CN108400219A - A kind of holder molding bulb-shaped LED and preparation method thereof - Google Patents
A kind of holder molding bulb-shaped LED and preparation method thereof Download PDFInfo
- Publication number
- CN108400219A CN108400219A CN201810133150.8A CN201810133150A CN108400219A CN 108400219 A CN108400219 A CN 108400219A CN 201810133150 A CN201810133150 A CN 201810133150A CN 108400219 A CN108400219 A CN 108400219A
- Authority
- CN
- China
- Prior art keywords
- led
- holder
- led support
- conductive sheet
- bulb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 19
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052742 iron Inorganic materials 0.000 claims abstract description 17
- 241000218202 Coptis Species 0.000 claims abstract description 15
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000004020 luminiscence type Methods 0.000 claims description 11
- 238000004140 cleaning Methods 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000000084 colloidal system Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 238000005488 sandblasting Methods 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims 1
- 230000008023 solidification Effects 0.000 claims 1
- 238000005520 cutting process Methods 0.000 abstract description 7
- 238000013461 design Methods 0.000 abstract description 6
- 239000011324 bead Substances 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of holder molding bulb-shaped LED and preparation method thereof, the program is by using separated LED holder, and the design of iron plate, LED support is mounted at the mode of array on iron plate, before die bond bonding wire, all LED supports have detached, after all process steps completion, there is no the slight deformations in cutting process, the problem of causing gold thread to be broken, LED lamp bead is caused to be scrapped.
Description
Technical field
The present invention relates to LED encapsulation fields, more specifically, it is related to a kind of holder molding bulb-shaped LED and its preparation
Method.
Background technology
For LED on the market during preparation, typically monoblock LED support carries out the operations such as die bond, bonding wire now,
This product is easy to cause the slight deformation of LED support during cutting, in the mistake of slight deformation when cutting in the later stage
Cheng Zhong, it is easy to cause gold thread to be broken, once there is gold thread fracture, entire LED light will scrap, fairly cumbersome.
Market Shanghai does not have technology that can solve the above problems at present, this is a great problem of present LED encapsulation fields.
Invention content
In view of the deficiencies of the prior art, the present invention intends to provide a kind of holder molding bulb-shaped LED and its
Preparation method.
To achieve the above object, the present invention provides following technical solutions：A kind of holder molding bulb-shaped LED, feature
It is, the holder molding bulb-shaped LED includes：
LED support；
It is arranged on the LED support upper surface, and mutually independent first conductive sheet and the second conductive sheet；
It is arranged on the LED support lower face, and mutually independent first pin holder and second pin holder；
It is arranged in the LED support, first leads to first conductive sheet is connected with the first pin holder
Hole；
It is arranged in the LED support, second leads to second conductive sheet is connected with the second pin holder
Hole；
LED luminescence chips on first conductive sheet are set；
Gold thread is set between the LED luminescence chips and second conductive sheet；
It is arranged on the LED support upper surface, first conductive sheet, second conductive sheet, the LED is shone
The colloid of chip and gold thread covering；And
It is fixed at the magnet at the LED support both ends.
In some embodiments, the LED support includes：
Rack body；
It is arranged in the rack body both sides, the supporting rod being easily installed；And
Setting is in the supporting rod end, the mounting hole for installation.
In some embodiments, the first pin holder and the second pin holder are separately positioned on the supporting rod
On lower face.
In some embodiments, the magnet is arranged on the supporting rod lower face.
The invention also provides a kind of holders to be molded bulb-shaped LED preparation methods, which is characterized in that the method includes：
Iron plate, LED support, luminescence chip, gold thread, glue and sealed in unit are provided；
By LED support successively magnetic attraction on iron plate, LED support array is formed, is fixed by magnetic attraction；
By LED support dehumidifying, die bond, baking, bonding wire and Ion Cleaning；
After the completion of cleaning, by moulding press and molding mould in the case of vacuum high-pressure power high temperature, make epoxy resin flows
Cooling and solidifying packet is attached to above LED support；
Baking, sandblasting gel resin, corner cut, test, packaging.
In some embodiments, spherical surface is formed after the epoxy resin cooling.
Present invention tool has the advantage that：The present invention by using separated LED holder and iron plate design, by LED branch
The mode for putting up array is mounted on iron plate, and before die bond bonding wire, all LED supports have detached, when all process steps are completed
After, there is no the slight deformations in cutting process, the problem of causing gold thread to be broken, LED lamp bead is caused to be scrapped.
Description of the drawings
Fig. 1 is the side view that a kind of holder of present pre-ferred embodiments is molded bulb-shaped LED.
Fig. 2 is the die bond structural schematic diagram that a kind of holder of present pre-ferred embodiments is molded bulb-shaped LED.
Fig. 3 is LED support array arrangement in a kind of holder molding bulb-shaped LED of present pre-ferred embodiments on iron plate
Structural schematic diagram.
Specific implementation mode
Referring to Fig.1 shown in-Fig. 3, a kind of holder molding bulb-shaped LED of the present embodiment, which is characterized in that the holder mould
Pressure ball head dummy LED includes：
LED support 10；
It is arranged on 10 upper surface of the LED support, and 20 and second conductive sheet 30 of mutually independent first conductive sheet；
It is arranged on 10 lower face of the LED support, and mutually independent first pin holder 40 and second pin holder
50；
It is arranged in the LED support 10, first conductive sheet 20 is connected with the first pin holder 40
First through hole (does not mark) in figure；
It is arranged in the LED support 10, second conductive sheet 30 is connected with the second pin holder 50
Second through-hole (does not mark) in figure；
LED luminescence chips 60 on first conductive sheet 20 are set；
Gold thread 70 is set between the LED luminescence chips 60 and second conductive sheet 30；
It is arranged on 10 upper surface of the LED support, by first conductive sheet 20, second conductive sheet 30, described
The colloid 80 that LED luminescence chips 60 and the gold thread 70 cover；And
It is fixed at the magnet 90 at 10 both ends of the LED support.
It should be noted that array arrangement of the magnet 90 for LED lamp bead holder in process of production, is welded in LED die bonds
Before line, all holders are cut and are detached, are adsorbed on successively on iron plate 100 by magnet 90, forms 10 array of LED support, it will
Monoblock iron plate 100 is sent into subsequent processing, after completing entire packaging technology, without cutting, avoids causing LED branch in cutting process
10 slight deformation of frame, cause gold thread 70 be broken the problem of.
Meanwhile the invention also provides a kind of schemes, and the material of the first pin holder 40 and second pin holder 50 is changed
For irony, this mode avoids the need for increasing on LED support 10 design of magnet 90, need to only make original iron plate into magnetic
90 plate of iron can also realize the array arrangement of LED lamp bead.Compared to the design for increasing magnet 90 on LED support 10, the design is more
For convenience.
In some embodiments, the LED support 10 includes：
Rack body 11；
The supporting rod 12 being easily installed in 11 both sides of the rack body is set；And
Setting is in 12 end of the supporting rod, the mounting hole 13 for installation.
In some embodiments, the first pin holder 40 and the second pin holder 50 are separately positioned on the branch
On 12 lower face of strut.
In some embodiments, the magnet 90 is arranged on 12 lower face of the supporting rod.
The invention also provides a kind of holders to be molded bulb-shaped LED preparation methods, which is characterized in that the method includes：
Iron plate, LED support, luminescence chip, gold thread, glue and sealed in unit are provided；
By LED support successively magnetic attraction on iron plate, LED support array is formed, is fixed by magnetic attraction；
By LED support dehumidifying, die bond, baking, bonding wire and Ion Cleaning；
After the completion of cleaning, by moulding press and molding mould in the case of vacuum high-pressure power high temperature, make epoxy resin flows
Cooling and solidifying packet is attached to above LED support；
Baking, sandblasting gel resin, corner cut, test, packaging.
In some embodiments, spherical surface is formed after the epoxy resin cooling.
In conclusion design of the present invention by using separated LED holder and iron plate, by LED support at array
Mode is mounted on iron plate, and before die bond bonding wire, all LED supports have detached, and after all process steps completion, is not present
Slight deformation in cutting process, the problem of causing gold thread to be broken, LED lamp bead is caused to be scrapped.
The above is only a preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-mentioned implementation
Example, all technical solutions belonged under thinking of the present invention all belong to the scope of protection of the present invention.It should be pointed out that for the art
Those of ordinary skill for, several improvements and modifications without departing from the principles of the present invention, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (6)
1. a kind of holder molding bulb-shaped LED, which is characterized in that the holder is molded bulb-shaped LED and includes：
LED support；
It is arranged on the LED support upper surface, and mutually independent first conductive sheet and the second conductive sheet；
It is arranged on the LED support lower face, and mutually independent first pin holder and second pin holder；
It is arranged in the LED support, the first through hole that first conductive sheet is connected with the first pin holder；
It is arranged in the LED support, the second through-hole that second conductive sheet is connected with the second pin holder；
LED luminescence chips on first conductive sheet are set；
Gold thread is set between the LED luminescence chips and second conductive sheet；
It is arranged on the LED support upper surface, by first conductive sheet, second conductive sheet, the LED luminescence chips
With the colloid of gold thread covering；And
It is fixed at the magnet at the LED support both ends.
2. holder according to claim 1 molding bulb-shaped LED, which is characterized in that the LED support includes：
Rack body；
It is arranged in the rack body both sides, the supporting rod being easily installed；And
Setting is in the supporting rod end, the mounting hole for installation.
3. holder according to claim 2 molding bulb-shaped LED, which is characterized in that the first pin holder and described
Second pin holder is separately positioned on the supporting rod lower face.
4. holder molding bulb-shaped LED according to claim 3, which is characterized in that the magnet is arranged in the support
On bar lower face.
5. the holder described in a kind of any one of claim 1-4 is molded bulb-shaped LED preparation methods, which is characterized in that institute
The method of stating includes：
Iron plate, LED support, luminescence chip, gold thread, glue and sealed in unit are provided；
By LED support successively magnetic attraction on iron plate, LED support array is formed, is fixed by magnetic attraction；
By LED support dehumidifying, die bond, baking, bonding wire and Ion Cleaning；
After the completion of cleaning, by moulding press and molding mould in the case of vacuum high-pressure power high temperature, epoxy resin flows is made to cool down
Solidification packet is attached to above LED support；
Baking, sandblasting gel resin, corner cut, test, packaging.
6. holder according to claim 5 is molded bulb-shaped LED preparation methods, which is characterized in that the epoxy resin is cold
But spherical surface is formed afterwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810133150.8A CN108400219B (en) | 2018-02-09 | 2018-02-09 | Bracket die-pressing ball-head type LED and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810133150.8A CN108400219B (en) | 2018-02-09 | 2018-02-09 | Bracket die-pressing ball-head type LED and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108400219A true CN108400219A (en) | 2018-08-14 |
| CN108400219B CN108400219B (en) | 2023-08-01 |
Family
ID=63096614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810133150.8A Active CN108400219B (en) | 2018-02-09 | 2018-02-09 | Bracket die-pressing ball-head type LED and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108400219B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120314419A1 (en) * | 2011-06-08 | 2012-12-13 | Wen-Kung Sung | Heat dissipation structure of light-emitting diode |
| CN105070813A (en) * | 2015-09-01 | 2015-11-18 | 宏齐光电子(深圳)有限公司 | Large-power LED support and packaging method thereof |
| CN208256719U (en) * | 2018-02-09 | 2018-12-18 | 永林电子有限公司 | A kind of bracket molding bulb-shaped LED |
-
2018
- 2018-02-09 CN CN201810133150.8A patent/CN108400219B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120314419A1 (en) * | 2011-06-08 | 2012-12-13 | Wen-Kung Sung | Heat dissipation structure of light-emitting diode |
| CN105070813A (en) * | 2015-09-01 | 2015-11-18 | 宏齐光电子(深圳)有限公司 | Large-power LED support and packaging method thereof |
| CN208256719U (en) * | 2018-02-09 | 2018-12-18 | 永林电子有限公司 | A kind of bracket molding bulb-shaped LED |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108400219B (en) | 2023-08-01 |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: No.6, Jinhe Xinguang Road, Zhangmutou town, Dongguan City, Guangdong Province 523000 Applicant after: Yonglin Electronics Co.,Ltd. Address before: 523000 No. three Xinguang Road, Jinhe Industrial Zone, Zhangmutou town, Guangdong, Dongguan, 3 Applicant before: Y.LIN ELECTRONICS Co.,Ltd. |
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| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |