CN208256719U - A kind of bracket molding bulb-shaped LED - Google Patents
A kind of bracket molding bulb-shaped LED Download PDFInfo
- Publication number
- CN208256719U CN208256719U CN201820233951.7U CN201820233951U CN208256719U CN 208256719 U CN208256719 U CN 208256719U CN 201820233951 U CN201820233951 U CN 201820233951U CN 208256719 U CN208256719 U CN 208256719U
- Authority
- CN
- China
- Prior art keywords
- led
- bracket
- support
- conductive sheet
- led support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- 238000000465 moulding Methods 0.000 title description 9
- 241000218202 Coptis Species 0.000 claims abstract description 13
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 13
- 238000004020 luminiscence type Methods 0.000 claims description 9
- 239000000084 colloidal system Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 24
- 229910052742 iron Inorganic materials 0.000 abstract description 12
- 238000005520 cutting process Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- 239000011324 bead Substances 0.000 abstract description 5
- 238000013461 design Methods 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of brackets to be molded bulb-shaped LED, the program is by using separated LED bracket, and the design of iron plate, LED support is mounted on iron plate at the mode of array, before die bond bonding wire, all LED supports have been separated, after all process steps completion, there is no the slight deformations in cutting process, the problem of causing gold thread to be broken, LED lamp bead is caused to be scrapped.
Description
Technical field
The utility model relates to LED encapsulation fields, more specifically, it is related to a kind of bracket molding bulb-shaped LED.
Background technique
For LED on the market during preparation, typically monolith LED support carries out the operation such as die bond, bonding wire now,
This product is easy during cutting when cutting in the later period, causes the slight deformation of LED support, in the mistake of slight deformation
Cheng Zhong, it is easy to cause gold thread to be broken, once there is gold thread fracture, entire LED light will scrap, fairly cumbersome.
Market Shanghai does not have technology can solve the above problem at present, this is a great problem of present LED encapsulation field.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide a kind of brackets to be molded bulb-shaped LED.
To achieve the above object, the utility model provides following technical solution: a kind of bracket molding bulb-shaped LED,
It is characterized in that, the bracket molding bulb-shaped LED includes:
LED support；
It is arranged on the LED support upper surface, and mutually independent first conductive sheet and the second conductive sheet；
It is arranged on the LED support lower end surface, and mutually independent first pin bracket and second pin bracket；
It is arranged in the LED support, first that first conductive sheet is connected with the first pin bracket is led to
Hole；
It is arranged in the LED support, second that second conductive sheet is connected with the second pin bracket is led to
Hole；
LED luminescence chip on first conductive sheet is set；
Gold thread is set between the LED luminescence chip and second conductive sheet；
It is arranged on the LED support upper surface, first conductive sheet, second conductive sheet, the LED is shone
The colloid of chip and gold thread covering；And
It is fixed at the magnet at the LED support both ends.
In some embodiments, the LED support includes:
Rack body；
It is arranged in the rack body two sides, the support rod being easily installed；And
Mounting hole in the support rod end, for installation is set.
In some embodiments, the first pin bracket and the second pin bracket are separately positioned on the support rod
On lower end surface.
In some embodiments, the magnet is arranged on the support rod lower end surface.
In some embodiments, spherical surface is formed after the epoxy resin is cooling.
The utility model has an advantage that the utility model setting by using separated LED bracket and iron plate
Meter, LED support is mounted on iron plate at the mode of array, before die bond bonding wire, all LED supports have been separated, and work as institute
After having process completion, there is no the slight deformations in cutting process, the problem of causing gold thread to be broken, LED lamp bead is caused to be scrapped.
Detailed description of the invention
Fig. 1 is the side view that a kind of bracket of the utility model preferred embodiment is molded bulb-shaped LED.
Fig. 2 is the die bond structural schematic diagram that a kind of bracket of the utility model preferred embodiment is molded bulb-shaped LED.
Fig. 3 is LED support array arrangement in a kind of bracket molding bulb-shaped LED of the utility model preferred embodiment in iron plate
On structural schematic diagram.
Specific embodiment
Referring to Fig.1 shown in-Fig. 3, a kind of bracket of the present embodiment is molded bulb-shaped LED, which is characterized in that the bracket mould
Pressure ball head dummy LED includes:
LED support 10；
It is arranged on 10 upper surface of LED support, and mutually independent first conductive sheet 20 and the second conductive sheet 30；
It is arranged on 10 lower end surface of LED support, and mutually independent first pin bracket 40 and second pin bracket
50；
It is arranged in the LED support 10, first conductive sheet 20 is connected with the first pin bracket 40
First through hole (does not mark) in figure；
It is arranged in the LED support 10, second conductive sheet 30 is connected with the second pin bracket 50
Second through-hole (does not mark) in figure；
LED luminescence chip 60 on first conductive sheet 20 is set；
Gold thread 70 is set between the LED luminescence chip 60 and second conductive sheet 30；
It is arranged on 10 upper surface of LED support, by first conductive sheet 20, second conductive sheet 30, described
The colloid 80 that LED luminescence chip 60 and the gold thread 70 cover；And
It is fixed at the magnet 90 at 10 both ends of LED support.
It should be noted that array arrangement of the magnet 90 for LED lamp bead bracket in process of production, is welded in LED die bond
Before line, all brackets are cut and are separated, are successively adsorbed on iron plate 100 by magnet 90, forms 10 array of LED support, it will
Monolith iron plate 100 is sent into subsequent processing, after completing entire packaging technology, without cutting, avoids causing LED branch in cutting process
10 slight deformation of frame, cause gold thread 70 be broken the problem of.
Meanwhile the utility model also proposed a kind of scheme, by the material of the first pin bracket 40 and second pin bracket 50
Matter is changed to irony, and this mode avoids the need for the design for increasing magnet 90 on LED support 10, need to only change original iron plate
At 90 plate of magnet, the array arrangement of LED lamp bead can also be realized.Compared to the design for increasing magnet 90 on LED support 10, this is set
It counts more convenient.
In some embodiments, the LED support 10 includes:
Rack body 11；
It is arranged in 11 two sides of rack body, the support rod 12 being easily installed；And
Mounting hole 13 in 12 end of support rod, for installation is set.
In some embodiments, the first pin bracket 40 and the second pin bracket 50 are separately positioned on the branch
On 12 lower end surface of strut.
In some embodiments, the magnet 90 is arranged on 12 lower end surface of support rod.
The utility model also proposed a kind of bracket molding bulb-shaped LED preparation method, which is characterized in that the method packet
It includes:
Iron plate, LED support, luminescence chip, gold thread, glue and sealed in unit are provided；
By LED support, successively magnetic attraction forms LED support array, is fixed by magnetic attraction on iron plate；
By LED support dehumidifying, die bond, baking, bonding wire and Ion Cleaning；
After the completion of cleaning, through moulding press and molding mould in the case where vacuum high-pressure power high temperature, make epoxy resin flows
Cooling and solidifying packet is attached to above LED support；
Baking, sandblasting gel resin, corner cut, test, packaging.
In some embodiments, spherical surface is formed after the epoxy resin is cooling.
In conclusion design of the utility model by using separated LED bracket and iron plate, by LED support Cheng Zhen
The mode of column is mounted on iron plate, and before die bond bonding wire, all LED supports have been separated, after all process steps completion, no
There are the slight deformations in cutting process, the problem of causing gold thread to be broken, LED lamp bead is caused to be scrapped.
The above is only the preferred embodiment of the utility model, and the protection scope of the utility model is not limited merely to
Above-described embodiment, technical solution belonging to the idea of the present invention belong to the protection scope of the utility model.It should refer to
Out, for those skilled in the art, it is without departing from the principle of the utility model it is several improvement and
Retouching, these improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (4)
1. a kind of bracket is molded bulb-shaped LED, which is characterized in that the bracket is molded bulb-shaped LED and includes:
LED support；
It is arranged on the LED support upper surface, and mutually independent first conductive sheet and the second conductive sheet；
It is arranged on the LED support lower end surface, and mutually independent first pin bracket and second pin bracket；
It is arranged in the LED support, the first through hole that first conductive sheet is connected with the first pin bracket；
It is arranged in the LED support, the second through-hole that second conductive sheet is connected with the second pin bracket；
LED luminescence chip on first conductive sheet is set；
Gold thread is set between the LED luminescence chip and second conductive sheet；
It is arranged on the LED support upper surface, by first conductive sheet, second conductive sheet, the LED luminescence chip
With the colloid of gold thread covering；And
It is fixed at the magnet at the LED support both ends.
2. bracket according to claim 1 is molded bulb-shaped LED, which is characterized in that the LED support includes:
Rack body；
It is arranged in the rack body two sides, the support rod being easily installed；And
Mounting hole in the support rod end, for installation is set.
3. bracket according to claim 2 is molded bulb-shaped LED, which is characterized in that the first pin bracket and described
Second pin bracket is separately positioned on the support rod lower end surface.
4. bracket according to claim 3 is molded bulb-shaped LED, which is characterized in that the magnet is arranged in the support
On bar lower end surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820233951.7U CN208256719U (en) | 2018-02-09 | 2018-02-09 | A kind of bracket molding bulb-shaped LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820233951.7U CN208256719U (en) | 2018-02-09 | 2018-02-09 | A kind of bracket molding bulb-shaped LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208256719U true CN208256719U (en) | 2018-12-18 |
Family
ID=64608241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820233951.7U Withdrawn - After Issue CN208256719U (en) | 2018-02-09 | 2018-02-09 | A kind of bracket molding bulb-shaped LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208256719U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108400219A (en) * | 2018-02-09 | 2018-08-14 | 永林电子有限公司 | A kind of holder molding bulb-shaped LED and preparation method thereof |
-
2018
- 2018-02-09 CN CN201820233951.7U patent/CN208256719U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108400219A (en) * | 2018-02-09 | 2018-08-14 | 永林电子有限公司 | A kind of holder molding bulb-shaped LED and preparation method thereof |
| CN108400219B (en) * | 2018-02-09 | 2023-08-01 | 永林电子股份有限公司 | Bracket die-pressing ball-head type LED and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No.6, Jinhe Xinguang Road, Zhangmutou town, Dongguan City, Guangdong Province 523000 Patentee after: Yonglin Electronics Co.,Ltd. Address before: 523000 No. three Xinguang Road, Jinhe Industrial Zone, Zhangmutou town, Guangdong, Dongguan, 3 Patentee before: Y.LIN ELECTRONICS Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20181218 Effective date of abandoning: 20240603 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20181218 Effective date of abandoning: 20240603 |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |