CN108521740B - The production method of in-out box - Google Patents
The production method of in-out box Download PDFInfo
- Publication number
- CN108521740B CN108521740B CN201810202140.5A CN201810202140A CN108521740B CN 108521740 B CN108521740 B CN 108521740B CN 201810202140 A CN201810202140 A CN 201810202140A CN 108521740 B CN108521740 B CN 108521740B
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- Prior art keywords
- gap
- panel assembly
- joint filling
- filling glue
- shell
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/061—Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
A kind of production method of in-out box disclosed by the invention includes: to provide shell and panel assembly, shell includes bottom wall and the side wall that the side from bottom wall extends, bottom wall surrounds fluted with side wall, and shell is formed with the aspirating hole of communication groove, and panel assembly includes lateral surface；Panel assembly is arranged in groove, is formed and is had the gap between the top and lateral surface of side wall, gap area aspirating hole；Joint filling glue is filled into gap；Pressure apparatus is provided, pressure apparatus extracts the gas in gap so that the air pressure in gap is less than the ambient pressure outside gap, so that gap-filling glue water be made to flow into gap by aspirating hole；With solidification joint filling glue to be fixedly connected with shell and panel assembly.The production method of above-mentioned in-out box makes the air pressure in gap be less than the ambient pressure outside gap by pressure apparatus, to make gap-filling glue water flow into gap, both it had solved the problems, such as to be difficult to dispensing, the further gap between reduction side wall and lateral surface after panel assembly is packed into groove.
Description
Technical field
The present invention relates to electronic device more particularly to a kind of production method of in-out box, in-out box and
Electronic device.
Background technique
In the related art, the electronic devices such as mobile phone include shell and panel assembly, and shell forms fluted, panel assembly
It is arranged in groove, shell and the side of panel assembly generally being fixedly connected by mode for dispensing glue.However, in order to improve electronics
The screen accounting of device, the gap between shell and the side of panel assembly is smaller, and glue is difficult to click and enter shell and panel assembly
In gap between side.
Summary of the invention
The present invention provides production method, in-out box and the electronic device of a kind of in-out box.
The production method of the in-out box of embodiment of the present invention comprising steps of
There is provided shell and panel assembly, the shell includes bottom wall and the side wall that the side from the bottom wall extends, described
Bottom wall surrounds fluted with the side wall, and the shell is formed with the aspirating hole for being connected to the groove, and the panel assembly includes
Lateral surface；
In the groove by panel assembly setting, it is formed between the top of the side wall and the lateral surface seamed
Gap, aspirating hole described in the gap area；
Joint filling glue is filled into the gap；
Pressure apparatus is provided, the pressure apparatus extracts the gas in the gap so that the seam by the aspirating hole
Air pressure in gap is less than the ambient pressure outside the gap, so that the gap-filling glue water be made to flow into the gap；With
Solidify the joint filling glue to be fixedly connected with the shell and the panel assembly.
The in-out box of embodiment of the present invention manufactures to be formed by above-described production method.
The electronic device of embodiment of the present invention include more than in-out box.
In the production method of the in-out box of embodiment of the present invention, in-out box and electronic device, pass through
The pressure apparatus makes the air pressure in gap be less than the ambient pressure outside the gap, to make described in the gap-filling glue water inflow
Gap not only can solve the problem of being difficult to dispensing after panel assembly is packed into groove, can also further decrease side wall and outer
Gap size between side.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect and advantage of the invention is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, in which:
Fig. 1 is the floor map of the electronic device of embodiment of the present invention.
Fig. 2 is the perspective exploded view of the in-out box of embodiment of the present invention；
Fig. 3 is the floor map of the in-out box of embodiment of the present invention；
Fig. 4 is diagrammatic cross-section of the in-out box along the direction III-III of Fig. 3；
Fig. 5 is the enlarged diagram of the part in-out box IV of Fig. 4；
Fig. 6 is diagrammatic cross-section of the in-out box along the direction V-V of Fig. 3；
Fig. 7 is the enlarged diagram of the part in-out box VI of Fig. 6；
Fig. 8 is the flow diagram of the production method of the in-out box of embodiment of the present invention；
Fig. 9 is the process schematic of the production method of the in-out box of embodiment of the present invention；
Figure 10 is another process schematic of the production method of the in-out box of embodiment of the present invention；
Figure 11 is the flow diagram of the production method of the in-out box of another embodiment of the present invention；
Figure 12 is the process schematic of the production method of the in-out box of a further embodiment of this invention；
Figure 13 is the step S14 process schematic of the production method of the in-out box of embodiment of the present invention；
Main element symbol description:
Electronic device 100, ontology 20, in-out box 10, shell 12, groove 122, side wall 126, long side surface 1223,
Long side wall 1224, short sides 1225, short side wall 1226, bottom surface 1228, bottom wall 124, aspirating hole 1241, side wall 126, top
1262, step 128, step surface 1282, below rank 1286 above 1284, rank, external 121, panel assembly 14, lateral surface 142, rank
Tread 1422, touch panel 144, touch panel lateral surface 1442, cover board 146, cover board lateral surface 1462, cover board lower surface
1464, upside 148, anti-overflow adhesive tape 16, joint filling adhesive tape 18, gap 11, opening 112, bonding adhesive tape 19, pressure apparatus 200.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy
Fixed orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.?
In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes in-out box 10 and ontology 20, input
Output precision 10 is arranged on ontology 20.Electronic device 100 includes but is not limited to mobile phone, tablet computer or wearable device.
Specifically, electronic device 100 further includes battery cover (not shown), battery (not shown) and main circuit board (not shown)
In electronic device 100, battery cover covers the inner body of the electronic devices such as battery and main circuit board 100.Battery is for being
Electronic device 100 provides electric energy, and main circuit board is configured as the working condition of control electronic device 100.
Please refer to Fig. 2 to Fig. 5, the in-out box 10 of embodiment of the present invention includes shell 12, panel assembly 14, extremely
A few anti-overflow adhesive tape 16 and joint filling adhesive tape 18.
Shell 12 is formed with the groove 122 for accommodating panel assembly 14, and panel assembly 14 is arranged in groove 122, panel
Component 14 includes lateral surface 142.Groove 122 is formed with for the side wall 126 with 142 relative engagement of lateral surface.Anti-overflow adhesive tape
16 can be arranged anti-overflow glue on the inside of side wall 126 by the circumferential direction along side wall 126 and be formed by curing.Anti-overflow adhesive tape 16
Seal the gap 11 between side wall 126 and lateral surface 142.Joint filling adhesive tape 18 can be by the top of side wall 126 1262 and outside
Joint filling glue is set between side 142 and is formed by curing.18 fixed bonding shell 12 of joint filling adhesive tape and panel assembly 14.
In the in-out box 10 of embodiment of the present invention, in-out box 10 is by presetting and solidifying anti-overflow
At least one the anti-overflow adhesive tape 16 of glue to be formed, so that anti-overflow adhesive tape 16 seals the seam between side wall 126 and lateral surface 142
Gap 11, can prevent subsequent when the joint filling glue for solidifying shell 12 and panel assembly 14 being arranged again, and joint filling glue penetrates into groove 122
Pollute shell 12 and/or panel assembly 14.Specifically, shell 12 includes bottom wall 124 and the side wall 126 extended from bottom wall 124,
Bottom wall 124 and side wall 126 surround groove 122.Shell 12 is substantially in cuboid, and shell 12 is the carrying of electronic device 100
Part, for carrying most of part of electronic device 100.Shell 12 can be adopted made of plastic, can also use metal material
It is made, or integral structure is formed by the technique of in-mould injection using plastics and metal.In one example, bottom wall 124
Material is metal, and the material of side wall 126 is plastics, first bottom wall 124 can be put into mold, then by injecting into mold
The plastic cement of melting forms side wall 126 after plastic cement solidification, to obtain shell 12.
In some embodiments, side wall 126 includes medial surface 1222, and bottom wall 124 includes connecting with medial surface 1222
Bottom surface 1228, medial surface 1222 are the plane perpendicular to bottom surface 1228.
In some embodiments, side wall 126 includes medial surface 1222, and bottom wall 124 includes connecting with medial surface 1222
Bottom surface 1228, medial surface 1222 are the edge outwardly extending inclined-plane upwards of bottom surface 1228.
Side wall 126 can be vertical with bottom surface 1228, can also extend outwardly upwards from the edge of bottom surface 1228, input and output
Component 10 can according to need the specific structure of selection.
In some embodiments, panel assembly 14 includes touch panel 144 and the lid being covered on touch panel 144
Plate 146.The lateral dimension of cover board 146 is greater than the lateral dimension of touch panel 144 so that lateral surface 142 is in cover board 146 and touch-control
Cascaded surface is formed between panel 144.Lateral surface 142 includes cover board lateral surface 1462 and touch panel lateral surface 1442.Adhesive-spill-preventing
Item 16 seals the gap 11 between side wall 126 and touch panel lateral surface 1442,.Joint filling adhesive tape 18 is fixedly connected with cover board lateral surface
1462 and side wall 126.
In this way, the side wall 126 of cover board lateral surface 1462 and groove 122 is able to connect by joint filling adhesive tape 18, so that
Panel assembly 14 is fixedly connected with shell 12.
Specifically, the material of cover board 146 can be made of translucent materials such as glass, ceramics or sapphires.Due to cover board 146
Due to the input part as electronic device 100, cover board 146 is often subject to the contact such as collide or scratch.For example, user is by electronics
When device 100 is put into pocket, cover board 146 may be scratched by the key in user's pocket and be damaged.Therefore, the material of cover board 146
The biggish material of hardness, such as above sapphire material can be used.Or hardened layer is formed to mention on the surface of cover board 146
The anti-scratch ability of high cover board 146.
Touch panel 144 includes display module (not shown) and the touch control layer (not shown) being arranged in display module.It is aobvious
Show that mould group is, for example, liquid crystal display die set (LCD Module, LCM), certainly, display module may be display module flexible.
Touch control layer is used to receive the touch-control input of user, to generate the signal for controlling the content that display module is shown.
Touch panel 144 and cover board 146 are for example bonded by optical cement (Optically Clear Adhesive, OCA)
It is fixed together, optical cement is not only adhesively fixed touch panel 144 and cover board 146, can also issue through touch panel 144
Light.
In one example, panel assembly 14 can be formed by following steps: first provide touch panel 144 and cover board
146, then cover board 146, is finally fitted on optical cement by the coated optical glue on touch panel 144, so that cover board 146
It is fixed together with touch panel 144.
In some embodiments, side wall 126 includes long side wall 1224 and the short side wall 1226 for connecting long side wall 1224, is prevented
Excessive glue item 16 is along the inside that long side wall 1224 is arranged in the length direction of long side wall 1224.In this way, the size of long side wall 1224
Larger, anti-overflow adhesive tape 16 is conducive to seal side wall along the inside that long side wall 1224 is arranged in the length direction of long side wall 1224
Gap 11 between 126 and lateral surface 1226.
Referring to Figure 6 together and Fig. 7, in some embodiments, groove 122 is generally rectangular shaped, and side wall 126 includes inside
Face 1222, medial surface 1222 include long side surface 1223 and the short sides 1225 for connecting long side surface 1223, and short sides 1225 are formed with
Step 128, panel assembly 14 are supported on step 128 and are adhesively fixed with step 128.In this way, step 128 is to panel assembly
14 play the role of a support, are conducive to panel assembly 14 and steadily connect with shell 12.Specifically, in present embodiment,
Cover board 146 is supported on step 128, and touch panel 144 is located at the side of step 128.
In other embodiment, short side wall 1226 can save step 128 and have with long side wall 1224 same
Structure, and be equally coated with anti-overflow glue and form anti-overflow adhesive tape 16.
In some embodiments, anti-overflow adhesive tape 16 is mounted on the inside of side wall 126 along the circumferential direction of side wall 126.Also
It is to say, anti-overflow adhesive tape 16 is separate structure with side wall 126.Anti-overflow adhesive tape 16 is, for example, foam, and anti-overflow adhesive tape 16 passes through double-sided adhesive
It is fitted on side wall 126.In addition, foam has elasticity, subsequent joint filling can not only be prevented as anti-overflow adhesive tape 16 using foam
Glue penetrates into groove 122 and pollutes shell 12 and/or panel assembly 14, padded coaming is also used as, in shell 12 and/or panel
Protection panels component 14 when component 14 is impacted.Further more, foam is simple and easy to get and light-weight, production efficiency and drop are being improved
While inexpensive, the weight of shell 12 and panel assembly 14 can be mitigated.
Certainly, in other some embodiments, anti-overflow adhesive tape 16 is structure as a whole with side wall 126, for example, adhesive-spill-preventing
Item 16 can be formed with side wall 126 by Shooting Technique.It should be pointed out that circumferentially extending of the anti-overflow adhesive tape 16 along side wall 126
It is intermittent, so that the air after dispensing joint filling glue in gap 11 can flow out to outside gap 11.
The present invention also provides a kind of production method of in-out box, the in-out boxes of embodiment of the present invention
Production method can be used for manufacturing and form the in-out box 10 of embodiment of the present invention.It specifically, below will be to this hair
The production method of the in-out box of bright embodiment is described in detail.
Please refer to Fig. 8 and Fig. 9, the production method of the in-out box of embodiment of the present invention the following steps are included:
S12: providing shell 12 and panel assembly 14, and shell 12 includes that bottom wall 124 and the side from bottom wall 124 extend
Side wall 126, bottom wall 124 and side wall 126 surround fluted 122, and shell 12 is formed with the aspirating hole 1241 of communication groove 122, face
Board group part 14 includes lateral surface 142；S14: the panel assembly 14 is arranged in the groove 122, the top of side wall 126
It is formed between 1262 and lateral surface 142 and has the gap 11, gap 11 is connected to aspirating hole 1241；
S16: joint filling glue is filled into gap 11；
S18: providing pressure apparatus 200 and so that the air pressure in gap 11 is less than the ring outside gap 11 by pressure apparatus 200
Border air pressure, so that gap-filling glue water be made to flow into gap 11；
S20: solidification joint filling glue is to be fixedly connected with shell 12 and panel assembly 14.
The production method of the in-out box of embodiment of the present invention is made in gap 11 by the pressure apparatus 200
Air pressure be less than the ambient pressure outside the gap 11 and can not only be solved so that the gap-filling glue water be made to flow into the gap 11
The problem of being certainly difficult to dispensing after panel assembly 14 is packed into groove 122, can also further decrease side wall 126 and lateral surface 142
Between gap size.
In step S14, sucker can be used by panel assembly 14, be then charged into groove 122.
In step s 16, joint filling glue can be sticked by dispenser point around gap 11 since joint filling glue has
Property, joint filling glue will not successfully flow into gap 11.
In step S18, pressure apparatus 200 can be supercharging device, or negative pressure device.In pressure apparatus 200
When for supercharging device, as shown in figure 9, step S18 is specifically included: pressure apparatus is arranged in shell 12 and panel assembly together
In 200, to increase the ambient pressure outside gap 11, so that the air pressure in gap 11 be made to be less than the ambient pressure outside gap 11.Increase
Pressure device can be by the filling gas into supercharging device, to increase the ambient pressure outside gap 11.It is appreciated that at this point,
Air pressure in gap 11 can be constant, so that gap 11 is inside and outside to form pressure difference, by the gap-filling glue hydraulic pressure outside gap 11
Enter in gap 11.
When pressure apparatus 200 is negative pressure device, shell 12 is formed with the aspirating hole 1241 of communication groove 122, further
Ground, aspirating hole 1241 are connected to gap 11.Preferably, aspirating hole 1241 is opened in bottom wall 124.At this point, as shown in Figure 10, step
S18 is specifically included: pressure apparatus 200 extracts the gas in gap 11 so that the air pressure in gap 11 is less than by aspirating hole 1241
Ambient pressure outside gap 11, so that gap-filling glue water be made to flow into gap 11.It is appreciated that the ambient pressure outside gap 11 can at this time
With constant, after extracting the gas in gap 11, negative pressure is formed in gap 11, so that gap 11 is inside and outside to form pressure difference, is filled out
Seam glue is pressed into gap 11 under the air pressure of environment.
In step S20, joint filling glue can also can be solidified by other means with spontaneous curing.For example, working as gap-filling glue
When water is UV glue, joint filling glue can be irradiated by ultraviolet light so that joint filling glue curing.
Figure 11 and Figure 12 is please referred to, in some embodiments, is further comprised the steps of: before step S14
Anti-overflow glue is arranged in S131, the circumferential direction along side wall 126 on the inside of side wall 126；
S132 solidifies anti-overflow glue to form at least one anti-overflow adhesive tape 16；
Step S14 includes:
Panel assembly 14 is arranged in groove 122 and anti-overflow adhesive tape 16 is made to seal the side wall 126 and outside by S141
Gap 11 between face 124, anti-overflow adhesive tape 16 are located at gap-filling glue side under water.
Specifically, anti-overflow adhesive tape 16 is contacted with lateral surface 142, so as to seal between side wall 126 and lateral surface 142
Gap 11.It should be pointed out that anti-overflow adhesive tape 16 seals the gap 11 of side wall 126 and 142 lower part of lateral surface, and anti-overflow adhesive tape
16 along the circumferentially extending of side wall 126 be intermittent, so that the air after dispensing joint filling glue in gap 11 can flow out
To outside gap 11.
In this way, anti-overflow adhesive tape 16 seals the gap 11 between side wall 126 and lateral surface 142, to prevent joint filling glue from seeping
Enter groove 122 and pollutes shell 12 and/or panel assembly 14.
In some embodiments, groove 122 is generally rectangular shaped, and side wall 126 includes long side wall 1224 and connection long side wall
1224 short side wall 1226.Step S131 the following steps are included:
Anti-overflow glue is arranged in length direction along long side wall 1224 on the inside of long side wall 1224.
In this way, may be implemented for anti-overflow glue to be arranged on the inside of long side wall 1224 of side wall 126.
In some embodiments, anti-overflow glue includes silicone adhesive.
The bonding force of silicone adhesive is strong, and moisture resistance is good.Using silicone adhesive as anti-overflow glue, can be consolidated by anti-overflow glue
Leakproofness and the moisture resistance for changing the anti-overflow adhesive tape 16 formed are more preferable.In addition, silicone adhesive also adapts to biggish temperature change, thus
So that anti-overflow adhesive tape 16 will not reduce sealing effect because of temperature change.Certainly, joint filling glue may be silicone adhesive.Adhesive-spill-preventing
Water and joint filling glue may be the preferable glue of other mobility such as UV glue.
In some embodiments, step S132 the following steps are included:
Solidifying anti-overflow glue in 20-25 DEG C of environment is more than five minutes.
In one example, solidify anti-overflow glue in 20 DEG C of environment, curing time is 15 minutes；In another example
In, solidify anti-overflow glue in 22 DEG C of environment, curing time is 12 minutes；In another example, in 25 DEG C of environment
Solidify anti-overflow glue, curing time is 6 minutes.Herein not to the solidification temperature within the scope of 20-25 DEG C and more than five minutes
Curing time in range does concrete restriction.
In this way, 20-25 DEG C is normal temperature environment, solidify the condition of cure that anti-overflow glue makes anti-overflow glue in normal temperature environment
Simply, easy to accomplish, to reduce the manufacturing cost of in-out box 10.
In some embodiments, the time is fully cured less than anti-overflow glue in the curing time of anti-overflow glue.At one
In example, the time is fully cured greater than 25min, and in the present invention in anti-overflow glue, and the curing time of anti-overflow glue is 10min.
In this way, anti-overflow glue curing for a period of time after, by panel assembly 14 be arranged in groove 122, can make
Panel assembly 14 is arranged in groove when anti-overflow glue is also uncured for tightness ratio between panel assembly 14 and groove 122
Tightness in the case where in 122 is small, facilitates the disassembly during subsequent maintenance.In addition, before anti-overflow glue is fully cured,
Panel assembly 14 is arranged in groove 122, can be reduced close caused by mobility to avoid since anti-overflow glue is fully cured
It is poor to seal effect.
It is appreciated that anti-overflow glue loses mobility after anti-overflow glue is fully cured, panel assembly 14 is set at this time
It sets in groove 122, anti-overflow glue can not deformation occurs and obtains better according to the extruding of panel assembly 14 and groove 122
Sealing effect.In addition, the anti-overflow adhesive tape 16 that the anti-overflow glue after being fully cured is formed is not smooth and has certain hardness, meeting
When causing to be placed into panel assembly 14 in groove 122, obstruction is generated.
Figure 13 is please referred to, in some embodiments, groove 122 is generally rectangular shaped, and side wall 126 includes medial surface 1222,
Medial surface 1222 includes long side surface 1223 and the short sides 1225 for connecting long side surface 1223.Short sides 1225 are formed with step
128, step 128 include step surface 1282, connection step surface 1282 and long side surface 1223 rank below 1284 and connection step surface
1286 above 1282 rank.
Step S131 the following steps are included:
Anti-overflow glue is continuously provided below rank 1284 length direction is 1284 below the rank.
In this way, can make adhesive-spill-preventing water 1284 below the rank on it is continuously distributed so that anti-overflow after anti-overflow glue curing
Adhesive tape 16 1284 below the rank on be it is continuous, prevent the discontinuous spot printing due to anti-overflow adhesive tape 16 and lead to anti-overflow adhesive tape 16 not
Continuous sealing ring, which can be formed, makes the effect for sealing the gap 11 between side wall 126 and lateral surface 142 poor.
It is appreciated that one of them is continuous for the anti-overflow glue being coated in long side wall 1224 and short side wall 1226, in this way, can
To prevent the anti-overflow adhesive tape 16 formed after solidifying that gap 11 is fully sealed the gas in gap 11 can not be flowed out.
Referring to Figure 13, in some embodiments, step S14 the following steps are included:
The setting bonding glue on step surface 1282；
Panel assembly 14 is supported on step surface 1282；With
Solidification bonding glue is to be bonded step surface 1282 and panel assembly 14.
In this way, panel assembly 14 is able to bear against and is fixed on step by the bonding adhesive tape 19 that bonding glue curing is formed
On face 1282.Step 128 to panel assembly 14 play the role of one support, be conducive to panel assembly 14 steadily with shell 12
Connection.
Specifically, bonding glue can be identical with the ingredient of joint filling glue, such as is above-mentioned silicone adhesive.In addition, face
Board group part 14 includes touch panel 144 and the cover board 146 being covered on touch panel 144, and the longitudinal size of cover board 146 is greater than touching
The longitudinal size of panel 144 is controlled, the cover board 146 of panel assembly 14 is born against on step surface 1282, the touch surface of panel assembly 14
1,284 16 gluings of anti-overflow adhesive tape formed by anti-overflow glue curing below plate 144 and rank.
In some embodiments, panel assembly 14 includes touch panel 144 and the lid being covered on touch panel 144
Plate 146.The lateral dimension of cover board 146 is greater than the lateral dimension of touch panel 144 so that lateral surface 142 is in cover board 146 and touch-control
Cascaded surface is formed between panel 144, lateral surface 142 includes cover board lateral surface 1462 and touch panel lateral surface 1442.
Step S14 includes:
The panel assembly 14 is arranged in the groove 122 and the anti-overflow adhesive tape 16 is made to seal the side wall 126
Gap 11 between the touch panel lateral surface 1442.
In some embodiments, step S20 includes:
Solidifying joint filling glue in 20-25 DEG C of environment is more than five minutes.
In one example, solidify joint filling glue in 20 DEG C of environment, curing time is 15 minutes；In another example
In, solidify joint filling glue in 22 DEG C of environment, curing time is 12 minutes；In another example, in 25 DEG C of environment
Solidify joint filling glue, curing time is 6 minutes.Herein not to the solidification temperature within the scope of 20-25 DEG C and more than five minutes
Curing time in range does concrete restriction.
In this way, realizing the solidification of joint filling glue.It is appreciated that joint filling glue loses after joint filling glue is fully cured
Mobility, the joint filling adhesive tape 18 being fully cured have certain hardness so that it is subsequent removal be located at panel assembly 14 upside 148 and
The joint filling glue of the outside 121 of shell 12 is inconvenient, it could even be possible to damaging the upside 148 of panel assembly 14 in removal process
And the outside 121 of shell 12.Solidify the joint filling glue more than five minutes in 20-25 DEG C of environment to be also not up to fully cured
State, be conducive to the subsequent joint filling glue removed positioned at the upside 148 of panel assembly 14 and the outside 121 of shell 12.In addition,
20-25 DEG C is normal temperature environment, solidifies joint filling glue in normal temperature environment and makes the condition of cure of joint filling glue simple, is easy real
It is existing, to reduce the manufacturing cost of in-out box 10.
In some embodiments, the production method of in-out box is further comprising the steps of after step S20:
Remove the joint filling glue (not shown) positioned at the upside 148 of panel assembly 14 and the outside 121 of shell 12.
During panel assembly 14 is packed into groove 122, since gap 11 is very narrow, joint filling glue is squeezed
It is easy to spill into the upside 148 of the outside 121 of shell 12 and panel assembly 14.Therefore, it after solidifying joint filling glue, also needs
Joint filling glue is wiped, so that there is no joint filling glue for the outside 121 of shell 12 and the upside 148 of panel assembly 14.
In some embodiments, the joint filling positioned at the upside 148 of panel assembly 14 and the outside 121 of shell 12 is removed
The step of glue the following steps are included:
The joint filling glue positioned at the upside 148 of panel assembly 14 and the outside 121 of shell 12 is wiped using non-dust cloth.
Non-dust cloth soft surface has good cleaning efficiency, using non-dust cloth erasing joint filling glue will not damage surface
While the upside 148 of board group part 14 and outside 121 of shell 12, higher cleaning efficiency can be obtained.In one example,
, then by manipulator clamping non-dust cloth, it is mobile can finally to control manipulator first using the fixed in-out box 10 of fixture
To wipe the joint filling glue positioned at the upside 148 of panel assembly 14 and the outside 121 of shell 12.
In some embodiments, the joint filling positioned at the upside 148 of panel assembly 14 and the outside 121 of shell 12 is removed
After the step of glue the following steps are included:
The joint filling glue after wiping the solidification in the gap between the lateral surface 142 and the side wall 126,
So that the appearance of the joint filling glue after solidifying is roughly the same with the appearance of the shell 12.After joint filling glue curing, joint filling
The mobility of glue reduces, the joint filling glue after wiping solidifies at this time, so that the appearance of joint filling glue is rougher to show
Matt state, thus roughly the same with the appearance of shell 12.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the invention.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that:
These embodiments can be carried out with a variety of variations, modification, replacement in the case where not departing from the principle of the present invention and objective and become
Type, the scope of the present invention are defined by the claims and their equivalents.
Claims (11)
1. a kind of production method of in-out box, which comprises the following steps:
Shell and panel assembly are provided, the shell includes bottom wall and the side wall that the side from the bottom wall extends, the bottom wall
Surrounded with the side wall fluted, the shell is formed with the aspirating hole for being connected to the groove, and the panel assembly includes outside
Face；
In the groove by panel assembly setting, it is formed and is had the gap between the top of the side wall and the lateral surface,
Aspirating hole described in the gap area；
Joint filling glue is filled into the gap；
Pressure apparatus is provided, the pressure apparatus extracts the gas in the gap so that in the gap by the aspirating hole
Air pressure be less than the ambient pressure outside the gap, so that the gap-filling glue water be made to flow into the gap；With
Solidify the joint filling glue to be fixedly connected with the shell and the panel assembly.
2. the production method of in-out box as described in claim 1, which is characterized in that the aspirating hole is opened in described
Bottom wall.
3. the production method of in-out box as described in claim 1, which is characterized in that the panel assembly includes touch-control
Panel and the cover board being covered on the touch panel, the lateral dimension of the cover board are greater than the lateral dimension of the touch panel
So that the lateral surface forms cascaded surface between the cover board and the touch panel, the lateral surface includes cover board lateral surface
It is described to solidify the step of joint filling glue is to be fixedly connected with the shell and panel assembly packet with touch panel lateral surface
It includes:
Solidify the joint filling glue to be fixedly connected with the top of the side wall and the cover board lateral surface.
4. the production method of in-out box as described in claim 1, which is characterized in that the gap is formed with towards upper
Opening, it is described into the gap fill joint filling glue the step of the following steps are included:
The joint filling glue is filled into the gap from described be open.
5. the production method of in-out box as described in claim 1, which is characterized in that the gap is in a ring, described
Into the gap fill joint filling glue the step of the following steps are included:
The joint filling glue is filled into the gap circumferentially continuously along the gap.
6. the production method of in-out box as described in claim 1, which is characterized in that the solidification joint filling glue
The step of the following steps are included:
Solidifying the joint filling glue in 20-25 DEG C of environment is more than five minutes.
7. the production method of in-out box as described in claim 1, which is characterized in that the groove is generally rectangular shaped,
The side wall includes medial surface, and the medial surface includes long side surface and the short sides for connecting the long side surface, the short sides shape
At there is step, the step includes step surface, connects below the rank of the step surface and the long side surface and connect the step
Above the rank in face, it is described by the panel assembly setting in the groove the step of the following steps are included:
The setting bonding glue on the step surface；
The panel assembly is supported on the step surface；With
Solidify the bonding glue to be bonded the step surface and the panel assembly.
8. the production method of in-out box as claimed in claim 7, which is characterized in that the panel assembly includes touch-control
Panel and the cover board being covered on the touch panel, the lateral dimension of the cover board are greater than the lateral dimension of the touch panel
So that the lateral surface forms cascaded surface between the cover board and the touch panel, it is described to be supported on the panel assembly
Step on the step surface includes:
By the cover plate support on the step surface, the touch panel is located at the side of the step；
The solidification bonding glue to include: the step of being bonded the step surface and the panel assembly
Solidify the bonding glue to be bonded the step surface and the cover board.
9. the production method of in-out box as described in claim 1, which is characterized in that the system of the in-out box
It is further comprising the steps of after making method the solidification joint filling glue the step of:
Remove the joint filling glue positioned at the upside of the panel assembly and the outside of the shell.
10. the production method of in-out box as claimed in claim 9, which is characterized in that the removal is located at the face
The step of joint filling glue of the upside of board group part and the outside of the shell the following steps are included:
The joint filling glue positioned at the upside of the panel assembly and the outside of the shell is wiped using non-dust cloth.
11. the production method of in-out box as described in claim 1, which is characterized in that the in-out box
Production method the solidification joint filling glue the step of after it is further comprising the steps of:
Wiping be located at the gap in solidification after the joint filling glue so that the appearance of the joint filling glue after solidify and
The appearance of the shell is roughly the same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810202140.5A CN108521740B (en) | 2018-03-12 | 2018-03-12 | The production method of in-out box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810202140.5A CN108521740B (en) | 2018-03-12 | 2018-03-12 | The production method of in-out box |
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| CN108521740A CN108521740A (en) | 2018-09-11 |
| CN108521740B true CN108521740B (en) | 2019-08-02 |
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| US20060121243A1 (en) * | 2004-12-06 | 2006-06-08 | Silitech Technology Corp. | Surface bonding method for PET film and silica gel buttons and a manufactured article of the same |
| CN105283016B (en) * | 2015-11-30 | 2018-04-03 | 中国电子科技集团公司第四十三研究所 | The vacuum encapsulation device and its encapsulating method of high-power high assembled density electronic product |
| CN205883768U (en) * | 2016-06-30 | 2017-01-11 | 珠海市魅族科技有限公司 | Display device |
| CN106843390B (en) * | 2017-01-09 | 2020-02-04 | Oppo广东移动通信有限公司 | Display screen assembly, electronic device and manufacturing method of display screen assembly |
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Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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