CN205723470U - A kind of for preventing the device of lead frame warpage - Google Patents
A kind of for preventing the device of lead frame warpage Download PDFInfo
- Publication number
- CN205723470U CN205723470U CN201620587295.1U CN201620587295U CN205723470U CN 205723470 U CN205723470 U CN 205723470U CN 201620587295 U CN201620587295 U CN 201620587295U CN 205723470 U CN205723470 U CN 205723470U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- unit
- preventing
- accommodating
- warpage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The utility model discloses a kind of device for preventing lead frame warpage, including circuit unit, heating unit and accommodating unit, described circuit unit includes that temperature arranges module and power-on switch circuit module, described heating unit includes heater, described accommodating unit is for accommodating described lead frame, described circuit unit is connected with heating unit, and described accommodating unit is arranged on above described heating unit.It is little that the utility model has volume, simple in construction, and deft design easily operates, low cost and other advantages, decreases a series of deviation that subsequent job produces, it is to avoid the mass defect of final encapsulating products, decreases the appearance of defective products.
Description
Technical field
The utility model relates to semiconductor applications, particularly to a kind of for preventing the device of lead frame warpage.
Background technology
Lead frame, as the chip carrier of integrated circuit, is by means of bonding material, one realizes that chip internal circuits draws
Go out end and the electric connection of outer lead, form the key structure part of conductive loops, be the important basic material of IC industry.
Lead frame is generally in square bar shaped, and its up or down is provided with the identical lead frame unit of some array arrangements.
Plastic packaging is to utilize epoxy molding compound that the matrix completing wire bonding is carried out injection molding encapsulating, it is achieved packaging body
Mechanical protection.During epoxy molding compound thawing is re-solidified, lead frame would generally be formed not by thermal stress effect
With the warpage of degree, causing the out-of-flatness of base plate for packaging, therefore, subsequent job can produce a series of deviation, causes final envelope
The mass defect of dress product, produces defective products.
Content of the invention
The utility model provides a kind of for preventing the device of lead frame warpage, to solve lead frame of the prior art
Frame owing to being caused the irregular problem of base plate for packaging by thermal stress effect, it is to avoid the mass defect of final encapsulating products.
The technical solution of the utility model is as follows:
A kind of for preventing the device of lead frame warpage, including circuit unit, heating unit and accommodating unit, described
Circuit unit includes that temperature arranges module and power-on switch circuit module, and described heating unit includes heater, described
Accommodating unit is for accommodating described lead frame；
Described circuit unit is connected with heating unit, and described accommodating unit is arranged on the upper of described heating unit
Face.
Further preferably, described heating unit is arranged on above described circuit unit.
Further preferably, described heater is heating rod.
Further preferably, it is digital display screen that described temperature arranges module, for the temperature arranging temperature, display sets
Degree and currently practical temperature.
Further preferably, described accommodating unit includes basal plane, two curb girders being arranged on described basal plane both sides, is positioned at two
Two and half grooves bottom curb girder.
Further preferably, the length of the minor face more than described lead frame for the distance between half groove described in two
Degree.
Further preferably, the distance between half groove described in two is 3-5mm.
Further preferably, described accommodating unit also includes being arranged on described basal plane rear end and is connected with described two curb girders
The end wall connecing.
Compared with prior art, the beneficial effects of the utility model are as follows:
Of the present utility model a kind of have volume little for preventing the device of lead frame warpage, simple in construction, design essence
Ingeniously, easily operating, low cost and other advantages, according to the actual needs design temperature, accommodating unit, under the effect of heater, makes
Obtain the epoxy molding compound deliquescing on lead frame, then the lead frame of deliquescing is taken out, and will with two pieces of cast iron casting pressing plates
It compresses, and is flattened under pressure, thus reduces the warpage of leadframe strip, therefore, after the utility model decreases
A series of deviation that continuous operation produces, it is to avoid the mass defect of final encapsulating products, decreases the appearance of defective products.
Certainly, implement arbitrary product of the present utility model to it is not absolutely required to reach all the above advantage simultaneously.
Brief description
Fig. 1 is of the present utility model a kind of for preventing the structural representation of the device of lead frame warpage；
Fig. 2 is of the present utility model a kind of for preventing the A-A ' section view of the accommodating unit of the device of lead frame warpage
Figure.
Detailed description of the invention
Below in conjunction with specific embodiment, the utility model is expanded on further.It should be understood that these embodiments are merely to illustrate
The utility model, rather than limit protection domain of the present utility model.Those skilled in the art are according to this in actual applications
Improvement that utility model is made and adjustment, still fall within protection domain of the present utility model.
In order to better illustrate the utility model, below with accompanying drawing, the utility model is described in detail.
As shown in Figure 1 a kind of for preventing the device of lead frame warpage, including circuit unit the 1st, heating unit 2 and holding
Putting unit 3, described circuit unit 1 is for realizing the circuit control of device, including temperature arranges module 4 and power-on switch circuit
Module (does not indicates in figure), and described heating unit 2 includes heater (not indicating in figure), and described accommodating unit 3 is used for
Accommodating described lead frame；Described circuit unit 1 is connected with heating unit 2, concrete, and described heating unit 2 sets
Putting on described circuit unit 1, described accommodating unit 3 is arranged on above described heating unit 2.This practicality is new
Type a kind of for preventing the device of lead frame warpage, the exterior material of device is metal material, can be iron.
Described heater (not indicating in figure) is heating rod.
It is digital display screen that described temperature arranges module 4, for showing the temperature of setting, the temperature of display setting and working as
The temperature of front reality.
As in figure 2 it is shown, described accommodating unit 3 includes that the 7th, basal plane is arranged on two curb girders 6 of described basal plane 7 both sides and is positioned at
Two and half grooves 8 bottom two curb girders 6.Described accommodating unit 3 also include being arranged on described basal plane 7 rear end and with described both sides
The end wall 9 that beam 6 is connected.
The length of the minor face more than described lead frame for the distance between half groove 8 described in two.
The distance between half groove 8 described in two is 3-5mm.
During use, power interface 5 is energized, and pushes described along the depression of described curb girder 6 by rectangular lead frame
In accommodating unit 3, setting certain temperature according to actual needs, accommodating unit 3 is under the effect of heater, by basal plane 7
Temperature raises so that the epoxy molding compound deliquescing on the lead frame inserted, and then takes out the lead frame of deliquescing,
Compressed with two pieces of cast iron casting pressing plates (not indicating in figure) afterwards, flattened under pressure, thus reduce leadframe strip
Warpage.
The utility model preferred embodiment disclosed above is only intended to help to illustrate the utility model.Preferred embodiment is simultaneously
There is no all of details of detailed descriptionthe, do not limit the detailed description of the invention that this utility model is only described yet.Obviously, according to this theory
The content of bright book, can make many modifications and variations.These embodiments are chosen and specifically described to this specification, is in order to preferably
Explain principle of the present utility model and actual application, so that skilled artisan can be best understood by and utilize this
Utility model.The utility model is only limited by claims and four corner thereof and equivalent.
Claims (8)
1. the device being used for preventing lead frame warpage, it is characterised in that include circuit unit, heating unit and accommodating list
Unit, described circuit unit includes that temperature arranges module and power-on switch circuit module, and described heating unit includes heating dress
Putting, described accommodating unit is for accommodating described lead frame；Described circuit unit is connected with heating unit, described
Accommodating unit is arranged on above described heating unit.
2. according to claim 1 a kind of for preventing the device of lead frame warpage, it is characterised in that described heating
Unit is arranged on above described circuit unit.
3. according to claim 1 a kind of for preventing the device of lead frame warpage, it is characterised in that described heating
Device is heating rod.
4. according to claim 1 a kind of for preventing the device of lead frame warpage, it is characterised in that described temperature
Arranging module is digital display screen.
5. according to claim 1 a kind of for preventing the device of lead frame warpage, it is characterised in that described is accommodating
Unit includes basal plane, two curb girders being arranged on described basal plane both sides and is positioned at two and half grooves bottom two curb girders.
6. according to claim 5 a kind of for preventing the device of lead frame warpage, it is characterised in that described in two
The length of the minor face more than described lead frame for the distance between half groove.
7. a kind of for preventing the device of lead frame warpage according to claim 5 or 6, it is characterised in that two institutes
The distance between half groove stated is 3-5mm.
8. according to claim 5 a kind of for preventing the device of lead frame warpage, it is characterised in that described is accommodating
Unit also includes the end wall being arranged on described basal plane rear end and being connected with described two curb girders.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620587295.1U CN205723470U (en) | 2016-06-16 | 2016-06-16 | A kind of for preventing the device of lead frame warpage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620587295.1U CN205723470U (en) | 2016-06-16 | 2016-06-16 | A kind of for preventing the device of lead frame warpage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205723470U true CN205723470U (en) | 2016-11-23 |
Family
ID=57305258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620587295.1U Expired - Fee Related CN205723470U (en) | 2016-06-16 | 2016-06-16 | A kind of for preventing the device of lead frame warpage |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205723470U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870043A (en) * | 2016-06-16 | 2016-08-17 | 苏州工业职业技术学院 | Device for preventing lead frame from warping |
-
2016
- 2016-06-16 CN CN201620587295.1U patent/CN205723470U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870043A (en) * | 2016-06-16 | 2016-08-17 | 苏州工业职业技术学院 | Device for preventing lead frame from warping |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161123 Termination date: 20170616 |