/cm
2, K
2CO
3Concentration 12g/L, washing inflow: 6L/min, 70 ℃ of bake out temperatures.
The wiring board of accomplishing according to a kind of light-emitting diode printed substrate of the present invention electroplate lead wire processing method case step can add false plating plate and directly be used for soft gold plating; The appearance color homogeneous that obtains the nickel plating gold is consistent; Nickel plating thickness maximum subtracts about 150 microinch of minimum value, and the maximum of soft golden thickness subtracts the product of minimum value 3 microinch, reduces edges of boards and the consumption of false plating plate to potassium auricyanide and electronickelling gold liquid medicine; Reduce and pollute, be beneficial to environmental protection.
Claims (1)
1. processing method that is applied to light-emitting diode printed substrate electroplate lead wire is characterized in that: adopt following procedure of processing:
The first step: the making of outer exposure egative film and anti-welding exposure egative film
(1) minor face (1) is arranged two-layer electroplate lead wire; Live width 1mm; Conduction limit (12) and minor face ground floor electroplate lead wire (3), minor face ground floor electroplate lead wire (3) and minor face second layer electroplate lead wire (4) be 2mm at interval, and on lead, whenever arranges the false copper facing skin (16) of an outside protrusion at a distance from the distance of 1cm; Copper sheet width 1mm, length 1.5mm; Be connected with conduction limit (12) at the minor face lead that the position of 14～15cm is provided with two width 1mm of being separated by between two parties; Second layer electroplate lead wire (4) evenly is provided with three leads and is connected conductor width 1mm with ground floor electroplate lead wire (3); Two leads that connect conduction limit and ground floor electroplate lead wire, overlapping can not appear in three leads that connect ground floor and second layer electroplate lead wire, and the ground floor electroplate lead wire can not directly be connected with the conduction limit with second layer electroplate lead wire two ends;
(2) grow limit (2) and arrange one deck electroplate lead wire (10); With the conduction limit at a distance of 2mm; Live width 1mm; And every distance at a distance from 1cm is arranged the false copper facing skin (16) to outer lug on lead-in wire; Copper sheet width 1mm; Length 1.5mm, the lead (11) that a 1.5mm width is set in the centre position on long limit makes long limit electroplate lead wire link to each other with the conduction limit;
(3) except that the circular optics point that anti-welding exposure aligning is used (13), outer contraposition optics point (14) and section hole (15) can not isolate existence, need to be connected with the conduction limit with lead; The first, two layer of electroplate lead wire that one deck electroplate lead wire (10) and minor face are electroplated in long limit can not cover anti-solder ink.
(4) electroplate lead wire is to plating area (17) connected mode: four limits, plating area evenly are provided with three leads (20) conducting electric current in plate; False copper facing skin (18) is arranged on the lead of conducting electric current in plate, and width is 3mm; The electroplate lead wire crosspoint is set as the false copper facing skin (19) of putting 3 х 3mm crosses, and the remainder electroplate lead wire around the plating area covers anti-solder ink;
Second step: the processing of electroplate lead wire
(1) will pass through the outer preliminary treatment line microetch of light-emitting diode printed substrate process of electroplating copper cash completion electro-coppering by vertical continuous, washing, pickling, washing, oven dry is cleaned; Cleaning pan feeding linear speed: 1.8-2.2m/min; Microetch speed: 30-50 microinch; The microetch spray is pressed: 1.5-2.5kg/cm
2Two circulation washing pressure: 0.4-0.8 kg/cm
2, flow of inlet water: 5-7L/min; Descaling bath sulfuric acid volumetric concentration: 2-4%; Three circulation washing pressure: 0.4-0.8 kg/cm
2, flow of inlet water: 5-7L/min; Bake out temperature: 75-85 ℃;
(2) will pass through pretreated light-emitting diode printed substrate and press dry film through outer laminated film machine, and use automatic exposure machine and the skin exposure egative film exposure of making, the development line develops, and making through acid line etching then needs outer electroplate lead wire;
Press dry film: preheating divides three sections, and three sections temperature are respectively 100-110 ℃, and 100-110 ℃, 80-100 ℃, speed 1.5-4.0 m/min; Paste the dry film wheel speeds: 1.8-2.2m/min, roller temperature: 110-120 ℃, roller pressure: 0.3-0.5MPa;
Exposure: energy uniformity is the 10-12 level greater than 85%, 25 grade of exposure level numerical table test progression;
Develop: development Na
2CO
3Mass concentration 0.8-1.2%, 1.5-1.7 kg/cm is pressed in spray
2, speed 3.0-4.0 m/min, temperature 28-32 ℃; Middle setting-out is washed pressure: 1.2-2.5 kg/cm
2, inflow: 5-10L/min; The compound washing pressure of middle pressure: 1.6-2.0 kg/cm
2, inflow: 5-10L/min; Bake out temperature: 50-65 ℃;
Acid etching: operation is acid etching, washing, striping, washing, oven dry; Etching solution proportion 1.26-1.33, HCl concentration 2.0-2.8mol/L, NaClO
3Concentration 15-50g/L, Cu
2+Concentration 95-140g/L, etch temperature 45-55 ℃, last spray spray is pressed: 2.2 ± 0.8 kg/cm
2, following spray spray is pressed: 1.8 ± 0.8 kg/cm
2Washing inflow 4-6L/min, washing pressure: 0.5-3.0 kg/cm
2Striping groove NaOH mass concentration 3-6%, speed: 1.0-2.0m/min, temperature 45-55 ℃; Washing flow of inlet water: 4-6L/min, nozzle exit pressure: 0.5-3.0kg/cm
2Bake out temperature: 55-65 ℃;
(3) the light emitting diode printed wire boards half-finished product of accomplishing through acid etching is handled through anti-welding preliminary treatment line; Two table top printing machines carry out ink printing; The frame-type baking box is roasting in advance; Use exposure machine and the anti-welding exposure egative film exposure of making; The development line develops, and obtains the electroplate lead wire that the plating of final soft gold needs;
Anti-welding preliminary treatment linear speed: 2.5-3.5m/min, microetch speed: 30-50 microinch, circulation washing inflow: 3-7L/min, bake out temperature: 80-90 ℃;
Anti-solder ink printing: print speed printing speed 3.0 ± 2.5m/min, half tone height < 20mm, squeegee pressure: 0.5 ± 0.3MPa, < 20 ° of scraper angles;
Roasting in advance: 75 ± 3 ℃ of temperature, roasting in advance time: 20min;
Exposure: pitch value ± 40um, exposure energy uniformity>80%;
Develop: speed 3.5-3.8m/min, temperature 28-32 ℃, pressure 1.0-2.0kg/cm
2, K
2CO
3Concentration 8-12g/L, washing inflow: 3-6L/min, bake out temperature 50-70 ℃.
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| CN 201110226119 CN102421255B (en) | 2011-08-08 | 2011-08-08 | Processing method of electroplated lead applied to LED printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110226119 CN102421255B (en) | 2011-08-08 | 2011-08-08 | Processing method of electroplated lead applied to LED printed circuit board |
Publications (2)
| Publication Number | Publication Date |
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| CN102421255A true CN102421255A (en) | 2012-04-18 |
| CN102421255B CN102421255B (en) | 2013-05-08 |
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| CN 201110226119 Active CN102421255B (en) | 2011-08-08 | 2011-08-08 | Processing method of electroplated lead applied to LED printed circuit board |
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| CN (1) | CN102421255B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104066278A (en) * | 2014-06-19 | 2014-09-24 | 四川普瑞森电子有限公司 | Resistance welding pretreatment method of printed circuit board and resistance welding pretreatment roughening micro-etching agent |
| CN104780710A (en) * | 2014-01-15 | 2015-07-15 | 深圳崇达多层线路板有限公司 | PCB (Printed circuit board) and manufacturing method thereof |
| CN108811349A (en) * | 2018-06-29 | 2018-11-13 | 奥士康精密电路（惠州）有限公司 | A method of improving pcb board production efficiency |
| CN108875250A (en) * | 2018-07-02 | 2018-11-23 | 广州美维电子有限公司 | A kind of ameliorative way, electronic equipment, the storage medium of electroplating mild alloy uniformity |
| CN108617103B (en) * | 2018-05-10 | 2019-12-24 | 广州兴森快捷电路科技有限公司 | Jigsaw structure |
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| GB2109638A (en) * | 1981-11-11 | 1983-06-02 | Greenwoods Electronics Manufac | Printed circuit boards |
| US6383401B1 (en) * | 2000-06-30 | 2002-05-07 | International Flex Technologies, Inc. | Method of producing flex circuit with selectively plated gold |
| CN101267713A (en) * | 2008-04-30 | 2008-09-17 | 陈国富 | Making method of electric nickel and golden circuit board for saving nickel and gold dosage |
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2011
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2109638A (en) * | 1981-11-11 | 1983-06-02 | Greenwoods Electronics Manufac | Printed circuit boards |
| US6383401B1 (en) * | 2000-06-30 | 2002-05-07 | International Flex Technologies, Inc. | Method of producing flex circuit with selectively plated gold |
| CN101267713A (en) * | 2008-04-30 | 2008-09-17 | 陈国富 | Making method of electric nickel and golden circuit board for saving nickel and gold dosage |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104780710A (en) * | 2014-01-15 | 2015-07-15 | 深圳崇达多层线路板有限公司 | PCB (Printed circuit board) and manufacturing method thereof |
| CN104066278A (en) * | 2014-06-19 | 2014-09-24 | 四川普瑞森电子有限公司 | Resistance welding pretreatment method of printed circuit board and resistance welding pretreatment roughening micro-etching agent |
| CN108617103B (en) * | 2018-05-10 | 2019-12-24 | 广州兴森快捷电路科技有限公司 | Jigsaw structure |
| CN108811349A (en) * | 2018-06-29 | 2018-11-13 | 奥士康精密电路（惠州）有限公司 | A method of improving pcb board production efficiency |
| CN108875250A (en) * | 2018-07-02 | 2018-11-23 | 广州美维电子有限公司 | A kind of ameliorative way, electronic equipment, the storage medium of electroplating mild alloy uniformity |
| CN108875250B (en) * | 2018-07-02 | 2023-03-24 | 广州美维电子有限公司 | Method for improving uniformity of electroplated soft gold, electronic equipment and storage medium |
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|---|---|
| CN102421255B (en) | 2013-05-08 |
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