HK1257184A1 - Film-wound body, and method for producing film-wound body - Google Patents

Film-wound body, and method for producing film-wound body

Info

Publication number
HK1257184A1
HK1257184A1 HK18116121.8A HK18116121A HK1257184A1 HK 1257184 A1 HK1257184 A1 HK 1257184A1 HK 18116121 A HK18116121 A HK 18116121A HK 1257184 A1 HK1257184 A1 HK 1257184A1
Authority
HK
Hong Kong
Prior art keywords
wound body
film
producing
producing film
wound
Prior art date
Application number
HK18116121.8A
Other languages
Chinese (zh)
Inventor
Yuta Araki
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1257184A1 publication Critical patent/HK1257184A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04Kinds or types
    • B65H75/08Kinds or types of circular or polygonal cross-section
    • B65H75/14Kinds or types of circular or polygonal cross-section with two end flanges
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
HK18116121.8A 2015-11-20 2018-12-17 Film-wound body, and method for producing film-wound body HK1257184A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015228229A JP6640538B2 (en) 2015-11-20 2015-11-20 Film wrapped body and method for manufacturing film wrapped body
PCT/JP2016/084276 WO2017086441A1 (en) 2015-11-20 2016-11-18 Film-wound body, and method for producing film-wound body

Publications (1)

Publication Number Publication Date
HK1257184A1 true HK1257184A1 (en) 2019-10-18

Family

ID=58717434

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18116121.8A HK1257184A1 (en) 2015-11-20 2018-12-17 Film-wound body, and method for producing film-wound body

Country Status (6)

Country Link
JP (1) JP6640538B2 (en)
KR (1) KR102092530B1 (en)
CN (1) CN108350324B (en)
HK (1) HK1257184A1 (en)
TW (1) TWI703077B (en)
WO (1) WO2017086441A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6223671B2 (en) * 2012-09-25 2017-11-01 日本オクラロ株式会社 Optical module
CN115133184B (en) * 2021-03-29 2023-10-03 宁德新能源科技有限公司 Battery cell, battery and electric equipment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3503735B2 (en) * 1998-02-26 2004-03-08 住友ベークライト株式会社 Anisotropic conductive adhesive film roll
JP4147614B2 (en) * 1998-04-15 2008-09-10 日立化成工業株式会社 Rolled body having an adhesive layer
JP2000144064A (en) * 1998-11-12 2000-05-26 Hitachi Chem Co Ltd Crosslinkable adhesive tape structure
WO2010038697A1 (en) * 2008-09-30 2010-04-08 リンテック株式会社 Film-peeling method, process for production of optical film, film-peeling mechanism, and apparatus for production of optical film
JP5723138B2 (en) * 2010-11-12 2015-05-27 デクセリアルズ株式会社 Reel body, manufacturing method thereof, and flattening method of adhesive film
JP5759168B2 (en) * 2010-12-24 2015-08-05 デクセリアルズ株式会社 Reel body and method for manufacturing reel body

Also Published As

Publication number Publication date
JP2017095574A (en) 2017-06-01
TW201731746A (en) 2017-09-16
TWI703077B (en) 2020-09-01
CN108350324A (en) 2018-07-31
CN108350324B (en) 2021-03-02
KR102092530B1 (en) 2020-03-24
KR20180051595A (en) 2018-05-16
WO2017086441A1 (en) 2017-05-26
JP6640538B2 (en) 2020-02-05

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