CN108322570A - Dispensing method - Google Patents
Dispensing method Download PDFInfo
- Publication number
- CN108322570A CN108322570A CN201810201727.4A CN201810201727A CN108322570A CN 108322570 A CN108322570 A CN 108322570A CN 201810201727 A CN201810201727 A CN 201810201727A CN 108322570 A CN108322570 A CN 108322570A
- Authority
- CN
- China
- Prior art keywords
- side wall
- glue
- panel assembly
- joint filling
- filling glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
A kind of dispensing method disclosed by the invention includes：There is provided shell and panel assembly, shell includes bottom wall and the side wall that the side from bottom wall extends, and bottom wall surrounds fluted with side wall, and panel assembly includes lateral surface and the upper surface that is connect with lateral surface；Outer edge in upper surface is coated with joint filling glue so that gap-filling glue water flow to lateral surface；By panel assembly setting in a groove so that joint filling glue fills the gap between lateral surface and the top of side wall；With solidification joint filling glue to be fixedly connected with shell and panel assembly.In above-mentioned dispensing method, outer edge in upper surface is coated with joint filling glue and is conducive to that the lateral surface in panel assembly for joint filling glue is arranged, panel assembly, which is fitted into groove, in turn can not only solve the problems, such as to be difficult to dispensing after panel assembly is packed into groove, can also further decrease the gap between side wall and lateral surface.
Description
Technical field
The present invention relates to electronic device more particularly to a kind of dispensing methods.
Background technology
In the related art, the electronic devices such as mobile phone include shell and panel assembly, and shell forms fluted, panel assembly
It is arranged in groove, shell and the side of panel assembly generally being fixedly connected by mode for dispensing glue.However, in order to improve electronics
The screen accounting of device, the gap between shell and the side of panel assembly is smaller, and glue is difficult to click and enter shell and panel assembly
In gap between side.
Invention content
The present invention provides a kind of dispensing method.
The dispensing method of embodiment of the present invention includes step：
There is provided shell and panel assembly, the shell includes bottom wall and the side wall that the side from the bottom wall extends, described
Bottom wall surrounds fluted with the side wall；The panel assembly includes lateral surface and the upper surface that is connect with the lateral surface,
The outer edge of the upper surface is coated with joint filling glue so that the gap-filling glue water flow to the lateral surface；
The panel assembly is arranged in the groove so that the joint filling glue fills the lateral surface and the side
Gap between the top of wall；With
Cure the joint filling glue to be fixedly connected with the shell and the panel assembly.
In above-mentioned dispensing method, the outer edge in upper surface is coated with joint filling glue and is conducive to joint filling glue being arranged in panel
The lateral surface of component, and then panel assembly is fitted into groove can not only solve to be difficult to dispensing after panel assembly is packed into groove
The problem of, the gap between side wall and lateral surface can also be further decreased.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obviously, or practice through the invention is recognized.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, wherein：
Fig. 1 is the perspective exploded view of the in-out box of embodiment of the present invention；
Fig. 2 is the floor map of the in-out box of embodiment of the present invention；
Fig. 3 is diagrammatic cross-section of the in-out box along the directions III-III of Fig. 2；
Fig. 4 is the enlarged diagram of the parts in-out box IV of Fig. 3；
Fig. 5 is diagrammatic cross-section of the in-out box along the directions V-V of Fig. 2；
Fig. 6 is the enlarged diagram of the parts in-out box VI of Fig. 5；
Fig. 7 is the flow diagram of the dispensing method of embodiment of the present invention；
Fig. 8-Figure 10 is the process schematic of the dispensing method of embodiment of the present invention；
Figure 11 is another flow diagram of the dispensing method of embodiment of the present invention；
Figure 12 is another process schematic of the dispensing method of embodiment of the present invention；
Figure 13 is the step S151 process schematics of the dispensing method of embodiment of the present invention；
Figure 14 is the floor map of the electronic device of embodiment of the present invention.
Main element symbol description：
Electronic device 100, ontology 20, in-out box 10, gap 11, shell 12, groove 122, medial surface 1222, length
Side 1223, long side wall 1224, short sides 1225, short side wall 1226, bottom surface 1228, bottom wall 124, side wall 126, step 128, platform
Below terrace 1282, rank 1286 above 1284, rank, outside 121, panel assembly 14, lateral surface 142, touch panel 144, touch-control
Panels outside face 1442, cover board 146, cover board lateral surface 1462, upper surface 148, anti-overflow adhesive tape 16, joint filling adhesive tape 18, bonded adhesives
Item 19.
Specific implementation mode
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term "center", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, do not indicate or imply the indicated device or element must have a particular orientation, with spy
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.
In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
Can also be to be electrically connected or can mutually communicate to be mechanical connection；It can be directly connected, it can also be by between intermediary
It connects connected, can be the interaction relationship of the connection or two elements inside two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or "lower"
It may include that the first and second features are in direct contact, can also not be to be in direct contact but pass through it including the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " include first special
Sign is right over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include fisrt feature immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
It please refers to Fig.1 to Fig.4, the in-out box 10 of embodiment of the present invention includes shell 12, panel assembly 14, extremely
A few anti-overflow adhesive tape 16 and joint filling adhesive tape 18.
Shell 12 includes bottom wall 124 and the side wall 126 that the side from bottom wall 124 extends, and bottom wall 124 is surrounded with side wall 126
Fluted 122.Panel assembly 14 includes lateral surface 142.Anti-overflow adhesive tape 16 can be by along the circumferential in side wall of side wall 126
Anti-overflow glue is set on 126 inside and is formed by curing.Anti-overflow adhesive tape 16 seals the gap between side wall 126 and lateral surface 142
11.Joint filling adhesive tape 18 can be by the way that joint filling glue be arranged between the top of side wall 126 1262 and lateral surface 142 and cures shape
At.18 fixed bonding shell 12 of joint filling adhesive tape and panel assembly 14.
In the in-out box 10 of embodiment of the present invention, in-out box 10 is anti-overflow by pre-setting and curing
At least one anti-overflow adhesive tape 16 of the glue to be formed so that anti-overflow adhesive tape 16 seals the gap between side wall 126 and lateral surface 142
11, when can prevent that the joint filling glue for curing shell 12 and panel assembly 14 is subsequently arranged again, it is dirty that joint filling glue penetrates into groove 122
Contaminate shell 12 and/or panel assembly 14.
Specifically, shell 12 includes bottom wall 124 and the side wall 126 from the extension of bottom wall 124, and bottom wall 124 is surrounded with side wall 126
Groove 122.Shell 12 is substantially in cuboid, and shell 12 is the load-bearing part of electronic device 100, for carrying electronic device 100
Most of part.Shell 12 may be used plastics and be made, and can also be made of metal material, or use plastics and metal
Integral structure is formed by the technique of in-mould injection.In one example, the material of bottom wall 124 is metal, the material of side wall 126
For plastics, first bottom wall 124 can be put into mold, then by injecting the plastic cement of melting into mold, after plastic cement solidification
Side wall 126 is formed, to obtain shell 12.
In some embodiments, side wall 126 includes medial surface 1222, and bottom wall 124 includes being connect with medial surface 1222
Bottom surface 1228, medial surface 1222 are the plane perpendicular to bottom surface 1228.
In some embodiments, side wall 126 includes medial surface 1222, and bottom wall 124 includes being connect with medial surface 1222
Bottom surface 1228, medial surface 1222 are the edge outwardly extending inclined-plane upwards of bottom surface 1228.
Inside bottom wall face 1222 can be vertical with bottom surface 1228, can also upwards extend outwardly from the edge of bottom surface 1228,
In-out box 10 can select specific structure as needed.
In some embodiments, panel assembly 14 includes touch panel 144 and the cover board being covered on touch panel 144
146.The lateral dimension of cover board 146 is more than the lateral dimension of touch panel 144 so that lateral surface 142 is in cover board 146 and touch surface
Cascaded surface is formed between plate 144.Lateral surface 142 includes cover board lateral surface 1462 and touch panel lateral surface 1442.Anti-overflow adhesive tape
Gap 11 between 16 sealing side walls 126 and touch panel lateral surface 1442.Joint filling adhesive tape 18 is fixedly connected with cover board lateral surface
1462 and side wall 126 top 1262.
In this way, the side wall 126 of cover board lateral surface 1462 and groove 122 is able to connect by joint filling adhesive tape 18, so that
Panel assembly 14 is fixedly connected with shell 12.
Specifically, the material of cover board 146 can be made of translucent materials such as glass, ceramics or sapphires.Due to cover board 146
Due to the input part as electronic device 100, cover board 146 is often subject to the contacts such as collide or scratch.For example, user is by electronics
When device 100 is put into pocket, cover board 146 may be scratched by the key in user's pocket and be damaged.Therefore, the material of cover board 146
The larger material of hardness, such as above sapphire material may be used.Or hardened layer is formed to carry on the surface of cover board 146
The anti-scratch ability of high cover board 146.
Specifically, touch panel 144 includes that display module (not shown) and the touch control layer being arranged in display module (are schemed not
Show).Display module is, for example, liquid crystal display die set (LCD Module, LCM), and certainly, display module may be flexible aobvious
Show module.Touch control layer is used to receive the touch-control input of user, to generate the signal for controlling the content that display module is shown.
Touch panel 144 is for example bonded by optical cement (Optically Clear Adhesive, OCA) with cover board 146
It is fixed together, optical cement is not only adhesively fixed touch panel 144 and cover board 146, can also penetrate what touch panel 144 be sent out
Light.
In one example, panel assembly 14 can be formed by following steps：Touch panel 144 and cover board are first provided
146, then cover board 146, is finally fitted on optical cement by the coated optical glue on touch panel 144, so that cover board 146
It is fixed together with touch panel 144.
In some embodiments, side wall 126 includes long side wall 1224 and connects the short side wall 1226 of long side wall 1224, is prevented
Excessive glue item 16 is arranged along the length direction of long side wall 1224 on the inside of long side wall 1224.In this way, the size of long side wall 1224
Larger, anti-overflow adhesive tape 16 is arranged along the length direction of long side wall 1224 to be conducive to seal side wall on the inside of long side wall 1224
Gap 11 between 126 and lateral surface 1226.
Also referring to Fig. 5 and Fig. 6, in some embodiments, groove 122 is generally rectangular shaped, and side wall 126 includes inside
Face 1222, medial surface 1222 include long side surface 1223 and connect the short sides 1225 of long side surface 1223, and short sides 1225 are formed with
Step 128, panel assembly 14 are supported on step 128 and are adhesively fixed with step 128.In this way, step 128 is to panel assembly 14
Play the role of a support, is conducive to panel assembly 14 and is steadily connect with shell 12.Specifically, in present embodiment, lid
Plate 146 is supported on step 128, and touch panel 144 is located at the side of step 128.
In other embodiment, short sides 1225 can save step 128 and have with long side surface 1223 same
Structure, and be equally coated with anti-overflow glue and form anti-overflow adhesive tape 16.
In some embodiments, anti-overflow adhesive tape 16 is along the inside that the circumferential direction of side wall 126 is mounted on side wall 126.Also
It is to say, anti-overflow adhesive tape 16 is separate structure with side wall 126.Anti-overflow adhesive tape 16 is, for example, foam, and anti-overflow adhesive tape 16 passes through double faced adhesive tape
It is fitted on side wall 126.In addition, foam has elasticity, follow-up joint filling can not only be prevented as anti-overflow adhesive tape 16 using foam
Glue penetrates into groove 122 and pollutes shell 12 and/or panel assembly 14, padded coaming is also used as, in shell 12 and/or panel
Protection panels component 14 when component 14 is impacted.Further more, foam is simple and easy to get and light-weight, production efficiency and reduction are being improved
While cost, the weight of shell 12 and panel assembly 14 can be mitigated.
Certainly, in some other embodiments, anti-overflow adhesive tape 16 is structure as a whole with side wall 126, for example, adhesive-spill-preventing
Item 16 can be formed with side wall 126 by Shooting Technique.
The present invention also provides a kind of dispensing method, the dispensing method of embodiment of the present invention, which can be used for manufacturing, forms this
The in-out box 10 of invention embodiment.Specifically, the dispensing method of embodiment of the present invention work will be retouched in detail below
It states.
Fig. 7 and Fig. 8 are please referred to, the dispensing method of embodiment of the present invention includes the following steps：
S12：Shell 12 and panel assembly 14 are provided, shell 12 includes bottom wall 124 and the side that the side from bottom wall 124 extends
Wall 126, bottom wall 124 surround fluted 122 with side wall 126, and panel assembly 14 includes lateral surface 142 and connect with lateral surface 142
Upper surface 148；
S14：In outer side 142, joint filling glue is set；
S16：The panel assembly 14 is arranged in the groove 122 so that the joint filling glue fills lateral surface 142
Gap 11 between the top 1262 of side wall 126；
S18：Cure joint filling glue to be fixedly connected with shell 12 and panel assembly 14.
The lateral surface 142 in panel assembly 14 is arranged in joint filling glue by the dispensing method of embodiment of the present invention, and then will
Panel assembly 14, which is fitted into groove 122 not only, can solve the problems, such as to be difficult to dispensing after panel assembly 14 is packed into groove 122, also
The gap size between side wall 126 and lateral surface 142 can be further decreased.
Wherein, in step S14, joint filling glue can be arranged by dispenser on outer side 142.In certain embodiment party
In formula, step S14 is specifically included：Outer edge in the upper surface 148 is coated with joint filling glue so that the gap-filling glue water is flow to
The lateral surface 142, as shown in Figure 9.Preferably, circumferentially continuous being coated with the joint filling in the outer peripheral of the upper surface 148
Glue.It is appreciated that since joint filling glue has mobility, after the edge of upper surface 148 is coated with joint filling glue, joint filling glue
Lateral surface 142 can be flow to.In this way so that lateral surface 142 forms joint filling glue.At this point, upper surface 148 is towards upper.
In some embodiments, step S14 is specifically included：Outer edge in the lower surface of panel assembly 14 149 is coated with
Joint filling glue is so that the gap-filling glue water flow to the lateral surface 142, as shown in Figure 10.Preferably, in the lower surface 149
It is outer peripheral circumferentially continuous to be coated with the joint filling glue.In this way, lateral surface 142 is easy to form joint filling glue.At this point, panel assembly
14 lower surface 149 upward, when panel assembly 14 is packed into groove 122, panel assembly 14 is overturn so that panel group
The lower surface 149 of part 14 is downward.
In some embodiments, step S14 is specifically included：It is coated with joint filling glue in outer side 142.Preferably, outside
Side 142 is coated with joint filling glue circumferentially continuously.At this point, joint filling glue is directly put on lateral surface 142.In an example
In, the dispensing needle head of dispenser is fixed, can be by rotary panel component 14 so that the glue of dispensing needle head outflow is along outer
The circumferential point of side 142 is fallen on outer side 142.
In step S14, joint filling glue is arranged in cover board lateral surface 1462.It in other words, can be by the upper surface
148 outer edge is coated with joint filling glue so that the gap-filling glue water flow to the cover board lateral surface 1462；Or, in panel assembly 14
The outer edge of lower surface 149 be coated with joint filling glue so that the gap-filling glue water flow to the cover board lateral surface 1462；Or, covering
Plate lateral surface 1462 is coated with joint filling glue.Therefore, the gap-filling glue hydropexis connection shell 12 and cover board lateral surface 142 after solidification.
In step s 16, panel assembly 14 can be drawn by sucker, be then charged into groove 122.
In step S18, joint filling glue can also can by other means be cured with spontaneous curing.For example, working as gap-filling glue
When water is UV glue, joint filling glue can be irradiated by ultraviolet light so that joint filling glue curing.
1 and Figure 12 is please referred to Fig.1, further includes step before step S16 in some embodiments：
Anti-overflow glue is arranged in S151, the circumferential direction along side wall 126 on the inside of side wall 126；
S152 cures the anti-overflow glue to form at least one anti-overflow adhesive tape 16；
Step S16 includes：
The panel assembly 14 is arranged in the groove 122 and anti-overflow adhesive tape 16 is made to seal the side wall 126 and institute
The gap 11 between lateral surface 124 is stated, the anti-overflow adhesive tape 16 is used to be located at gap-filling glue side under water.
Specifically, anti-overflow adhesive tape 16 is contacted with lateral surface 142, so as to seal between side wall 126 and lateral surface 142
Gap 11.It should be pointed out that anti-overflow adhesive tape 16 seals the gap 11 of side wall 126 and 142 lower part of lateral surface.
In this way, anti-overflow adhesive tape 16 seals the gap 11 between side wall 126 and lateral surface 142, to prevent joint filling glue from oozing
Enter groove 122 and pollutes shell 12 and/or panel assembly 14.
It should be pointed out that step S151 and step S152 can be carried out before step S14, it can also be after step S14
It carries out, is not limited thereto.
In some embodiments, groove 122 is generally rectangular shaped, and side wall 126 includes long side wall 1224 and connection long side wall
1224 short side wall 1226.Step S151 includes the following steps：
Anti-overflow glue is arranged in length direction along long side wall 1224 on the inside of long side wall 1224.
In this way, may be implemented anti-overflow glue being arranged on the inside of the long side wall 1224 of side wall 126.
In some embodiments, adhesive-spill-preventing is set on the inside of long side wall 1224 along the length direction of long side wall 1224
The step of water, includes the following steps：
Length direction along long side wall 1224 is continuously provided anti-overflow glue on the inside of long side wall 1224.
In this way, the size of long side wall 1224 is larger, anti-overflow adhesive tape 16 is arranged along the length direction of long side wall 1224 in long side
Be conducive to seal the gap 11 between side wall 126 and lateral surface 1226 on the inside of wall 1224.In addition, anti-overflow glue is in long side wall
It is continuously distributed on 1224 so that the anti-overflow adhesive tape 16 after anti-overflow glue curing is continuous on the inside of long side wall 1224, is prevented
Only cause anti-overflow adhesive tape 16 that cannot form continuous sealing ring due to the discontinuous spot printing of anti-overflow adhesive tape 16 to seal side wall
The effect in the gap 11 between 126 and lateral surface 142 is poor.
In some embodiments, anti-overflow glue includes silicone adhesive.
The bonding force of silicone adhesive is strong, and moisture resistance is good.Using silicone adhesive as anti-overflow glue, can be consolidated by anti-overflow glue
Leakproofness and the moisture resistance for changing the anti-overflow adhesive tape 16 formed are more preferable.In addition, silicone adhesive also adapts to larger temperature change, to
So that anti-overflow adhesive tape 16 will not reduce sealing effect because of temperature change.Certainly, joint filling glue may be silicone adhesive.Adhesive-spill-preventing
Water and joint filling glue may be the preferable glue of other mobility such as UV glue.
In some embodiments, step S152 includes the following steps：
It is more than five minutes to cure anti-overflow glue in 20-25 DEG C of environment.
In one example, cure anti-overflow glue in 20 DEG C of environment, hardening time is 15 minutes；In another example
In, cure anti-overflow glue in 22 DEG C of environment, hardening time is 12 minutes；In another example, in 25 DEG C of environment
Cure anti-overflow glue, hardening time is 6 minutes.Herein not within the scope of 20-25 DEG C solidification temperature and more than five minutes
Hardening time in range does concrete restriction.
In this way, 20-25 DEG C is normal temperature environment, cure the condition of cure that anti-overflow glue makes anti-overflow glue in normal temperature environment
Simply, easy to implement, to reduce the manufacturing cost of in-out box 10.
In some embodiments, the time is fully cured less than anti-overflow glue in the hardening time of anti-overflow glue.At one
In example, the time that is fully cured of anti-overflow glue is more than 25min, and in the present invention, the hardening time of anti-overflow glue is 10min.
In this way, anti-overflow glue curing for a period of time after, by panel assembly 14 be arranged in groove 122, can make
Panel assembly 14 is arranged in groove when anti-overflow glue is also uncured for tight ness rating ratio between panel assembly 14 and groove 122
Tight ness rating in the case of in 122 is small, facilitates the dismounting during subsequent maintenance.In addition, before anti-overflow glue is fully cured,
Panel assembly 14 is arranged in groove 122, it can be to avoid since anti-overflow glue is fully cured and reduces close caused by mobility
It is poor to seal effect.
It is appreciated that after anti-overflow glue is fully cured, anti-overflow glue loses mobility, at this time sets panel assembly 14
It sets in groove 122, anti-overflow glue can not be deformed upon according to the extruding of panel assembly 14 and groove 122 and be obtained preferably close
Seal effect.In addition, the anti-overflow adhesive tape 16 that the anti-overflow glue after being fully cured is formed is not smooth and has certain hardness, can lead
When panel assembly 14 is placed into groove 122 by cause, obstruction is generated.
3 are please referred to Fig.1, in some embodiments, groove 122 is generally rectangular shaped, and side wall 126 includes medial surface 1222,
Medial surface 1222 includes long side surface 1223 and connects the short sides 1225 of long side surface 1223.Short sides 1225 are formed with step 128,
Step 128 include step surface 1282, connection step surface 1282 and long side surface 1223 rank below 1284 and connection step surface 1282
Rank above 1286.
Step S151 includes the following steps：
It is continuously provided anti-overflow glue below rank 1284 length direction is 1284 below the rank.
In this way, continuously distributed on can making adhesive-spill-preventing water 1284 below the rank so that anti-overflow after anti-overflow glue curing
Adhesive tape 16 1284 below the rank on be continuous, prevent from leading to anti-overflow adhesive tape 16 not due to the discontinuous spot printing of anti-overflow adhesive tape 16
Continuous sealing ring, which can be formed, makes the effect for sealing the gap 11 between side wall 126 and lateral surface 142 poor.
It is appreciated that the anti-overflow glue being coated in long side wall 1224 and short side wall 1226 is continuous, in this way, along side wall
The anti-overflow adhesive tape 16 formed after the 126 anti-overflow glue curing being circumferentially coated with can form the sealing ring of a closure.
Referring to Figure 13, in some embodiments, step S16 includes the following steps：
The setting bonding glue on step surface 1282；
Panel assembly 14 is supported on step surface 1282；With
Solidification bonding glue is to be bonded step surface 1282 and panel assembly 14.
In this way, panel assembly 14 is able to bear against and is fixed on step surface by being bonded the bonding adhesive tape 19 that glue curing is formed
On 1282.Step 128 plays the role of a support to panel assembly 14, is conducive to panel assembly 14 and steadily connects with shell 12
It connects.
Specifically, bonding glue can be identical with the ingredient of joint filling glue, such as is above-mentioned silicone adhesive.In addition, face
Board group part 14 includes touch panel 144 and the cover board 146 being covered on touch panel 144, and the longitudinal size of cover board 146, which is more than, to be touched
The longitudinal size of panel 144 is controlled, the cover board 146 of panel assembly 14 is born against on step surface 1282, the touch surface of panel assembly 14
Plate 144 and 1,284 16 gluings of anti-overflow adhesive tape formed by anti-overflow glue curing below rank.
In some embodiments, panel assembly 14 includes touch panel 144 and the cover board being covered on touch panel 144
146.The lateral dimension of cover board 146 is more than the lateral dimension of touch panel 144 so that lateral surface 142 is in cover board 146 and touch surface
Cascaded surface is formed between plate 144, lateral surface 142 includes cover board lateral surface 1462 and touch panel lateral surface 1442.
Step S16 includes：
The panel assembly 14 is arranged in the groove 122 and the anti-overflow adhesive tape 16 is made to seal the side wall 126
Gap 11 between the touch panel lateral surface 1442.
In some embodiments, step S18 includes：
It is more than five minutes to cure joint filling glue in 20-25 DEG C of environment.
In one example, cure joint filling glue in 20 DEG C of environment, hardening time is 15 minutes；In another example
In, cure joint filling glue in 22 DEG C of environment, hardening time is 12 minutes；In another example, in 25 DEG C of environment
Cure joint filling glue, hardening time is 6 minutes.Herein not within the scope of 20-25 DEG C solidification temperature and more than five minutes
Hardening time in range does concrete restriction.
In this way, realizing the solidification of joint filling glue.It is appreciated that after joint filling glue is fully cured, joint filling glue loses
Mobility, the joint filling adhesive tape 18 being fully cured have certain hardness so that follow-up removal is positioned at the upper surface 148 of panel assembly 14
And the joint filling glue of the outside 121 of shell 12 is inconvenient, it could even be possible to damaging the upper table of panel assembly 14 in removal process
Face 148 and the outside of shell 12 121.Joint filling glue of the solidification more than five minutes is also not up to complete in 20-25 DEG C of environment
Cured state is conducive to subsequently remove the gap-filling glue positioned at the upper surface 148 of panel assembly 14 and the outside 121 of shell 12
Water.In addition, 20-25 DEG C is normal temperature environment, cures joint filling glue in normal temperature environment and makes the condition of cure of joint filling glue simple,
It is easy to implement, to reduce the manufacturing cost of in-out box 10.
In some embodiments, dispensing method is further comprising the steps of after step S18：
Remove the joint filling glue (not shown) positioned at the upper surface 148 of panel assembly 14 and the outside 121 of shell 12.
During panel assembly 14 is packed into groove 122, since gap 11 is very narrow, joint filling glue is squeezed
It is easy to spill into the outside 121 of shell 12 and the upper surface 148 of panel assembly 14.Therefore, it after curing joint filling glue, also needs
Joint filling glue is wiped so that there is no joint filling glue for the outside 121 of shell 12 and the upper surface 148 of panel assembly 14.
In some embodiments, the joint filling positioned at the upper surface 148 of panel assembly 14 and the outside 121 of shell 12 is removed
The step of glue, includes the following steps：
The joint filling glue positioned at the upper surface 148 of panel assembly 14 and the outside 121 of shell 12 is wiped using non-dust cloth.
Non-dust cloth soft surface has good cleaning efficiency, using non-dust cloth erasing joint filling glue will not damage surface
While the upper surface 148 of board group part 14 and outside 121 of shell 12, higher cleaning efficiency can be obtained.In an example
In, first fixture can be used to fix in-out box 10, then by manipulator clamping non-dust cloth, last control machinery hand is moved
It moves to wipe the joint filling glue positioned at the upper surface 148 of panel assembly 14 and the outside 121 of shell 12.
In some embodiments, the joint filling positioned at the upper surface 148 of panel assembly 14 and the outside 121 of shell 12 is removed
Include the following steps after the step of glue：
The joint filling glue after the solidification in the gap between the lateral surface 142 and the side wall 126 is wiped,
So that the appearance of the joint filling glue after solidification is roughly the same with the appearance of the shell 12.After joint filling glue curing, joint filling
The mobility of glue reduces, the joint filling glue after wiping solidification at this time so that the appearance of joint filling glue is smooth and shows
Matt state, to roughly the same with the appearance of shell 12.
4 are please referred to Fig.1, the in-out box 10 of embodiment of the present invention can be applied to electronic device 100.Electronics fills
It includes ontology 20 to set 100, and in-out box 10 is arranged on ontology 20.Electronic device 100 includes but not limited to mobile phone, tablet
Computer or wearable device.
Specifically, electronic device 100 further includes battery cover (not shown), and battery cover is located at shell 12 and panel assembly
On 14 opposite sides.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the present invention.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：
Can these embodiments be carried out with a variety of variations in the case of not departing from the principle of the present invention and objective, modification, replace and become
Type, the scope of the present invention are limited by claim and its equivalent.
Claims (15)
1. a kind of dispensing method, which is characterized in that including：
Shell and panel assembly are provided, the shell includes bottom wall and the side wall that the side from the bottom wall extends, the bottom wall
Surrounded with the side wall fluted, the panel assembly includes lateral surface and the upper surface that is connect with the lateral surface, described
The outer edge of upper surface is coated with joint filling glue so that the gap-filling glue water flow to the lateral surface；
The panel assembly is arranged in the groove so that the joint filling glue fills the lateral surface and the side wall
Gap between top；With
Cure the joint filling glue to be fixedly connected with the shell and the panel assembly.
2. dispensing method as described in claim 1, which is characterized in that the outer edge in the upper surface is coated with gap-filling glue
The step of water includes：
Outer peripheral in the upper surface circumferentially continuous is coated with the joint filling glue.
3. dispensing method as described in claim 1, which is characterized in that the panel assembly includes touch panel and is covered in institute
The cover board on touch panel is stated, the lateral dimension of the cover board is more than the lateral dimension of the touch panel so that the lateral surface
Cascaded surface is formed between the cover board and the touch panel, the cover board includes the upper surface, and the lateral surface includes
Cover board lateral surface and touch panel lateral surface, the outer edge in the upper surface is coated with joint filling glue so that the gap-filling glue
Water flow to the step of lateral surface and includes the following steps：
Outer edge in the upper surface is coated with the joint filling glue so that the gap-filling glue water flow to the cover board lateral surface；
The solidification joint filling glue to include the step of being fixedly connected with the shell and the panel assembly：
Cure the joint filling glue to be fixedly connected with the shell and the cover board lateral surface.
4. dispensing method as described in claim 1, which is characterized in that the step of solidification joint filling glue includes following
Step：
It is more than five minutes to cure the joint filling glue in 20-25 DEG C of environment.
5. dispensing method as described in claim 1, which is characterized in that the dispensing method exists by panel assembly setting
Further include step before step in the groove：
Anti-overflow glue is arranged in circumferential direction along the side wall on the inside of the side wall；
Cure the anti-overflow glue to form at least one anti-overflow adhesive tape；
It is described to include in the step of groove by panel assembly setting：
By the panel assembly be arranged in the groove and make side wall and the lateral surface described in the anti-overflow adhesive tape sealing it
Between gap, the anti-overflow adhesive tape be used for be located at the gap-filling glue under water side.
6. dispensing method as claimed in claim 5, which is characterized in that the groove is generally rectangular shaped, and the side wall includes length
Side wall and the short side wall for connecting the long side wall, it is described that adhesive-spill-preventing is set on the inside of the side wall along the circumferential of the side wall
The step of water, includes the following steps：
The anti-overflow glue is arranged in length direction along the long side wall on the inside of the long side wall.
7. dispensing method as claimed in claim 6, which is characterized in that the length direction along the long side wall is in the length
The step of anti-overflow glue is arranged on the inside of side wall includes the following steps：
Length direction along the long side wall is continuously provided the anti-overflow glue on the inside of the long side wall.
8. dispensing method as claimed in claim 5, which is characterized in that the solidification anti-overflow glue is at least one to be formed
The step of anti-overflow adhesive tape, includes the following steps：
It is more than five minutes to cure the anti-overflow glue in 20-25 DEG C of environment.
9. dispensing method as claimed in claim 5, which is characterized in that the hardening time of the anti-overflow glue is less than described anti-overflow
The time is fully cured in glue.
10. dispensing method as claimed in claim 5, which is characterized in that the panel assembly includes touch panel and is covered in
The lateral dimension of cover board on the touch panel, the cover board is more than the lateral dimension of the touch panel so that the outside
Face forms cascaded surface between the cover board and the touch panel, and the lateral surface includes outside cover board lateral surface and touch panel
Side, it is described that the panel assembly is arranged in the groove and makes side wall and the outside described in the anti-overflow adhesive tape sealing
The step of gap between face includes：
The panel assembly is arranged in the groove and makes side wall and the touch panel described in the anti-overflow adhesive tape sealing
Gap between lateral surface.
11. dispensing method as claimed in claim 5, which is characterized in that the groove is generally rectangular shaped, and the side wall includes interior
Side, the medial surface include long side surface and connect the short sides of the long side surface, and the short sides are formed with step, described
Rank includes step surface, connects below the rank of the step surface and the long side surface and above the rank of the connection step surface, described
Circumferential along the side wall includes the following steps the step of anti-overflow glue is arranged on the inside of the side wall：
Length direction below the rank is continuously provided the anti-overflow glue.
12. dispensing method as claimed in claim 11, which is characterized in that described that the panel assembly is arranged in the groove
In step include the following steps：
The setting bonding glue on the step surface；
The panel assembly is supported on the step surface；With
Cure the bonding glue with the step surface and the panel assembly of being adhesively fixed.
13. dispensing method as claimed in claim 12, which is characterized in that the dispensing method is curing the joint filling glue
It is further comprising the steps of after step：
The joint filling glue of the removal positioned at the outside of the shell and the upper surface.
14. dispensing method as claimed in claim 13, which is characterized in that the removal is positioned at the outside of the shell and described
The step of joint filling glue of upper surface, includes the following steps：
Using non-dust cloth erasing positioned at the joint filling glue of the outside of the shell and the upper surface.
15. dispensing method as claimed in claim 13, which is characterized in that the dispensing method is in removal positioned at the shell
Further include step after the step of joint filling glue of the external and described upper surface：
The joint filling glue after the solidification in the gap between the lateral surface and the top of the side wall is wiped, so that
The appearance of the joint filling glue after solidification is roughly the same with the appearance of the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810201727.4A CN108322570A (en) | 2018-03-12 | 2018-03-12 | Dispensing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810201727.4A CN108322570A (en) | 2018-03-12 | 2018-03-12 | Dispensing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108322570A true CN108322570A (en) | 2018-07-24 |
Family
ID=62900801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810201727.4A Pending CN108322570A (en) | 2018-03-12 | 2018-03-12 | Dispensing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108322570A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110442202A (en) * | 2019-06-28 | 2019-11-12 | 上海华兴数字科技有限公司 | Display component installation method and display device |
| CN112934605A (en) * | 2021-01-28 | 2021-06-11 | 苏州朗坤自动化设备股份有限公司 | Automatic dispensing device for cover plate of polar plate type lithium battery |
| CN117718191A (en) * | 2024-02-08 | 2024-03-19 | 珠海市申科谱工业科技有限公司 | Dispensing equipment, dispensing system and dispensing process of dimming film |
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| CN103057244A (en) * | 2011-10-24 | 2013-04-24 | 比亚迪股份有限公司 | Dispensing method for touch panel and touch panel |
| CN105376359A (en) * | 2015-10-23 | 2016-03-02 | 广东欧珀移动通信有限公司 | Mobile equipment, and casing assembly and manufacture method thereof |
| CN106843390A (en) * | 2017-01-09 | 2017-06-13 | 广东欧珀移动通信有限公司 | The preparation method of display screen component, electronic installation and display screen component |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103057244A (en) * | 2011-10-24 | 2013-04-24 | 比亚迪股份有限公司 | Dispensing method for touch panel and touch panel |
| CN105376359A (en) * | 2015-10-23 | 2016-03-02 | 广东欧珀移动通信有限公司 | Mobile equipment, and casing assembly and manufacture method thereof |
| CN106843390A (en) * | 2017-01-09 | 2017-06-13 | 广东欧珀移动通信有限公司 | The preparation method of display screen component, electronic installation and display screen component |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110442202A (en) * | 2019-06-28 | 2019-11-12 | 上海华兴数字科技有限公司 | Display component installation method and display device |
| CN112934605A (en) * | 2021-01-28 | 2021-06-11 | 苏州朗坤自动化设备股份有限公司 | Automatic dispensing device for cover plate of polar plate type lithium battery |
| CN117718191A (en) * | 2024-02-08 | 2024-03-19 | 珠海市申科谱工业科技有限公司 | Dispensing equipment, dispensing system and dispensing process of dimming film |
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| CB02 | Change of applicant information |
Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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Application publication date: 20180724 |