CN108350324B - Film wound body and method for producing film wound body - Google Patents

Film wound body and method for producing film wound body Download PDF

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Publication number
CN108350324B
CN108350324B CN201680064713.1A CN201680064713A CN108350324B CN 108350324 B CN108350324 B CN 108350324B CN 201680064713 A CN201680064713 A CN 201680064713A CN 108350324 B CN108350324 B CN 108350324B
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film
release
adhesive film
peeling
contact
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CN108350324A (en
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荒木雄太
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Dexerials Corp
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Dexerials Corp
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04Kinds or types
    • B65H75/08Kinds or types of circular or polygonal cross-section
    • B65H75/14Kinds or types of circular or polygonal cross-section with two end flanges
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Abstract

Provided are a film roll which can obtain excellent temporary bonding performance and a method for manufacturing the film roll. The film wound body is provided with: an adhesive film (2) having a1 st surface (concave surface) formed in the longitudinal direction such that the thickness of both ends in the width direction is greater than the thickness of the central portion, and a flat 2 nd surface (flat surface) formed on the opposite side of the 1 st surface; a release film (3) having a heavy release surface with a relatively high release force and a light release surface with a relatively low release force; and a reel (4) for winding the adhesive film and the release film around the winding core, wherein the film wound body is wound so that the 1 st surface of the adhesive film (2) is in contact with the heavy release surface of the release film (3) and the 2 nd surface of the adhesive film (2) is in contact with the light release surface of the release film (3).

Description

Film wound body and method for producing film wound body
Technical Field
The present invention relates to a Film roll formed by winding an adhesive Film such as an ACF (anisotropic Conductive Film) or NCF (Non-Conductive Film), and a method for manufacturing the Film roll. This application claims priority on the basis of Japanese patent application No. Japanese 2015-228229, filed in Japan 11/20/2015, which is incorporated herein by reference.
Background
Conventionally, an adhesive film such as an ACF or an NCF is obtained by a slitting process of slitting (slitting) a wide adhesive film into narrow adhesive films having a width of, for example, 1 to 3 mm. In the adhesive film after the slitting step, one surface is raised in the slitting direction and the other surface is flat (for example, see patent document 1).
That is, the adhesive film after the slitting step has a surface (concave surface) on one side formed in the longitudinal direction so that the thickness of both ends in the width direction is larger than the thickness of the central portion, and a surface (flat surface) on the other side that is flat.
When a film roll-up body formed by winding up such an adhesive film is used, the adhesive film is usually pulled out in a state where a flat surface of the adhesive film is bonded to a release film. Therefore, it is difficult to obtain excellent temporary adhesion by attaching the concave surface of the adhesive film to a material to be bonded such as a substrate.
Documents of the prior art
Patent document
Patent document 1, japanese patent application laid-open No. 2012-102278.
Disclosure of Invention
Problems to be solved by the invention
The present invention solves the problems of the prior art described above, and provides a film roll that can obtain excellent temporary adhesion, and a method for manufacturing the film roll.
Means for solving the problems
In order to solve the above problem, a method for manufacturing a film roll according to the present invention includes: an adhesive film having a1 st surface formed in a longitudinal direction so that both end portions in a width direction have a thickness larger than that of a central portion, and a flat 2 nd surface formed on the opposite side of the 1 st surface; a release film having a heavy release surface with a relatively high release force and a light release surface with a relatively low release force; and a winding core around which the adhesive film and the release film are wound, wherein the wound film body is wound around the winding core such that a1 st surface of the adhesive film is in contact with a heavy release surface of the release film and a2 nd surface of the adhesive film is in contact with a light release surface of the release film.
In addition, the method for manufacturing a film roll package according to the present invention is characterized by comprising the steps of forming an adhesive film having a1 st surface formed in a longitudinal direction so that both end portions in a width direction have a thickness larger than that of a central portion, and a flat 2 nd surface formed on the opposite side of the 1 st surface; and a release film having a heavy release surface with a relatively high release force and a light release surface with a relatively low release force, wherein the roll core is wound in such a manner that the 1 st surface of the adhesive film is in contact with the heavy release surface of the release film and the 2 nd surface of the adhesive film is in contact with the light release surface of the release film.
Further, a method for manufacturing a connection structure according to the present invention is a method for manufacturing a connection structure, in which a laminated film in which a1 st surface of an adhesive film is in contact with a heavy release surface of a release film is pulled out from a film wound body including the adhesive film, the release film, and a winding core, a2 nd surface of the adhesive film is temporarily bonded to a1 st circuit member, the release film is released, and a2 nd circuit member is placed on the adhesive film, and is finally pressure-bonded, wherein the film wound body includes: an adhesive film having a1 st surface formed in a longitudinal direction so that both end portions in a width direction have a thickness larger than that of a central portion, and a flat 2 nd surface formed on the opposite side of the 1 st surface; a release film having a heavy release surface with a relatively high release force and a light release surface with a relatively low release force; and a winding core around which the adhesive film and the release film are wound, wherein in the wound film body, a1 st surface of the adhesive film is in contact with a heavy release surface of the release film, and a2 nd surface of the adhesive film is in contact with a light release surface of the release film.
Effects of the invention
According to the present invention, the flat surface of the adhesive film is bonded to the material to be bonded such as a substrate while the concave surface of the adhesive film is pulled out in a state of being bonded to the release film, and therefore, excellent temporary bonding properties can be obtained.
Drawings
FIG. 1 is a perspective view schematically showing an example of a film wound body.
Fig. 2 is a cross-sectional view schematically showing an adhesive film.
Fig. 3 is a cross-sectional view schematically showing an adhesive film pulled out from a film roll package.
FIG. 4 is a sectional view schematically showing the outermost periphery of the film wound body of configuration example 1 in section A-A of the film wound body shown in FIG. 2.
FIG. 5 is a sectional view schematically showing the outermost periphery of the film wound body of the 1 st configuration example at the time of drawing out in the section A-A of the film wound body shown in FIG. 2.
FIG. 6 is a sectional view schematically showing the outermost periphery of the film wound body of configuration example 2 at the time of pulling out the film wound body in section A-A of the film wound body shown in FIG. 2.
FIG. 7 is a sectional view schematically showing a state where an adhesive film is protruded and attached to a flange in a section A-A of the film wound body shown in FIG. 2.
Fig. 8 is a partial sectional view schematically showing a wide adhesive film (a roll).
Fig. 9 is a cross-sectional view of the adhesive film schematically showing the slitting step.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail in the following order.
1. Film wound body
2. Method for producing film wound body
3. Method for manufacturing connection structure
4. Examples of the embodiments
< 1. Membrane wound body >
The film roll package according to the present embodiment includes: an adhesive film having a1 st surface (concave surface) formed in a longitudinal direction so that both end portions in a width direction have a thickness larger than that of a central portion, and a flat 2 nd surface (flat surface) formed on the opposite side of the 1 st surface; a release film having a heavy release surface with a relatively high release force and a light release surface with a relatively low release force; and a reel member for winding the adhesive film and the release film around the winding core, wherein the film wound body is wound such that the 1 st surface of the adhesive film is in contact with the heavy release surface of the release film and the 2 nd surface of the adhesive film is in contact with the light release surface of the release film. In this way, the flat surface of the adhesive film is bonded to the material to be bonded such as a substrate while the concave surface of the adhesive film is pulled out in a state of being bonded to the support film, and therefore, excellent temporary bonding properties can be obtained.
Fig. 1 is a perspective view schematically showing an example of a film roll according to the present embodiment. As shown in fig. 1, the film wound body 1 is formed by winding an adhesive film 2 and a release film 3 around a reel 4.
Fig. 2 is a cross-sectional view schematically showing the adhesive film, and fig. 3 is a cross-sectional view schematically showing the adhesive film when it is pulled out from the film roll package.
The adhesive film 2 has a1 st surface (concave surface) formed in the longitudinal direction so that the thickness of both ends in the width direction is larger than the thickness of the central portion, and a flat 2 nd surface (flat surface) formed on the opposite side of the 1 st surface. As shown in fig. 2, the cross section of the adhesive film 2 in the width direction is concave, convex portions 2a continuous in the longitudinal direction are formed at both ends of the concave surface in the width direction, and concave portions 2b continuous in the longitudinal direction are formed at the center of the concave surface in the width direction. The total contact width Sa (Sa1 + Sa2) of the projections 2a at both ends of the concave surface in the width direction is, for example, 10 to 60% of the contact width Sb of the flat surface in the width direction. The contact width Sb in the width direction of the flat surface is, for example, 0.6mm to 5.0 mm. The height h of the convex portions 2a and the concave portions 2b is, for example, 5 μm or more, and the upper limit value thereof is 70% or less of the film thickness. The length of the adhesive film is, for example, 50 to 5000 m.
Examples of the adhesive film 2 include: anisotropic Conductive Film (ACF), Non-Conductive Film (NCF), Conductive adhesive Film for connecting the electrodes of the solar cell and the TAB line, and the like.
The release film 3 is a support film formed in a band shape and supporting the adhesive film. Examples of the substrate for the release film 3 include: PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methlpentene-1, Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene), and the like.
The release film 3 has a heavy release surface with a relatively high release force and a light release surface with a relatively low release force. Here, the heavy release surface having a relatively high release force means a surface having a relatively high release force when the release forces of both surfaces of the release film 3 are measured under the same conditions; the light release surface having a relatively low release force is a surface having a relatively low release force when the release forces of both surfaces of the release film 3 are measured under the same conditions. The peeling force between the heavy peeling surface and the light peeling surface can be adjusted by, for example, the type of a peeling agent such as silicone or the like, the surface roughness (Rz) of the base material, or the like. Further, examples of the method for measuring the peeling force include: 180 DEG peel strength test (JIS K6854-2), 90 DEG peel strength test (JIS K6854-1) and the like.
In the present embodiment, a value obtained by multiplying the contact width in the width direction between the concave surface and the heavy peeling surface by the peeling force of the heavy peeling surface is larger than a value obtained by multiplying the contact width in the width direction between the flat surface and the light peeling surface by the peeling force of the light peeling surface. Specifically, the difference [ (Ta × Sa) - (Tb × Sb) ] obtained by subtracting a value obtained by multiplying the contact width Sb in the width direction between the flat surface and the light peeling surface by the 180 ° peeling force Tb of the light peeling surface from a value obtained by multiplying the contact width Sa in the width direction between the concave surface and the heavy peeling surface by the 180 ° peeling force Ta of the heavy peeling surface is preferably 0.3mN or more and 4.5mN or less, more preferably 0.5mN or more and 3.0mN or less, and still more preferably 1.0mN or more and 2.5mN or less. In this way, the flat surface of the adhesive film is bonded to the material to be bonded such as a substrate while the concave surface of the adhesive film is pulled out in a state of being bonded to the support film, and therefore, excellent temporary bonding properties can be obtained.
The reel 4 includes: a cylindrical winding core 5 for winding the adhesive film 2 and the release film 3, and plate-like flanges 6 provided at both ends of the winding core 5. The winding core 5 has a shaft hole into which a rotation shaft for rotating the reel 4 is inserted. One end in the longitudinal direction of the adhesive film 2 or the release film 3 is connected to the winding core 5, and the adhesive film 2 and the release film 3 are wound around the winding core.
The reeling core 5 and the flange 6 can be formed, for example, using various plastic materials. The flange 6 may be subjected to electrostatic treatment on the surface thereof in contact with the adhesive film 2. Examples of the method for performing the electrostatic treatment include: a method of applying a compound such as polythiophene to the flange 6. The film roll package shown in fig. 1 is configured by winding an adhesive film around a roll core 5 having flanges 6 at both ends, but may be configured by winding an adhesive film around a roll core without a flange.
[ 1 st configuration example ]
FIG. 4 is a sectional view schematically showing the outermost periphery of the film wound body of configuration example 1 in section A-A of the film wound body shown in FIG. 2. As shown in fig. 4, in the release film 3, the concave surface of the adhesive film 2 is in contact with the heavy release surface with a predetermined contact width Sa in the width direction, and the flat surface of the adhesive film 2 is in contact with the light release surface with a predetermined contact width Sb.
The film wound body of configuration example 1 is configured by winding a laminate film in which a flat surface of an adhesive film 2 and a light release surface of a release film 3 are in contact with each other, such that the adhesive film 2 side is on the inner peripheral side.
FIG. 5 is a sectional view schematically showing the outermost periphery of the film wound body of configuration example 1 at the time of pulling out the film wound body in section A-A of the film wound body shown in FIG. 2. As shown in fig. 5, the outermost release film 3 is peeled by 1 cycle, and when pulled out, the adhesive film 2 is pulled out in a state of being in contact with the inner release film 3.
[ 2 nd constitution example ]
FIG. 6 is a sectional view schematically showing the outermost periphery of the film wound body of configuration example 2 at the time of pulling out the film wound body in section A-A of the film wound body shown in FIG. 2. The film wound body of configuration example 2 is configured by winding a laminate film in which a flat surface of an adhesive film 2 and a light release surface of a release film 3 are in contact with each other so that the adhesive film 2 side is on the outer peripheral side. As shown in fig. 6, the outermost adhesive film 2 is peeled off by 1 cycle, and when pulled out, the adhesive film 2 is pulled out in a state of being in contact with the outer release film 3.
[ anti-blocking Properties ]
FIG. 7 is a sectional view schematically showing a state where the adhesive film is protruded and attached to the flange in the section A-A of the film wound body shown in FIG. 2. In the film wound body, the pressure of the adhesive film 2 may be generated by expansion and contraction due to temperature, drawing operation, or the like (winding き り). As a result, the resin (adhesive component) of the adhesive film 2 flows further outward than one end in the width direction along the longitudinal direction of the resin, and may overflow from the side surface of the release film 3. As shown in fig. 7, if the resin of the adhesive film 2 overflows from the side surface of the release film 3, the resin of the adhesive film may adhere to the side surface of the flange 6 of the reel, and blocking may occur in which the adhesive film cannot be normally pulled out.
In the film wound body according to the present embodiment, the adhesive film is wound around a roll having a1 st surface (concave surface) formed in the longitudinal direction so that the thickness of both end portions in the width direction is larger than the thickness of the central portion, and a flat 2 nd surface (flat surface) formed on the opposite side of the 1 st surface. Therefore, as shown in fig. 2 and 3, the concave portions 2b are continuously formed in the longitudinal direction between the concave surface of the adhesive film 2 and the release film 3. In this way, the void caused by the concave portion 2b is formed between the concave surface of the adhesive film 2 and the release film 3, and thus, when the roll-up occurs, the resin of the adhesive film 2 can be made to flow into the void caused by the concave portion 2b while reducing the force of the roll-up. Therefore, the overflow of the resin is suppressed, and excellent blocking resistance can be obtained.
Further, according to the film roll-up body of configuration example 1, since the adhesive film is present on the side in the direction in which the film is pulled out, the release film 3 can be pulled out so as to lift the adhesive film 2. Therefore, even if resin adheres to the flange 6, the resin can be peeled off with a strength as strong as possible to eliminate blocking, and excellent blocking resistance can be obtained.
< 2. method for producing film wound body
Next, a method for producing the film wound body will be described. The method for producing a film wound body according to the present embodiment is as follows: a winding core of a reel member is wound with an adhesive film having a1 st surface (concave surface) formed at both ends in a width direction in a longitudinal direction and having a thickness larger than that of a central portion and a flat 2 nd surface (flat surface) formed on the opposite side of the 1 st surface, and a release film having a heavy release surface with a relatively high release force and a light release surface with a relatively low release force, so that the 1 st surface of the adhesive film is in contact with the heavy release surface of the release film and the 2 nd surface of the adhesive film is in contact with the light release surface of the release film.
First, a release film having a heavy release surface with a relatively high release force and a light release surface with a relatively low release force is prepared, and a composition of an adhesive film is applied to the light release surface so as to have a predetermined thickness. Thus, the adhesive film can be transferred to and bonded to the heavy release surface when the adhesive film is pulled out after being wound. As the composition of the adhesive film, known ones such as acf (anisotropic Conductive film) and ncf (non Conductive film) can be used.
Fig. 8 is a partial sectional view schematically showing a wide adhesive film (a roll). As shown in fig. 8, after the adhesive film (raw roll) having a wide width is formed, since foreign matter is mixed at the time of cutting, it is preferable to attach a cover film 7 to the adhesive film.
Fig. 9 is a cross-sectional view schematically showing the adhesive film in the slitting step. In the slitting step, the adhesive film having a wide width is slit to a predetermined width. In this cutting, a concave surface is formed on the adhesive film due to the influence of a difference in strength between the release film 3 and the cover film 7, a cutting edge, and the like. Thus, when the concave surface is viewed from above the film, a line indicating a difference in level of the concave portion substantially parallel to the longitudinal direction may be observed. The line indicating the difference in level of the concave portion is a straight line, but a portion may be curved or a portion may be broken to form a non-straight line. After cutting, the cover film 7 is peeled off, and the adhesive film 2 and the release film 3 are wound on the reel 4, whereby the film wound body 1 can be obtained.
Here, the film roll package of configuration example 1 shown in fig. 4 can be obtained by winding a laminate film in which a flat surface of an adhesive film 2 and a light release surface of a release film 3 are in contact with each other around a reel such that the adhesive film 2 side is on the inner peripheral side.
The film roll-up body of the configuration example 2 shown in fig. 6 can be obtained by rolling up a laminate film in which the flat surface of the adhesive film 2 and the light release surface of the release film 3 are in contact with each other on a reel so that the adhesive film 2 side is on the outer peripheral side.
Alternatively, the laminated film in which the concave surface of the adhesive film 2 pulled out from the film roll-up body of configuration example 1 or configuration example 2 is in contact with the heavy release surface of the release film 3 may be wound around another reel such that the adhesive film 2 side is on the outer circumferential side or the inner circumferential side.
< 3. method for manufacturing connection structure
The method for manufacturing the connection structure according to the present embodiment is as follows: pulling out a laminated film in which the 1 st surface of the adhesive film is in contact with the heavy release surface of the release film from the film wound body described below, temporarily bonding the 2 nd surface of the adhesive film to the 1 st adherend, releasing the release film, placing the 2 nd circuit member on the adhesive film, and performing a main pressure bonding; the film wound body is provided with: an adhesive film having a1 st surface (concave surface) formed in a longitudinal direction so that both end portions in a width direction have a thickness larger than that of a central portion, and a flat 2 nd surface (flat surface) formed on the opposite side of the 1 st surface; a release film having a heavy release surface with a relatively high release force and a light release surface with a relatively low release force; and a reel member for winding the adhesive film and the release film around the winding core, wherein the film wound body is wound such that the 1 st surface of the adhesive film is in contact with the heavy release surface of the release film and the 2 nd surface of the adhesive film is in contact with the light release surface of the release film.
The 1 st circuit component and the 2 nd circuit component are not particularly limited and may be appropriately selected according to the purpose. Examples of the 1 st circuit component include: glass substrates for Plasma Display Panel (PDP) applications, LCD (Liquid Crystal Display) panel applications, and the like, Printed Wiring Boards (PWBs), and the like. Further, as the 2 nd circuit component, for example, there are: flexible Printed Circuits (FPC), Tape Carrier Package (TCP) substrates, Integrated Circuits (IC), and the like.
According to the method for manufacturing a connection structure of the present embodiment, since the flat surface of the adhesive film is bonded to the 1 st circuit member, excellent temporary adhesion can be obtained. In addition, since the concave surface of the adhesive film is eliminated by the 2 nd circuit member pressure-bonding at the time of the main pressure-bonding, excellent adhesive strength can be obtained.
< 4. example >.
Examples
< 4.1 embodiment 1 >)
Hereinafter, embodiment 1 of the present invention will be described. In example 1, a film roll was produced by winding a radical ACF in a so-called inward-winding configuration using release films having different peeling forces. Then, the transfer adhesiveness and temporary adhesiveness of the ACF when the ACF was pulled out were evaluated. It should be noted that the present invention is not limited to these examples.
[ measurement of peeling force of peeling film ]
The peel force of the release film was measured using the radical ACF composition in the same manner as in the examples. The radical type ACF composition was obtained by uniformly mixing 50 parts by mass of a phenoxy resin (trade name: YP-50, manufactured by Nippon iron chemical Co., Ltd.), 20 parts by mass of a bifunctional acrylic monomer (trade name: A-200, manufactured by Nippon Mediterranean chemical Co., Ltd.), 20 parts by mass of a urethane acrylate (trade name: U-2PPA, manufactured by Nippon Mediterranean chemical Co., Ltd.), 5 parts by mass of dilauroyl peroxide (trade name: Nyper BW, manufactured by Nippon oil Co., Ltd.), and 5 parts by mass of conductive particles (trade name: AUL704, manufactured by Water chemical industries, Ltd.) by a conventional method. The radical ACF composition was applied to an unpeeled PET film having a thickness of about 38 μm so that the thickness after drying became 25 μm, and dried to prepare a radical ACF with PET having a width of 5 cm.
The free radical type ACF with PET was adhered to the measurement surface of the 5cm wide release film using a 2kg roll, and the peel force (tape peel, peel angle 180 °, peel speed 300 mm/min) after 30 minutes was measured according to the 180 ° peel strength test (JIS K6854-2).
[ evaluation of transfer adhesiveness ]
The ACF was drawn out from the reel to a length of 200m, and the length of the transfer-bonded state in which the release film was bonded to the concave surface of the ACF was measured to calculate the transfer-bonding ratio. Then, the trans-adhesiveness was evaluated according to the following criteria.
A: the transfer adhesion ratio is more than 90% and less than 100%
B: the transfer bonding proportion is more than 50 percent and less than 90 percent
C: the transfer bonding proportion is less than 50 percent
[ evaluation of temporary adhesiveness ]
10 ACF sheets pulled out from a reel were temporarily stuck to a mother glass having a thickness of 0.7mm under the following conditions, and the peeling film was peeled off. After the peeling of the peeling film, the number of successful sheets in a state where the ACF is temporarily attached to the mother glass was counted. Then, the temporary adhesiveness was evaluated based on the following index.
Bonding conditions: the temperature is 60 ℃ and the pressure is 1MPa for 1 second
A buffer material: silicone rubber (thickness 200 μm)
A: the number of successful tablets is 8-10
B: the number of successful tablets is 3-7
C: the number of successful tablets is 0-2.
[ example 1]
A release film having an A-side surface with a release force Ta of 0.05N/cm and a B-side surface with a release force Tb of 0.01N/cm was prepared.
A composition of radical ACF was prepared by uniformly mixing 50 parts by mass of phenoxy resin (trade name: YP-50, manufactured by Nippon iron chemical Co., Ltd.), 20 parts by mass of bifunctional acrylic monomer (trade name: A-200, manufactured by Nippon Mediterranean chemical Co., Ltd.), 20 parts by mass of urethane acrylate (trade name: U-2PPA, manufactured by Nippon Mediterranean chemical Co., Ltd.), 5 parts by mass of dilauroyl peroxide (trade name: Nyper BW, manufactured by Nippon oil and fat Co., Ltd.), and 5 parts by mass of conductive particles (trade name: AUL704, manufactured by Water chemical industries, Ltd.) by a conventional method.
The above composition was applied to the B surface of a release film to a thickness of 25 μm, followed by attaching a cover film and cutting to a width of 0.15cm, to obtain an ACF having a length of 200 m. In the cross section schematically shown in fig. 2, the ACF after the cutting step has a contact width Sa of the concave convex portions 2a of about 0.06cm and a contact width Sb of the flat surface of about 0.15 cm.
Next, the cover film is peeled off, and the ACF and the release film are wound up on a reel so that the ACF is disposed on the inner peripheral side, thereby obtaining a so-called inward-wound film package. The evaluation results of the film wound body of example 1 are shown in table 1.
[ example 2]
A film wound body was obtained in the same manner as in example 1, except that a release film having a surface A with a release force Ta of 0.03N/cm and a surface B with a release force Tb of 0.01N/cm was prepared. The evaluation results of the film wound body of example 2 are shown in table 1.
[ example 3]
A film wound body was obtained in the same manner as in example 1, except that a release film having a surface A with a release force Ta of 0.08N/cm and a surface B with a release force Tb of 0.01N/cm was prepared. The evaluation results of the film wound body of example 3 are shown in table 1.
[ example 4]
A film wound body was obtained in the same manner as in example 1, except that a release film having a surface A with a release force Ta of 0.1N/cm and a surface B with a release force Tb of 0.01N/cm was prepared. The evaluation results of the film wound body of example 4 are shown in table 1.
[ example 5]
A film wound body was obtained in the same manner as in example 1 except that a release film having a surface A with a release force Ta of 0.05N/cm and a surface B with a release force Tb of 0.01N/cm was prepared and cut into a width of 0.20 cm. In the ACF after the cutting step, in the cross section schematically shown in fig. 2, the contact width Sa of the convex portions 2a of the concave surface is about 0.08cm, and the contact width Sb of the flat surface is 0.20 cm. The evaluation results of the film wound body of example 5 are shown in table 1.
[ example 6]
A film wound body was obtained in the same manner as in example 1 except that a release film having a surface A with a release force Ta of 0.05N/cm and a surface B with a release force Tb of 0.01N/cm was prepared and cut into a width of 0.10 cm. In the ACF after the cutting step, in the cross section schematically shown in fig. 2, the contact width Sa of the convex portions 2a of the concave surface is about 0.03cm, and the contact width Sb of the flat surface is 0.10 cm. The evaluation results of the film wound body of example 6 are shown in table 1.
Comparative example 1
A film wound body was obtained in the same manner as in example 1, except that a release film having a surface A with a release force Ta of 0.01N/cm and a surface B with a release force Tb of 0.05N/cm was prepared. The evaluation results of the film wound body of comparative example 1 are shown in table 1.
Comparative example 2
A film wound body was obtained in the same manner as in example 1, except that a release film having a surface A with a release force Ta of 0.02N/cm and a surface B with a release force Tb of 0.02N/cm was prepared. The evaluation results of the film wound body of comparative example 2 are shown in table 1.
[ Table 1]
Figure DEST_PATH_IMAGE001
As in comparative example 1, when the adhesive film and the release film were wound so that the concave surface was in contact with the light release surface and the flat surface was in contact with the heavy release surface, the adhesive film was difficult to pull out in a state of being transferred with the release film adhered to the concave surface of the adhesive film, and it was difficult to temporarily bond the adhesive film and the release film. Further, as shown in comparative example 2, even when the release film does not have a heavy release surface and a light release surface, it is difficult to pull out the release film in a transfer-bonded state, and temporary bonding is difficult.
On the other hand, as in examples 1 to 6, when the adhesive film and the release film are wound so that the concave surface is in contact with the heavy release surface and the flat surface is in contact with the light release surface, the adhesive film and the release film can be pulled out in a transfer-bonded state in which the release film is bonded to the concave surface of the adhesive film, and temporary bonding can be performed.
Further, a difference [ (Ta × Sa) - (Tb × Sb) ] obtained by subtracting a value obtained by multiplying a contact width Sb in the width direction between the flat surface and the light peeling surface by a 180 ° peeling force Tb of the light peeling surface from a value obtained by multiplying a contact width Sa in the width direction between the concave surface and the heavy peeling surface by a 180 ° peeling force Ta of the heavy peeling surface is 0.3mN or more and 4.5mN or less, whereby excellent transfer adhesiveness and temporary adhesiveness are obtained.
< 4.2 embodiment 2 >)
Hereinafter, embodiment 2 of the present invention will be described. In example 2, the so-called inward-wound film roll, outward-wound film roll, film roll having a concave surface on one side, and film roll having only a flat surface were evaluated for transfer adhesiveness, temporary adhesiveness, and blocking resistance. It should be noted that the present invention is not limited to these examples.
The measurement of the peeling force of the release film, the evaluation of the transfer adhesiveness, and the evaluation of the temporary adhesiveness were performed in the same manner as in example 1.
[ evaluation of anti-blocking Property ]
Using a reel member of a double-sided flange type having a core shaft portion of 85mm in diameter and a flange made of polystyrene of 1.5mm in average thickness, the ACF and the release film were wound up to the core shaft portion of the reel member under a winding tension of 20 g. Then, the ACF wound up to the reel member was drawn out at a drawing tension of 70g and a drawing speed of 500 mm/sec for 5 hours in several cm and several cm, and the number of times of blocking occurred in a state where the adhesive film could not be normally drawn out from the reel was counted.
A: the number of occurrences is 0 to 3
B: the number of occurrences is 4-10
C: the number of occurrences is 11 or more.
[ example 1]
The anti-blocking property of the film wound body of example 1 was evaluated. The evaluation results of the film wound body of example 1 are shown in table 2.
[ example 7]
A film wound body was obtained in the same manner as in example 1, except that the ACF and the release film were wound up on a reel so as to be disposed on the outer peripheral side, thereby obtaining a so-called outward wound film wound body. The evaluation results of the film wound body of example 7 are shown in table 2.
[ reference example ]
A film wound body was obtained in the same manner as in example 1, except that a release film having a surface a with a release force Ta of 0.02N/cm and a surface B with a release force Tb of 0.02N/cm was prepared and cut so that both surfaces were flat. The evaluation results of the film wound body of comparative example 3 are shown in table 1.
[ Table 2]
Figure 589840DEST_PATH_IMAGE002
As shown in the reference example, when an adhesive film having flat both sides and a release film having the same peeling force on both sides are wound in a so-called inward-winding configuration, a large amount of adhesive component of the adhesive film overflows and adheres to the flange of the reel, and therefore blocking occurs frequently.
On the other hand, as shown in example 7, when the adhesive film having a concave surface and the release film having a different release force were wound in a so-called outward-wound configuration, the number of times of blocking occurred was small. This is considered to be because the amount of overflow of the adhesive component of the adhesive film can be reduced by the void formed in the widthwise central portion of the concave surface.
Further, as shown in example 1, in the case of winding in a so-called inward-winding configuration, the number of occurrences of blocking is smaller. This is considered to be because the adhesive film is present on the drawing direction side by the transfer bonding, and therefore the adhesive film can be drawn so as to lift the release film, and therefore the resin can be strongly peeled off even if it adheres to the flange.
Description of the symbols
1 film wound body, 2 adhesive film, 3 release film, 4 reel, 5 winding core, 6 flange, 7 cover film.

Claims (8)

1. A film wound body, comprising:
an adhesive film having a1 st surface formed in a longitudinal direction so that both end portions in a width direction have a thickness larger than that of a central portion, and a flat 2 nd surface formed on the opposite side of the 1 st surface;
a release film having a heavy release surface with a relatively high release force and a light release surface with a relatively low release force; and
a winding core for winding the adhesive film and the release film,
the wound film body is wound around the winding core such that a1 st surface of the adhesive film is in contact with a heavy release surface of the release film and a2 nd surface of the adhesive film is in contact with a light release surface of the release film,
a value obtained by subtracting a value obtained by multiplying a contact width in the width direction between the 2 nd surface and the light peeling surface by a 180 ° peeling force of the light peeling surface from a value obtained by multiplying a contact width in the width direction between the 1 st surface and the heavy peeling surface by the 180 ° peeling force of the heavy peeling surface is 0.3mN or more and 4.5mN or less.
2. The film roll package according to claim 1, wherein a laminate film in which the 2 nd surface of the adhesive film is in contact with the light release surface of the release film is wound such that the adhesive film side is on the inner peripheral side.
3. The film roll package according to claim 1, wherein a laminate film in which the 1 st surface of the adhesive film is in contact with the heavy release surface of the release film is wound such that the adhesive film side is on the outer peripheral side.
4. The film roll package according to claim 1, wherein flanges are provided at both ends of the roll core.
5. The film roll-up body according to claim 1, wherein the adhesive film is an anisotropic conductive film.
6. The film roll package according to claim 1, wherein the width of the adhesive film is 0.6mm to 5.0 mm.
7. A method for manufacturing a film wound body, wherein an adhesive film having a1 st surface formed at both ends in a width direction in a longitudinal direction and having a thickness larger than that of a central portion and a flat 2 nd surface formed on the opposite side of the 1 st surface, and a release film having a heavy release surface with a relatively high release force and a light release surface with a relatively low release force are wound around a winding core such that the 1 st surface of the adhesive film is in contact with the heavy release surface of the release film and the 2 nd surface of the adhesive film is in contact with the light release surface of the release film,
a value obtained by subtracting a value obtained by multiplying a contact width in the width direction between the 2 nd surface and the light peeling surface by a 180 ° peeling force of the light peeling surface from a value obtained by multiplying a contact width in the width direction between the 1 st surface and the heavy peeling surface by the 180 ° peeling force of the heavy peeling surface is 0.3mN or more and 4.5mN or less.
8. A method for manufacturing a connection structure, wherein,
a laminated film in which a1 st surface of the adhesive film is in contact with a heavy release surface of the release film is pulled out from a wound film body including the adhesive film, the release film, and a winding core, the wound film body including: an adhesive film having a1 st surface formed in a longitudinal direction so that both end portions in a width direction have a thickness larger than that of a central portion, and a flat 2 nd surface formed on the opposite side of the 1 st surface; a release film having a heavy release surface with a relatively high release force and a light release surface with a relatively low release force; and a winding core around which the adhesive film and the release film are wound, wherein a1 st surface of the adhesive film is in contact with a heavy release surface of the release film, and a2 nd surface of the adhesive film is in contact with a light release surface of the release film,
temporarily bonding the 2 nd surface of the adhesive film to the 1 st circuit member, peeling off the peeling film, and
placing the 2 nd circuit component on the adhesive film, and formally pressing the circuit component,
a value obtained by subtracting a value obtained by multiplying a contact width in the width direction between the 2 nd surface and the light peeling surface by a 180 ° peeling force of the light peeling surface from a value obtained by multiplying a contact width in the width direction between the 1 st surface and the heavy peeling surface by the 180 ° peeling force of the heavy peeling surface is 0.3mN or more and 4.5mN or less.
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