CN207909916U - A kind of lateral heat conduction installing mechanism for the installation of LED chip component - Google Patents
A kind of lateral heat conduction installing mechanism for the installation of LED chip component Download PDFInfo
- Publication number
- CN207909916U CN207909916U CN201820431439.3U CN201820431439U CN207909916U CN 207909916 U CN207909916 U CN 207909916U CN 201820431439 U CN201820431439 U CN 201820431439U CN 207909916 U CN207909916 U CN 207909916U
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- CN
- China
- Prior art keywords
- copper
- main substrate
- led chip
- installation
- heat conduction
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model is related to LED chip group device arts, especially a kind of lateral heat conduction installing mechanism for the installation of LED chip component includes the main substrate for installing LED chip, main substrate front offers the main mounting groove for installing LED chip.A kind of lateral heat conduction installing mechanism for the installation of LED chip component of the utility model inside main substrate by opening up the vertical of built-in copper telescoping tube, horizontal flexible through-hole, it is plugged with inside copper telescoping tube for connecting the external copper copper telescopic rod for being mounted laterally frame, the heat-conducting silicone grease for promoting heat conduction is opened up at the main substrate back side, for promoting main substrate inner wall, heat-conductive characteristic between copper flexible inside pipe wall and copper telescopic rod outer wall, greatly promote the thermal diffusivity of entire installing mechanism, the installation extruding copper sheet on main substrate lateral surface is utilized simultaneously, coordinate heat-conducting silicone grease, so that copper be mounted laterally between frame and installation shell is more bonded, bradyseism performance greatly promotes.
Description
Technical field
The utility model is related to LED chip group device arts, especially a kind of sides for the installation of LED chip component
To heat conduction installing mechanism.
Background technology
LED is the abbreviation of English light emitting diode (light emitting diode), is a kind of solid semiconductor device
Part, the heart of LED are the chips of a semiconductor, and one end of chip is attached on a holder, and one end is cathode, other end connection
The anode of power supply makes entire chip by epoxy encapsulation.Its major function is：Electric energy is converted into luminous energy, chip
Main material is monocrystalline silicon.Semiconductor wafer consists of two parts, and a part is P-type semiconductor, and hole accounts for leading inside it
Status, the other end are N-type semiconductors, are mainly electronics in this side.But when both semiconductors connect, between them
With regard to forming a P-N junction.When electric current acts on this chip by conducting wire, electronics will be pushed to the areas P, in the areas P
Then electronics will send out energy with hole-recombination in the form of photon, here it is the principles that LED shines.And the wavelength of light
It is exactly the color of light, is determined by the material of formation P-N junction.Its basic structure is one block of electroluminescent semi-conducting material
Then chip uses silver wire or gold thread to connect chip and circuit board, then surrounding epoxy on elargol or latex solidified to holder
Resin seal plays the role of protecting internal core, finally installs shell, but when it install with shell, circuit board and outside
Can have gap between shell, while influencing its anti-seismic performance the heat dissipation of main substrate also will receive influence.
Utility model content
The technical problems to be solved in the utility model is：In order to solve the problems, such as above-mentioned background technology, one is provided
Kind improved lateral heat conduction installing mechanism for the installation of LED chip component, solve installation base plate currently used for LED chip with
Shell install when, can have gap between circuit board and shell, while influencing its anti-seismic performance the heat dissipation of main substrate can also receive
To the problem of influence.
Technical solution adopted by the utility model to solve its technical problems is：It is a kind of to be used for what LED chip component was installed
Lateral heat conduction installing mechanism, includes the main substrate for installing LED chip, the main substrate front, which offers, to be used for
The main mounting groove of LED chip is installed, the main substrate front is located at main mounting groove periphery and offers metallic channel, the main base
Plate front offers a glue groove between main mounting groove and metallic channel, and a plurality of upper and lower sides are opened up inside the main substrate
Wall all has the longitudinal flexible through-hole of opening and a plurality of left and right side walls all have the horizontal flexible through-hole of opening, and described is vertical
It sets and has been fixedly connected with copper telescoping tube inside flexible through-hole and horizontal flexible through-hole, be provided on the main substrate lateral wall
Copper to be mounted laterally frame, the copper frame that is mounted laterally is inserted by the copper telescopic rod in inside in the copper telescoping tube of corresponding position
Portion and the flexible connection of copper telescoping tube, the main substrate back side corresponds to longitudinal flexible through-hole and horizontal flexible lead to the hole site is opened
Equipped with for heat-conducting silicone grease to be squeezed into internal material guide hole, the material guide hole outer openings are detachable to be fixed with
Heat conduction copper sheet.
Further, the main substrate lateral surface is provided with the extruding being bent outwardly positioned at copper be mounted laterally on the inside of frame
Copper sheet, the extruding copper sheet include the flat segments being fixedly connected with main substrate lateral surface and are mounted laterally frame medial surface with copper
The bending section being connected.
Further, the copper frame two sides that are mounted laterally are that the assembly that length gradually shortens out of outer net is oblique
Face.
Further, very close to each other between the copper telescopic rod lateral surface and copper telescoping tube medial surface.
The utility model has the beneficial effects that a kind of lateral heat conduction for the installation of LED chip component of the utility model
Installing mechanism sets flexible through-hole by opening up built-in the longitudinal and transverse of copper telescoping tube inside main substrate, inside copper telescoping tube
It is plugged with for connecting the external copper copper telescopic rod for being mounted laterally frame, is opened up at the main substrate back side for promoting leading for heat conduction
Hot silicone grease, for promoting the heat-conductive characteristic between main substrate inner wall, copper flexible inside pipe wall and copper telescopic rod outer wall, significantly
The thermal diffusivity of entire installing mechanism is promoted, while using the installation extruding copper sheet on main substrate lateral surface, coordinating heat-conducting silicone grease, making
It obtains copper be mounted laterally between frame and installation shell to be more bonded, bradyseism performance greatly promotes.
Description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the sectional view of the utility model.
In figure:1. main substrate, 2. main mounting grooves, 3. metallic channels, 4. glue grooves, 5. longitudinal flexible through-holes, 6. is horizontal flexible
Through-hole, 7. copper telescoping tubes, 8. it is copper be mounted laterally frame, 9. copper telescopic rods, 10. heat conduction copper sheets, 11. squeeze copper sheets, and 12. lead
Expect hole.
Specific implementation mode
The utility model is described in further detail presently in connection with attached drawing.These attached drawings are simplified schematic diagram,
Only illustrate the basic structure of the utility model in a schematic way, therefore it only shows composition related with the utility model.
Fig. 1 and a kind of lateral heat conduction installing mechanism for the installation of LED chip component shown in Fig. 2, including be used to install
The main substrate 1 of LED chip, 1 front of main substrate offer the main mounting groove 2 for installing LED chip, and main substrate 1 is just
Face is located at 2 periphery of main mounting groove and offers metallic channel 3, and 1 front of main substrate offers between main mounting groove 2 and metallic channel 3
Point glue groove 4, open up inside main substrate 12 upper and lower side walls all have opening longitudinal flexible through-hole 5 and 2 left and right side walls it is equal
It has been fixedly connected with inside horizontal flexible through-hole 6 with opening, longitudinal flexible through-hole 5 and horizontal flexible through-hole 6 copper flexible
Pipe 7, be provided on 1 lateral wall of main substrate it is copper be mounted laterally frame 8, the copper frame 8 that is mounted laterally is inserted by the copper telescopic rod 9 in inside
Enter copper 7 inside of telescoping tube of corresponding position and copper telescoping tube 7 is flexibly connected, 1 back side of main substrate corresponds to longitudinal 5 He of flexible through-hole
Horizontal 6 position of flexible through-hole offers and the material guide hole 12 for heat-conducting silicone grease to be squeezed into inside, 12 outer openings of material guide hole
To be fixed with detachable heat conduction copper sheet 10.
Further, 1 lateral surface of main substrate is provided with the extruding copper sheet being bent outwardly positioned at copper 8 inside of frame that is mounted laterally
11, it squeezes copper sheet 11 and includes the flat segments being fixedly connected with 1 lateral surface of main substrate and be connected with copper 8 medial surface of frame that is mounted laterally
The bending section connect, further, copper 8 two sides of frame that are mounted laterally are the assembly inclined-plane that length gradually shortens out of outer net,
Further, very close to each other, a kind of use of the utility model between 7 medial surface of 9 lateral surface of copper telescopic rod and copper telescoping tube
In the installation of LED chip component lateral heat conduction installing mechanism by opened up inside main substrate 1 built-in copper telescoping tube 7 it is vertical,
Horizontal flexible through-hole is plugged with inside copper telescoping tube 7 for connecting the external copper copper telescopic rod 9 for being mounted laterally frame 8,
Open up the heat-conducting silicone grease for promoting heat conduction at 1 back side of main substrate, for promoted 1 inner wall of main substrate, 7 inner wall of copper telescoping tube and
Heat-conductive characteristic between 9 outer wall of copper telescopic rod greatly promotes the thermal diffusivity of entire installing mechanism, while using in main substrate
Installation squeezes copper sheet 11 on 1 lateral surface, coordinates heat-conducting silicone grease so that copper be mounted laterally between frame 8 and installation shell is more sticked on
It closes, bradyseism performance greatly promotes.
It is enlightenment, through the above description, related work people with the above-mentioned desirable embodiment according to the utility model
Member can carry out various changes and amendments in the range of without departing from this item utility model technological thought completely.This item is real
It is not limited to the contents of the specification with novel technical scope, it is necessary to which its technology is determined according to right
Property range.
Claims (4)
1. a kind of lateral heat conduction installing mechanism for the installation of LED chip component includes the main substrate for installing LED chip
(1), it is characterized in that：Main substrate (1) front offers the main mounting groove (2) for installing LED chip, described
Main substrate (1) front be located at main mounting groove (2) periphery and offer metallic channel (3), the main substrate (1) front is positioned at main peace
A glue groove (4) is offered between tankage (2) and metallic channel (3), and a plurality of upper and lower side walls are opened up inside the main substrate (1)
It all has the longitudinal flexible through-hole (5) of opening and a plurality of left and right side walls all has the horizontal flexible through-hole (6) of opening, it is described
Longitudinal flexible through-hole (5) and horizontal flexible through-hole (6) inside be fixedly connected with copper telescoping tube (7), the main substrate
(1) be provided on lateral wall it is copper be mounted laterally frame (8), the copper frame (8) that is mounted laterally passes through the copper telescopic rod in inside
(9) the copper telescoping tube of corresponding position (7) inside and copper telescoping tube (7) flexible connection, the main substrate (1) back side pair are inserted into
Longitudinal flexible through-hole (5) and horizontal flexible through-hole (6) position is answered to offer and the guide for heat-conducting silicone grease to be squeezed into inside
Hole (12), the material guide hole (12) outer openings are to be fixed with detachable heat conduction copper sheet (10).
2. a kind of lateral heat conduction installing mechanism for the installation of LED chip component according to claim 1, it is characterized in that：
Described main substrate (1) lateral surface is located at copper be mounted laterally on the inside of frame (8) and is provided with the extruding copper sheet (11) being bent outwardly, institute
The extruding copper sheet (11) stated includes the flat segments being fixedly connected with main substrate (1) lateral surface and is mounted laterally in frame (8) with copper
The bending section that side is connected.
3. a kind of lateral heat conduction installing mechanism for the installation of LED chip component according to claim 1, it is characterized in that：
Described copper frame (8) two sides that are mounted laterally are the assembly inclined-plane that length gradually shortens out of outer net.
4. a kind of lateral heat conduction installing mechanism for the installation of LED chip component according to claim 1, it is characterized in that：
It is very close to each other between copper telescopic rod (9) lateral surface and copper telescoping tube (7) medial surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820431439.3U CN207909916U (en) | 2018-03-28 | 2018-03-28 | A kind of lateral heat conduction installing mechanism for the installation of LED chip component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820431439.3U CN207909916U (en) | 2018-03-28 | 2018-03-28 | A kind of lateral heat conduction installing mechanism for the installation of LED chip component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207909916U true CN207909916U (en) | 2018-09-25 |
Family
ID=63559545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820431439.3U Expired - Fee Related CN207909916U (en) | 2018-03-28 | 2018-03-28 | A kind of lateral heat conduction installing mechanism for the installation of LED chip component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207909916U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111787719A (en) * | 2020-07-14 | 2020-10-16 | 湖北皓天智通科技有限公司 | Computer lab integration rack convenient to dismouting |
-
2018
- 2018-03-28 CN CN201820431439.3U patent/CN207909916U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111787719A (en) * | 2020-07-14 | 2020-10-16 | 湖北皓天智通科技有限公司 | Computer lab integration rack convenient to dismouting |
| CN111787719B (en) * | 2020-07-14 | 2021-06-29 | 湖北皓天智通科技有限公司 | Computer lab integration rack convenient to dismouting |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180925 Termination date: 20210328 |