CN108613025A - Set convertible heat dissipation mounting bracket in a kind of bottom for LED chip component - Google Patents
Set convertible heat dissipation mounting bracket in a kind of bottom for LED chip component Download PDFInfo
- Publication number
- CN108613025A CN108613025A CN201810399803.7A CN201810399803A CN108613025A CN 108613025 A CN108613025 A CN 108613025A CN 201810399803 A CN201810399803 A CN 201810399803A CN 108613025 A CN108613025 A CN 108613025A
- Authority
- CN
- China
- Prior art keywords
- heat radiation
- holder
- plate
- heat dissipation
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
- F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to LED radiating subassembly technical fields, especially convertible heat dissipation mounting bracket is set at a kind of bottom for LED chip component, including a left side set metal holder, it is right set metal holder and with the left and right plastic substrate for setting metal holder injection molding, plastic substrate upper surface center offers the main mounting groove of installation LED chip.Convertible heat dissipation mounting bracket is set at a kind of bottom for LED chip component of the present invention has heat dissipation supporting plate, bottom heat radiation plate and the copper bottom heat radiation holder of X-type structure for overturning connecting lateral plate by being connected and fixed on the left and right connecting plate for setting metal holder lower end, so that the heat dissipation performance of LED chip component greatly promotes, and radiating mode is more diversified, a variety of radiators can be adapted to, the scope of application is very extensive.
Description
Technical field
The present invention relates to LED radiating subassembly technical fields, especially a kind of bottoms for LED chip component to set convertible dissipate
Hot mounting bracket.
Background technology
LED is the abbreviation of English light emitting diode (light emitting diode), is a kind of solid semiconductor device
Part, the heart of LED are the chips of a semiconductor, and one end of chip is attached on a holder, and one end is cathode, other end connection
The anode of power supply makes entire chip by epoxy encapsulation.Its major function is：Electric energy is converted into luminous energy, chip
Main material is monocrystalline silicon.Semiconductor wafer consists of two parts, and a part is P-type semiconductor, and hole accounts for leading inside it
Status, the other end are N-type semiconductors, are mainly electronics in this side.But when both semiconductors connect, between them
With regard to forming a P-N junction.When electric current acts on this chip by conducting wire, electronics will be pushed to the areas P, in the areas P
Then electronics will send out energy with hole-recombination in the form of photon, here it is the principles that LED shines.And the wavelength of light
It is exactly the color of light, is determined by the material of formation P-N junction.Its basic structure is one block of electroluminescent semi-conducting material
Then chip uses silver wire or gold thread to connect chip and circuit board, then surrounding epoxy on elargol or latex solidified to holder
Resin seal plays the role of protecting internal core, finally installs shell, but current plastic substrate is simple in structure, heat dissipation
Mode is single, can not also install mating radiator, and heat dissipation performance is caused to compare limitation.
Invention content
The technical problem to be solved by the present invention is to：In order to solve the problems, such as above-mentioned background technology, one kind is provided and is changed
Into the bottom for LED chip component set convertible heat dissipation mounting bracket, it is simple in structure to solve current plastic substrate, heat dissipation side
Formula is single, the problem of can not also installing mating radiator, heat dissipation performance is caused to compare limitation.
The technical solution adopted by the present invention to solve the technical problems is：Overturning is set at a kind of bottom for LED chip component
Formula heat dissipation mounting bracket, including metal holder is set on a left side, metal holder is set on the right side and sets metal holder injection molding with left and right
Plastic substrate, the plastic substrate upper surface center offer installation LED chip main mounting groove, the plastic cement
Upper surface of base plate is located at main mounting groove periphery and offers L-type structure metallic channel, and the plastic substrate upper surface is located at main installation
Slot right side opening is equipped with the point glue groove for being connected to main mounting groove and metallic channel, and the plastic substrate lower surface is provided with X-type knot
The copper bottom heat radiation holder of structure, the integral structure that the bottom heat radiation holder two side front and back ends all have outwardly convex connect
Connect card column, the left side, which sets metal holder and all has downwardly convex integral structure with right side metal holder lower surface, to be connected
Plate, the connecting plate are correspondingly connected with card column position and offer and connect the matched connection through-hole of card column, the bottom
Cooling stand is caught in inside connection through-hole by both ends connection card column and is connected and fixed respectively with left and right metal holder of setting, described
Bottom heat radiation holder lower surface have downwardly convex integral structure bottom heat radiation plate, the bottom heat radiation plate lower end opens up
There are two the fitting groove of built-in connecting shaft, overturning connecting lateral plate, the overturning are both provided on the outside of the bottom heat radiation plate
Connecting lateral plate is sleeved on by top connecting cylinder in connecting shaft and corresponding position fitting groove is flexibly connected, the overturning connecting lateral plate
Far from the limit support board having on bottom heat radiation plate side for limiting overturning connecting lateral plate maximum flip angle.
Further, the left side sets metal holder and the right side to set metal holder size identical.
Further, the bottom heat radiation rack upper surface corresponds to main installation groove location and all has integral structure heat dissipation support
Plate.
Further, it is offered with bottom heat radiation holder corresponding position on the overturning connecting lateral plate scattered for installing
The internal thread through hole of Hot-air fan.
The invention has the advantages that convertible heat dissipation installation branch is set at a kind of bottom for LED chip component of the present invention
Frame has heat dissipation supporting plate, bottom heat radiation plate and overturning by being connected and fixed on the left and right connecting plate for setting metal holder lower end
The copper bottom heat radiation holder of X-type structure of connecting lateral plate so that the heat dissipation performance of LED chip component greatly promotes, and radiates
Mode is more diversified, can be adapted to a variety of radiators, and the scope of application is very extensive.
Description of the drawings
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is the structural schematic diagram of the present invention.
Fig. 2 is the upward view of the present invention.
In figure:1. metal holder is set on a left side, metal holder, 3. plastic substrates, 4. main mounting grooves, 5. conducting wires are set in 2. right sides
Slot, 6. glue grooves, 7. bottom heat radiation holders, 8. connection card columns, 9. connecting plates, 10. connection through-holes, 11. bottom heat radiation plates, 12.
Connecting shaft, 13. fitting grooves, 14. overturning connecting lateral plates, 15. top connecting cylinders, 16. limit support boards, 17. heat dissipation supporting plates, 18.
Internal thread through hole.
Specific implementation mode
In conjunction with the accompanying drawings, the present invention is further explained in detail.These attached drawings are simplified schematic diagram, only with
Illustration illustrates the basic structure of the present invention, therefore it only shows the composition relevant to the invention.
Convertible heat dissipation mounting bracket is set at Fig. 1 and a kind of bottom for LED chip component shown in Fig. 2, including gold is set on a left side
Belong to fixed frame 1, it is right set metal holder 2 and with the left and right plastic substrate 3 for setting metal holder injection molding, on plastic substrate 3
Centre of surface position offers the main mounting groove 4 of installation LED chip, and 3 upper surface of plastic substrate is located at 4 periphery of main mounting groove and opens up
There are L-type structure metallic channel 5,3 upper surface of plastic substrate to be located at 4 right side opening of main mounting groove and be equipped with for being connected to main mounting groove 4 and leading
The point glue groove 6 of wire casing 5,3 lower surface of plastic substrate are provided with the copper bottom heat radiation holder 7 of X-type structure, 7 liang of bottom heat radiation holder
Side wall front and back ends all have the integral structure connection card column 8 of outwardly convex, and metal holder 1 and right side metal holder 2 are set in a left side
Lower surface all has downwardly convex integral structure connecting plate 9, and connecting plate 9 is correspondingly connected with 8 position of card column and offers and connect
8 matched connection through-hole 10 of card column, bottom heat radiation holder 7 connect card column 8 by both ends and are caught in 10 inside of connection through-hole respectively
It is connected and fixed with left and right metal holder of setting, 7 lower surface of bottom heat radiation holder has downwardly convex integral structure bottom heat radiation
Plate 11,11 lower end of bottom heat radiation plate open up the fitting groove 13 there are two built-in connecting shaft 12, and 11 outside of bottom heat radiation plate is respectively provided with
There is overturning connecting lateral plate 14, overturning connecting lateral plate 14 is sleeved in connecting shaft 12 by top connecting cylinder 15 and corresponding position fitting groove
13 flexible connections, overturning connecting lateral plate 14 are maximum for limiting overturning connecting lateral plate 14 far from having on 11 side of bottom heat radiation plate
The limit support board 16 of flip angle.
Further, a left side sets metal holder 1 and the right side to set 2 size of metal holder identical, further, bottom heat radiation branch
7 upper surface of frame corresponds to 4 position of main mounting groove and all has integral structure heat dissipation supporting plate 17, further, on overturning connecting lateral plate 14
The internal thread through hole 18 for installing radiator fan, a kind of use of the invention are offered with 7 corresponding position of bottom heat radiation holder
Convertible heat dissipation mounting bracket is set by blocking on the left and right connecting plate 9 for setting metal holder lower end in the bottom of LED chip component
The fixed copper bottom heat radiation holder 7 of X-type structure with heat dissipation supporting plate 17, bottom heat radiation plate 11 and overturning connecting lateral plate 14 is connect,
So that the heat dissipation performance of LED chip component greatly promotes, and radiating mode is more diversified, can be adapted to a variety of heat dissipation dresses
It sets, the scope of application is very extensive.
It is enlightenment with above-mentioned desirable embodiment according to the present invention, through the above description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention
Property range is not limited to the contents of the specification, it is necessary to determine its technical scope according to right.
Claims (4)
1. convertible heat dissipation mounting bracket is set at a kind of bottom for LED chip component, including metal holder (1) is set on a left side, the right side is set
Metal holder (2) and with the left and right plastic substrate (3) for setting metal holder injection molding, it is characterized in that：The plastic cement base
Plate (3) upper surface center offers the main mounting groove (4) of installation LED chip, and the plastic substrate (3) upper surface is located at
Main mounting groove (4) periphery offers L-type structure metallic channel (5), and the plastic substrate (3) upper surface is located at main mounting groove (4)
Right side opening is equipped with the point glue groove (6) for being connected to main mounting groove (4) and metallic channel (5), and the plastic substrate (3) lower surface is set
It is equipped with the copper bottom heat radiation holder (7) of X-type structure, bottom heat radiation holder (7) two side front and back ends all have convex
The integral structure connection card column (8) risen, metal holder (1) is set on the left side and right side metal holder (2) lower surface has
There are downwardly convex integral structure connecting plate (9), the connecting plate (9) to be correspondingly connected with card column (8) position and offer and connect
The matched connection through-hole (10) of card column (8) is connect, the bottom heat radiation holder (7) connects card column (8) company of being caught in by both ends
It connects inside hole (10) and is connected and fixed respectively with left and right metal holder of setting, described bottom heat radiation holder (7) lower surface has
Downwardly convex integral structure bottom heat radiation plate (11), described bottom heat radiation plate (11) lower end are opened up there are two built-in connecting shaft
(12) fitting groove (13), the bottom heat radiation plate (11) outside are both provided with overturning connecting lateral plate (14), the overturning
Connecting lateral plate (14) is sleeved on by top connecting cylinder (15) in connecting shaft (12) and corresponding position fitting groove (13) is flexibly connected, institute
The overturning connecting lateral plate (14) stated is maximum for limiting overturning connecting lateral plate (14) far from having on bottom heat radiation plate (11) side
The limit support board (16) of flip angle.
2. convertible heat dissipation mounting bracket, feature are set in a kind of bottom for LED chip component according to claim 1
It is：Metal holder (1) is set on the left side, and with the right side to set metal holder (2) size identical.
3. convertible heat dissipation mounting bracket, feature are set in a kind of bottom for LED chip component according to claim 1
It is：Described bottom heat radiation holder (7) upper surface corresponds to main mounting groove (4) position and all has integral structure heat dissipation supporting plate (17).
4. convertible heat dissipation mounting bracket, feature are set in a kind of bottom for LED chip component according to claim 1
It is：It is offered with bottom heat radiation holder (7) corresponding position for installing radiator fan on the overturning connecting lateral plate (14)
Internal thread through hole (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810399803.7A CN108613025B (en) | 2018-04-28 | 2018-04-28 | Bottom-mounted turnover type heat dissipation mounting bracket for LED chip assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810399803.7A CN108613025B (en) | 2018-04-28 | 2018-04-28 | Bottom-mounted turnover type heat dissipation mounting bracket for LED chip assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108613025A true CN108613025A (en) | 2018-10-02 |
| CN108613025B CN108613025B (en) | 2020-08-11 |
Family
ID=63661450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810399803.7A Active CN108613025B (en) | 2018-04-28 | 2018-04-28 | Bottom-mounted turnover type heat dissipation mounting bracket for LED chip assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108613025B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4500945A (en) * | 1982-07-23 | 1985-02-19 | International Business Machines Corporation | Directly sealed multi-chip module |
| CN2541952Y (en) * | 2002-04-15 | 2003-03-26 | 硕麟企业有限公司 | Retainer of integrated circuit radiator |
| CN2558190Y (en) * | 2002-06-11 | 2003-06-25 | 鸿富锦精密工业（深圳）有限公司 | Heat sink fastener |
| CN101072486A (en) * | 2006-05-12 | 2007-11-14 | 富准精密工业(深圳)有限公司 | Radiator fixing device |
| CN104482435A (en) * | 2014-12-11 | 2015-04-01 | 东莞市闻誉实业有限公司 | LED (light emitting diode) illumination lamp |
| CN107117066A (en) * | 2017-03-31 | 2017-09-01 | 合肥德通科贸有限公司 | Electric car rain-proof heat radiating type electric machine controller |
| CN208074609U (en) * | 2018-04-28 | 2018-11-09 | 澳洋集团有限公司 | Set convertible heat dissipation mounting bracket in a kind of bottom for LED chip component |
-
2018
- 2018-04-28 CN CN201810399803.7A patent/CN108613025B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4500945A (en) * | 1982-07-23 | 1985-02-19 | International Business Machines Corporation | Directly sealed multi-chip module |
| CN2541952Y (en) * | 2002-04-15 | 2003-03-26 | 硕麟企业有限公司 | Retainer of integrated circuit radiator |
| CN2558190Y (en) * | 2002-06-11 | 2003-06-25 | 鸿富锦精密工业（深圳）有限公司 | Heat sink fastener |
| CN101072486A (en) * | 2006-05-12 | 2007-11-14 | 富准精密工业(深圳)有限公司 | Radiator fixing device |
| CN104482435A (en) * | 2014-12-11 | 2015-04-01 | 东莞市闻誉实业有限公司 | LED (light emitting diode) illumination lamp |
| CN107117066A (en) * | 2017-03-31 | 2017-09-01 | 合肥德通科贸有限公司 | Electric car rain-proof heat radiating type electric machine controller |
| CN208074609U (en) * | 2018-04-28 | 2018-11-09 | 澳洋集团有限公司 | Set convertible heat dissipation mounting bracket in a kind of bottom for LED chip component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108613025B (en) | 2020-08-11 |
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