CN108364882B - Method for obtaining wafer back scratch source - Google Patents
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- CN108364882B CN108364882B CN201810157691.4A CN201810157691A CN108364882B CN 108364882 B CN108364882 B CN 108364882B CN 201810157691 A CN201810157691 A CN 201810157691A CN 108364882 B CN108364882 B CN 108364882B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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Abstract
The invention provides a method for obtaining a wafer back scratch source, which comprises the steps of grouping mechanical arms of a production machine according to the size of the width of a section; carrying out particle detection on the wafer back of the wafer to judge whether the wafer back of the wafer is scratched or not; when the wafer back is scratched, acquiring the shortest distance between the scratch and the center of the wafer circle; and judging the group of the mechanical arms for scratching the wafer back of the wafer according to the shortest distance between the scratch and the center of the wafer circle. The method for detecting the particles can quickly and accurately judge whether the wafer back of the wafer is scratched or not, improves the detection efficiency, avoids the uncertainty of manual visual inspection, groups the mechanical arms of the production machine, and can quickly determine the group of the mechanical arms scratching the wafer back of the wafer when the wafer back of the wafer is scratched, thereby timely and effectively finding out the production machine with problems, avoiding the generation of defective products in batches, reducing the labor expenditure and effectively improving the yield and quality of products.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to a method for obtaining a wafer back scratch source.
Background
As the size of integrated circuit devices is continuously reduced and the complexity of the process is continuously increased, defect detection becomes an essential link in the whole production process.
In the existing wafer manufacturing process, the scratching of the wafer back is a very serious defect, but the detection of the scratching defect of the wafer back still stays at the stage of manual visual inspection at present, the accuracy and the severity of the manual visual inspection on the scratching of the wafer back are greatly different according to different detection personnel, different scratching severity and different brightness of detected light, so that a plurality of uncertain factors exist in the judgment on the scratching of the wafer back, and whether the wafer back is scratched or not cannot be accurately judged. In addition, at present, no method capable of rapidly determining the source of wafer back scratches exists, and a machine station with a fault cannot be found in time, so that a defective product flows out, and the yield and the capacity of the product are reduced.
Disclosure of Invention
The invention aims to provide a method for obtaining a wafer back scratch source, which is used for solving the problems that a fault machine cannot be found in time in the prior art, so that defective products flow out and the like.
In order to achieve the above object, the present invention provides a method for obtaining a wafer back scratch source, which comprises:
grouping the mechanical arms of the production machine according to the size of the section width;
grabbing the wafer by using mechanical arms of different groups, wherein the mechanical arms support the wafer back of the wafer in the grabbing process;
carrying out particle detection on the wafer back of the wafer to judge whether the wafer back of the wafer is scratched or not;
when the wafer back is scratched, acquiring the shortest distance between the scratch and the center of the wafer circle; and judging the group of the mechanical arms for scratching the wafer back of the wafer according to the shortest distance between the scratch and the center of the wafer circle.
Optionally, grouping the manipulators of the production machine according to the size of the cross-sectional width includes:
grouping the mechanical arms of the production machine according to the size of the section width;
and classifying the mechanical arms of each group of production machines according to the grabbing mode.
Optionally, the manipulator is axisymmetric.
Optionally, during the grabbing process, the symmetry axis of the robot is aligned with the diameter direction of the wafer.
Optionally, grouping the manipulators of the production machine according to the size of the cross-sectional width includes:
when one half of the cross-sectional width of the manipulator is in a first range, the manipulator is in group A; when one half of the cross-sectional width of the manipulator is in a second range, the manipulator is in group B; and when one half of the cross-sectional width of the manipulator is in a third range, the manipulator is in group C.
Optionally, when the shortest distance between the scratch and the center of the wafer circle is within a first range, the scratch is originated from the manipulator of group a; when the shortest distance between the scratch and the center of the wafer circle is within a second range, the scratch is originated from the manipulator in group B; and when the shortest distance between the scratch and the center of the wafer circle is within a third range, the scratch is originated from the C-group mechanical arm.
Optionally, the first range is 0 mm to 50 mm, the second range is 50 mm to 100 mm, and the third range is 100 mm to 150 mm.
Optionally, classify the manipulator of every group production board according to snatching the mode and include:
when the grabbing mode of the manipulator is single-chip grabbing, the manipulator is of a first type; when the grabbing mode of the manipulator is multi-piece grabbing, the manipulator is of a second type; and when the grabbing mode of the manipulator is grabbing in a whole batch, the manipulator is of a third type.
Optionally, when the wafer back of the single wafer is scratched, the scratch is originated from a first type of manipulator; when the wafer backs of the continuous wafers are scratched, the scratching source is a second type of mechanical arm; when the wafer backs of the whole batch of wafers are scratched, the scratch is originated from a third type of manipulator.
Optionally, the number of the wafers grabbed by the multi-grabbing manipulator is 5-10; the number of the wafers grabbed by the whole batch grabbing manipulator at each time is 20-30.
Optionally, after determining the group of the manipulator scratching the wafer back according to the shortest distance between the scratch and the wafer center, the method for obtaining the wafer back scratch source further includes:
and maintaining the production machine corresponding to the mechanical arm for scratching the wafer back.
Optionally, particle detection is performed on the wafer back of the wafer by using particle detection equipment to judge whether the wafer back of the wafer is scratched or not.
The method for obtaining the wafer back scratch source comprises the steps of grouping mechanical arms of a production machine according to the size of the section width; grabbing the wafer by using mechanical arms of different groups, wherein the mechanical arms support the wafer back of the wafer in the grabbing process; carrying out particle detection on the wafer back of the wafer to judge whether the wafer back of the wafer is scratched or not; when the wafer back is scratched, acquiring the shortest distance between the scratch and the center of the wafer circle; and judging the group of the mechanical arms for scratching the wafer back of the wafer according to the shortest distance between the scratch and the center of the wafer circle. The method for detecting the particles can quickly and accurately judge whether the wafer back of the wafer is scratched or not, improves the detection efficiency, avoids the uncertainty of manual visual inspection, groups the mechanical arms of the production machine, and can quickly determine the group of the mechanical arms scratching the wafer back of the wafer according to the shortest distance between the scratch and the circle center of the wafer when the wafer back of the wafer is scratched, thereby timely and effectively finding out the production machine with problems, avoiding the generation of defective products in batches, reducing the labor expenditure and effectively improving the yield and the quality of products.
Drawings
Fig. 1 is a flowchart of a method for obtaining a wafer back scratch source according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a robot provided in an embodiment of the present invention;
FIG. 3 is a schematic view of a scratch provided by an embodiment of the present invention;
FIG. 4 is a schematic diagram illustrating grouping and sorting of manipulators of a manufacturing tool according to an embodiment of the present invention;
wherein, 1-wafer back, 11-wafer center, 12-scratch, 2-manipulator, X-scratch and the shortest distance between the wafer center; y-the cross-sectional width of the robot, a-the extension of the wafer diameter.
Detailed Description
The following describes in more detail embodiments of the present invention with reference to the schematic drawings. Advantages and features of the present invention will become apparent from the following description and claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Referring to fig. 1, which is a flowchart illustrating a method for obtaining a wafer back scratch source according to the present embodiment, as shown in fig. 1, the method for obtaining a wafer back scratch source includes:
s1: grouping the mechanical arms of the production machine according to the size of the section width;
s2: grabbing the wafer by using mechanical arms of different groups, wherein the mechanical arms support the wafer back of the wafer in the grabbing process;
s3: carrying out particle detection on the wafer back of the wafer to judge whether the wafer back of the wafer is scratched or not;
s4: when the wafer back is scratched, acquiring the shortest distance between the scratch and the center of the wafer circle;
s5: and judging the group of the mechanical arms for scratching the wafer back of the wafer according to the shortest distance between the scratch and the center of the wafer circle.
The invention adopts the particle detection method to rapidly and accurately judge whether the wafer back is scratched, thereby improving the detection efficiency, avoiding the uncertainty of manual visual inspection, grouping the mechanical arms of the production machine, and rapidly determining the group of the mechanical arms scratching the wafer back according to the shortest distance between the scratch and the circle center of the wafer when the wafer back is scratched, thereby timely and effectively finding out the production machine with problems, avoiding the generation of defective products in batch, reducing the labor expenditure, and effectively improving the yield and quality of products.
With reference to fig. 2-4, the method for obtaining the wafer backside scratch source according to the present embodiment will be further described with reference to fig. 2-4.
First, referring to fig. 2, when the robot 2 of the production machine grabs the wafer or turns the wafer, the wafer back 1 is supported by multi-point contact, so the robot 2 will not damage the wafer. The manipulator 2 should be kept parallel to the wafer back 1 when grabbing the wafer, and if the machine has a problem, the manipulator is not parallel to the wafer back 1, and the wafer back 1 is easily scratched when the manipulator extends in and out. Further, since the robot 2 has an axisymmetric structure and the wafer center 11 is used as a calibration point when the wafer is picked, i.e., the symmetry axis of the robot is aligned with the diameter direction of the wafer (as shown by a straight line a in fig. 2) during the picking process, the shortest distance between the scratch and the wafer center 11 has a very close relationship with the cross-sectional width of the robot 2.
Referring to fig. 3, when the robot 2 is in normal operation, the robot is axially symmetric about a straight line a, and extends in and out along the straight line a, the cross-sectional width of the robot 2 is Y, when a problem occurs in the production machine, the robot 2 scratches the wafer back 1 to cause a scratch 12, and the minimum distance between the scratch 12 and the wafer center 11 is X (the length between the wafer center 11 and the perpendicular line of the straight line where the scratch is located); the scratches 12 are caused by the friction extrusion of the two front claws of the robot 2, and the cross-sectional dimensions of the two front claws are negligible compared to the cross-sectional width Y of the entire robot 2, so that the minimum distance X between the scratches 12 and the wafer center 11 is approximately half of the cross-sectional width Y, i.e., the cross-sectional widths Y and 2X of the robot 2 can be considered to be equal.
Referring to fig. 4, the manipulators 2 of the production machine are grouped according to the size of the cross-sectional width Y, in this embodiment, the manipulators 2 are divided into 3 groups, specifically, when one half (Y/2) of the cross-sectional width Y of the manipulator 2 of the production machine is within a first range, the group is a group a; when one half (Y/2) of the section width Y of the manipulator 2 of the production machine is in a second range, the section width Y is set as B; and when one half (Y/2) of the section width Y of the manipulator 2 of the production machine is in a third range, the section width Y is in the group C, the first range is 0 mm-50 mm, the second range is 50 mm-100 mm, and the third range is 100 mm-300 mm.
Then, classifying the manipulator 2 of the production machine according to a grabbing manner, in this embodiment, the manipulator 2 is classified into 3 types, specifically, when the grabbing manner of the manipulator 2 of the production machine is single-piece grabbing, the manipulator is of the first type; when the grabbing mode of the manipulator 2 of the production machine is multi-piece grabbing, the grabbing mode is the second type; when the grabbing mode of the manipulator 2 of the production machine is batch grabbing, the grabbing mode is the third type, and the number of wafers grabbed by the manipulator with multiple pieces of grabbing every time is 5-10; the number of the wafers grabbed by the whole batch grabbing manipulator at each time is 20-30. Certainly, the manipulators 2 of the production machine can be further divided into 4 groups, 5 groups and the like, and the manipulators 2 of the production machine can also be divided into 4 types, 5 types and the like according to different grabbing modes, so as to improve the efficiency and accuracy of finding the problem machines.
Next, scanning the wafer back 1 by using a particle detection device to obtain a defect condition of the wafer back 1, so as to accurately determine whether the wafer back 1 is scratched, when the wafer back 1 is not scratched, the production machine continues to operate, when the wafer back 1 is detected to be scratched, a shortest distance X between the scratch 12 and the wafer center 11 is obtained by measuring, and then it is determined which manipulator 2 group the X falls in, further, the condition of scratching a batch of wafers is detected, and then the type of the manipulator 2 scratching the wafer back is determined, for example, when the shortest distance X between the scratch 12 and the wafer center 11 is 80 mm, and when multiple continuous scratches occur, it can be determined that the scratch source is a second manipulator of the B groups. Of course, when the manipulator 2 is divided into a plurality of groups, the type of the manipulator 2 can be judged first, and then the group can be judged, so that the time is saved, and the efficiency of searching for a problem production machine is improved.
Further, if the shortest distance X between the scratch 12 and the wafer center 11 falls near the threshold value of the grouping, for example, X is 50 mm, the robots of both the group a and the group B may be stopped to check, so as to avoid erroneous determination, but in the actual production process, because the difference between the cross-sectional widths Y of each group of robots is large, the probability that the shortest distance X between the scratch 12 and the wafer center 11 is the threshold value (50, 100) or the value near the threshold value is small.
And finally, after the group and the category of the mechanical arm for scratching the wafer back are determined, stopping and maintaining the production machine in the interval, or further determining the production machine with the problem according to the direction of the scratch, and then maintaining the production machine with the problem.
In summary, the method for obtaining a wafer back scratch source according to the embodiments of the present invention includes grouping manipulators of a production machine according to a cross-sectional width; grabbing the wafer by using mechanical arms of different groups, wherein the mechanical arms support the wafer back of the wafer in the grabbing process; carrying out particle detection on the wafer back of the wafer to judge whether the wafer back of the wafer is scratched or not; when the wafer back is scratched, acquiring the shortest distance between the scratch and the center of the wafer circle; and judging the group of the mechanical arms for scratching the wafer back of the wafer according to the shortest distance between the scratch and the center of the wafer circle. The method for detecting the particles can quickly and accurately judge whether the wafer back of the wafer is scratched or not, improves the detection efficiency, avoids the uncertainty of manual visual inspection, and groups the mechanical arms of the production machine, and when the wafer back of the wafer is scratched, the groups of the mechanical arms scratching the wafer back of the wafer can be quickly determined according to the shortest distance between the scratch and the circle center of the wafer, so that the production machine with problems can be timely and effectively found out, the generation of defective products in batches is avoided, the labor expenditure is reduced, and the yield and the quality of products are effectively improved.
The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any way. It will be understood by those skilled in the art that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. A method for obtaining a wafer back scratch source is characterized in that the method for obtaining the wafer back scratch source comprises the following steps:
grouping the mechanical arms of the production machine according to the size of the section width;
grabbing the wafer by using mechanical arms of different groups, wherein the mechanical arms support the wafer back of the wafer in the grabbing process;
carrying out particle detection on the wafer back to judge whether the wafer back is scratched or not;
when the wafer back is scratched, acquiring the shortest distance between the scratch and the center of the wafer;
judging the group of the mechanical arms which scratch the wafer back according to the shortest distance between the scratch and the circle center of the wafer;
grouping the mechanical arms of the production machine according to the size of the section width comprises the following steps:
when one half of the cross-sectional width of the manipulator is in a first range, the manipulator is in group A; when one half of the cross-sectional width of the manipulator is in a second range, the manipulator is in group B; when one half of the cross-sectional width of the manipulator is in a third range, the width is C group, the first range is 0 mm-50 mm, the second range is 50 mm-100 mm, and the third range is 100 mm-150 mm;
when the shortest distance between the scratch and the circle center of the wafer is within a first range, the scratch is originated from the A group of manipulators; when the shortest distance between the scratch and the circle center of the wafer is within a second range, the scratch is originated from the manipulator in the group B; and when the shortest distance between the scratch and the circle center of the wafer is within a third range, the scratch is originated from the C-group mechanical arm.
2. The method of claim 1, wherein grouping the manipulators of the production tool into groups according to cross-sectional widths comprises:
grouping the mechanical arms of the production machine according to the size of the section width;
and classifying the mechanical arms of each group of production machines according to the grabbing mode.
3. The method of claim 2, wherein the robot is axisymmetric.
4. The method of claim 3, wherein during the capturing process, the symmetry axis of the robot is aligned with the diameter direction of the wafer.
5. The method of claim 4, wherein classifying the manipulators of each group of production tools according to the grabbing manner comprises:
when the grabbing mode of the manipulator is single-chip grabbing, the manipulator is of a first type; when the grabbing mode of the manipulator is multi-piece grabbing, the manipulator is of a second type; when the grabbing mode of the manipulator is batch grabbing, the manipulator is of a third type;
the number of the wafers grabbed by the multi-piece grabbing manipulator is 5-10; the number of the wafers grabbed by the whole batch grabbing manipulator at each time is 20-30.
6. The method according to claim 5, wherein when the wafer back is scratched, the scratch is derived from a first type of robot; when the wafer backs of the continuous wafers are scratched, the scratching source is a second type of mechanical arm; when the wafer backs of the whole batch of wafers are scratched, the scratch is originated from a third type of manipulator.
7. The method according to claim 1, wherein after determining the group of the robot for scratching the wafer back according to the shortest distance between the scratch and the center of the wafer, the method for obtaining the wafer back scratch source further comprises:
and maintaining the production machine corresponding to the mechanical arm for scratching the wafer back.
8. The method according to claim 1, wherein a particle detection device is used to perform particle detection on the wafer backside to determine whether the wafer backside is scratched.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102130030A (en) * | 2010-01-18 | 2011-07-20 | 上海华虹Nec电子有限公司 | Method for detecting mechanical scratching condition of silicon wafers |
| CN103681392A (en) * | 2012-09-06 | 2014-03-26 | 中芯国际集成电路制造(上海)有限公司 | Mechanical scratch detection method |
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| TW201545819A (en) * | 2014-06-06 | 2015-12-16 | Yealy Optic Electronic Co Ltd | Computer-aided visual identification output image LED die selection system and its selection method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102130030A (en) * | 2010-01-18 | 2011-07-20 | 上海华虹Nec电子有限公司 | Method for detecting mechanical scratching condition of silicon wafers |
| CN103681392A (en) * | 2012-09-06 | 2014-03-26 | 中芯国际集成电路制造(上海)有限公司 | Mechanical scratch detection method |
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