CN108443846A - A kind of cooling stand for LED chip installation base plate - Google Patents
A kind of cooling stand for LED chip installation base plate Download PDFInfo
- Publication number
- CN108443846A CN108443846A CN201810311266.6A CN201810311266A CN108443846A CN 108443846 A CN108443846 A CN 108443846A CN 201810311266 A CN201810311266 A CN 201810311266A CN 108443846 A CN108443846 A CN 108443846A
- Authority
- CN
- China
- Prior art keywords
- plastic substrate
- lateral
- support frame
- frame
- fitting groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
- F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to LED chip installation ancillary technique fields, a kind of especially cooling stand for LED chip installation base plate, a left side including plastic substrate, on the left of plastic substrate sets metal connection frame and sets metal with the right side on the right side of plastic substrate and connect frame, and interconnected lateral fitting groove is offered on plastic substrate lateral surface.A kind of cooling stand for LED chip installation base plate of the present invention connects the lateral fitting groove of frame, lateral support frame and bottom support frame by being opened up in plastic substrate periphery for installing fixed metal, and it is fixed with plastic substrate by splicing lateral support frame and bottom support frame, the heat dissipation performance of plastic substrate is not only improved using integral structure bottom heat radiation supporting plate, but also the rigidity for keeping it whole is strengthened.
Description
Technical field
The present invention relates to LED chip installation ancillary technique field, especially a kind of heat dissipations for LED chip installation base plate
Holder.
Background technology
LED is the abbreviation of English light emitting diode (light emitting diode), is a kind of solid semiconductor device
Part, the heart of LED are the chips of a semiconductor, and one end of chip is attached on a holder, and one end is cathode, other end connection
The anode of power supply makes entire chip by epoxy encapsulation.Its major function is：Electric energy is converted into luminous energy, chip
Main material is monocrystalline silicon.Semiconductor wafer consists of two parts, and a part is P-type semiconductor, and hole accounts for leading inside it
Status, the other end are N-type semiconductors, are mainly electronics in this side.But when both semiconductors connect, between them
With regard to forming a P-N junction.When electric current acts on this chip by conducting wire, electronics will be pushed to the areas P, in the areas P
Then electronics will send out energy with hole-recombination in the form of photon, here it is the principles that LED shines.And the wavelength of light
It is exactly the color of light, is determined by the material of formation P-N junction.Its basic structure is one block of electroluminescent semi-conducting material
Then chip uses silver wire or gold thread to connect chip and circuit board, then surrounding epoxy on elargol or latex solidified to holder
Resin seal plays the role of protecting internal core, finally installs shell, but currently used for installing the plastic cement base of LED chip
Harden structure is simple, and heat dissipation performance is than relatively limited, and integral rigidity is poor.
Invention content
The technical problem to be solved by the present invention is to：In order to solve the problems, such as above-mentioned background technology, one kind is provided and is changed
Into the cooling stand for LED chip installation base plate, solve currently used for install LED chip plastic substrate it is simple in structure,
Heat dissipation performance is than relatively limited, and the problem that integral rigidity is poor.
The technical solution adopted by the present invention to solve the technical problems is：A kind of heat dissipation for LED chip installation base plate
Holder, including plastic substrate, the left side on the left of plastic substrate set metal connection frame and the right side on the right side of plastic substrate
Metal connection frame is set, interconnected lateral fitting groove, the plastic cement base are offered on the plastic substrate lateral surface
Plate lower surface is located at preposition and postposition marginal position and offers the bottom support slot being connected with inside lateral fitting groove, described
A left side set metal connection frame by being mutually clamped with plastic substrate inside the lateral fitting groove that is inserted on the left of plastic substrate, the right side
It sets metal connection frame and is mutually clamped with plastic substrate by being inserted into the lateral fitting groove inside on the right side of plastic substrate, metal is set on the left side
Connection frame right side both ends, which are located at, all has an integral structure left side raised to the right inside the lateral fitting groove of the forward and backward side of plastic substrate
Lateral support frame is set, the right side is set metal connection frame left side both ends and is located inside the lateral fitting groove of the forward and backward side of plastic substrate
It all has the to the left raised integral structure right side and sets lateral support frame, position in the lateral fitting groove of the forward and backward side of plastic substrate
It is both provided with bottom support frame between lateral support frame is set on a left side and lateral support frame is set on the right side, the bottom support frame both ends are equal
With the pilot hole to lateral protrusions, lateral support frame right side is set on the left side and the right side sets lateral support frame left side and corresponds to dress
Assembly inserted block is all had with hole site, the plastic substrate lower end is provided with bottom heat radiation supporting plate, the bottom heat radiation support
Plate is fixedly connected with corresponding position bottom support frame lower surface respectively by the copper bottom bracket in both sides, the bottom heat radiation support
Plate, bottom support frame and copper bottom bracket are structure as a whole.
Further, the bottom support frame lower surface offers the internal gelled radiating groove of tool.
Further, the left side sets metal connection frame and the right side and sets metal to connect frame size identical.
Further, metal connection frame left side is set on the left side, metal connection frame right side is set on the right side, lateral support is set on a left side
Outer frame side, the right side, which are set lateral support outer frame side and bottom support frame lateral surface and plastic substrate lateral surface and be located at, is same as plane.
The invention has the advantages that a kind of cooling stand for LED chip installation base plate of the present invention is by moulding
Glue substrate peripheral opens up the lateral fitting groove for installing fixed metal connection frame, lateral support frame and bottom support frame, and
It is fixed with plastic substrate by splicing lateral support frame and bottom support frame, is not only carried using integral structure bottom heat radiation supporting plate
The heat dissipation performance of plastic substrate is risen, and the rigidity for keeping it whole is strengthened.
Description of the drawings
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is the structural schematic diagram of the present invention.
Fig. 2 is the upward view of the present invention.
In figure:1. plastic substrate, metal connection frame is set on 2. left sides, and metal connection frame, 4. lateral fitting grooves, 5. bottoms are set in 3. right sides
Lateral support frame is set on support slot, 6. left sides, and lateral support frame is set on 7. right sides, and 8. bottom support frames, 9. pilot holes, 10. assemble inserted blocks,
11. bottom heat radiation supporting plate, 12. copper bottom brackets, 13. radiating grooves.
Specific implementation mode
In conjunction with the accompanying drawings, the present invention is further explained in detail.These attached drawings are simplified schematic diagram, only with
Illustration illustrates the basic structure of the present invention, therefore it only shows the composition relevant to the invention.
Fig. 1 and a kind of cooling stand for LED chip installation base plate shown in Fig. 2, including plastic substrate 1, be mounted on
The left side in the left side of plastic substrate 1, which sets metal connection frame 2 and sets metal with the right side mounted on 1 right side of plastic substrate, connects frame 3, plastic substrate
Interconnected lateral fitting groove 4 is offered on 1 lateral surface, 1 lower surface of plastic substrate is located at preposition and postposition marginal position
The bottom support slot 5 being connected with inside lateral fitting groove 4 is offered, metal connection frame 2 is set by being inserted into plastic substrate 1 in a left side
4 inside of lateral fitting groove in left side is mutually clamped with plastic substrate 1, and metal connection frame 3 is set by being inserted into 1 right side of plastic substrate in the right side
4 inside of lateral fitting groove is mutually clamped with plastic substrate 1, and a left side sets metal and connects 2 right side both ends of frame to be located at plastic substrate 1 forward and backward
An integral structure left side raised to the right is all had inside the lateral fitting groove 4 of side and sets lateral support frame 6, and it is left that metal connection frame 3 is set on the right side
Side both ends, which are located at, to be all had the to the left raised integral structure right side and sets laterally inside the lateral fitting groove 4 of 1 forward and backward side of plastic substrate
Support frame 7, the lateral fitting groove 4 of 1 forward and backward side of plastic substrate are internally located at that lateral support frame 6 is set on a left side and lateral support frame 7 is set on the right side
Between be both provided with bottom support frame 8, support frame 8 both ends in bottom all have the pilot hole 9 to lateral protrusions, and lateral support is set on a left side
6 right side of frame and the right side set 7 left side of lateral support frame correspond to 9 position of pilot hole all have assembly inserted block 10,1 lower end of plastic substrate
Be provided with bottom heat radiation supporting plate 11, bottom heat radiation supporting plate 11 by the copper bottom bracket in both sides 12 respectively with corresponding position bottom branch
8 lower surface of support frame is fixedly connected, and bottom heat radiation supporting plate 11, bottom support frame 8 and copper bottom bracket 12 are structure as a whole.
Further, support frame 8 lower surface in bottom offers the internal gelled radiating groove 13 of tool, further,
A left side sets metal connection frame 2 and the right side and sets metal connect 3 size of frame identical, and further, a left side sets that metal connects 2 left side of frame, the right side is set
3 right side of metal connection frame, 6 lateral surface of lateral support frame is set on a left side, the right side is set outside 7 lateral surface of lateral support frame and bottom support frame 8
Side is located at 1 lateral surface of plastic substrate is same as plane, and a kind of cooling stand for LED chip installation base plate of the invention is logical
It crosses and opens up the lateral assembly for installing fixed metal connection frame, lateral support frame and bottom support frame 8 in 1 periphery of plastic substrate
Slot 4, and fixed with plastic substrate 1 by splicing lateral support frame and bottom support frame 8, utilize integral structure bottom heat radiation
Supporting plate 11 not only improves the heat dissipation performance of plastic substrate 1, but also the rigidity for keeping it whole is strengthened.
It is enlightenment with above-mentioned desirable embodiment according to the present invention, through the above description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention
Property range is not limited to the contents of the specification, it is necessary to determine its technical scope according to right.
Claims (4)
1. a kind of cooling stand for LED chip installation base plate, including plastic substrate (1), it is mounted on the left of plastic substrate (1)
A left side set metal connection frame (2) and set metal with the right side on the right side of the plastic substrate (1) and connect frame (3), it is characterized in that：Described
Interconnected lateral fitting groove (4), the plastic substrate (1) lower surface position are offered on plastic substrate (1) lateral surface
It is offered and the internal bottom support slot (5) being connected of lateral fitting groove (4), the left side in preposition and postposition marginal position
It sets metal connection frame (2) and is mutually clamped with plastic substrate (1) by being inserted into lateral fitting groove (4) inside on the left of plastic substrate (1),
Metal connection frame (3) is set on the right side, and by being inserted into, lateral fitting groove (4) on the right side of plastic substrate (1) is internal and plastic substrate
(1) it is mutually clamped, the lateral fitting groove that metal connection frame (2) right side both ends are located at plastic substrate (1) forward and backward side is set on the left side
(4) lateral support frame (6) is set on the internal integral structure left side for all having protrusion to the right, and metal connection frame (3) left side is set on the right side
It sets laterally on the internal integral structure right side for all having protrusion to the left of lateral fitting groove (4) that both ends are located at plastic substrate (1) forward and backward side
Support frame (7), the lateral fitting groove (4) of the forward and backward side of the plastic substrate (1) are internally located at a left side and set lateral support frame (6) and the right side
It sets and is both provided with bottom support frame (8) between lateral support frame (7), described bottom support frame (8) both ends all have to lateral
The pilot hole (9) of protrusion, lateral support frame (6) right side is set on the left side and the right side sets lateral support frame (7) left side and corresponds to dress
Distribution (9) position all has assembly inserted block (10), and the plastic substrate (1) lower end is provided with bottom heat radiation supporting plate (11), institute
The bottom heat radiation supporting plate (11) stated by the copper bottom bracket in both sides (12) respectively with corresponding position bottom support frame (8) lower surface
It is fixedly connected, the bottom heat radiation supporting plate (11), bottom support frame (8) and copper bottom bracket (12) are structure as a whole.
2. a kind of cooling stand for LED chip installation base plate according to claim 1, it is characterized in that：The bottom
Portion's support frame (8) lower surface offers the internal gelled radiating groove (13) of tool.
3. a kind of cooling stand for LED chip installation base plate according to claim 1, it is characterized in that：The left side
Metal connection frame (2) is set with the right side to set metal to connect frame (3) size identical.
4. a kind of cooling stand for LED chip installation base plate according to claim 1, it is characterized in that：The left side
Set metal connection frame (2) left side, metal connection frame (3) right side is set on the right side, lateral support frame (6) lateral surface is set on a left side, side is set on the right side
It is located to support frame (7) lateral surface and bottom support frame (8) lateral surface with plastic substrate (1) lateral surface and is same as plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810311266.6A CN108443846B (en) | 2018-04-09 | 2018-04-09 | Heat dissipation support for LED chip mounting substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810311266.6A CN108443846B (en) | 2018-04-09 | 2018-04-09 | Heat dissipation support for LED chip mounting substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108443846A true CN108443846A (en) | 2018-08-24 |
| CN108443846B CN108443846B (en) | 2020-08-11 |
Family
ID=63198906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810311266.6A Active CN108443846B (en) | 2018-04-09 | 2018-04-09 | Heat dissipation support for LED chip mounting substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108443846B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08139218A (en) * | 1994-11-08 | 1996-05-31 | Hitachi Ltd | Hybrid integrated circuit device and its manufacture |
| CN201749865U (en) * | 2010-03-03 | 2011-02-16 | 宋文恭 | LED heat dissipation structure |
| CN103390714A (en) * | 2013-07-10 | 2013-11-13 | 陕西光电科技有限公司 | Integral type LED (Light Emitting Diode) encapsulation structure and method |
| CN107842522A (en) * | 2017-12-07 | 2018-03-27 | 张家港市三利密封合金材料有限公司 | A kind of split type pump seal with sealing oil duct |
| CN208332212U (en) * | 2018-04-09 | 2019-01-04 | 澳洋集团有限公司 | A kind of cooling stand for LED chip installation base plate |
-
2018
- 2018-04-09 CN CN201810311266.6A patent/CN108443846B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08139218A (en) * | 1994-11-08 | 1996-05-31 | Hitachi Ltd | Hybrid integrated circuit device and its manufacture |
| CN201749865U (en) * | 2010-03-03 | 2011-02-16 | 宋文恭 | LED heat dissipation structure |
| CN103390714A (en) * | 2013-07-10 | 2013-11-13 | 陕西光电科技有限公司 | Integral type LED (Light Emitting Diode) encapsulation structure and method |
| CN107842522A (en) * | 2017-12-07 | 2018-03-27 | 张家港市三利密封合金材料有限公司 | A kind of split type pump seal with sealing oil duct |
| CN208332212U (en) * | 2018-04-09 | 2019-01-04 | 澳洋集团有限公司 | A kind of cooling stand for LED chip installation base plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108443846B (en) | 2020-08-11 |
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