CN110600494A - Display substrate and preparation method thereof, display panel and preparation method thereof - Google Patents
Display substrate and preparation method thereof, display panel and preparation method thereof Download PDFInfo
- Publication number
- CN110600494A CN110600494A CN201910877284.5A CN201910877284A CN110600494A CN 110600494 A CN110600494 A CN 110600494A CN 201910877284 A CN201910877284 A CN 201910877284A CN 110600494 A CN110600494 A CN 110600494A
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- China
- Prior art keywords
- display
- substrate
- flexible substrate
- area
- pixel unit
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Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
Abstract
The invention provides a display substrate and a preparation method thereof, a display panel and a preparation method thereof, belongs to the technical field of display, and can solve the problem that the existing large-area micro LED display panel is wide in abutted seam. The display substrate of the present invention includes: a flexible substrate including a display area and a routing area; the pixel units are arranged in the display area of the flexible substrate; a plurality of signal lines disposed on the flexible substrate; each signal is electrically connected with at least one pixel unit and extends to a wiring area of the flexible substrate; the wiring area of the flexible substrate can be bent to one side, away from the pixel unit, of the display area of the flexible substrate, so that the flexible substrate can be directly connected with the control circuit board.
Description
Technical Field
The invention belongs to the technical field of display, and particularly relates to a display substrate and a preparation method thereof, and a display panel and a preparation method thereof.
Background
The micro LED (micro LED) display technology is used as a new generation display technology, has higher brightness, better luminous efficiency and lower power consumption than an OLED (organic light-Emitting Diode) display technology, and has better application prospect.
In the prior art, the micro LEDs are usually transferred onto the display substrate by a transfer printing technique, and a large-area micro LED display panel cannot be directly prepared due to the limitation of the transfer printing technique. Therefore, in the prior art, a plurality of micro LEDs with small areas can be spliced
The display panel is spliced to form a large-area miniature LED display panel.
The existing small-area miniature LED display panel mainly comprises the following two types: bonding a flexible Circuit Board on a display surface of a display substrate, bending the flexible Circuit Board to the back surface (a non-display surface opposite to the display surface) of the display substrate, and connecting the flexible Circuit Board with a PCB (Printed Circuit Board); and secondly, connecting the signal line positioned on the front surface of the display substrate with the control circuit positioned on the back surface of the display substrate by punching a hole on the display substrate and filling the hole with metal.
The inventor finds that the splicing seams of the large-area miniature LED display panels spliced by the first miniature LED display panels are obvious, and the display effect is influenced; the splicing seam of the large-area miniature LED display panel spliced by the first miniature LED display panel is relatively thin, but the display substrate punching technology and the metal filling technology are difficult to realize.
Disclosure of Invention
The present invention is directed to at least one of the problems of the prior art, and provides a display substrate with a thin frame.
The technical scheme adopted for solving the technical problem of the invention is a display substrate, which comprises:
a flexible substrate including a display area and a routing area;
the pixel units are arranged in the display area of the flexible substrate;
a plurality of signal lines disposed on the flexible substrate; each signal is electrically connected with at least one pixel unit and extends to a wiring area of the flexible substrate;
the wiring area of the flexible substrate can be bent to one side, away from the pixel unit, of the display area of the flexible substrate, so that the flexible substrate can be directly connected with the control circuit board.
Preferably, the display substrate further includes:
the first cover plate is correspondingly arranged in the display area of the flexible substrate and is positioned on one side, away from the flexible substrate, of the pixel unit; the first cover plate comprises a hard cover plate.
Preferably, the display substrate further includes: the first cover plate is correspondingly arranged in the display area of the flexible substrate and is positioned on one side, away from the flexible substrate, of the pixel unit; the first cover plate comprises a flexible cover plate.
Preferably, the display substrate further includes:
the second cover plate is correspondingly arranged in the display area of the flexible substrate and is positioned on one side, away from the pixel unit, of the display area of the flexible substrate;
and the wiring area of the flexible substrate is bent to one side of the second cover plate, which is far away from the pixel unit.
Preferably, the display substrate further includes: the printed circuit board is arranged on one side of the flexible substrate, which is far away from the pixel unit, and the pixel unit is electrically connected with the printed circuit board through the signal line.
Preferably, the display substrate comprises a micro LED display substrate.
The technical scheme adopted for solving the technical problem of the invention is a display panel, which comprises:
a plurality of display substrates which are spliced with each other; the display substrate comprises any one of the display substrates.
The technical scheme adopted for solving the technical problem of the invention is a preparation method of a display substrate, which comprises the following steps:
providing a support substrate, and forming a flexible substrate on the support substrate; the display device comprises a display area and a wiring area, wherein the wiring area is positioned outside the display area;
forming a plurality of pixel units in a display area of the flexible substrate;
forming a plurality of signal lines on the flexible substrate, wherein each signal line is electrically connected with at least one pixel unit and extends to a wiring area of the flexible substrate;
and peeling at least the supporting substrate corresponding to the wiring area of the flexible substrate formed with the pixel units and the signal lines from the flexible substrate so as to enable the wiring area of the flexible substrate to be bent to one side of the display area of the flexible substrate, which is far away from the pixel units.
Preferably, after the step of forming a plurality of pixel units in the display area of the flexible substrate, the method further includes:
and forming a first cover plate in the display area of the flexible substrate.
The technical scheme adopted for solving the technical problem of the invention is a preparation method of a display panel, which comprises the following steps:
forming a plurality of display substrates according to the preparation method;
and splicing a plurality of display substrates to form a display panel.
Drawings
FIG. 1 is a schematic plan view of a display substrate according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a display substrate according to an embodiment of the invention;
FIG. 3 is a schematic view of a display substrate according to an embodiment of the invention after bending of a flexible substrate;
FIG. 4 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
wherein the reference numerals are: 1. a flexible substrate; 11. a display area; 12. a wiring area; 2. a pixel unit; 3. a signal line; 4. a first cover plate; 5. a protective layer; 6. a printed wiring board.
Detailed Description
In order to make the technical solutions of the present invention better understood, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Example 1:
as shown in fig. 1 to 3, the present embodiment provides a display substrate, including: a flexible substrate 1, and a plurality of pixel units 2, a plurality of signal lines 3, and the like provided on the flexible substrate 1. Wherein, the flexible substrate 1 comprises a display area 11 and a wiring area 12; the pixel unit 2 is arranged in the display area 11 of the flexible substrate 1; the signal line 3 is arranged on the flexible substrate 1; each signal is electrically connected with at least one pixel unit 2 and extends to the wiring area 12 of the flexible substrate 1; the wiring area 12 of the flexible substrate 1 can be bent to a side of the display area 11 of the flexible substrate 1 away from the pixel unit 2, so that the flexible substrate 1 can be directly connected with the control circuit board.
Specifically, as shown in fig. 1, the flexible substrate 1 is divided into a display area 11 and a routing area 12, and the pixel units 2 may be arranged in the display area 11 of the flexible substrate 1 in an array arrangement; the signal lines 3 are disposed in the wiring area 12 and extend into the display area 11 to connect with the pixel units 2. Each pixel unit 2 may include a pixel structure and a driving structure correspondingly connected to the pixel structure.
It will be appreciated that the type of pixel structure will vary depending on the type of display substrate. For example, the pixel structure may include an OLED display device, a QLED display device, a micro LED display device, or the like; the driving structure may include a driving transistor, etc.
As shown in fig. 2 and 3, in the display substrate provided in this embodiment, the signal line 3 is directly disposed on the flexible substrate 1, and the wiring region 12 of the flexible substrate 1 can be bent backward by utilizing the bendable characteristic of the flexible substrate 1, and bent to a side of the flexible substrate 1 away from the pixel unit 2 (i.e., a non-display surface side of the display substrate), so that the signal line 3 can be directly electrically connected to the printed circuit board 6 on the non-display surface side of the display substrate.
For set up the connection pad of being connected with signal line 3 electricity in display substrates among the prior art, after flexible line way board and connection pad nation, buckle the flexible line way board and overturn to flexible basement 1's one side that deviates from pixel unit 2, with the technical scheme who realizes the electricity with printed circuit board and be connected, the flexible basement 1 that directly forms signal line 3 among the display substrates that this embodiment provided buckles, need not to set up the connection pad, the setting in nation's district has been removed from, thereby can reduce display substrates's frame non-display area 11 areas, improve display substrates's screen and account for the ratio. In addition, the display substrate provided by the embodiment omits the structure of the flexible circuit board, so that the structure of the display substrate can be simplified, and the process of bonding the flexible circuit board is omitted, so that the preparation process of the display substrate can be simplified.
The display substrate provided by the embodiment is particularly suitable for a micro LED display substrate. The method is limited by the current preparation process, a large-area micro LED display substrate cannot be directly formed, and a plurality of small-size micro LED display substrates need to be spliced to form the micro LED display substrate. When the micro LED display substrate is the display substrate provided in this embodiment, since the frame of the display substrate is narrow, the edge joint of the large-sized display substrate formed after the splicing is narrow, and the size of the edge joint can be reduced to the same size as the size of the gap between the two adjacent pixel units 2 of the display area 11, thereby implementing the seamless splicing of the micro LED display substrate.
Preferably, the display substrate may further include a protection layer 5, which may be disposed on a side of the pixel unit away from the flexible substrate 1, for protecting the pixel unit from being corroded by external water, oxygen, and the like. For example, when the display substrate is a micro LED display substrate, the protective layer 5 may protect the micro LED device. The material of the protective layer 5 may be a flexible material or a rigid material. Further preferably, the protective layer is made of a flexible material, and the display substrate is a flexible substrate, so that the flexible display substrate can be applied to flexible display products or curved display products and has a good application prospect.
Preferably, this embodiment further includes: the first cover plate 4 is correspondingly disposed in the display area 11 of the flexible substrate 1 and located on a side of the pixel unit 2 away from the flexible substrate 1. As an embodiment, the first cover plate 4 may be a hard cover plate. Since the substrate of the display substrate in this embodiment is the flexible substrate 1, the rigidity is poor. When the display substrate is required to be a hard display substrate, as shown in fig. 2, a hard first cover plate 4 may be disposed on the display side of the substrate to enhance the rigidity of the display substrate. Further, the material of the first cover plate 4 may include hard materials such as glass. As another embodiment, the first cover 4 may be a flexible cover, so as to protect the entire display substrate, and meanwhile, may be suitable for a flexible display product, a curved display product, and the like.
Preferably, the display substrate in this embodiment may further include: the second cover plate is correspondingly arranged in the display area 11 of the flexible substrate and is positioned on one side, away from the pixel unit 2, of the display area 11 of the flexible substrate; the routing area 12 of the flexible substrate is bent to the side of the second cover plate facing away from the pixel unit 2. Similar to the first cover plate 4, the second cover plate may also be used to enhance the rigidity of the display substrate. The second cover plate may also be made of hard materials such as glass.
Preferably, the display substrate in this embodiment may further include: and the printed circuit board 6 is arranged on one side of the flexible substrate, which is far away from the pixel unit 2, and the pixel unit 2 is electrically connected with the printed circuit board 6 through the signal line 3. The printed wiring board 6 may be used to input control signals to the signal lines 3 to control the operation of the individual pixel cells 2.
Example 2:
as shown in fig. 4, the present embodiment provides a display panel including: a plurality of display substrates which are spliced with each other; the display substrate includes any one of the display substrates provided in embodiment 1.
Since the display panel in this embodiment is formed by splicing the display substrates provided in embodiment 1, the display substrate provided in this embodiment has a narrow splice, and can be seamlessly spliced.
The display panel provided by the embodiment can be preferably used for any product or component with a display function, such as electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
Example 3:
the embodiment provides a method for manufacturing a display substrate, which includes:
s1, providing a supporting substrate, and forming a flexible substrate on the supporting substrate; the display device comprises a display area and a wiring area, wherein the wiring area is positioned outside the display area.
The material of the flexible substrate may include polyimide and the like.
And S2, forming a plurality of pixel units in the display area of the flexible substrate.
The structure of the pixel unit may be different according to the type of the display substrate. Preferably, the pixel unit in the present embodiment may include a micro LED structure. Specifically, in this embodiment, the micro LED structure may be formed on the flexible substrate by means of transfer printing or the like.
And S3, forming a plurality of signal lines on the flexible substrate, wherein each signal line is electrically connected with at least one pixel unit and extends to the wiring area of the flexible substrate.
In this step, a pattern of signal lines may be formed on the substrate by a patterning process. The signal line is electrically connected with the pixel unit and extends to the wiring area so as to be electrically connected with the printed circuit board in the subsequent step.
It should be noted that, in this embodiment, the preparation sequence of step S2 and step S3 may be determined according to actual situations, and in this embodiment, no display is performed as long as the pixel unit is electrically connected to the signal line.
Preferably, the present embodiment may further include a step of forming a protective layer on the flexible substrate on which the pixel unit is formed to protect the pixel unit.
Preferably, in this embodiment, after the step of forming a plurality of pixel units in the display area of the flexible substrate, the method further includes: a first cover plate is formed on a display area of a flexible substrate.
Wherein, the material of the first cover plate can comprise glass. The first cover plate may be formed on the flexible substrate by means of bonding or the like. The first cover plate may serve to enhance the overall rigidity of the display substrate. Meanwhile, the display substrate can be conveniently spliced by using the rigidity of the first cover plate. It can be understood that, in the embodiment, since the wiring area of the flexible substrate is subsequently bent to the side of the display area of the flexible substrate away from the pixel unit, the first cover plate should be attached to the display area of the corresponding display substrate.
And S4, at least peeling the supporting substrate corresponding to the wiring area of the flexible substrate formed with the pixel units and the signal lines from the flexible substrate, so that the wiring area of the flexible substrate can be bent to the side of the display area of the flexible substrate, which is far away from the pixel units.
In this step, the flexible substrate is peeled from the support substrate to form a display substrate. Specifically, the present step may include the following two embodiments:
the first implementation mode comprises the following steps:
and only peeling the support substrate corresponding to the wiring area of the flexible substrate from the flexible substrate so that the wiring area of the flexible substrate can be bent to the side of the support substrate, which is far away from the pixel unit. When the flexible substrate of the wiring area is bent to the side of the supporting substrate, which is far away from the pixel unit, a hard display substrate can be formed.
The second embodiment:
the supporting substrate and the flexible substrate are all peeled off, so that the non-display area of the flexible substrate can be bent to the side, away from the pixel unit, of the display area of the flexible substrate, and the flexible display substrate can be formed.
Preferably, the present embodiment may further include a step of electrically connecting the signal line on the bent flexible substrate and a printed wiring board located on the non-display surface side of the display substrate.
In the manufacturing method provided by this embodiment, the signal line is directly formed on the flexible substrate, and the signal line can be bent to a side of the flexible substrate away from the pixel unit by directly bending the flexible substrate. According to the preparation method, the link bonding pad is not required to be arranged, and the setting of a bonding area is omitted, so that the area of a frame non-display area of the display substrate can be reduced, and the screen occupation ratio of the display substrate is improved. In addition, the manufacturing method provided by the embodiment omits the structure of the flexible circuit board, so that the structure of the display substrate can be simplified, and the process of bonding the flexible circuit board is omitted, so that the manufacturing process of the display substrate can be simplified.
Example 4:
the embodiment provides a preparation method of a display panel, which comprises the following steps: forming a plurality of display substrates according to the method for preparing a display substrate provided in embodiment 1; and splicing the display substrates to form the display panel.
The preparation method provided by the embodiment is particularly suitable for preparing the micro LED display panel. When the preparation method is used for preparing the miniature LED display panel, the edge frame of a single display substrate is narrow, so that the splicing seam of the large-size display substrate formed after splicing is narrow, and the size of the splicing seam can be reduced to the size which is the same as the size of the gap between two adjacent pixel units of the display area, thereby realizing the seamless splicing of the miniature LED display substrate.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A display substrate, comprising:
a flexible substrate including a display area and a routing area;
the pixel units are arranged in the display area of the flexible substrate;
a plurality of signal lines disposed on the flexible substrate; each signal is electrically connected with at least one pixel unit and extends to a wiring area of the flexible substrate;
the wiring area of the flexible substrate can be bent to one side, away from the pixel unit, of the display area of the flexible substrate, so that the flexible substrate can be directly connected with the control circuit board.
2. The display substrate of claim 1, further comprising:
the first cover plate is correspondingly arranged in the display area of the flexible substrate and is positioned on one side, away from the flexible substrate, of the pixel unit; the first cover plate comprises a hard cover plate.
3. The display substrate of claim 1, further comprising:
the first cover plate is correspondingly arranged in the display area of the flexible substrate and is positioned on one side, away from the flexible substrate, of the pixel unit; the first cover plate comprises a flexible cover plate.
4. The display substrate of claim 1, further comprising:
the second cover plate is correspondingly arranged in the display area of the flexible substrate and is positioned on one side, away from the pixel unit, of the display area of the flexible substrate;
and the wiring area of the flexible substrate is bent to one side of the second cover plate, which is far away from the pixel unit.
5. The display substrate of claim 1, further comprising: the printed circuit board is arranged on one side of the flexible substrate, which is far away from the pixel unit, and the pixel unit is electrically connected with the printed circuit board through the signal line.
6. The display substrate of claim 1, wherein the display substrate comprises a micro LED display substrate.
7. A display panel, comprising:
a plurality of display substrates which are spliced with each other; the display substrate comprises the display substrate of any one of claims 1 to 6.
8. A method for preparing a display substrate is characterized by comprising the following steps:
providing a support substrate, and forming a flexible substrate on the support substrate; the display device comprises a display area and a wiring area, wherein the wiring area is positioned outside the display area;
forming a plurality of pixel units in a display area of the flexible substrate;
forming a plurality of signal lines on the flexible substrate, wherein each signal line is electrically connected with at least one pixel unit and extends to a wiring area of the flexible substrate;
and peeling at least the supporting substrate corresponding to the wiring area of the flexible substrate formed with the pixel units and the signal lines from the flexible substrate so as to enable the wiring area of the flexible substrate to be bent to one side of the display area of the flexible substrate, which is far away from the pixel units.
9. The method for manufacturing a display substrate according to claim 8, further comprising, after the step of forming a plurality of pixel units in the display region of the flexible substrate:
and forming a first cover plate in the display area of the flexible substrate.
10. A method for manufacturing a display panel, comprising:
forming a plurality of display substrates according to the method for manufacturing a display substrate of claim 8 or 9;
and splicing a plurality of display substrates to form a display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910877284.5A CN110600494A (en) | 2019-09-17 | 2019-09-17 | Display substrate and preparation method thereof, display panel and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910877284.5A CN110600494A (en) | 2019-09-17 | 2019-09-17 | Display substrate and preparation method thereof, display panel and preparation method thereof |
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| CN110600494A true CN110600494A (en) | 2019-12-20 |
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| CN201910877284.5A Pending CN110600494A (en) | 2019-09-17 | 2019-09-17 | Display substrate and preparation method thereof, display panel and preparation method thereof |
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Cited By (5)
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| CN111276058A (en) * | 2020-02-11 | 2020-06-12 | 京东方科技集团股份有限公司 | Splicing display panel and splicing display device |
| CN113178138A (en) * | 2021-04-23 | 2021-07-27 | 京东方科技集团股份有限公司 | Display panel, display device and preparation method thereof |
| CN113450661A (en) * | 2020-05-28 | 2021-09-28 | 重庆康佳光电技术研究院有限公司 | Display screen, spliced display screen and splicing method of spliced display screen |
| CN113658518A (en) * | 2021-08-24 | 2021-11-16 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
| WO2022266865A1 (en) * | 2021-06-22 | 2022-12-29 | 京东方科技集团股份有限公司 | Display panel, fabrication method for display panel, and display apparatus |
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