CN108246585A - Dispensing method, in-out box and electronic device - Google Patents
Dispensing method, in-out box and electronic device Download PDFInfo
- Publication number
- CN108246585A CN108246585A CN201810200445.2A CN201810200445A CN108246585A CN 108246585 A CN108246585 A CN 108246585A CN 201810200445 A CN201810200445 A CN 201810200445A CN 108246585 A CN108246585 A CN 108246585A
- Authority
- CN
- China
- Prior art keywords
- glue
- panel assembly
- dispensing method
- overflow
- joint filling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
Abstract
A kind of dispensing method disclosed by the invention includes：Housing and panel assembly are provided, housing is formed with the groove for accommodating panel assembly, and panel assembly includes lateral surface and the upper surface being connect with lateral surface, and groove formation is useful for the medial surface with lateral surface relative engagement；Panel assembly is arranged on groove；Outer edge setting in upper surface dredges gel coating so as to dredge the outer edge of gel coating covering upper surface；Gap setting joint filling glue between medial surface and lateral surface；With curing joint filling glue to be fixedly connected with housing and panel assembly.The dispensing method of the present invention using the upper surface for dredging gel coating cover plate component outer edge, during so as to prevent from subsequently setting the joint filling glue of fixed shell and panel assembly, the upper surface of gap-filling glue water pollution panel assembly.The invention also discloses a kind of in-out box and electronic devices.
Description
Technical field
The present invention relates to a kind of electronic device more particularly to dispensing method, in-out box and electronic devices.
Background technology
In the related art, the electronic devices such as mobile phone include housing and panel assembly, and housing forms fluted, panel assembly
It sets in groove, side generally being fixedly connected by mode for dispensing glue of housing and panel assembly.However, since glue has
Mobility, easily point pollutes panel assembly to glue to the upper surface of panel assembly.
Invention content
The present invention provides a kind of dispensing method, in-out box and electronic device..
The dispensing method of embodiment of the present invention includes step：
Housing is provided and panel assembly, the housing are formed with the groove for accommodating the panel assembly, the panel
Component includes lateral surface and the upper surface being connect with the lateral surface, and the groove formation is useful for match opposite with the lateral surface
The medial surface of conjunction；
The panel assembly is arranged on the groove；
Gel coating is dredged in outer edge setting in the upper surface so that the thin gel coating covers the outside of the upper surface
Edge；
Gap setting joint filling glue between the medial surface and the lateral surface；With
Cure the joint filling glue to be fixedly connected with the housing and the panel assembly.
The in-out box of embodiment of the present invention is manufactured by the dispensing method of any of the above embodiment and is formed.
The electronic device of embodiment of the present invention includes ontology and the in-out box of any of the above embodiment.It is described
In-out box is set on the body.
Dispensing method, in-out box and the electronic device of embodiment of the present invention utilize thin gel coating cover plate group
The outer edge of the upper surface of part, during so as to prevent from subsequently setting the joint filling glue of fixed shell and panel assembly, joint filling glue is dirty
Contaminate the upper surface of panel assembly.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
It obtains significantly or is recognized by the practice of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
It obtains significantly and is readily appreciated that, wherein：
Fig. 1 is the perspective exploded view of the in-out box of embodiment of the present invention；
Fig. 2 is the floor map of the in-out box of embodiment of the present invention；
Fig. 3 is diagrammatic cross-section of the in-out box of Fig. 2 along III-III directions；
Fig. 4 is the enlarged diagram of the in-out box IV parts of Fig. 3；
Fig. 5 is diagrammatic cross-section of the in-out box of Fig. 2 along V-V directions；
Fig. 6 is the enlarged diagram of the in-out box VI parts of Fig. 5；
Fig. 7 is the flow diagram of the dispensing method of embodiment of the present invention；
Fig. 8 is the process schematic of the dispensing method of embodiment of the present invention；
Fig. 9 is the step S14 process schematics of the dispensing method of embodiment of the present invention；
Figure 10 is the floor map of the electronic device of embodiment of the present invention.
Main element symbol description：
Electronic device 100, ontology 20, in-out box 10, housing 12, groove 122, medial surface 1222, long side surface
1224th, short sides 1226, bottom surface 1228, substrate 124, side wall 126, step 128, step surface 1282, below rank above 1284, rank
1286th, outside 121, panel assembly 14, lateral surface 142, touch panel 144, touch panel lateral surface 1442, cover board 146, cover board
Lateral surface 1462, upper surface 148, outer edge 1482, anti-overflow item 16, joint filling adhesive tape 18, gap 11, is opened at cover board lower surface 1464
Mouth 112, dredges gel coating 13 at bonding adhesive tape 19.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning
Same or similar element is represented to same or similar label eventually or there is the element of same or like function.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instructions such as needle ", " counterclockwise " are based on orientation shown in the drawings or position relationship, are for only for ease of
The description present invention and simplified description rather than instruction imply that signified device or element must be with specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that instruction or hint relative importance or the implicit quantity for indicating indicated technical characteristic.
" first " is defined as a result, and the feature of " second " can be expressed or implicitly includes one or more feature.
In description of the invention, " multiple " are meant that two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or be integrally connected；It can
To be mechanical connection or electrical connection or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the interaction relationship of connection inside two elements or two elements.For the ordinary skill of this field
For personnel, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature it " on " or it " under "
It can be in direct contact including the first and second features, it is not to be in direct contact but pass through it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " including first spy
Sign is right over second feature and oblique upper or is merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " immediately below second feature and obliquely downward or be merely representative of including fisrt feature
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
It please refers to Fig.1 to Fig.4, the in-out box 10 of embodiment of the present invention includes housing 12,14 and of panel assembly
Joint filling adhesive tape 18.
Housing 12 forms fluted 122, and groove 122 is formed with medial surface 1222.Housing 12 includes prominent from medial surface 1222
Go out and the anti-overflow item 16 of circumferentially extending along medial surface 1222.Panel assembly 14 is housed in groove 122.Panel assembly 14 includes
With the lateral surface 142 of 1222 relative engagement of medial surface and the upper surface 148 being connect with lateral surface 142.The anti-overflow sealing of item 16 inside
Gap 11 between face 1222 and lateral surface 142.Joint filling adhesive tape 18 is filled out by being set between medial surface 1222 and lateral surface 142
Seam glue is simultaneously formed by curing.Joint filling adhesive tape 18 is fixedly connected with housing 12 and panel assembly 14.
The in-out box 10 of embodiment of the present invention is by setting anti-overflow item 16 so that anti-overflow item 16 seals medial surface
Gap 11 between 1222 and lateral surface 142, so as to prevent subsequently setting the gap-filling glue of curing housing 12 and panel assembly 14 again
During water, joint filling glue penetrates into groove 122 and pollutes housing 12 and/or panel assembly 14.
The side wall 126 that housing 12 includes substrate 124 and self-reference substrate 124 extends, substrate 124 surround groove with side wall 126
122.Housing 12 is substantially in cuboid, and housing 12 is the load-bearing part of electronic device 100, for carrying the big of electronic device 100
Part.Housing 12 may be used plastics and be made, and can also be made of metal material or be passed through using plastics and metal
The technique of in-mould injection forms integral structure.In one example, the material of substrate 124 is metal, and the material of side wall 126 is modeling
Substrate 124, can first be put into mold by material, then by injecting the plastic cement of melting into mold, be formed after plastic cement curing
Side wall 126, so as to obtain housing 12.
In some embodiments, anti-overflow item 16 and side wall 126 are separate structure, week of the anti-overflow item 16 along medial surface 1222
To being mounted on medial surface 1222.
Certainly, in some other embodiments, anti-overflow item 16 is structure as a whole with side wall 126, for example, anti-overflow item 16
It can be formed with side wall 126 by Shooting Technique.
In some embodiments, when anti-overflow item 16 and side wall 126 are separate structure, anti-overflow item 16 includes foam.This
When, foam can be mounted in by double faced adhesive tape on medial surface 1222.Foam have elasticity, using foam as anti-overflow item 16 not
It can only prevent follow-up joint filling glue from penetrating into groove 122 and pollute housing 12 and/or panel assembly 14, be also used as fender
Material, the protection panels component 14 when housing 12 and/or panel assembly 14 are impacted.In addition, foam is simple and easy to get and light-weight,
While improving production efficiency and reducing cost, the weight of housing 12 and panel assembly 14 can be mitigated.
In some embodiments, groove 122 forms the bottom surface 1228 being connect with medial surface 1222, and medial surface 1222 is vertical
Directly in the plane of bottom surface 1228.Medial surface 1222 is located at side wall 126, and bottom surface 1228 is located on substrate 124.
In some embodiments, groove 122 forms the bottom surface 1228 being connect with medial surface 1222, and medial surface 1222 is bottom
The edge in face 1228 outwardly extending inclined-plane upwards.
Medial surface 1222 can be vertical with bottom surface 1228, can also upwards extend outwardly from the edge of bottom surface 1228, input
Output precision 10 can select specific structure as needed.
In some embodiments, panel assembly 14 includes touch panel 144 and the cover board being covered on touch panel 144
146.The lateral dimension of cover board 146 is more than the lateral dimension of touch panel 144 so that lateral surface 142 is in cover board 146 and touch surface
Cascaded surface is formed between plate 144.Lateral surface 142 includes cover board lateral surface 1462 and touch panel lateral surface 1442.Anti-overflow item 16
Seal the gap 11 between medial surface 1222 and touch panel lateral surface 1442.Joint filling adhesive tape 18 is fixedly connected with cover board lateral surface
1462 and medial surface 1222.
In this way, the medial surface 1222 of cover board lateral surface 1462 and groove 122 is able to connect by joint filling adhesive tape 18, so as to make
Panel assembly 14 is obtained to be fixedly connected with housing 12.
Specifically, the material of cover board 146 can be made of translucent materials such as glass, ceramics or sapphires.Due to cover board 146
Due to the input part as electronic device 100, cover board 146 is often subject to collide or the contacts such as scratches.For example, user is by electronics
When device 100 is put into pocket, cover board 146 may be scratched by the key in user's pocket and be damaged.Therefore, the material of cover board 146
The larger material of hardness, such as above sapphire material may be used.Or hardened layer is formed to carry on the surface of cover board 146
The anti-scratch ability of high cover board 146.
Specifically, touch panel 144 includes display module (not shown) and the touch control layer being arranged in display module (is schemed not
Show).Display module is, for example, liquid crystal display die set (LCD Module, LCM), and certainly, display module may be flexible shows
Show module.Touch control layer is used to receive the touch-control input of user, to generate the signal of the content for display module to be controlled to show.
Touch panel 144 is for example bonded with cover board 146 by optical cement (Optically Clear Adhesive, OCA)
It is fixed together, optical cement is not only adhesively fixed touch panel 144 and cover board 146, can also penetrate what touch panel 144 be sent out
Light.
In one example, panel assembly 14 can be formed by following steps：Touch panel 144 and cover board are first provided
146, then cover board 146, is finally fitted on optical cement by the coated optical glue on touch panel 144, so that cover board 146
It is fixed together with touch panel 144.
In some embodiments, medial surface 1222 includes long side surface 1224 and connects the short sides of long side surface 1224
1226, the length direction of anti-overflow item 16 along long side surface 1224 is arranged on long side surface 1224.In this way, the size of long side surface 1224 compared with
Greatly, the length direction of anti-overflow item 16 along long side surface 1224, which is arranged on long side surface 1224, is conducive to seal medial surface 1222 and outside
Gap 11 between face 1226.
Also referring to Fig. 5 and Fig. 6, in some embodiments, groove 122 is generally rectangular shaped, and medial surface 1222 includes
The short sides 1226 of long side surface 1224 and connection long side surface 1224, short sides 1226 are formed with step 128, and panel assembly 14 supports
It is adhesively fixed on step 128 and with step 128.In this way, step 128 plays the role of panel assembly 14 support, have
It is steadily connect conducive to panel assembly 14 with housing 12.Specifically, in present embodiment, cover board 146 is supported on step 128 simultaneously
It is adhesively fixed with step 128, and touch panel 144 is located at the side of step 128.
In other embodiment, short sides 1226 can save step 128 and have with long side surface 1224 same
Structure, and equally mount anti-overflow item 16.
The present invention also provides a kind of dispensing method, the dispensing method of embodiment of the present invention can be used for manufacture and form this
The in-out box 10 of invention embodiment.Specifically, the dispensing method of embodiment of the present invention work will be retouched in detail below
It states.
Fig. 7 and Fig. 8 are please referred to, the dispensing method of embodiment of the present invention includes the following steps：
S12：Housing 12 is provided and panel assembly 14, housing 12 are formed with the groove 122 for accommodating panel assembly 14, face
Plate component 14 includes lateral surface 142 and the upper surface 148 that is connect with lateral surface 142, and groove 122, which is formed with, to be used for and lateral surface
The medial surface 1222 of 142 relative engagements；
S14：Panel assembly 14 is arranged on groove 122；
S16：Gel coating 13 is dredged in the setting of outer edge 1482 in upper surface 148 so that dredging gel coating 13 covers upper surface 148
Outer edge 1482；
S18：Gap 11 between medial surface 1222 and lateral surface 142 sets joint filling glue；With
S20：Cure joint filling glue to be fixedly connected with housing 12 and panel assembly 14.
The dispensing method of embodiment of the present invention utilizes the outside for the upper surface 148 for dredging 13 cover plate component 14 of gel coating
Edge 1482, during so as to prevent from subsequently setting the joint filling glue of fixed shell 12 and panel assembly 14, gap-filling glue water pollution panel group
The upper surface of part 14.
In step S14, panel assembly 14 can be drawn by sucker, be then charged into groove 122, and make anti-overflow item 16
It is contacted with lateral surface 142, so as to seal the gap 11 between medial surface 1222 and lateral surface 142.It is it should be pointed out that anti-
The item 16 that overflows seals the gap 11 of 142 lower part of medial surface 1222 and lateral surface.
Step S16 can be carried out before step S12 and S14.When step S16 is carried out before step S12, the panel that provides
Component 14, which carries, dredges gel coating.
In step S18, joint filling glue can be located at by dispenser point in the top in gap 11.Joint filling glue can be certainly
So curing, can also cure by other means.For example, when joint filling glue is UV glue, can glue be irradiated by ultraviolet light
Water is so that glue curing.
In some embodiments, step S16 includes：
Thin gel coating 13 is arranged on to the outer edge 1482 of upper surface 148 by way of coating.
The application range of coating process is very extensive.It is formed by the way of coating in the upper surface of panel assembly 14 148
The thin gel coating of the outer edge 1482 of one layer of covering upper surface 148, it is simple and convenient, it is easy to implement.
In some embodiments, step S16 includes：
Thin gel coating 13 is arranged on to the outer edge 1482 of upper surface 148 by way of vapor deposition.
One layer of thin gel coating 13 is formed in the upper surface of panel assembly 14 148 using the technique of vacuum evaporation, can be caused
Film purity and the compactness for dredging gel coating 13 are high.
In some embodiments, panel assembly 14 includes touch panel 144 and the cover board being covered on touch panel 144
146.The lateral dimension of cover board 146 is more than the lateral dimension of touch panel 144 so that lateral surface 142 is in cover board 146 and touch surface
Cascaded surface is formed between plate 144, lateral surface 142 includes cover board lateral surface 1462 and touch panel lateral surface 1442.
Step S18 includes：
Gap 11 between medial surface 1222 and cover board lateral surface 1462 sets joint filling glue；
Step S20 includes：
Cure joint filling glue to be fixedly connected with housing 12 and cover board lateral surface 1462.
In this way, housing 12 and cover board lateral surface 1462 are connected and are consolidated by the joint filling glue 18 formed by joint filling glue curing
It is fixed, so as to which panel assembly 14 be made to be fixed in groove 122.
In some embodiments, gap 11 is formed with towards upper opening 112, and step is outside medial surface 1222 and cover board
Gap 11 between side 1462 sets joint filling glue to include the following steps：
Gap 11 is placed in from opening 112 by joint filling glue.
Joint filling glue can be placed in gap 11 by Glue dripping head generally in needle-shaped by opening 112.In one example, may be used
Fixture fixation first to be used to accommodate in-out box 10, then Glue dripping head was moved along one week of gap 11, passed through opening
Joint filling glue is placed in gap 11 by 112.In this way, realize the filling of bonding glue.
In some embodiments, step S20 includes：
Cure joint filling glue in 20-25 DEG C of environment more than five minutes.
In one example, cure joint filling glue in 20 DEG C of environment, hardening time is 15 minutes；In another example
In, cure joint filling glue in 22 DEG C of environment, hardening time is 12 minutes；In another example, in 25 DEG C of environment
Cure joint filling glue, hardening time is 6 minutes.Herein not to the solidification temperature in the range of 20-25 DEG C and more than five minutes
In the range of hardening time do concrete restriction.
In this way, realize the curing of joint filling glue.It is appreciated that after joint filling glue is fully cured, joint filling glue loses
Mobility, the joint filling adhesive tape 18 being fully cured have certain hardness so that follow-up removal is positioned at the upper surface 148 of panel assembly 14
And the joint filling glue in the outside 121 of housing 12 is inconvenient, it could even be possible to damaging the upper table of panel assembly 14 in removal process
Face 148 and the outside of housing 12 121.Joint filling glue of the curing more than five minutes is also not up to complete in 20-25 DEG C of environment
Cured state is conducive to subsequently remove the gap-filling glue positioned at the upper surface 148 of panel assembly 14 and the outside 121 of housing 12
Water.In addition, 20-25 DEG C is normal temperature environment, cures joint filling glue in normal temperature environment and so that the condition of cure of joint filling glue is simple,
It is easy to implement, so as to reduce the manufacture cost of in-out box 10.
Referring to Fig. 8, in some embodiments, dispensing method further includes step before step S14：
Along the circumferential direction of medial surface 1222, anti-overflow glue is set on medial surface 1222；
Cure anti-overflow glue to form at least one anti-overflow item 16；
Step S14 includes：
Panel assembly 14 is arranged on groove 122 and anti-overflow item 16 is made to seal between medial surface 1222 and lateral surface 142
Gap 11.
Anti-overflow item 16 is set to seal the gap 11 between medial surface 1222 and lateral surface 142 before step S14, it can be to prevent
When only subsequently setting the joint filling glue of curing housing 12 and panel assembly 14 again, joint filling glue penetrates into groove 122 and pollutes housing 12
And/or panel assembly 14.
In some embodiments, groove 122 is generally rectangular shaped, and medial surface 1222 includes long side surface 1224 and connects long side
The short sides 1226 in face 1224, along medial surface 1222 it is circumferential include anti-overflow glue is set on medial surface 1222 the step of it is following
Step：
Along the length direction of long side surface 1224, anti-overflow glue is set on long side surface 1224.
Anti-overflow glue is arranged on the long side surface 1224 of medial surface 1222 in this way, can realize.
In some embodiments, the step of anti-overflow glue is set along the length direction of long side surface 1224 on long side surface 1224
Suddenly include the following steps：
Anti-overflow glue is continuously provided on long side surface 1224 along the length direction of long side surface 1224.
In this way, the size of long side surface 1224 is larger, anti-overflow item 16 is arranged on long side surface along the length direction of long side surface 1224
Be conducive to seal the gap 11 between medial surface 1222 and lateral surface 1226 on 1224.In addition, anti-overflow glue is in long side surface 1224
It is upper continuously distributed so that the anti-overflow item 16 after anti-overflow glue curing is continuous on long side surface 1224, is prevented due to anti-overflow item
16 discontinuous spot printing and cause anti-overflow item 16 that cannot form continuous sealing ring and to seal medial surface 1222 and lateral surface 142
Between gap 11 effect it is poor.
In some embodiments, anti-overflow glue includes silicone adhesive.
The bonding force of silicone adhesive is strong, and moisture resistance is good.Using silicone adhesive as anti-overflow glue, can be consolidated by anti-overflow glue
Leakproofness and the moisture resistance for changing the anti-overflow item 16 formed are more preferable.In addition, silicone adhesive also adapts to larger temperature change, so as to make
Sealing effect will not be reduced due to temperature change by obtaining anti-overflow item 16.Certainly, sealing glue may be silicone adhesive.Anti-overflow glue and
It may be the preferable glue of other mobility such as UV glue to seal glue.
In some embodiments, cure the step of anti-overflow glue is to form at least one anti-overflow item 16 and include following step
Suddenly：
Cure anti-overflow glue in 20-25 DEG C of environment more than five minutes.
In one example, cure anti-overflow glue in 20 DEG C of environment, hardening time is 15 minutes；In another example
In, cure anti-overflow glue in 22 DEG C of environment, hardening time is 12 minutes；In another example, in 25 DEG C of environment
Cure anti-overflow glue, hardening time is 6 minutes.Herein not to the solidification temperature in the range of 20-25 DEG C and more than five minutes
In the range of hardening time do concrete restriction.
In this way, 20-25 DEG C is normal temperature environment, cure the condition of cure that anti-overflow glue causes anti-overflow glue in normal temperature environment
Simply, it is easy to implement, so as to reduce the manufacture cost of in-out box 10.
In some embodiments, the time is fully cured less than anti-overflow glue in the hardening time of anti-overflow glue.At one
In example, the time is fully cured more than 25min, and in the present invention in anti-overflow glue, and the hardening time of anti-overflow glue is 10min.
In this way, anti-overflow glue curing for a period of time after, panel assembly 14 is arranged in groove 122, can be caused
Panel assembly 14 is arranged on groove by the tight ness rating ratio between panel assembly 14 and groove 122 when anti-overflow glue is also uncured
Tight ness rating in the case of in 122 is small, facilitates the dismounting during subsequent maintenance.In addition, before anti-overflow glue is fully cured,
Panel assembly 14 is arranged in groove 122, can to avoid be fully cured due to anti-overflow glue and caused by reducing mobility it is close
It is poor to seal effect.
It is appreciated that after anti-overflow glue is fully cured, anti-overflow glue loses mobility, at this time sets panel assembly 14
It puts in groove 122, anti-overflow glue can not be deformed upon according to the extruding of panel assembly 14 and groove 122 and be obtained preferably close
Seal effect.In addition, the anti-overflow item 16 that the anti-overflow glue after being fully cured is formed is not smooth and has certain hardness, can cause
When panel assembly 14 is placed into groove 122, obstruction is generated.
In some embodiments, panel assembly 14 includes touch panel 144 and the cover board being covered on touch panel 144
146, the lateral dimension of cover board 146 is more than the lateral dimension of touch panel 144 so that lateral surface 142 is in cover board 146 and touch surface
Cascaded surface is formed between plate 144, lateral surface 142 includes cover board lateral surface 1462 and touch panel lateral surface 1442, by panel group
Part 14 is arranged on groove 122 and includes the step of anti-overflow item 16 is made to seal gap 11 between medial surface 1222 and lateral surface 142：
Panel assembly 14 is arranged on groove 122 and anti-overflow item 16 is made to seal medial surface 1222 and touch panel lateral surface
Gap between 1442.
In this way, realize that anti-overflow item 16 seals the gap 11 between medial surface 1222 and touch panel lateral surface 1442.It can be with
When preventing from subsequently setting the joint filling glue of curing housing 12 and panel assembly 14 again, joint filling glue penetrates into groove 122 and pollutes housing
12 and/or panel assembly 14.
Referring to Fig. 9, in some embodiments, groove 122 is generally rectangular shaped, medial surface 1222 includes long side surface 1224
With the short sides 1226 of connection long side surface 1224, short sides 1226 are formed with step 128, and step 128 includes step surface 1282, connects
It connects 1284 and above the rank of connection step surface 1,282 1286 below the rank of step surface 1282 and long side surface 1224, along medial surface 1222
Circumferential include the following steps anti-overflow glue is set on medial surface 1222 the step of：
1284 length direction is continuously provided anti-overflow glue below along rank.
It is in this way, continuously distributed on can causing adhesive-spill-preventing water 1284 below the rank so that anti-overflow after anti-overflow glue curing
Item 16 1284 below the rank on be continuous, prevent the discontinuous spot printing due to anti-overflow item 16 and cause anti-overflow item 16 that cannot be formed
Continuous sealing ring so that the effect for sealing the gap 11 between medial surface 1222 and lateral surface 142 is poor.
It is appreciated that it is continuous in the anti-overflow glue that long side surface 1224 and short sides 1226 are coated with, in this way, along inside
The anti-overflow item 16 formed after the anti-overflow glue curing being circumferentially coated in face 1222 can form the sealing ring of a closure.
In some embodiments, step S14 includes the following steps：
The setting bonding glue on step surface；
Panel assembly is supported on step surface；With
Curing is bonded glue to be bonded step surface knead dough plate component.
In this way, panel assembly 14 be able to bear against and pass through be bonded glue curing formation bonding adhesive tape 19 be fixed on step surface
On 1282.Step 128 plays the role of panel assembly 14 support, is conducive to panel assembly 14 and steadily connects with housing 12
It connects.
Specifically, bonding glue can be identical with the ingredient of anti-overflow glue, such as is above-mentioned silicone adhesive.In addition, face
Plate component 14 includes touch panel 144 and the cover board 146 being covered on touch panel 144, and the longitudinal size of cover board 146, which is more than, to be touched
The longitudinal size of panel 144 is controlled, the cover board 146 of panel assembly 14 is born against on step surface 1282, the touch surface of panel assembly 14
Plate 144 and 1,284 16 gluings of anti-overflow item formed by anti-overflow glue curing below rank.
In some embodiments, dispensing method is further comprising the steps of after step S20：
Thin gel coating 13 is removed from upper surface 148.
After thin gel coating 13 is removed from upper surface 148, the joint filling glue put on thin gel coating 13 removes together, upper table
Face 148 is blocked by thin gel coating 13, does not have gap-filling glue water, because without wiping.
In some embodiments, dispensing method further includes after the step of removing thin gel coating 13 from upper surface 148
Following steps：
Removal is positioned at the joint filling glue in the outside 121 of housing 12.
During by joint filling glue from 112 points of opening into gap 11, since gap 11 is very narrow, when from Glue dripping head
When the dispensing amount of outflow is excessive, joint filling glue 13 easily spills into the outside 121 of housing 12 and the upper surface of panel assembly 14
148.Therefore, it after joint filling glue is cured, also needs to wipe in joint filling glue so that the outside 121 of housing 12 and panel assembly
There is no joint filling glue for 14 upper surface 148.It is appreciated that work as on the outer edge 1482 of upper surface 148 covered with thin gel coating
When 13, it is still desirable to the joint filling glue on gel coating 13 is dredged in erasing, but based on the characteristic of thin gel coating, it wipes and dredges gel coating 13
On joint filling cement ratio erasing panel assembly 14 upper surface 148 on joint filling glue it is conveniently easy.Alternatively, it is also possible to go
During except joint filling glue on thin gel coating 13, thin gel coating 13 is removed together.
In some embodiments, removal includes the following steps positioned at the step of joint filling glue in the outside 121 of housing 12：
Using non-dust cloth erasing positioned at the joint filling glue in the outside 121 of housing 12.
Non-dust cloth soft surface has good cleaning efficiency, using non-dust cloth erasing joint filling glue will not damage surface
While 14 surface 148 of plate component and outside 121 of housing 12, higher cleaning efficiency can be obtained.In one example, may be used
First fixture to be used to fix in-out box 10, then by manipulator clamping non-dust cloth, last control machinery hand movement with
Erasing is positioned at the joint filling glue in 12 outside 121 of 14 surface 148 of panel assembly and housing.It is appreciated that dredge gel coating 13 in erasing
On joint filling glue when, dredge gel coating 13 be removed together.
Referring to Fig. 10, the in-out box 10 of embodiment of the present invention can be applied to electronic device 100.Electronics fills
It puts 100 and includes ontology 20, in-out box 10 is arranged on ontology 20.Electronic device 100 includes but not limited to mobile phone, tablet
Computer or wearable device.
Specifically, electronic device 100 further includes battery cover (not shown), and battery cover is located at housing 12 and panel assembly respectively
On 14 opposite sides.
The dispensing method of embodiment of the present invention, the dispensing method of embodiment of the present invention include the following steps：
S12：Housing 12 is provided and panel assembly 14, housing 12 are formed with the groove 122 for accommodating panel assembly 14, face
Plate component 14 includes lateral surface 142 and the upper surface 148 that is connect with lateral surface 142, and groove 122, which is formed with, to be used for and lateral surface
The medial surface 1222 of 142 relative engagements；
S14：Panel assembly 14 is arranged on groove 122；
S16：Gel coating 13 is dredged in the setting of outer edge 1482 in upper surface 148 so that dredging gel coating 13 covers upper surface 148
Outer edge 1482；
S18：Gap 11 between medial surface 1222 and lateral surface 142 sets joint filling glue；With
S20：Cure joint filling glue to be fixedly connected with housing 12 and panel assembly 14.
In this way, using the outer edge 1482 for the upper surface 148 for dredging 13 cover plate component 14 of gel coating, it is follow-up so as to prevent
When the joint filling glue of fixed shell 12 and panel assembly 14 is set, the upper surface 148 of gap-filling glue water pollution panel assembly 14.
In the description of this specification, reference term " embodiment ", " is schematically implemented " certain embodiments "
The description of mode ", " example ", " specific example " or " some examples " etc. means with reference to the embodiment or example description
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the present invention.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can in an appropriate manner combine in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：
In the case of not departing from the principle of the present invention and objective can these embodiments be carried out with a variety of variations, modification, replace and become
Type, the scope of the present invention are limited by claim and its equivalent.
Claims (19)
1. a kind of dispensing method, which is characterized in that including：
Housing is provided and panel assembly, the housing are formed with the groove for accommodating the panel assembly, the panel assembly
The upper surface being connect including lateral surface and with the lateral surface, the groove formation are useful for and the lateral surface relative engagement
Medial surface；
The panel assembly is arranged on the groove；
Gel coating is dredged in outer edge setting in the upper surface so that the thin gel coating covers the outer edge of the upper surface；
Gap setting joint filling glue between the medial surface and the lateral surface；With
Cure the joint filling glue to be fixedly connected with the housing and the panel assembly.
2. dispensing method as described in claim 1, which is characterized in that the outer edge setting in the upper surface is dredged glue and applied
The step of layer, includes：
The thin gel coating is arranged on to the outer edge of the upper surface by way of coating.
3. dispensing method as claimed in claim 2, which is characterized in that the outer edge setting in the upper surface is dredged glue and applied
The step of layer, includes：
The thin gel coating is arranged on to the outer edge of the upper surface by way of vapor deposition.
4. dispensing method as described in claim 1, which is characterized in that the panel assembly includes touch panel and is covered in institute
The cover board on touch panel is stated, the lateral dimension of the cover board is more than the lateral dimension of the touch panel so that the lateral surface
Cascaded surface is formed between the cover board and the touch panel, the lateral surface is included on the outside of cover board lateral surface and touch panel
The step of face, the gap between the medial surface and the lateral surface sets joint filling glue, includes the following steps：
Gap between the medial surface and the cover board lateral surface sets the joint filling glue；
It is described to cure the joint filling glue to include the step of being fixedly connected with the housing and the panel assembly：
Cure the joint filling glue to be fixedly connected with the housing and the cover board lateral surface.
5. dispensing method as described in claim 1, which is characterized in that the gap is formed with towards upper opening, it is described
The step of gap between the medial surface and the lateral surface sets joint filling glue includes the following steps：
The joint filling glue is placed in the gap from the opening.
6. dispensing method as described in claim 1, which is characterized in that described the step of curing the joint filling glue includes following
Step：
Cure the joint filling glue in 20-25 DEG C of environment more than five minutes.
7. dispensing method as described in claim 1, which is characterized in that the dispensing method is arranged on by the panel assembly
Step was further included before the step of groove：
Along the circumferential direction of the medial surface, anti-overflow glue is set on the medial surface；
Cure the anti-overflow glue to form at least one anti-overflow item；
The described the step of panel assembly is arranged on the groove, includes：
The panel assembly is arranged on the groove and the anti-overflow item is made to seal between the medial surface and the lateral surface
Gap.
8. dispensing method as described in claim 1, which is characterized in that the groove is generally rectangular shaped, and the medial surface includes
Long side surface and the short sides for connecting the long side surface, it is described that adhesive-spill-preventing is set on the medial surface along the circumferential of the medial surface
The step of water, includes the following steps：
Along the length direction of the long side surface, the anti-overflow glue is set on the long side surface.
9. dispensing method as claimed in claim 8, which is characterized in that the length direction along the long side surface is in the length
The step of anti-overflow glue is set on side includes the following steps：
The anti-overflow glue is continuously provided on the long side surface along the length direction of the long side surface.
10. dispensing method as claimed in claim 7, which is characterized in that described to cure the anti-overflow glue to form at least one
A anti-overflow the step of, includes the following steps：
Cure the anti-overflow glue in 20-25 DEG C of environment more than five minutes.
11. dispensing method as claimed in claim 7, which is characterized in that the hardening time of the anti-overflow glue is less than described anti-
The time is fully cured in excessive glue water.
12. dispensing method as claimed in claim 7, which is characterized in that the panel assembly includes touch panel and is covered in
Cover board on the touch panel, the lateral dimension of the cover board are more than the lateral dimension of the touch panel so that the outside
Face forms cascaded surface between the cover board and the touch panel, and the lateral surface is included outside cover board lateral surface and touch panel
Side, it is described that the panel assembly is arranged on the groove and the anti-overflow item is made to seal the medial surface and the lateral surface
Between gap the step of include：
The panel assembly is arranged on the groove and the anti-overflow item is made to seal outside the medial surface and the touch panel
Gap between side.
13. dispensing method as claimed in claim 7, which is characterized in that the groove is generally rectangular shaped, and the medial surface includes
Long side surface and the short sides for connecting the long side surface, the short sides are formed with step, and the step includes step surface, connection institute
Above the rank for stating below the rank of step surface and the long side surface and connecting the step surface, circumferentially the existing along the medial surface
The step of setting anti-overflow glue on the medial surface includes the following steps：
The anti-overflow glue is continuously provided along the length direction below the rank.
14. dispensing method as claimed in claim 13, which is characterized in that described that the panel assembly is arranged on the groove
The step of include the following steps：
The setting bonding glue on the step surface；
The panel assembly is supported on the step surface；With
Cure the bonding glue to be bonded the step surface and the panel assembly.
15. dispensing method as described in claim 1, which is characterized in that the dispensing method is in the curing gap-filling glue
It is further comprising the steps of after the step of water：
The thin gel coating is removed from the upper surface.
16. dispensing method as claimed in claim 15, which is characterized in that the dispensing method by the thin gel coating from institute
It is further comprising the steps of after the step of stating upper surface removal：
Removal is positioned at the joint filling glue of the hull outside.
17. dispensing method as claimed in claim 16, which is characterized in that the removal is filled out positioned at the described of the hull outside
The step of stitching glue includes the following steps：
Using non-dust cloth erasing positioned at the joint filling glue of the hull outside.
18. a kind of in-out box, which is characterized in that the in-out box passes through described in claim any one of 1-17
Dispensing method manufacture to be formed.
19. a kind of electronic device, which is characterized in that including：
Ontology；
In-out box described in claim 18, the in-out box setting is on the body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810200445.2A CN108246585A (en) | 2018-03-12 | 2018-03-12 | Dispensing method, in-out box and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810200445.2A CN108246585A (en) | 2018-03-12 | 2018-03-12 | Dispensing method, in-out box and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108246585A true CN108246585A (en) | 2018-07-06 |
Family
ID=62746721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810200445.2A Pending CN108246585A (en) | 2018-03-12 | 2018-03-12 | Dispensing method, in-out box and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108246585A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103057244A (en) * | 2011-10-24 | 2013-04-24 | 比亚迪股份有限公司 | Dispensing method for touch panel and touch panel |
| CN105058691A (en) * | 2015-08-31 | 2015-11-18 | 广东欧珀移动通信有限公司 | Shell assembly molding process |
| CN105376359A (en) * | 2015-10-23 | 2016-03-02 | 广东欧珀移动通信有限公司 | Mobile equipment, and casing assembly and manufacture method thereof |
| CN106843390A (en) * | 2017-01-09 | 2017-06-13 | 广东欧珀移动通信有限公司 | The preparation method of display screen component, electronic installation and display screen component |
-
2018
- 2018-03-12 CN CN201810200445.2A patent/CN108246585A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103057244A (en) * | 2011-10-24 | 2013-04-24 | 比亚迪股份有限公司 | Dispensing method for touch panel and touch panel |
| CN105058691A (en) * | 2015-08-31 | 2015-11-18 | 广东欧珀移动通信有限公司 | Shell assembly molding process |
| CN105376359A (en) * | 2015-10-23 | 2016-03-02 | 广东欧珀移动通信有限公司 | Mobile equipment, and casing assembly and manufacture method thereof |
| CN106843390A (en) * | 2017-01-09 | 2017-06-13 | 广东欧珀移动通信有限公司 | The preparation method of display screen component, electronic installation and display screen component |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108372092A (en) | Dispensing method, front shell assemblies and electronic device | |
| CN102823338B (en) | Glass composite, electronic device using glass composite, and input device | |
| KR101300020B1 (en) | Method for manufacturing display panel with curved shape | |
| CN207854300U (en) | Electronic equipment | |
| CN108600441B (en) | Manufacturing method of display screen assembly, display screen assembly and electronic device | |
| CN108322570A (en) | Dispensing method | |
| CN105452980A (en) | Electronic device with injection molded display trim | |
| CN108683780A (en) | Dispensing method, housing unit and electronic device | |
| CN108506300A (en) | Dispensing method, in-out box and electronic device | |
| CN108561391A (en) | Dispensing method, in-out box and electronic device | |
| CN108540597A (en) | Production method, front shell assemblies and the electronic device of front shell assemblies | |
| KR101162017B1 (en) | Display device | |
| CN108515004A (en) | dispensing method | |
| EP3605216B1 (en) | Glue sealing method for display screen frame | |
| KR20150019204A (en) | Front window cover for touch screen display device and method for producing the same | |
| CN108246585A (en) | Dispensing method, in-out box and electronic device | |
| CN108521739A (en) | Dispensing method, in-out box and electronic device | |
| CN108480129A (en) | Dispensing method, in-out box and electronic device | |
| CN108499819A (en) | The production method of in-out box | |
| CN108616620A (en) | Production method, in-out box and the electronic device of in-out box | |
| CN108600423A (en) | The production method of in-out box | |
| CN108412865A (en) | Dispensing method, in-out box and electronic device | |
| CN108393247A (en) | dispensing method | |
| CN108506301A (en) | dispensing method | |
| CN108521740B (en) | The production method of in-out box |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180706 |