CN112992756A - Transfer bearing device and transfer method - Google Patents
Transfer bearing device and transfer method Download PDFInfo
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- CN112992756A CN112992756A CN202010465382.0A CN202010465382A CN112992756A CN 112992756 A CN112992756 A CN 112992756A CN 202010465382 A CN202010465382 A CN 202010465382A CN 112992756 A CN112992756 A CN 112992756A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Abstract
The invention relates to a transfer bearing device and a transfer method. The transfer bearing device comprises a light source module, an optical modulation module arranged on the light emitting side of the light source module and a plurality of transfer elements; the light modulation module comprises a light incident surface, a plurality of light control regions and a light emergent surface; the light-incident surface is close to the light-emitting side, the light-emitting surface is far away from the light-emitting side, and the light control region is arranged between the light-incident surface and the light-emitting surface; the transfer element comprises a first surface and a second surface, the first surface is in contact with the light emergent surface of the light modulation module, and the second surface is used for placing the micro-element to be transferred. The transfer method comprises the following steps: placing a micro-component to be transferred on a transfer component; aligning target transfer positions on a target substrate with the micro-components to be transferred one by one; starting a light source module, wherein light rays emitted by the light source module enter a light control area; and controlling the light rays entering the preset light control area to pass through the light emergent surface, and changing the shape of the corresponding transfer element to drive the micro-element on the transfer element to move. The crystal expansion process is not needed, the selective transfer and repair can be realized, and the precision and the speed are high.
Description
Technical Field
The invention relates to the technical field of micro-element transfer, in particular to a transfer bearing device and a transfer method.
Background
In the manufacturing process of Micro Light Emitting diode (Micro-LED) display panels, because a finer display effect is sought, the number of Micro-LED chips in a unit area is increased in a geometric multiple, how to efficiently transfer millions or even tens of millions of Micro-LED chips from a growth substrate forming the Micro-LED chips to a display back plate to complete mass transfer is a problem which needs to be solved urgently at present. The existing bulk transfer methods are generally: firstly, bonding a growth substrate with a temporary storage substrate coated with photolysis adhesive or pyrolysis adhesive; then stripping the growth substrate by utilizing a stripping technology; then, the temporary storage substrate and the display back plate are oppositely attached; and finally, the glue material on the temporary storage substrate is debonded by illumination or heating, that is, the viscosity of the glue material is reduced, and the debonding process consumes time and labor.
In addition, when transferring Micro-components including Micro-LED chips, the Micro-components are required to be bonded to a display backplane, i.e. a target substrate, at a pitch y, while single color chips are usually arranged at a pitch x on a growth substrate. For a massive transfer of chips of equal spacing y and x and single color, the transfer process is relatively easy. However, it is often the case that the pitches y and x are not equal, so that a direct transfer of the chip on the growth substrate onto the display backplane cannot be achieved. Aiming at the problem, the existing mass transfer technology firstly transfers the chips on the growth substrate to the temporary storage substrate according to equal spacing, then completes the work of crystal expansion on the temporary storage substrate, namely, the chip spacing x on the temporary storage substrate is adjusted to be equidistant to the chip spacing y on the display backboard, and then transfers the large amount of the chips on the temporary storage substrate to the display backboard after crystal expansion. The crystal expansion process is time-consuming and labor-consuming, and the crystal expansion process is difficult to ensure that the distances between every two chips are equal, so that the chips cannot be transferred sufficiently and accurately, and the chips falling off due to unsuccessful binding are difficult to repair.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present application aims to provide a transfer carrier and a transfer method, which aims to solve the problem of eliminating the operations of die expanding and glue dissolving while completing the sufficient transfer of Micro-components including Micro-LED chips.
A transfer carrier, comprising: a light source module;
the light modulation module is arranged on the light emitting side of the light source module; the light modulation module comprises a light incident surface, a plurality of light control regions and a light emergent surface; the light incident surface is close to the light emergent side, the light emergent surface is far away from the light emergent side, and the light control region is arranged between the light incident surface and the light emergent surface;
a plurality of transfer elements comprising a first surface and a second surface; the transfer element is arranged on the light emergent surface, wherein the first surface of the transfer element is in contact with the light emergent surface of the light modulation module, and the second surface of the transfer element is used for placing the micro-element to be transferred.
The light control areas of the transfer bearing device are mutually independent, and a plurality of corresponding light control areas can be selected by professional technicians according to the target transfer position, so that light rays entering the light control areas penetrate through the light emitting surface to enter corresponding transfer elements, the transfer elements are deformed, and the micro elements on the transfer elements are driven to move in the deformation process. Thereby realizing the selective transfer or selective repair of the micro-components. In addition, the device simple structure only needs to apply illumination to corresponding transfer element during the use, labour saving and time saving promotes the transfer speed, reduces and shifts the cost.
Optionally, in the transfer carrier device as described above, the projected area of the micro-component to be transferred is S3, the projected area of the transfer component is S2, and the projected area of the light control region is S1, so that S1 ≧ S2 ≧ S3 is satisfied.
Optionally, as described above, the transfer carrier, the light source module includes: the light source is arranged on the focal point of the optical lens. The light emitted by the light source is converted into parallel light after passing through the optical lens, so that the light control effect is better.
Optionally, the transfer carrier as described above, the transfer element comprising a photo-deformable transfer element.
Optionally, the transfer carrier as described above, the light-induced deformation transfer element comprises at least one of: light expansion transfer element, light contraction transfer element. The light deformation transfer element can be a light expansion transfer element, a light contraction transfer element or a mixture of the light expansion transfer element and the light contraction transfer element.
Based on the same inventive concept, the application also provides a transferring method applying the transferring and carrying device, which comprises the following steps:
placing a micro-component to be transferred on a second surface of the transfer component;
aligning a target substrate with the transfer bearing device to enable target transfer positions on the target substrate to be aligned with the micro-components to be transferred one by one;
starting the light source module to emit light;
the light rays enter the light control region of the light modulation module from the light incident surface of the light modulation module;
and controlling the light rays entering the preset light control area to pass through the light emergent surface of the light modulation module, and changing the shape of the corresponding transfer element to drive the micro-element on the transfer element to move.
The transfer method is simple, can realize full transfer without a crystal expansion process, can accurately control the position of the micro-element to be transferred, can be used for selective transfer and selective repair, is easy to implement, does not need a glue dissolving process, and is time-saving, labor-saving and low in transfer cost.
Alternatively, in the transfer method as described above, the predetermined light control region is a light control region corresponding to a target transfer position of the target substrate.
Alternatively, the transfer method as described above, the transfer element being a photo-expandable transfer element which expands under excitation by light; the step of controlling the light entering the preset light control area to pass through the light emergent surface of the light modulation module, changing the shape of the corresponding transfer element and driving the micro-element on the transfer element to move comprises the following steps: the micro-component is moved to a target transfer position of the target substrate.
Optionally, in the transfer method as described above, the predetermined light control region is a light control region corresponding to a non-target transfer position of the target substrate.
Alternatively, the transfer method as described above, the transfer element being a photo-shrinkable transfer element, shrinking under excitation by light;
the step of aligning the target substrate with the transfer bearing device to align the target transfer positions on the target substrate with the micro-components to be transferred one by one includes: enabling a target transfer position on a target substrate to be attached to the micro element to be transferred;
the step of controlling the light entering the preset light control area to pass through the light emergent surface of the light modulation module and changing the shape of the corresponding transfer element to drive the micro-element on the transfer element to move comprises the following steps: the micro-component is remote from the target substrate.
According to the invention, through the transfer bearing device and the transfer method based on the transfer bearing device, selective transfer and selective repair can be realized, the processes of crystal expansion and glue dissolution are cancelled, the transfer accuracy and the transfer speed are improved, and the transfer cost is reduced.
Drawings
Fig. 1 is a schematic structural diagram of a transfer carriage 1 according to a first embodiment of the present invention;
FIG. 2 is a schematic diagram showing the relationship among the projection areas of the micro-device, the transfer device and the light control region;
fig. 3 is a schematic structural diagram of a transfer carriage 1A according to a second embodiment of the present invention;
FIG. 4 is a schematic diagram illustrating the operation principle and the position relationship of a polarizer;
fig. 5 is a schematic structural diagram of a transfer carriage 1A according to a second embodiment of the present invention;
fig. 6 is a schematic structural view of a transfer carriage 1B according to a third embodiment of the present invention;
FIG. 7 is a flowchart of a transfer method according to the first embodiment of the present invention;
FIG. 8 is a flow chart of a transfer method according to a second embodiment of the present invention;
FIG. 9 is a schematic diagram of a chip arrangement structure on a display back panel of the Micro-LED display panel;
FIG. 10 is a schematic view of an arrangement structure of a growth substrate of a red Micro-Led chip;
FIG. 11 is a schematic diagram of red Micro-Led chip transfer;
FIG. 12 is a flow chart of a micro-component transfer method according to a third embodiment of the present invention;
FIG. 13 is a flow chart of a method for transferring micro-components according to a fourth embodiment of the present invention;
description of reference numerals:
1-transferring the carrier; 1A-a transfer carrier; 1B-a transfer carrier; 2-a target substrate; 3-a growth substrate; 4-a first polarizer; 5-a glass substrate; 6-liquid crystal molecules; 7-TFT glass substrate; 8-a second polarizer; 9-photo-deformable particles; 10-a light source module; 20-a light modulation module; 20A-spatial light modulator; 21-a light incident surface; 22-a light control region; 23-a light-emitting surface; 30-a transfer element; 1S-a first surface of transfer element 30; 2S-a second surface of the transfer element 30; 40-a micro-component; 40S-the element surface of micro-element 40; 11 — the light exit side of the light source module 10; 12-a light source; 13-incident light; 14-TFT power-on region; 15-liquid crystal molecule deflection region; 16-a light passing band; 17-convex lens; r-red light chip; g-green light chip; b-a blue light chip; r1-red light chip bonding area; g1-green chip bonding area; b1-blue chip bonding area; s1-projected area of light control region; s2-projected area of transfer element; s3-projected area of micro-component.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
In the prior art, as described in the background section, the process of wafer expansion is required when transferring the micro-components, the position to be transferred cannot be accurately controlled, the transferring process is time-consuming and labor-consuming, and the transferring cost is high.
Based on this, the present application intends to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.
The invention provides a transfer bearing device. Fig. 1 is a schematic structural diagram of a transfer carriage 1 according to a first embodiment of the present invention. Referring to fig. 1, a transfer carrier 1 includes a light source module 10, a light modulation module 20, and a plurality of transfer elements 30. The light source module 10 is used for emitting light. The transfer member 30 is a member that can be deformed by excitation with light. In detail, in the present embodiment, the light modulation module 20 is disposed on the light exit side 11 of the light source module 10. The light modulation module 20 includes a light incident surface 21, a plurality of independent light control regions 22, and a light emitting surface 23. The light incident surface 21 is adjacent to the light emitting side 11 and receives the incident light 12. The light exit surface 23 is remote from the light exit side 11, and the light control region 22 is disposed between the light entrance surface 21 and the light exit surface 23. The light entering from the light incident surface 21 enters the light control region 22, controls the light entering the predetermined light control region 22, passes through the predetermined light control region 22 to reach the light emitting surface 23, and passes out from the light emitting surface 23. The preset light control areas are a plurality of light control areas which are selected by a professional according to the target transfer position and correspond to the target transfer position. The plurality of transfer elements 30 are disposed on the light emitting surface 23, and in detail, in the embodiment, the plurality of transfer elements 30 may be arranged on the light emitting surface 23 of the light modulation module 20 in an array, and the pitch between adjacent transfer elements 30 matches the pitch between adjacent micro-elements 40 on the growth substrate, and usually the two pitches are substantially equal, but the invention is not limited thereto. After the light beam passing out from the light-emitting surface 23 enters the corresponding transfer element 30, the transfer element 30 is deformed.
Specifically, each transfer element 30 includes a first surface 1S and a second surface 2S, where the first surface 1S contacts the light emitting surface 23 of the light modulation module 20, and the second surface 2S is used for placing the micro-component 40 to be transferred. In the present embodiment, each of the microelements 40 has an element surface 40S. The second surfaces 2S of the transfer elements 30 are used to place the micro-elements 40, respectively, in contact with the element surfaces 40S, respectively. Specifically, second surface 2S of each transfer element 30 is configured to receive one micro-component 40, contacting component surface 40S of a corresponding one of micro-components 40. The deformation of the transfer element 30 brings the micro-components 40 on the second surface 2S to move together. In the present embodiment, the Micro element 40 is, for example, a Micro-LED chip, but the present invention is not limited thereto, and any Micro element may be used as long as it has an element surface 40 s. Specifically, according to the structure of the transferring and carrying device 1 of the present embodiment, those skilled in the art can understand that the projected area S3 of each micro-component 40 is not greater than the projected area S2 of each transferring component 30, and the projected area S2 of each transferring component 30 is not greater than the projected area S1 of each light control region 22, as shown in fig. 2, and S1 ≧ S2 ≧ S3 is satisfied. The transfer carrier 1 can be used to realize the selective transfer or selective repair of the micro-components. In addition, the device simple structure only needs to apply illumination to corresponding transfer element during the use, labour saving and time saving promotes the transfer speed, reduces and shifts the cost.
Fig. 3 is a schematic structural diagram of a transfer carriage 1A according to a second embodiment of the present invention. Referring to fig. 3, in the present embodiment, the light source module 10 is any light source 12 capable of emitting light. In the present embodiment, the light modulation module 20 is a spatial light modulator 20A in the prior art, the spatial light modulator 20A includes a first polarizer 4 as a light exit surface thereof, and an upper surface of the first polarizer 4 is used for fixing a plurality of transfer elements 30. The lower part of the first polarizer 4 is sequentially fixed with a glass substrate 5, liquid crystal molecules 6, a TFT glass substrate 7 and a second polarizer 8 as a light incident surface. A box-shaped accommodating space is formed between the glass substrate 5 and the TFT glass substrate 7, and the liquid crystal molecules 6 are loaded in the box-shaped accommodating space. In use, incident light 13 from the light source 12 passes through the second polarizer 8 and enters the TFT glass substrate 7. The polarizer, referred to as polarizer for short, has the function of polarizing the incident light in the vertical or horizontal direction, i.e. only the light in a single direction can penetrate the polarizer. Fig. 4 shows the working principle of the polarizer, which is described by taking the case that the first polarizer 4 can only pass through the vertical light and the second polarizer 8 can only pass through the parallel light as an example, the incident light 13 includes light in all directions, the second polarizer 8 can only pass through the parallel light, the vertical light cannot pass through the second polarizer 8, the parallel light passing through the second polarizer 8 cannot pass through the first polarizer 4 disposed perpendicular to the second polarizer 8, because the first polarizer 4 can only pass through the vertical light. The TFT (Thin Film Transistor) glass substrate 7 is formed by fabricating a plurality of TFT arrays on a glass substrate, where each TFT array includes a plurality of pixel driving units, and generally, one driving unit includes at least one TFT. The TFT energizing areas 14 are divided by pixel driving unit according to transfer requirements, and each TFT energizing area 14 includes at least one pixel driving unit. The liquid crystal molecules 6 are characterized in that the direction of light can be changed under the action of an electric field. When in use, the TFT energizing area 14 in the TFT glass substrate is energized, and an electric field can be generated after the energization, so that the arrangement direction of the corresponding liquid crystal molecules 6 is changed, and a liquid crystal molecule deflection area 15 is correspondingly formed in the accommodating space. In the present embodiment, the TFT energizing area 14 and the liquid crystal molecule deflecting area 15 constitute a light control area 22 of the spatial light modulator 20A, and further, the conduction of light paths in a single or a plurality of light control areas is realized according to the transfer requirement, as shown in fig. 5, and the light passing through the light control areas is referred to as a light transmitting belt 16.
Specifically, in the present embodiment, the spatial light modulator 20A is provided with at least one TFT semiconductor switching device per light control region, and each TFT is directly controlled by a dot pulse, so that each light control region is relatively independent and can be controlled continuously. This allows the liquid crystal molecules in the corresponding liquid crystal molecule deflection regions 15 to be deflected by energizing the TFT energizing regions 14 in the predetermined light control region, and thus the parallel light transmitted from the second polarizer 8 to be deflected into the perpendicular light that can pass through the first polarizer 4, according to the transfer requirement. The light passing through the first polarizer 4 enters the corresponding transfer element 30, and the corresponding transfer element 30 is deformed under the excitation of light to drive the micro-element 40 thereon to move, so that the position to be transferred can be accurately controlled, and the micro-element can be used for selective transfer or selective repair, thereby improving the transfer speed and reducing the transfer cost.
Fig. 6 is a schematic structural diagram of a transfer carriage 1B according to a third embodiment of the present invention. The difference between the transfer carriage 1B of the present embodiment and the transfer carriage 1A of fig. 3 is that: the light source module 10 of the present embodiment includes: the light source 13 and the optical lens 17, and the optical lens 17 is disposed between the light source 13 and the spatial light modulator 20A, and functions to adjust the divergent light emitted from the light source 13 into a single-direction light path, thereby improving the light quality. Specifically, when the optical lens 17 is, for example, a convex lens, as shown in fig. 7, the light source 13 is disposed at the focal point of the convex lens, and the light coming out from the light exit side of the convex lens is parallel light, so that the spatial light modulator 20A obtains high-quality incident light and improves the light control effect.
The transfer element 30 in the transfer carrier 1, the transfer carrier 1A, and the transfer carrier 1B is, for example, a light-induced deformation transfer element, but the invention is not limited thereto, and the light-induced deformation transfer element is an element that can be deformed under excitation of light, for example, a light-induced deformation transfer element made of a light-induced deformation type polymer material.
Optionally, the above-mentioned light induced deformation transfer element comprises at least one of: light expansion transfer element, light contraction transfer element. Those skilled in the art will understand that: the light deformation transfer element can be a light expansion transfer element, a light contraction transfer element or a mixture of the light expansion transfer element and the light contraction transfer element. The optical expansion transfer element is made of a photo-expansion type polymer material, i.e., a photo-deformation type polymer material that reversibly expands in volume under the action of light, such as a polymer containing a spirobenzopyran structure, expands under light and can restore to the original shape under non-light. The optical shrinkage transfer element is made of a photo-shrinkage polymer material, such as lead lanthanum zirconate titanate (PLZT), which is a photo-deformation polymer material that shrinks reversibly in volume under the action of light and can recover its original shape when not illuminated.
The method for fixing the transfer element 30 made of the photo-deformable polymer material on the light emitting surface may be: a whole block of photo-deformable polymer material is laid on the light-emitting surface, and then the photo-deformable polymer material layer is cut by using the existing cutting equipment, so as to obtain a plurality of transfer elements 30. The solution according to the invention does not however limit the method for obtaining the transfer element 30, in particular with which prior art solution is adopted.
Based on the same idea, the second aspect of the present invention provides a micro component transferring method. Fig. 7 is a flowchart of a micro-component transferring method using the above transferring and carrying device 1 according to the first embodiment of the present invention. The steps of the method will now be described in detail with reference to fig. 7.
In step S101, the microcomponents 40 to be transferred are placed on the second surface S2 of the transfer element 30;
in step S102, aligning the target substrate with the transfer carrier 1, so that the target transfer positions on the target substrate are aligned with the micro-components 40 to be transferred one by one;
alternatively, when the target substrate is aligned with the transfer device 1, the target substrate is placed upside down, and the unbound microcomponents can be screened out by gravity.
In step S103, the light source module 10 is activated to emit light 13;
in step S104, the light ray 13 enters the light control region 22 of the light modulation module 20 from the light incident surface 21 thereof;
in step S105, the light entering the predetermined light control region is controlled to pass through the light emitting surface 23 of the light modulation module 20, and the shape of the corresponding transfer element 30 is changed to drive the micro-component 40 thereon to move.
Modulating the light passing through the predetermined light control region, wherein the modulated light enters the corresponding transfer element 30 through the light emitting surface 23; if the light passing through the other light control regions except the preset light control region is not modulated, the light cannot pass through the light emitting surface; the predetermined light control region is a preselected light control region. Therefore, selective transfer and repair can be realized, the transfer position is more accurate and fast, the processes of crystal expansion and glue dissolution are not needed, and time and labor are saved.
Fig. 8 is a flowchart of a micro-component transferring method using the above transferring and carrying device 1 according to a second embodiment of the present invention. The transfer element according to this embodiment is preferably a photo-expandable transfer element that reversibly expands upon excitation by light, and is made of, for example, a photo-expandable polymer material. The steps of the method will now be described in detail with reference to fig. 8.
In step S201, the microcomponents 40 to be transferred are placed on the second surface S2 of the transfer element 30;
in step S202, aligning the target substrate with the transfer carrier 1, so that the target transfer positions on the target substrate 2 are aligned with the micro-components 40 to be transferred one by one;
the distance between the micro-component 40 to be transferred and the target transfer position is not greater than the deformation distance of the transfer element.
In step S203, the light source module 10 is activated to emit light 13;
in step S204, the light ray 13 enters the light control region 22 of the light modulation module 20 from the light incident surface 21 thereof;
in step S205, the light entering the predetermined light control region is controlled to pass through the light emitting surface 23 of the light modulation module 20, the shape of the corresponding transfer element 30 is changed to drive the micro-component 40 thereon to move, and the micro-component 40 moves to the target transfer position of the target substrate. The predetermined light control region is a light control region corresponding to a target transfer position of a target substrate. After the micro-component 40 is transferred to the target transfer position of the target substrate, the binding operation is performed at the same time, laser or conductive curing glue can be selected for binding, after the binding is completed, the light source module 10 is closed, the transfer component 30 is restored to the original state, and the transfer is finished.
For the convenience of those skilled in the art to understand, fig. 9 shows that the display backplane, i.e. the target substrate 2 example, for realizing full-color, Micro-LED chips requiring three colors of red light R, green light G, and blue light B are bound to the target transfer position of the display backplane 2 according to a predetermined color sequence and a chip pitch y. Fig. 10 shows an example of a growth substrate 3 of red R Micro-LED chips, i.e. on the growth substrate 3 are red single color Micro-LED chips arranged in a chip pitch x, in fig. 8, y is larger than x. In the case of mass transfer of Micro-LED chips of three colors of red R, green G and blue B light, respectively, here illustrated by the red Micro-LED chip transfer example shown in fig. 11, first the red R Micro-LED chips on the production substrate 3 are placed on the second surfaces S2 of the plurality of transfer elements 30 of the transfer carrier 1. According to the target transfer position R1 of the red Micro-LED chips on the display backplane 2, it can be understood that the red Micro-LED chips in the 1 st and 7 th columns on the transfer carrier 1 need to be transferred onto the display backplane 2, and then the light control region corresponding to the chip in the 1 st column on the transfer carrier 1 can be used as a predetermined light control region, and the chip in the 7 th column on the transfer carrier 1 is divided into another predetermined light control region. Controlling the light rays entering the two predetermined light control regions to pass through the light emitting surface 23 of the light modulation module 20, and changing the shape of the corresponding transfer element 30, so that the red Micro-LED chips in the 1 st and 7 th columns are pushed to the target transfer position R1 of the red Micro-LED chip of the display back panel by the light expansion transfer element subjected to expansion deformation; according to the above implementation, the chips in columns 1 and 7 are transferred, and the remaining chips that are not transferred remain on the transfer carrier 1 without waste. If the second display backplane 2 with the same pitch needs to transfer the chips in the 2 nd and 8 th columns on the transfer carrier 1 to the display backplane 2, the transfer carrier 1 with the chips in the 1 st and 7 th columns can be continuously taken for transfer, and only the realignment is needed to align the chips in the 2 nd and 8 th columns on the transfer carrier 1 to the target transfer position R1 of the red Micro-LED chip of the second display backplane, and the following transfer implementation process of the chips in the 2 nd and 8 th columns is the same as the above-mentioned transfer implementation process of the chips in the 1 st and 7 th columns, so the description is not repeated. And so on, transferring chips of other colors: the green Micro-LED chips on the transfer bearing device 1 are transferred to the target transfer position G1 of the green Micro-LED chips of the display back panel 2, and the blue Micro-LED chips on the transfer bearing device 1 are transferred to the target transfer position B1 of the blue Micro-LED chips of the display back panel 2, and the implementation process is the same as the implementation process of the red chips, so that the repeated description is omitted. Therefore, the transfer method of the embodiment can realize selective transfer, can realize full transfer of chips and has high transfer speed. Moreover, when the optical expansion transfer element is restored to the original state, the Micro-LED chips which are not successfully bound lose the support and fall off under the action of gravity, and after the fallen Micro-LED chips are removed, the transfer method of the embodiment can be used for selective repair.
Fig. 12 is a flowchart of a micro-component transferring method using the above transferring and carrying device 1 according to a third embodiment of the present invention. The transfer element according to this embodiment is preferably a photo-shrinkable transfer element which reversibly shrinks upon excitation with light, and is made of, for example, a photo-shrinkable polymer material. The steps of the method will now be described in detail with reference to fig. 12.
In step S301, the microcomponents 40 to be transferred are placed on the second surface S2 of the transfer element 30;
in step S302, aligning the target substrate 2 with the transfer carrier 1, so that the target transfer positions on the target substrate 2 are aligned with the micro-components 40 to be transferred one by one, and the target transfer positions on the target substrate 2 are attached to the micro-components 40 to be transferred; binding operation is carried out at the attached position, and laser or conductive curing adhesive can be selected for binding;
in step S303, the light source module 10 is started to emit light 13;
in step S304, the light ray 13 enters the light control region 22 of the light modulation module 20 from the light incident surface 21 thereof;
in step S305, the light entering the predetermined light control region is controlled to pass through the light emitting surface 23 of the light modulation module 20, and the shape of the corresponding transfer element 30 is changed to drive the micro-component 40 thereon to move, where the micro-component 40 is far away from the target substrate 2. The predetermined light control region is a light control region corresponding to a non-target transfer position of the target substrate.
After the transferring and carrying device 1 is moved away, the micro-components which are not successfully bound lose the support and fall off under the action of gravity, and after the fallen micro-components are removed, the large-scale transferring method of the embodiment can be used for selective repairing.
Fig. 13 is a flowchart of a micro-component transferring method using the transferring and carrying device 1A according to a fourth embodiment of the present invention. The steps of the method will now be described in detail with reference to fig. 13.
In step S401, the microcomponents 40 to be transferred are placed on the second surface S2 of the transfer element 30;
in step S402, aligning the target substrate 2 with the transfer carrier 1A, so that the target transfer positions on the target substrate are aligned with the micro-components 40 to be transferred one by one;
in step S403, the light source 12 is activated to emit light 13;
in step S404, the light 13 enters the light control region 22 of the spatial light modulator 20A from the second polarizer 8 thereof;
in step S405, the light entering the predetermined light control region is controlled to pass through the first polarizer 4 of the spatial light modulator 20A, and the shape of the corresponding transfer element 30 is changed to move the micro-elements 40 thereon.
And electrifying the TFT electrifying region 14 of the preset light control region to change the arrangement direction of the liquid crystal molecules 6 in the corresponding liquid crystal molecule deflection region 15, modulating the light rays passing through the preset light control region to modulate the parallel light into vertical light, wherein the vertical light enters the corresponding transfer element 30 through the first polarizer 4, and the shape of the corresponding transfer element 30 is changed to drive the micro-element 40 on the corresponding transfer element to move. No modulation is performed on light passing through other light control regions than the predetermined light control region, that is, no power is applied to the TFT power-on regions 14 of the other light control regions, so that the alignment direction of the liquid crystal molecules 6 in the corresponding liquid crystal molecule deflection regions 15 is not changed, incident parallel light cannot pass through the first polarizer 4, and accordingly no light enters the corresponding transfer elements 30, so that the transfer elements 30 are not deformed and the micro-elements 40 thereon are not moved. The predetermined light control region is a preselected light control region.
The transfer method of the embodiment transfers by using the transfer carrier 1A manufactured by the spatial light modulator 20A in the prior art, and can realize selective transfer without operations of crystal expansion and glue dissolution, and can realize sufficient and high-precision transfer of chips, and the transfer speed is high.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.
Claims (10)
1. A transfer carriage, comprising:
a light source module;
the light modulation module is arranged on the light emitting side of the light source module; the light modulation module comprises a light incident surface, a plurality of light control regions and a light emergent surface; the light incident surface is close to the light emergent side, the light emergent surface is far away from the light emergent side, and the light control region is arranged between the light incident surface and the light emergent surface;
a plurality of transfer elements comprising a first surface and a second surface; the transfer element is arranged on the light emergent surface, wherein the first surface of the transfer element is in contact with the light emergent surface of the light modulation module, and the second surface of the transfer element is used for placing the micro-element to be transferred.
2. The transfer carriage of claim 1, wherein the projected area of the micro-component to be transferred is S3, the projected area of the transfer component is S2, and the projected area of the light control region is S1, so that S1 ≧ S2 ≧ S3 is satisfied.
3. The transfer carrier of claim 1, wherein the light source module comprises: the light source is arranged on the focal point of the optical lens.
4. The transfer carrier of claim 1, wherein the transfer element comprises a photo-deformable transfer element.
5. The transfer carrier of claim 4, wherein the light-induced deformation transfer element comprises at least one of: light expansion transfer element, light contraction transfer element.
6. A transfer method using the transfer carrier according to claim 1, comprising the steps of:
placing a micro-component to be transferred on a second surface of the transfer component;
aligning a target substrate with the transfer bearing device to enable target transfer positions on the target substrate to be aligned with the micro-components to be transferred one by one;
starting the light source module to emit light;
the light rays enter the light control region of the light modulation module from the light incident surface of the light modulation module;
and controlling the light rays entering the preset light control area to pass through the light emergent surface of the light modulation module, and changing the shape of the corresponding transfer element to drive the micro-element on the transfer element to move.
7. The transfer method of claim 6, wherein the predetermined light control region is a light control region corresponding to a target transfer position of a target substrate.
8. The transfer method of claim 7 wherein the transfer element is a photo-expandable transfer element; the step of controlling the light entering the preset light control area to pass through the light emergent surface of the light modulation module, changing the shape of the corresponding transfer element and driving the micro-element on the transfer element to move comprises the following steps: the micro-component is moved to a target transfer position of the target substrate.
9. The transfer method of claim 6, wherein the predetermined light management area is a light management area corresponding to a non-target transfer location of the target substrate.
10. The transfer method of claim 9 wherein said transfer element is a photo-shrinkable transfer element;
the step of aligning the target substrate with the transfer bearing device to align the target transfer positions on the target substrate with the micro-components to be transferred one by one includes: enabling a target transfer position on a target substrate to be attached to the micro element to be transferred;
the step of controlling the light entering the preset light control area to pass through the light emergent surface of the light modulation module and changing the shape of the corresponding transfer element to drive the micro-element on the transfer element to move comprises the following steps: the micro-component is remote from the target substrate.
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| CN202010465382.0A CN112992756A (en) | 2020-05-28 | 2020-05-28 | Transfer bearing device and transfer method |
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