CN108550417B - Copper conductive paste suitable for xenon lamp sintering and preparation method thereof - Google Patents
Copper conductive paste suitable for xenon lamp sintering and preparation method thereof Download PDFInfo
- Publication number
- CN108550417B CN108550417B CN201810186271.9A CN201810186271A CN108550417B CN 108550417 B CN108550417 B CN 108550417B CN 201810186271 A CN201810186271 A CN 201810186271A CN 108550417 B CN108550417 B CN 108550417B
- Authority
- CN
- China
- Prior art keywords
- copper
- flake
- copper powder
- sintering
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/068—Flake-like particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Abstract
The invention discloses copper conductive slurry suitable for xenon lamp sintering and a preparation method thereof. The copper conductive paste comprises a copper powder main material, a sheet metal material for auxiliary sintering, an auxiliary agent, a binder and a solvent, wherein the copper conductive paste contains two sheets with average thickness, the defect that the sheet with thicker thickness is difficult to sinter is made up by the fact that the sheet with thinner thickness has high activity characteristic, the contact surface of the sheet with thicker thickness can be maintained after the sheet with thinner thickness is combined with the sheet with thicker thickness, and a copper film generated after the copper conductive paste is used has the characteristics of high compactness and high conductivity.
Description
Technical Field
The invention relates to a copper conductive paste suitable for xenon lamp sintering and a preparation method thereof.
Background
The solidified copper conductive paste is an important raw material in the printed circuit industry, and the use amount of the copper conductive paste is gradually increased along with the development of a xenon lamp sintering technology in recent years. The copper conductive paste contains flake copper powder, and compared with spherical copper powder, the contact area between flake copper powder materials is far larger than that between spherical copper powder. The flake copper powder has the characteristics of few defects, high point conductivity and difficult oxidation, but the copper conductive slurry in the prior art is difficult to sinter due to the thicker flake copper powder, namely the flake copper powder and the flake copper powder are difficult to be connected together without sintering within millisecond. In order to overcome the defect of difficult sintering, nanometer-scale particles with higher activity are doped among the flake copper powder to carry out auxiliary sintering in the prior art. Although the technical means solves the technical problem of difficult sintering between the flake copper powders to a certain extent, when the nano particles are positioned between two copper sheets in an unsintered state, the contact area between the flake copper powders can be greatly reduced, the compactness and the conductivity are influenced, and the advantage that the flake powder material has a larger contact area is seriously weakened.
Disclosure of Invention
The invention aims to solve the technical problem of how to reduce the sintering difficulty of flake copper powder under the condition of maintaining the contact amount between the flake copper powder, thereby obtaining the copper conductive paste suitable for xenon lamp sintering.
In order to solve the technical problems, the invention adopts the following technical scheme: the copper conductive paste comprises a copper powder main material, a sheet metal material for auxiliary sintering, an auxiliary agent, a binder and a solvent, wherein the surfaces of the copper powder main material and the sheet metal material for auxiliary sintering both contain modified organic matters, the modified organic matters are derived from the auxiliary agent, the binder and the solvent, the average thickness of the copper powder main material is 0.2-5 microns, the average sheet diameter is 2-25 microns, the average thickness of the sheet metal material for auxiliary sintering is 40-100 nanometers, the average sheet diameter is 2-30 microns,
the weight percentage of the copper powder main material is 45-70 wt%,
the weight percentage of the sheet metal material for auxiliary sintering is 5-30 wt%,
the weight percentage of the auxiliary agent is 0.1wt percent to 1wt percent,
the weight percentage of the adhesive is 0.5 wt% -2 wt%,
the weight percentage of the solvent is 10 wt% -30 wt%.
In the prior art, the influence of the diameter and the material type of the flaky powder on sintering is emphasized, and the influence of the thickness of the flaky powder on the sintering process based on the xenon lamp sintering technology is neglected. It is the technical prejudice that the prior art is limited to adopt the mode of changing the sheet diameter to reduce the sintering difficulty among the copper flake powders, or to mix or select other materials (nano materials in the prior art) to reduce the sintering difficulty among the copper flake powders through an auxiliary sintering mode. However, in the technical scheme, the technical problem can be solved based on the idea of adding thin sheet materials into thick sheet materials, and the thin sheet materials have high activity and are beneficial to welding between thick sheet materials in the xenon lamp sintering process. For example, when the copper powder main material is common flake copper powder, flake copper powder with thinner thickness is doped to solve the technical problem that thin copper powder is doped into thick copper powder, the copper powder main material is thick copper powder, and the flake metal material for auxiliary sintering is thin copper powder. Therefore, the technical scheme fully utilizes the characteristics of good stability of the thick sheet and high activity and easy sintering of the thin sheet in the xenon lamp sintering process. Along with the reduction of the thickness of the sheet, the xenon lamp energy required by sintering is reduced, which is more beneficial to the stable operation of the equipment, namely, under the condition of providing low xenon lamp sintering energy, the contact surface of the thick sheet-thin sheet-thick sheet can be fused, so that the sintering process is more stable. The sheet metal material for auxiliary sintering and the copper powder main material are both sheets, and the stacking structure obtained by mixing the two sheets is the same as the stacking structure of the sheets in the copper powder main material, so that even if the sheet metal material for auxiliary sintering between the copper powder main material is in an unsintered state, a sufficient contact surface between the sheet metal material for auxiliary sintering and the copper powder main material can be still ensured, namely the contact amount between the sheet metal material for auxiliary sintering and the copper powder main material is sufficient, and a copper film with high compactness and high conductivity can be obtained in use.
In the technical scheme, the copper powder main body material can be common flaky copper powder, and can also be one of flaky silver-coated copper powder, flaky copper oxide powder and flaky copper powder with an oxide layer on the surface.
In the technical scheme, the flake metal material for auxiliary sintering comprises one of copper oxide flakes, flake silver powder, flake copper powder, flake tin powder, flake gold powder, flake silver-coated copper powder and flake brass powder.
Preferably, the auxiliary agent is one of a leveling agent, a dispersing agent and a thixotropic agent or a combination of the leveling agent, the dispersing agent and the thixotropic agent.
Preferably, the binder is one of cellulose, polyurethane, epoxy resin, amino resin, polyvinylpyrrolidone, acrylic resin, gelatin, gum arabic, polyester resin, alkyd resin, or a combination thereof.
Preferably, the solvent is one of ethanol, ethylene glycol, diethylene glycol, triethylene glycol, ethylene glycol methyl ether, propylene glycol methyl ether acetate, isophorone, propylene glycol, isopropanol, diethylene glycol, ethylene glycol, triethylene glycol, terpineol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol, xylene, gum ester, diethylene glycol methyl ether, diethylene glycol butyl ether acetate, S100 aromatic solvent oil, white spirit, glycerol, and linear alkyl ether, or a combination thereof.
The copper conductive paste of the present invention is obtained by the following preparation method.
The preparation method of the copper conductive paste suitable for xenon lamp sintering,
firstly, 45-70 wt% of copper powder main body material with the average thickness of 0.2-5 microns and the average sheet diameter of 2-25 microns and 5-30 wt% of sheet metal material for auxiliary sintering with the average thickness of 40-100 nanometers and the average sheet diameter of 2-30 microns are mixed to obtain compound copper powder;
secondly, mixing 0.1 to 1 weight percent of auxiliary agent, 0.5 to 2 weight percent of adhesive and 10 to 30 weight percent of solvent, and stirring the obtained mixed solution at a high speed to obtain uniform mixed solution;
and step three, adding the compound copper powder into the mixed solution, and uniformly mixing to obtain the copper conductive slurry.
The invention adopts the technical scheme that: the copper conductive paste contains two sheets with average thickness, the defect that the sheet with thicker thickness is difficult to sinter is compensated by the fact that the sheet with thinner thickness has high activity characteristic, the contact surface of the sheet with thicker thickness can be maintained after the sheet with thinner thickness is combined with the sheet with thicker thickness, and a copper film generated after the copper conductive paste is used has the characteristics of high compactness and high conductivity.
Detailed Description
The first embodiment of the present invention.
The copper powder main material adopts flake copper powder, the average thickness of the flake copper powder is 0.2 micron, and the average flake diameter of the flake copper powder is 2 microns. The sheet metal material for auxiliary sintering adopts a copper oxide sheet, the average thickness of the copper oxide sheet is 40 nanometers, and the average sheet diameter of the copper oxide sheet is 2 micrometers. The auxiliary agent adopts a leveling agent. The adhesive is polyurethane. The solvent is one-to-one mixed solution of glycol and terpineol.
During preparation, firstly, 45 wt% of copper powder main material and 22.9 wt% of auxiliary sintering flaky metal material are mixed to obtain compound copper powder; then, mixing 0.1 wt% of auxiliary agent, 2 wt% of adhesive and 30 wt% of solvent, and stirring the obtained mixed solution at a high speed to obtain a uniform mixed solution; and finally, adding the compound copper powder into the mixed solution, and uniformly mixing by using a three-roller machine to obtain the copper conductive paste.
When the conductive paste is used, a copper film is obtained on a substrate by the copper conductive paste through a screen printing mode, preheating and drying are carried out for 3 minutes at the temperature of 30 ℃, and the average thickness of the dried copper film is 25 micrometers. Then, the obtained dried copper film was sintered by irradiation with a xenon lamp having an energy density of 10J/cm2。
The resistivity of the sintered copper film on the substrate was tested to be 60-80 micro-ohm cm. The adhesion was tested using the international standard ASTM D3359, grade 5B. At this point, the slab-slice-slab has melted so that the slab and slab sinter into one piece.
A second embodiment of the invention.
The copper powder main material adopts flake copper powder, the average thickness of the flake copper powder is 0.5 micron, and the average flake diameter of the flake copper powder is 5 microns. The flaky metal material for auxiliary sintering adopts flaky silver-coated copper powder, the average thickness of the flaky metal material is 60 nanometers, and the average sheet diameter of the flaky metal material is 6 micrometers. The auxiliary agent adopts a leveling agent. The adhesive is polyester resin. The solvent is one-to-one mixed solution of diethylene glycol butyl ether acetate and ethylene glycol methyl ether.
When in preparation, firstly, 70 weight percent of copper powder main material and 10 weight percent of auxiliary sintering flaky metal material are mixed to obtain compound copper powder; then, mixing 1 wt% of auxiliary agent, 2 wt% of adhesive and 17 wt% of solvent, and stirring the obtained mixed solution at a high speed to obtain a uniform mixed solution; and finally, adding the compound copper powder into the mixed solution, and uniformly mixing by using a three-roller machine to obtain the copper conductive paste.
When the conductive paste is used, a copper film is obtained on a substrate by the copper conductive paste through a screen printing mode, preheating and drying are carried out for 15 minutes at the temperature of 50 ℃, and the average thickness of the dried copper film is 40 micrometers. Then, the obtained dried copper film was sintered by irradiation with a xenon lamp having an energy density of 37.5J/cm2. The resistivity of the sintered copper film on the substrate was 30-60 micro-ohm cm by the test. The adhesion was tested using the international standard ASTM D3359, grade 5B. At this point, the slab-slice-slab has melted so that the slab and slab sinter into one piece.
The invention provides three embodiments.
The copper powder main material adopts flaky silver-coated copper powder, the average thickness of the flaky silver-coated copper powder is 1.3 micrometers, and the average flake diameter of the flaky silver-coated copper powder is 3.5 micrometers. The flaky metallic material for auxiliary sintering is flaky brass powder, the average thickness of the flaky metallic material is 90 nanometers, and the average sheet diameter of the flaky metallic material is 20 micrometers. The auxiliary agent adopts a leveling agent. The adhesive is acrylic resin. The solvent is one-to-one mixed solution of isophorone and ethylene glycol methyl ether.
When in preparation, firstly, 70 weight percent of copper powder main material and 20 weight percent of auxiliary sintering flaky metal material are mixed to obtain compound copper powder; then, mixing 1 wt% of auxiliary agent, 2 wt% of adhesive and 7 wt% of solvent, and stirring the obtained mixed solution at high speed to obtain a uniform mixed solution; and finally, adding the compound copper powder into the mixed solution, and uniformly mixing by using a three-roller machine to obtain the copper conductive paste.
When the conductive paste is used, a copper film is obtained on a substrate by the copper conductive paste through a screen printing mode, preheating and drying are carried out for 5 minutes at the temperature of 40 ℃, and the average thickness of the dried copper film is 20 micrometers. Then, the obtained dried copper film was sintered by irradiation with a xenon lamp having an energy density of 12.5J/cm2。
The resistivity of the sintered copper film on the substrate was 20-30 micro-ohm cm by the test. The adhesion was tested using the international standard ASTM D3359, grade 5B. At this point, the slab-slice-slab has melted so that the slab and slab sinter into one piece.
Four embodiments of the invention.
The copper powder main material adopts flake copper powder, the average thickness of the flake copper powder is 4 microns, and the average flake diameter of the flake copper powder is 7.5 microns. The flake metal material for auxiliary sintering is flake silver powder, and the average thickness of the flake silver powder is 90 nanometers, and the average flake diameter of the flake silver powder is 15 micrometers. The auxiliary agent adopts a leveling agent. The adhesive is alkyd resin. The solvent is one-to-one mixed solution of ethylene glycol monoethyl ether and diethylene glycol.
During preparation, firstly, 65 wt% of copper powder main material and 25 wt% of auxiliary sintering flaky metal material are mixed to obtain compound copper powder; then, mixing 1 wt% of auxiliary agent, 2 wt% of adhesive and 7 wt% of solvent, and stirring the obtained mixed solution at high speed to obtain a uniform mixed solution; and finally, adding the compound copper powder into the mixed solution, and uniformly mixing by using a three-roller machine to obtain the copper conductive paste.
When the conductive paste is used, a copper film is obtained on a substrate by the copper conductive paste through a screen printing mode, preheating and drying are carried out for 15 minutes at the temperature of 65 ℃, and the average thickness of the dried copper film is 40 micrometers. Then, the obtained dried copper film was sintered by irradiation with a xenon lamp having an energy density of 37.5J/cm2。
The resistivity of the sintered copper film on the substrate was 10-20 micro-ohm cm by the test. The adhesion was tested using the international standard ASTM D3359, grade 5B. At this point, the slab-slice-slab has melted so that the slab and slab sinter into one piece.
The invention has five embodiments.
The copper powder main material adopts flake copper powder, the average thickness of the flake copper powder is 3.5 microns, and the average flake diameter of the flake copper powder is 12.5 microns. The flaky metal material for auxiliary sintering adopts flaky silver-coated copper powder, the average thickness of which is 90 nanometers, and the average sheet diameter of which is 25 micrometers. The auxiliary agent adopts a leveling agent. The adhesive adopts polyvinylpyrrolidone. The solvent is one-to-one mixed solution of propylene glycol methyl ether acetate and diethylene glycol.
When in preparation, firstly, 55 weight percent of copper powder main material and 30 weight percent of auxiliary sintering flaky metal material are mixed to obtain compound copper powder; then, 0.2 wt% of auxiliary agent, 1.3 wt% of adhesive and 13.5 wt% of solvent are mixed, and the obtained mixed solution is stirred at high speed to obtain uniform mixed solution; and finally, adding the compound copper powder into the mixed solution, and uniformly mixing by using a three-roller machine to obtain the copper conductive paste.
When the conductive paste is used, a copper film is obtained on a substrate by the copper conductive paste through a screen printing mode, preheating and drying are carried out for 6 minutes at the temperature of 40 ℃, and the average thickness of the dried copper film is 20 micrometers. Then, the obtained dried copper film was sintered by irradiation with a xenon lamp having an energy density of 12.5J/cm2。
The resistivity of the sintered copper film on the substrate was tested to be 60-80 micro-ohm cm. The adhesion was tested using the international standard ASTM D3359, grade 5B. At this point, the slab-slice-slab has melted so that the slab and slab sinter into one piece.
A sixth embodiment of the present invention.
The copper powder main material adopts flake copper powder, the average thickness of the flake copper powder is 5 microns, and the average flake diameter of the flake copper powder is 25 microns. The sheet metal material for auxiliary sintering is a copper oxide sheet, the average thickness of which is 100 nanometers and the average sheet diameter of which is 30 micrometers. The auxiliary agent adopts a leveling agent. The adhesive is polyurethane. The solvent is one-to-one mixed solution of glycol and terpineol.
When in preparation, firstly, 70 weight percent of copper powder main material and 5 weight percent of auxiliary sintering flaky metal material are mixed to obtain compound copper powder; then, mixing 0.5 wt% of auxiliary agent, 0.5 wt% of adhesive and 24 wt% of solvent, and stirring the obtained mixed solution at a high speed to obtain a uniform mixed solution; and finally, adding the compound copper powder into the mixed solution, and uniformly mixing by using a three-roller machine to obtain the copper conductive paste.
When in use, the copper conductive paste is subjected to screen printingThe method comprises the steps of obtaining a copper film on a substrate, preheating and drying the copper film at the temperature of 45 ℃ for 5 minutes, wherein the average thickness of the dried copper film is 35 microns. Then, the obtained dried copper film was sintered by irradiation with a xenon lamp having an energy density of 13J/cm2。
The resistivity of the copper film after sintering on the substrate was 25-50 micro-ohm cm by the test. The adhesion was tested using the international standard ASTM D3359, grade 5B. At this point, the slab-slice-slab has melted so that the slab and slab sinter into one piece.
A seventh embodiment of the invention.
The copper powder main material adopts flake copper powder, the average thickness of the flake copper powder is 3 microns, and the average flake diameter of the flake copper powder is 18 microns. The sheet metal material for auxiliary sintering was a copper oxide sheet having an average thickness of 55 nm and an average sheet diameter of 10 μm. The auxiliary agent adopts a leveling agent. The adhesive is polyurethane. The solvent is one-to-one mixed solution of glycol and terpineol.
During preparation, firstly, 69 wt% of copper powder main material and 20 wt% of auxiliary sintering flaky metal material are mixed to obtain compound copper powder; then, mixing 0.5 wt% of auxiliary agent, 0.5 wt% of adhesive and 10 wt% of solvent, and stirring the obtained mixed solution at high speed to obtain a uniform mixed solution; and finally, adding the compound copper powder into the mixed solution, and uniformly mixing by using a three-roller machine to obtain the copper conductive paste.
When the conductive paste is used, a copper film is obtained on a substrate by the copper conductive paste through a screen printing mode, preheating and drying are carried out for 5 minutes at the temperature of 45 ℃, and the average thickness of the dried copper film is 35 micrometers. Then, the obtained dried copper film was sintered by irradiation with a xenon lamp having an energy density of 13J/cm2。
The resistivity of the copper film after sintering on the substrate was 25-50 micro-ohm cm by the test. The adhesion was tested using the international standard ASTM D3359, grade 5B. At this point, the slab-slice-slab has melted so that the slab and slab sinter into one piece.
In the above embodiments, the copper powder main material may also be flake copper oxide powder or flake copper powder with an oxide layer on the surface, thereby obtaining corresponding embodiments.
In the above embodiments, the flake-shaped copper powder, flake-shaped tin powder, or flake-shaped gold powder may be used as the flake-shaped metal material for sintering assistance, thereby obtaining the corresponding embodiments.
In the above embodiments, the assistant may also be a dispersant or a thixotropic agent, or a combination of a leveling agent and a dispersant, a leveling agent and a thixotropic agent, or a dispersant and a thixotropic agent, thereby obtaining corresponding embodiments.
In the above embodiments, the adhesive may also use one or a combination of cellulose, polyurethane, epoxy resin, amino resin, polyvinylpyrrolidone, acrylic resin, gelatin, gum arabic, polyester resin, alkyd resin, thereby obtaining the corresponding embodiments.
In each of the above examples, the solvent may be one of ethanol, ethylene glycol, diethylene glycol, triethylene glycol, ethylene glycol methyl ether, propylene glycol methyl ether acetate, isophorone, propylene glycol, isopropyl alcohol, diethylene glycol, ethylene glycol, triethylene glycol, terpineol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol, xylene, gum ester, diethylene glycol methyl ether, diethylene glycol butyl ether acetate, S100 aromatic solvent oil, white spirit, glycerin, and linear alkyl ether, or a combination thereof, to obtain the corresponding example.
Claims (7)
1. The copper conductive paste suitable for xenon lamp sintering is characterized in that:
the copper conductive paste comprises a copper powder main material, a sheet metal material for auxiliary sintering, an auxiliary agent, a binder and a solvent, wherein the surfaces of the copper powder main material and the sheet metal material for auxiliary sintering both contain modified organic matters, the average thickness of the copper powder main material is 0.2-5 microns, the average sheet diameter is 2-25 microns, the average thickness of the sheet metal material for auxiliary sintering is 40-100 nanometers, the average sheet diameter is 2-30 microns,
the weight percentage of the copper powder main material is 45-70 wt%,
the weight percentage of the sheet metal material for auxiliary sintering is 5-30 wt%,
the weight percentage of the auxiliary agent is 0.1wt percent to 1wt percent,
the weight percentage of the adhesive is 0.5 wt% -2 wt%,
the weight percentage of the solvent is 10 wt% -30 wt%.
2. The copper conductive paste suitable for xenon lamp sintering according to claim 1, wherein: the copper powder main body material comprises one of flake copper powder, flake silver-coated copper powder, flake copper oxide powder and flake copper powder with an oxide layer on the surface.
3. The copper conductive paste suitable for xenon lamp sintering according to claim 1, wherein: the flake metal material for auxiliary sintering comprises one of copper oxide flake, silver flake, copper flake, tin flake, gold flake, silver-coated flake and brass flake.
4. The copper conductive paste suitable for xenon lamp sintering according to claim 1, wherein: the auxiliary agent is one or the combination of a flatting agent, a dispersing agent and a thixotropic agent.
5. The copper conductive paste suitable for xenon lamp sintering according to claim 1, wherein: the adhesive is one or the combination of cellulose, polyurethane, epoxy resin, amino resin, polyvinylpyrrolidone, acrylic resin, gelatin, gum arabic, polyester resin, alkyd resin and alkyd resin.
6. The copper conductive paste suitable for xenon lamp sintering according to claim 1, wherein: the solvent is one or the combination of ethanol, ethylene glycol, diethylene glycol, triethylene glycol, ethylene glycol methyl ether, propylene glycol methyl ether acetate, isophorone, propylene glycol, isopropanol, diethylene glycol, ethylene glycol, triethylene glycol, terpineol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol, xylene, gum ester, diethylene glycol methyl ether, diethylene glycol butyl ether acetate, S100 aromatic solvent oil, petroleum solvent oil, glycerol and linear alkyl ether.
7. A preparation method of copper conductive paste suitable for xenon lamp sintering is characterized by comprising the following steps:
firstly, 45-70 wt% of copper powder main body material with the average thickness of 0.2-5 microns and the average sheet diameter of 2-25 microns and 5-30 wt% of sheet metal material for auxiliary sintering with the average thickness of 40-100 nanometers and the average sheet diameter of 2-30 microns are mixed to obtain compound copper powder;
secondly, mixing 0.1 to 1 weight percent of auxiliary agent, 0.5 to 2 weight percent of adhesive and 10 to 30 weight percent of solvent, and stirring the obtained mixed solution at a high speed to obtain uniform mixed solution;
and step three, adding the compound copper powder into the mixed solution, and uniformly mixing to obtain the copper conductive slurry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810186271.9A CN108550417B (en) | 2018-03-07 | 2018-03-07 | Copper conductive paste suitable for xenon lamp sintering and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810186271.9A CN108550417B (en) | 2018-03-07 | 2018-03-07 | Copper conductive paste suitable for xenon lamp sintering and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108550417A CN108550417A (en) | 2018-09-18 |
| CN108550417B true CN108550417B (en) | 2020-01-14 |
Family
ID=63516422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810186271.9A Active CN108550417B (en) | 2018-03-07 | 2018-03-07 | Copper conductive paste suitable for xenon lamp sintering and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108550417B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111276296B (en) * | 2020-03-05 | 2021-08-31 | 南京理工大学 | Conductive silver paste composite sintering method and device |
| CN115642000B (en) * | 2022-12-23 | 2023-04-07 | 西北工业大学 | Preparation method of conductive copper paste capable of being subjected to photon sintering |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1745437A (en) * | 2002-05-17 | 2006-03-08 | 日立化成工业株式会社 | Conductive paste |
| CN103021512A (en) * | 2011-09-21 | 2013-04-03 | 三星电机株式会社 | Conductive paste composition for low temperature firing |
| CN104900297A (en) * | 2014-03-07 | 2015-09-09 | 湖南利德电子浆料股份有限公司 | Copper conductive slurry for radio frequency identification (RFID) tag and preparation method thereof |
| CN105225723A (en) * | 2015-10-26 | 2016-01-06 | 东莞市圣龙特电子科技有限公司 | A kind of copper electrocondution slurry and preparation method thereof |
| CN106981324A (en) * | 2017-04-26 | 2017-07-25 | 上海安缔诺科技有限公司 | A kind of copper electrocondution slurry and its production and use |
-
2018
- 2018-03-07 CN CN201810186271.9A patent/CN108550417B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1745437A (en) * | 2002-05-17 | 2006-03-08 | 日立化成工业株式会社 | Conductive paste |
| CN103021512A (en) * | 2011-09-21 | 2013-04-03 | 三星电机株式会社 | Conductive paste composition for low temperature firing |
| CN104900297A (en) * | 2014-03-07 | 2015-09-09 | 湖南利德电子浆料股份有限公司 | Copper conductive slurry for radio frequency identification (RFID) tag and preparation method thereof |
| CN105225723A (en) * | 2015-10-26 | 2016-01-06 | 东莞市圣龙特电子科技有限公司 | A kind of copper electrocondution slurry and preparation method thereof |
| CN106981324A (en) * | 2017-04-26 | 2017-07-25 | 上海安缔诺科技有限公司 | A kind of copper electrocondution slurry and its production and use |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108550417A (en) | 2018-09-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10529873B2 (en) | Aging resistant backside silver paste for crystalline silicon solar cells and preparation method thereof | |
| TWI583264B (en) | Conductive structure and manufacturing method, conductive composition, and electronic component module | |
| KR101207363B1 (en) | Composition for Conductive Paste Containing Nanometer-Thick Metal Microplates | |
| US20120219787A1 (en) | Conductive metal paste composition and method of manufacturing the same | |
| KR101246750B1 (en) | Composition for Conductive Paste Containing Nanometer-Thick Metal Microplates with Surface-Modifying Metal Nanoparticles | |
| TW201349253A (en) | Low silver content paste composition and method of making a conductive film therefrom | |
| JP2004362950A (en) | Conductive paste mainly composed of silver powder, and its manufacturing method | |
| WO2003038838A1 (en) | Ag COMPOUND PASTE | |
| CN108550417B (en) | Copper conductive paste suitable for xenon lamp sintering and preparation method thereof | |
| CN111468713B (en) | Nickel slurry for electronic cigarette atomization core and preparation method thereof | |
| EP2447954B1 (en) | Paste composition for front electrode of solar cell, and solar sell including the same | |
| CN112768112B (en) | Electronic paste and preparation method thereof | |
| CN114334216B (en) | Thick film conductor paste | |
| JPWO2014073530A1 (en) | Conductive paste composition | |
| KR20060120258A (en) | Conductive paste for multilayer ceramic electronic component and method for producing multilayer unit for multilayer ceramic electronic component | |
| JP3879749B2 (en) | Conductive powder and method for producing the same | |
| JP2007103845A (en) | Conductive paste for laminated ceramic component terminal electrode | |
| WO2020153101A1 (en) | Electroconductive paste, substrate equipped with electroconductive film, and method for manufacturing substrate equipped with electroconductive film | |
| KR20120004122A (en) | Electrode paste and electrode using the same | |
| JP2004228094A (en) | Terminal electrode composition material for multi-layer ceramic capacitor | |
| JP2018152218A (en) | Conductive paste, chip electronic component and method for producing the same | |
| WO2019005452A1 (en) | Copper-containing thick print electroconductive pastes | |
| TW201910449A (en) | Conductive paste | |
| KR102495578B1 (en) | Silver microparticle dispersion | |
| JP4615987B2 (en) | Metal paste and method for producing conductive film using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |