CN102130030A - Method for detecting mechanical scratching condition of silicon wafers - Google Patents

Abstract

The invention discloses a method for detecting the mechanical scratching condition of silicon wafers. A method for detecting source machines which are subjected to mechanical scratching comprises the following steps of: 1, establishing a characteristic information database of a mechanical transmission device of a silicon wafer carrying device on a silicon wafer production line; 2, when detecting that the silicon wafers are subjected to the mechanical scratching on the production line, collecting characteristic parameters of silicon wafer scratches; 3, comparing the characteristic parameters of the silicon wafer scratches with the characteristic information of the mechanical transmission device in the database to retrieve equipment models matched with the scratches; and 4, analyzing the equipment operating records of the silicon wafers, and screening specific operating machines with the scratches and operating time out. By the method, the source machines with the scratches can be found quickly, and machine halt can be performed as soon as possible when the silicon wafers are scratched to reduce damaged batches and the loss of the wafers and improve the yield.

Description

The detection method of silicon chip machinery scuffing situation

Technical field

The present invention relates to the detection method in a kind of silicon chip manufacture process, be specifically related to a kind of detection method of silicon chip machinery scuffing situation.

Background technology

In the production process of silicon chip, need to adopt the carrying device of accurately control to carry out the conveyance of silicon chip.In the conveyance process, the manipulator of carrying device only contacts the silicon chip back side and does not touch the front of silicon chip, to avoid the scuffing of silicon chip.But in actual mechanical process, can cause the displacement of manipulator owing to reasons such as mechanical wear or screw are loosening, and the spacing between the silicon chip is very narrow, therefore the displacement of manipulator be easy to cause manipulator in motion process, touch below the surface of one piece of silicon chip, cause the scuffing of silicon chip, as shown in Figure 1.

The machinery of silicon chip scratches situation in case be scanned out at follow-up defective supervision control engineering, just must find the source board as early as possible and carry out fault restoration, avoids the infringement to product.Present detection method is by the picture of distribution map and optics, ESEM in the face that scratches silicon chip being analyzed, investigated, judging to scratch with engineer's experience may occur on the board equipment of which operation.

But because the processing step complexity that silicon chip is made, the accidental scuffing that once takes place often is difficult in directly to detect in tens up to a hundred operations and produces the operation that scratches.Therefore the detection method that more effectively scratches at present situation is, after identical machinery scratches and repeats to take place, with two be scratched batch pictorial information analyze, at first define and suspect the technology paragraph, in suspecting the operation paragraph, carry out the comparison of equipment availability resume then, seek two batches of common used boards, thereby dwindle the scope of the suspicious board that scuffing takes place; Investigate one by one at these boards at last, find out the source board of scuffing,, avoid scratching once more and take place so that to source board shutdown maintenance.

This detection method is more consuming time, is difficult to judge the source board before repeating to scratch.And what scratch repeats to mean bigger yield loss.

Summary of the invention

Technical problem to be solved by this invention provides a kind of detection method of silicon chip machinery scuffing situation, and it can find out the reason that silicon chip machinery scratches quickly and efficiently.

For solving the problems of the technologies described above, the technical solution of the detection method of silicon chip machinery scuffing situation of the present invention is:

Detect silicon chip by following steps the source board that machinery scratches take place:

The first step is set up the characteristic information database of the mechanical moving device of silicon chip carrying device on the silicon chip production line; Described mechanical moving device comprise might with the positive production that contacts unusually of silicon chip and the associated components of determinator; Described database comprises the detailed dimensions of unit type, the sequence of operation, notch alignment mode, the name of parts that may produce scuffing, the issuable cut of these parts.

In second step, detecting certain batch of silicon chip on production line has machinery to scratch, and gathers the characteristic parameter of silicon chip cut;

The 3rd step, the characteristic information of mechanical moving device in the characteristic parameter of silicon chip cut and the database is compared, retrieve the unit type with the cut coupling, this kind equipment is the unit type of this scuffing of generation; The characteristic parameter of described cut comprises the angle, length of the sheet number that is scratched silicon chip, cut, apart from the intercept in the center of circle.

The 4th step, according to this silicon chip place product batches information, analyze the equipment availability resume of this batch silicon chip, in the equipment of all processes of this batch silicon chip, find the device type that produces this silicon chip cut, thereby filter out the concrete machines and the activity duration that produce cut, this board is the source board that produces cut.

Detection method of the present invention automatically performs by the yield analytical system, and concrete grammar is as follows:

The yield analytical system comprises the characteristic information database and the equipment availability resume of mechanical moving device; With the characteristic parameter of silicon chip cut and the batch information input yield analytical system at scuffing silicon chip place; The operation of yield analytical system, output produce the unit type of this scuffing, the concrete machines that produces cut and activity duration, characteristic matching degree.

The technique effect that the present invention can reach is:

The present invention can find out quickly rapidly and produce the source board that scratches, and avoids the consuming time of manual detection and blindness; And can shut down early when silicon chip scratches taking place, reduce and be injured batch, reduce chip loss, thereby improve yields.

Description of drawings

The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments:

Fig. 1 is the schematic diagram that silicon chip is scratched;

Fig. 2 is the flow chart of the detection method of silicon chip machinery scuffing situation of the present invention.

Description of reference numerals among the figure:

10 is cut.

Embodiment

The detection method of silicon chip machinery scuffing situation of the present invention, detect silicon chip by following steps the source board that machinery scratches take place:

1, sets up the characteristic information database of the mechanical moving device of silicon chip carrying device on the silicon chip production line;

Because nearly tens kinds of the actual type of the manipulator of mechanical moving device, size differs, so the scuffing size that dissimilar manipulators causes is also different.

This mechanical moving device comprise might with the positive production that contacts unusually of silicon chip and the associated components (manipulator, conveyer belt etc.) of determinator, database comprises the detailed dimensions of unit type, the sequence of operation, notch alignment mode, the name of parts that may produce scuffing, the issuable cut of these parts;

2, detecting certain batch of silicon chip on production line has machinery to scratch, and gathers the characteristic parameter of silicon chip cut, comprises the angle, length of the sheet number that is scratched silicon chip, cut, apart from the intercept in the center of circle;

3, the characteristic information of mechanical moving device in the characteristic parameter of silicon chip cut and the database is compared, retrieve the unit type with the cut coupling, this kind equipment is the unit type that produces this scuffing;

4, according to this silicon chip place product batches information, analyze the equipment availability resume (being the Historical Jobs record) of this batch silicon chip, in the equipment of all processes of this batch silicon chip, find the device type that produces this silicon chip cut, thereby filter out the concrete machines and the activity duration that produce cut, this board is the source board that produces cut.

After finding out the source board, send instructions, the source board that causes scuffing is stopped operation, take place thereby avoid scratching once more to production system.The source board is carried out checking maintenance, verify the reason that produce to scratch, so that fundamentally avoid the generation that scratches.

As shown in Figure 2, the operating process of the detection method of silicon chip machinery scuffing situation of the present invention is as follows:

1, set up the yield analytical system, the yield analytical system comprises the relevant parameter achievement data storehouse and the equipment availability resume of mechanical moving device;

2, with the characteristic parameter of silicon chip cut and the batch information input yield analytical system at scuffing silicon chip place;

Characteristic parameter as the silicon chip cut is:

(1) scratch a piece number and show as every a piece scuffing, odd number is piece good, and only an even number piece same position scratches;

(2) all scratch the silicon chip angle unanimity;

(3) cut is 5cm apart from the intercept in the silicon chip center of circle.

Production code member (batch information at corresponding silicon chip place) and cut characteristic parameter input yield analytical system with this silicon chip;

3, yield analytical system operation, output produce the unit type of this scuffing, the concrete machines that produces cut and activity duration, characteristic matching degree;

The yield analytical system corresponds to following board feature with above 3 cut features:

(1) two-chamber operation;

(2) jagged alignment device;

(3) width of carrying manipulator is about 5cm * 2, i.e. 10cm.

According to these board features, in conjunction with the equipment availability resume that scratch silicon chip, system crosses this scuffing silicon chip with operation and meets the machine station information that scratches feature and retrieves automatically, thereby finds out the source board.

4, make the source board that causes scuffing stop production operation rapidly, the on-the-spot carrying device of confirming this source board is debugged again.

The present invention is by carrying out the measurement of characteristic index to the phenomenon that scratches generation and defining, and the characteristic parameter of cut is input to analytical system, by analytical system the characteristic parameter of silicon chip cut and the characteristic information of mechanical moving device are compared, analysis and judgement goes out to produce the source board of cut, and export the information of source board rapidly, thereby target is carried out fault exactly and is disposed and recover.

Claims (4)

1. the detection method of silicon chip machinery scuffing situation is characterized in that: detect silicon chip by following steps the source board that machinery scratches takes place:

The first step is set up the characteristic information database of the mechanical moving device of silicon chip carrying device on the silicon chip production line;

In second step, detecting certain batch of silicon chip on production line has machinery to scratch, and gathers the characteristic parameter of silicon chip cut;

The 3rd step, the characteristic information of mechanical moving device in the characteristic parameter of silicon chip cut and the database is compared, retrieve the unit type with the cut coupling, this kind equipment is the unit type of this scuffing of generation;

The 4th step, according to this silicon chip place product batches information, analyze the equipment availability resume of this batch silicon chip, in the equipment of all processes of this batch silicon chip, find the device type that produces this silicon chip cut, thereby filter out the concrete machines and the activity duration that produce cut, this board is the source board that produces cut.

2. the detection method of silicon chip according to claim 1 machinery scuffing situation is characterized in that: described mechanical moving device comprise institute might with the positive unusual production that contacts of silicon chip and the associated components of determinator; Described database comprises the detailed dimensions of unit type, the sequence of operation, notch alignment mode, the name of parts that may produce scuffing, the issuable cut of these parts.

3. the detection method of silicon chip according to claim 1 machinery scuffing situation is characterized in that: the characteristic parameter of described cut comprises the angle, length of the sheet number that is scratched silicon chip, cut, apart from the intercept in the center of circle.

4. the detection method of silicon chip machinery scuffing situation according to claim 1, it is characterized in that: described detection method automatically performs by the yield analytical system, and concrete grammar is as follows:

The yield analytical system comprises the characteristic information database and the equipment availability resume of mechanical moving device; With the characteristic parameter of silicon chip cut and the batch information input yield analytical system at scuffing silicon chip place; The operation of yield analytical system, output produce the unit type of this scuffing, the concrete machines that produces cut and activity duration, characteristic matching degree.

Images