CN108346606B - Microchip transfer device and microchip transfer system - Google Patents
Microchip transfer device and microchip transfer system Download PDFInfo
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- CN108346606B CN108346606B CN201810135275.4A CN201810135275A CN108346606B CN 108346606 B CN108346606 B CN 108346606B CN 201810135275 A CN201810135275 A CN 201810135275A CN 108346606 B CN108346606 B CN 108346606B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
Abstract
The invention relates to the technical field of transfer printing, and discloses a microchip transfer printing device and a microchip transfer printing system, wherein the microchip transfer printing device comprises: a indenter substrate; the transfer printing array layer is arranged on one side, facing the bearing substrate, of the pressure head substrate and used for transferring micro devices on the bearing substrate, the transfer printing array layer comprises a plurality of transfer printing blocks distributed on the pressure head substrate in an array mode, each transfer printing block is in a non-pickup state and a pickup state used for picking up the micro devices, and switching of each transfer printing block between the non-pickup state and the pickup state is individually controllable. Every block of rendition piece can regulate and control alone in this microchip transfer device in the switching between non-pick-up state and pick-up state, and this structure not only can realize the patterning to the rendition array layer, realizes the rendition when to a large amount of micro-devices, can require the pattern of transform rendition array layer to different renditions moreover, realizes the use of rendition array layer under different rendition demands, avoids changing the complicated operation of transfer printing head, reduces the rendition cost to the micro-device.
Description
Technical Field
The invention relates to the technical field of transfer printing, in particular to a microchip transfer printing device and a microchip transfer printing system.
Background
Microchips are integrated circuit chips fabricated using microelectronics technologies, which have been developed into the gigabit (core GSI) era, and portable supercomputers, electronic notebooks, micro-translators, cellular phones, and the like, fabricated using microchips, have been developed in succession.
With the advent of the micro-space LED display screen, the micro-space LED display screen has been increasingly applied to key occasions such as a command center hall, a control room, a conference center and the like by virtue of the advantages of real seamless splicing, high cost performance, superior color restoration capability, nearly perfect display effect and the like. With the continuous reduction of the pixel point distance of the micro-distance LED display screen, the viewing distance of people is further shortened.
However, no matter the microchip, the microsensor, the micro LED and other devices, the transfer and packaging of the small-sized chip are still difficult, and especially the transfer technology corresponding to the large number of chips is technically deficient.
At present, transfer techniques for microchips or micro-LEDs can be generally classified into two main categories: single transfer and batch transfer. Specifically, the principle of the single transfer printing device is as follows: the microchip is directly pressed down to the circuit board from the extension film by using a pressure head, but the method cannot be corresponding to ultra-thin and small size, and has low transfer printing speed and low production efficiency; the principle of the batch transfer printing technology is as follows: the transfer printing is carried out in batch by intermolecular force or magnetic force, but the pattern transferred by the transfer printing method can only be transferred according to the pattern on the surface of the transfer printing head, and the patterned transfer printing cannot be flexibly realized.
Disclosure of Invention
The invention provides a microchip transfer printing device and a microchip transfer printing system.
In order to achieve the purpose, the invention provides the following technical scheme:
a microchip transfer device, comprising:
a indenter substrate;
locate the pressure head base plate is towards load-bearing substrate one side, and is used for the rendition array layer of little device on the load-bearing substrate, the rendition array layer include a plurality of arrays distribute in the rendition piece of pressure head base plate, each rendition piece has the state of not picking up and is used for picking up the state of picking up of little device, and each rendition piece is in it is not picking up the state and picking up the switching between the state is controllable alone.
In the microchip transfer device, a transfer array layer is formed on one side, facing a bearing substrate, of a pressure head substrate, the transfer array layer comprises a plurality of transfer blocks distributed on the pressure head substrate in an array mode, each transfer block is provided with a pickup state and a non-pickup state, when transfer operation is needed, due to the fact that switching of each transfer block between the non-pickup state and the pickup state is independently adjustable, the transfer blocks needed to be used in the transfer operation can be switched from the non-pickup state to the pickup state, patterning of the transfer array layer is achieved, then the transfer blocks in the pickup state can carry out operation of picking up micro devices on the bearing substrate, and after the pickup operation is completed, the transfer blocks are switched from the pickup state to the non-pickup state to prepare for next pickup operation of the pressure head substrate.
It should be noted that, in the microchip transferring apparatus provided by the present invention, the switching of each transferring block between the non-pickup state and the pickup state can be independently controlled, the structure not only can realize the patterning of the transferring array layer, realize the simultaneous transferring of a large number of micro devices, and improve the working efficiency, but also can change the pattern of the transferring array layer according to different transferring requirements, realize the use of the transferring array layer under different transferring requirements, avoid the complex operation of replacing the transferring head, and reduce the transferring cost of the micro devices.
Therefore, in the microchip transfer device, the microchip transfer device can not only transfer a large number of micro devices at one time, but also realize the use of the transfer layer under different transfer requirements by changing the structure of the microchip transfer device.
Preferably, the preparation material of the transfer array layer is a shape memory material.
Preferably, the shape memory material comprises a photo-deformable material.
Preferably, the method further comprises the following steps:
and the laser device is used for controlling the transfer block to switch between the non-pickup state and the pickup state.
Preferably, the shape memory material comprises a heat deformable material.
Preferably, the method further comprises the following steps:
and the heat source device is used for controlling the transfer block to switch between the non-pickup state and the pickup state.
Preferably, the extension length of each transfer block in the pick-up state along the direction vertical to the substrate of the pressure head is adjustable.
Preferably, the transfer blocks in the pick-up state correspond to the micro devices on the carrier substrate one-to-one, and each pair of the transfer blocks corresponding to each other and in the micro devices:
the extension length of the transfer block along the direction vertical to the pressure head substrate is the same as the sum of the sizes of the micro devices along the direction vertical to the bearing substrate.
Preferably, the liquid crystal display device further comprises a buffer layer arranged between the indenter substrate and the transfer printing array layer.
The invention also provides a microchip transfer printing system, which adopts any one of the microchip transfer printing devices provided in the technical scheme.
Drawings
FIG. 1 is a schematic structural view of a microchip transfer device according to an embodiment of the present invention;
FIG. 2 is a schematic view of another structure of a microchip transfer device according to an embodiment of the present invention;
FIG. 3 is a side view of FIG. 2;
fig. 4 is a schematic structural diagram of a microchip transferring apparatus for picking up a micro device according to an embodiment of the present invention.
Icon: 1-a indenter substrate; 2-transferring the array layer; 21-transfer block in pickup state; 22-transfer block in non-pickup state; 3-a buffer layer; 4-a carrier substrate; 5-micro device.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 4, the present invention provides a microchip transferring apparatus, including:
a indenter substrate 1;
locate indenter base plate 1 and towards bearing base plate 4 one side, and be used for the rendition array layer 2 of rendition micro device 5 on the bearing base plate 4, rendition array layer 2 includes a plurality of arrays and distributes in the rendition piece of indenter base plate 1, and each rendition piece has the non-state of picking up and is used for picking up the pick-up state of micro device 5, and each rendition piece is not picking up the switching between the state and picking up the state controllable alone.
In the microchip transfer printing device, a transfer printing array layer 2 is formed on one side, facing a bearing substrate 4, of a pressure head substrate 1, the transfer printing array layer 2 comprises a plurality of transfer printing blocks distributed on the pressure head substrate 1 in an array mode, each transfer printing block has a pickup state and a non-pickup state, when transfer printing operation is needed, due to the fact that switching of each transfer printing block between the non-pickup state and the pickup state is independently adjustable, the transfer printing blocks needed to be used in the transfer printing operation can be switched from the non-pickup state to the pickup state, patterning of the transfer printing array layer 2 is achieved, then the transfer printing blocks 21 in the pickup state can conduct operation of picking up micro devices 5 on the bearing substrate 4, and after the pickup operation is completed, the transfer printing blocks are switched from the pickup state to the non-pickup state to prepare for next pickup operation of the pressure head substrate 1.
It should be noted that, in the microchip transferring apparatus provided by the present invention, the switching of each transferring block between the non-pickup state and the pickup state can be individually controlled, the structure not only can realize the patterning of the transferring array layer 2, realize the simultaneous transferring of a large number of micro devices 5, and improve the working efficiency, but also can change the pattern of the transferring array layer 2 according to different transferring requirements, realize the use of the transferring array layer 2 under different transferring requirements, avoid the complex operation of replacing the transferring head, and reduce the transferring cost of the micro devices 5.
Therefore, in the above microchip transfer device, not only can a large number of micro devices 5 be transferred at one time, but also the use of the transfer layer under different transfer needs can be realized by changing the structure of the microchip transfer device.
Note that the material for preparing the indenter substrate 1 may be a metal or a ceramic material.
On the basis of the technical scheme, the preparation material of the transfer printing array layer 2 is a shape memory material.
It should be noted that there are many possibilities for the shape memory material, at least one of the following:
the structure I is as follows: the shape memory material comprises a light-induced deformable material.
On the basis of the technical scheme in the first structure, the microchip transfer printing device provided by the invention further comprises:
and a laser device for controlling the transfer block to switch between a non-pickup state and a pickup state.
Specifically, when a transfer operation is required, each transfer block required for the transfer operation can be irradiated by a laser device, and each transfer block in the part of the transfer blocks is switched from a non-pickup state to a pickup state, so that the patterning of the transfer array layer 2 is realized; then, the transfer blocks 21 in the picking state are driven by the pressure head substrate 1 to pick up the micro devices 5 on the bearing substrate 4; when the pickup operation is completed, the laser device is again used to switch the transfer block 21 in the pickup state from the pickup state to the non-pickup state in preparation for the next pickup operation.
When the laser device emits a light source to switch the transfer block from the non-pickup state to the pickup state, the transfer block irradiated with light is deformed and expanded, and a protrusion is formed in a direction perpendicular to the head substrate 1, as shown in fig. 3.
It should be noted that the transfer block 21 in the pick-up state and the transfer block 22 in the non-pick-up state in the transfer array layer 2 form a concave-convex shape, which is beneficial to pick-up of the micro device 5 and peeling after transfer.
The structure II is as follows: the shape memory material comprises a heat deformable material.
On the basis of the technical scheme in the second structure, the microchip transfer printing device provided by the invention further comprises:
and a heat source device for controlling the transfer block to switch between a non-pickup state and a pickup state.
Specifically, when the transfer operation is required, the heat source device can heat each transfer block required to be used in the transfer operation, so that each transfer block in the part of the transfer blocks is switched from a non-pickup state to a pickup state, and the patterning of the transfer array layer 2 is realized; then, the transfer blocks 21 in the picking state are driven by the pressure head substrate 1 to pick up the micro devices 5 on the bearing substrate 4; when the pickup operation is completed, the heat source device is again used to switch the transfer block 21 in the pickup state from the pickup state to the non-pickup state in preparation for the next pickup operation.
When the heat source device emits a heat source to switch the transfer block from the non-pickup state to the pickup state, the transfer block after being heated deforms and expands, and a protrusion is formed in a direction perpendicular to the head substrate 1, as shown in fig. 3.
It should be noted that the transfer block 21 in the pick-up state and the transfer block 22 in the non-pick-up state in the transfer array layer 2 form a concave-convex shape, which is beneficial to pick-up of the micro device 5 and peeling after transfer.
On the basis of the above technical solution, in order to make the transfer operation of the microchip transfer device provided by the present invention more flexible, as a preferred embodiment, the extension length of each transfer block 21 in the pick-up state in the direction perpendicular to the head substrate 1 is adjustable.
Specifically, the light path of the laser device and the temperature of the heat source device may be adjusted or the temperature of the heat source device may be adjusted according to the structure of the device to be transferred, so as to adjust the extension length of each transfer block 21 in the pickup state along the direction perpendicular to the head substrate 1.
On the basis of the above technical solution, it should be noted that the microchip transfer device provided by the present invention can transfer micro devices 5 of different sizes on the same carrier substrate 4.
Specifically, the transfer blocks in the pickup state correspond to the micro devices 5 on the carrier substrate 4 one by one, and each pair of transfer blocks corresponding to each other and in the micro devices 5:
the transfer block extends for the same length in the direction perpendicular to the indenter substrate 1 as the sum of the dimensions of the micro-device 5 in the direction perpendicular to the carrier substrate 4, for example L, as shown in fig. 4.
On the basis of the above technical solution, please continue to refer to fig. 1 to 4, the microchip transferring apparatus further includes a buffer layer 3 disposed between the indenter substrate 1 and the transferring array layer 2.
The buffer layer 3 may be made of a material having a certain ductility, such as resin or ceramic.
The invention also provides a microchip transfer printing system, which adopts any one of the microchip transfer printing devices provided in the technical scheme.
The transfer operation using the microchip transfer apparatus according to the present invention may be as follows:
1. patterning the array transfer layer according to transfer requirements, so that part of the transfer blocks are switched from a non-pickup state to a pickup state;
2. applying pressure to the indenter substrate 1, and sucking the micro device 5 on the carrier substrate 4 to the transfer block 21 in the pick-up state by using electrostatic force or intermolecular force;
3. the pressure head substrate 1 drives the array transfer printing layer to move integrally, the micro device 5 which is carried by the transfer printing block and needs transfer printing is transferred to the circuit substrate of the welding circuit printed in advance, and the micro device 5 is left on the circuit by utilizing the self viscosity of the printed welding circuit.
In this process, the marks on the circuit board and the marks on the indenter board 1 are aligned and adjusted, and a large number of micro devices 5 are transferred by one alignment. The Circuit Board may be a flexible Circuit such as PI (Polyimide), PFC (Power Factor Correction), PET (Polyethylene terephthalate), or the like, or may be a rigid Board such as PCB (Printed Circuit Board) or glass.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (9)
1. A microchip transfer device, comprising:
a indenter substrate;
the transfer printing array layer is arranged on one side, facing the bearing substrate, of the pressure head substrate and is used for transferring micro devices on the bearing substrate, the transfer printing array layer comprises a plurality of transfer printing blocks distributed on the pressure head substrate in an array mode, each transfer printing block is provided with a non-pickup state and a pickup state used for picking up the micro devices, and switching of each transfer printing block between the non-pickup state and the pickup state is individually controllable; the extension length of each transfer block in a pick-up state along the direction vertical to the substrate of the pressure head is adjustable.
2. The microchip transfer device of claim 1, wherein the preparation material of the transfer array layer is a shape memory material.
3. The microchip transfer device of claim 2, wherein the shape memory material comprises a light-induced deformable material.
4. The microchip transfer device according to claim 3, further comprising:
and the laser device is used for controlling the transfer block to switch between the non-pickup state and the pickup state.
5. The microchip transfer device of claim 2, wherein the shape memory material comprises a thermally deformable material.
6. The microchip transfer device according to claim 5, further comprising:
and the heat source device is used for controlling the transfer block to switch between the non-pickup state and the pickup state.
7. The microchip transfer device according to claim 1, wherein the transfer blocks in the pick-up state correspond one-to-one to the micro devices on the carrier substrate, and each pair of the transfer blocks corresponding to each other and within the micro devices:
the extension length of the transfer block along the direction vertical to the pressure head substrate is the same as the sum of the sizes of the micro devices along the direction vertical to the bearing substrate.
8. The microchip transfer printing apparatus of claim 7, further comprising a buffer layer disposed between the indenter substrate and the transfer printing array layer.
9. A microchip transfer system characterized by using the microchip transfer device according to any one of claims 1 to 8.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810135275.4A CN108346606B (en) | 2018-02-09 | 2018-02-09 | Microchip transfer device and microchip transfer system |
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| CN201810135275.4A CN108346606B (en) | 2018-02-09 | 2018-02-09 | Microchip transfer device and microchip transfer system |
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| CN108346606A CN108346606A (en) | 2018-07-31 |
| CN108346606B true CN108346606B (en) | 2020-12-15 |
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Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109449260B (en) * | 2018-11-13 | 2021-02-19 | 京东方科技集团股份有限公司 | Micro light-emitting diode transfer substrate and transfer method, display panel and preparation method |
| CN111199907A (en) * | 2018-11-20 | 2020-05-26 | 昆山工研院新型平板显示技术中心有限公司 | Transfer method and transfer apparatus for micro-light emitting device |
| CN109712928B (en) * | 2019-01-02 | 2020-08-25 | 广东省半导体产业技术研究院 | High-precision transfer printing equipment and system suitable for micro device |
| CN109887867B (en) | 2019-03-08 | 2021-03-09 | 京东方科技集团股份有限公司 | Micro device transfer device and micro device transfer method |
| CN109950194B (en) * | 2019-04-11 | 2021-04-16 | 京东方科技集团股份有限公司 | Chip transfer substrate and chip transfer method |
| CN110033704B (en) * | 2019-04-19 | 2022-07-19 | 京东方科技集团股份有限公司 | Transfer device and transfer method |
| CN113690158A (en) * | 2020-05-19 | 2021-11-23 | 成都辰显光电有限公司 | Transfer substrate, selective pickup, color screen body preparation and screen body repair method |
| CN112992756A (en) * | 2020-05-28 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | Transfer bearing device and transfer method |
| CN112968108B (en) * | 2020-08-24 | 2022-07-29 | 重庆康佳光电技术研究院有限公司 | Transfer method of light-emitting structure |
| CN112606586B (en) * | 2020-12-02 | 2022-04-26 | 潍坊歌尔微电子有限公司 | Device transfer printing processing method and micro microphone dustproof device transfer printing processing method |
| US20220319900A1 (en) * | 2021-04-01 | 2022-10-06 | Terecircuits Corporation | Selective donor plates, methods of fabrication and uses thereof for assembling components onto substrates |
| CN112786520B (en) * | 2021-04-12 | 2021-07-20 | 武汉大学 | Transfer head, transfer head array and micro LED (light emitting diode) mass transfer method |
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