CN108412865A - Dispensing method, in-out box and electronic device - Google Patents
Dispensing method, in-out box and electronic device Download PDFInfo
- Publication number
- CN108412865A CN108412865A CN201810403603.4A CN201810403603A CN108412865A CN 108412865 A CN108412865 A CN 108412865A CN 201810403603 A CN201810403603 A CN 201810403603A CN 108412865 A CN108412865 A CN 108412865A
- Authority
- CN
- China
- Prior art keywords
- side wall
- shell
- joint filling
- edge
- panel assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 44
- 239000003292 glue Substances 0.000 claims abstract description 141
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 238000007711 solidification Methods 0.000 claims abstract description 12
- 230000008023 solidification Effects 0.000 claims abstract description 12
- 239000002390 adhesive tape Substances 0.000 claims description 15
- 239000000428 dust Substances 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000007789 sealing Methods 0.000 abstract description 6
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000013464 silicone adhesive Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000006260 foam Substances 0.000 description 5
- 239000004568 cement Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
Abstract
A kind of dispensing method disclosed by the invention includes：There is provided shell and panel assembly, shell includes bottom wall and the side wall that the side from bottom wall extends, and bottom wall surrounds fluted with side wall, and shell includes being protruded inwardly from from side wall and along the anti-overflow item of the circumferentially extending of side wall；Panel assembly is arranged in groove, the gap between the edge of anti-overflow item sealing side wall knead dough board group part；Heated shell；Gap between the top and edge of side wall is arranged joint filling glue and improves the temperature of joint filling glue by the shell after heating to increase the mobility of joint filling glue；With solidification joint filling glue to be fixedly connected with shell and panel assembly.Pollute shell and/or panel assembly in the bottom that anti-overflow shell of the dispensing method of the present invention prevents joint filling glue from penetrating into groove.In addition, heated shell can increase the mobility of joint filling glue, is conducive to joint filling glue and fills to gap.The present invention also provides a kind of in-out box and electronic devices.
Description
Technical field
The present invention relates to a kind of electronic device more particularly to dispensing method, in-out box and electronic devices.
Background technology
In the related art, the electronic devices such as mobile phone include shell and panel assembly, and shell forms fluted, panel assembly
It is arranged in groove, shell and the side of panel assembly generally being fixedly connected by mode for dispensing glue.However, due to shell and face
Gap between board group part is smaller, and glue is difficult to click and enter in the gap between shell and panel assembly.
Invention content
A kind of dispensing method of present invention offer, in-out box and electronic device.
The dispensing method of embodiment of the present invention includes step：
There is provided shell and panel assembly, the shell includes bottom wall and the side wall that the side from the bottom wall extends, described
Bottom wall surrounds fluted with the side wall, and the shell includes inwardly projecting from the side wall and along the circumferentially extending of the side wall
Anti-overflow item；
The panel assembly is arranged in the groove, the anti-overflow item seals the side wall and the panel assembly
Gap between edge；
Heat the shell；
The gap between the top of the side wall and the edge is arranged joint filling glue and passes through the institute after heating
It states shell and improves the temperature of the joint filling glue to increase the mobility of the joint filling glue；With
Cure the joint filling glue to be fixedly connected with the shell and the panel assembly.
The in-out box of embodiment of the present invention includes shell, panel assembly and joint filling adhesive tape.The shell includes
Bottom wall and the side wall extended from the side of the bottom wall, the bottom wall surrounds fluted with the side wall.The shell includes certainly
The side wall is inwardly projecting and along the anti-overflow item of the circumferentially extending of the side wall.The panel assembly is housed in the groove.
The panel assembly includes the edge with the side wall relative engagement.The anti-overflow item seals between the side wall and the edge
Gap.The joint filling adhesive tape is by the joint filling glue that is arranged between the side wall and the edge and the heating joint filling glue
To increase the mobility of the joint filling glue and be formed by curing.The joint filling adhesive tape is fixedly connected with the shell and the panel group
Part.
The electronic device of embodiment of the present invention includes the in-out box of ontology and any of the above embodiment.It is described
In-out box is arranged on the body.
Dispensing method, in-out box and the electronic device of embodiment of the present invention are made by pre-setting anti-overflow item
It obtains the anti-overflow item and seals the gap between the side wall and the edge, to prevent that the fixed shell is subsequently arranged again
When the joint filling glue of body and the panel assembly, the joint filling glue penetrates into the bottom of the groove and pollutes the shell
And/or the panel assembly.In addition, heated shell can increase the mobility of joint filling glue, be conducive to joint filling glue fill to
In gap.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obviously, or practice through the invention is recognized.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, wherein：
Fig. 1 is the perspective exploded view of the in-out box of embodiment of the present invention；
Fig. 2 is the floor map of the in-out box of embodiment of the present invention；
Fig. 3 is diagrammatic cross-section of the in-out box along the directions III-III of Fig. 2；
Fig. 4 is the enlarged diagram of the parts in-out box IV of Fig. 3；
Fig. 5 is diagrammatic cross-section of the in-out box along the directions V-V of Fig. 2；
Fig. 6 is the enlarged diagram of the parts in-out box VI of Fig. 5；
Fig. 7 is the flow diagram of the dispensing method of embodiment of the present invention；
Fig. 8 is the process schematic of the dispensing method of embodiment of the present invention；
Fig. 9 is the process schematic of the dispensing method of another embodiment of the present invention；
Figure 10 is the process schematic of the dispensing method of a further embodiment of this invention；
Figure 11 is the step S14 process schematics of the dispensing method of embodiment of the present invention；
Figure 12 is the floor map of the electronic device of embodiment of the present invention.
Main element symbol description：
Electronic device 100, ontology 20, in-out box 10, shell 12, groove 122, medial surface 1222, long side surface
1223, long side wall 1224, short sides 1225, short side wall 1226, bottom surface 1228, bottom wall 124, side wall 126, top 1262, step
128, step surface 1282,1286, outside 121 above 1284, rank below rank, panel assembly 14, edge 142, touch panel 144,
Touch panel edge 1442, cover board 146, side edge thereof 1462, cover board lower surface 1464, upper surface 148, anti-overflow item 16, joint filling
Adhesive tape 18, gap 11, opening 112, bonding adhesive tape 19.
Specific implementation mode
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term "center", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, do not indicate or imply the indicated device or element must have a particular orientation, with spy
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.
In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
Can also be to be electrically connected or can mutually communicate to be mechanical connection；It can be directly connected, it can also be by between intermediary
It connects connected, can be the interaction relationship of the connection or two elements inside two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or "lower"
It may include that the first and second features are in direct contact, can also not be to be in direct contact but pass through it including the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " include first special
Sign is right over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include fisrt feature immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
It please refers to Fig.1 to Fig.4, the in-out box 10 of embodiment of the present invention includes shell 12,14 and of panel assembly
Joint filling adhesive tape 18.
Shell 12 includes bottom wall 124 and the side wall 126 from the extension of the edge of bottom wall 124 142, and bottom wall 124 is enclosed with side wall 126
At fluted 122.Shell 12 includes inwardly projecting from side wall 126 and along the anti-overflow item 16 of the circumferentially extending of side wall 126.Panel group
Part 14 is housed in groove 122.Panel assembly 14 includes the edge 142 with 126 relative engagement of side wall.Anti-overflow item 16 seals side wall
Gap 11 between 126 and edge 142.Joint filling adhesive tape 18 is by the joint filling glue that is arranged between side wall 126 and edge 142 and adds
Hot joint filling glue is formed by curing after the mobility to increase joint filling glue.Joint filling adhesive tape 18 is fixedly connected with shell 12 and panel assembly
14。
In the in-out box 10 of embodiment of the present invention, in-out box 10 by pre-setting anti-overflow item 16,
So that anti-overflow item 16 seals the gap 11 between side wall 126 and edge 142, to prevent that solidification 12 knead dough of shell is subsequently arranged again
When the joint filling glue of board group part 14, joint filling glue penetrates into the bottom of groove 122 and pollutes shell 12 and/or panel assembly 14.Separately
Outside, heat can be transmitted to joint filling glue to increase the mobility of joint filling glue by the shell 12 after heating, be conducive to joint filling glue
In filling to gap 11 so that gap 11 can be designed to smaller size.
Shell 12 includes bottom wall 124 and the side wall 126 from the extension of bottom wall 124, and bottom wall 124 surrounds groove with side wall 126
122.Shell 12 is substantially in cuboid, and shell 12 is the load-bearing part of electronic device 100, for carrying the big of electronic device 100
Part, as shown in figure 12.Shell 12 may be used plastics and be made, and can also be made of metal material, or using modeling
Material and metal form integral structure by the technique of in-mould injection.In one example, the material of bottom wall 124 is metal, side wall
126 material is plastics, and first bottom wall 124 can be put into mold, then by injecting the plastic cement of melting into mold, wait moulding
Side wall 126 is formed after adhesive curing, to obtain shell 12.
In some embodiments, anti-overflow item 16 and side wall 126 are separate structure, circumferential direction of the anti-overflow item 16 along side wall 126
It is mounted on the inside of side wall 126.
Certainly, in some other embodiments, anti-overflow item 16 is structure as a whole with side wall 126, for example, anti-overflow item 16
It can be formed by Shooting Technique with side wall 126.
In some embodiments, when anti-overflow item 16 and side wall 126 are separate structure, anti-overflow item 16 includes foam.This
When, foam can be mounted in by double faced adhesive tape on the inside of side wall 126.Foam has elasticity, using foam as anti-overflow item
16, which can not only prevent follow-up joint filling glue from penetrating into groove 122, pollutes shell 12 and/or panel assembly 14, is also used as buffering
Material, the protection panels component 14 when shell 12 and/or panel assembly 14 are impacted.In addition, foam is simple and easy to get and weight
Gently, while improving production efficiency and reducing cost, the weight of shell 12 and panel assembly 14 can be mitigated.
In some embodiments, side wall 126 includes medial surface 1222, and bottom wall 124 includes being connect with medial surface 1222
Bottom surface 1228, medial surface 1222 are the plane perpendicular to bottom surface 1228.In some embodiments, side wall 126 includes medial surface
1222, bottom wall 124 includes the bottom surface 1228 being connect with medial surface 1222, and medial surface 1222 is that the edge of bottom surface 1228 is outside upwards
The inclined-plane of extension.
Medial surface 1222 can be vertical with bottom surface 1228, can also upwards extend outwardly from the edge of bottom surface 1228, input
Output precision 10 can select specific structure as needed.
In some embodiments, panel assembly 14 includes touch panel 144 and the cover board being covered on touch panel 144
146.The lateral dimension of cover board 146 is more than the lateral dimension of touch panel 144 so that edge 142 is in cover board 146 and touch panel
Cascaded surface is formed between 144.Edge 142 includes side edge thereof 1462 and touch panel edge 1442.Anti-overflow item 16 seals side wall
Gap 11 between 126 and touch panel edge 1442.Joint filling adhesive tape 18 is fixedly connected with side edge thereof 1462 and side wall 126.
In this way, the side wall 126 of side edge thereof 1462 and groove 122 is able to connect by joint filling adhesive tape 18, so that face
Board group part 14 is fixedly connected with shell 12.
Specifically, the material of cover board 146 can be made of translucent materials such as glass, ceramics or sapphires.Due to cover board 146
Due to the input part as electronic device 100, cover board 146 is often subject to the contacts such as collide or scratch.For example, user is by electronics
When device 100 is put into pocket, cover board 146 may be scratched by the key in user's pocket and be damaged.Therefore, the material of cover board 146
The larger material of hardness, such as above sapphire material may be used.Or hardened layer is formed to carry on the surface of cover board 146
The anti-scratch ability of high cover board 146.
Specifically, touch panel 144 includes that display module (not shown) and the touch control layer being arranged in display module (are schemed not
Show).Display module is, for example, liquid crystal display die set (LCD Module, LCM), and certainly, display module may be flexible aobvious
Show module.Touch control layer is used to receive the touch-control input of user, to generate the signal for controlling the content that display module is shown.
Touch panel 144 is for example bonded by optical cement (Optically Clear Adhesive, OCA) with cover board 146
It is fixed together, optical cement is not only adhesively fixed touch panel 144 and cover board 146, can also penetrate what touch panel 144 be sent out
Light.
In one example, panel assembly 14 can be formed by following steps：Touch panel 144 and cover board are first provided
146, then cover board 146, is finally fitted on optical cement by the coated optical glue on touch panel 144, so that cover board 146
It is fixed together with touch panel 144.
In some embodiments, side wall 126 includes long side wall 1224 and connects the short side wall 1226 of long side wall 1224, is prevented
The item 16 that overflows is arranged along the length direction of long side wall 1224 on the inside of long side wall 1224.In this way, the size of long side wall 1224 compared with
Greatly, the top for being conducive to seal side wall 126 in long side wall 1224 is arranged along the length direction of long side wall 1224 for anti-overflow item 16
Gap 11 between 1262 and edge 1226.
Also referring to Fig. 5 and Fig. 6, in some embodiments, groove 122 is generally rectangular shaped, and side wall 126 includes inside
Face 1222, medial surface 1222 include long side surface 1223 and connect the short sides 1225 of long side surface 1223, and short sides 1225 are formed with
Step 128, panel assembly 14 are supported on step 128 and are adhesively fixed with step 128.
In this way, step 128 to panel assembly 14 play the role of one support, be conducive to panel assembly 14 steadily with shell
Body 12 connects.Specifically, in present embodiment, cover board 146 is supported on step 128 and is adhesively fixed with step 128, and touch-control
Panel 144 is located at the side of step 128.
In other embodiment, short side wall 1226 can save step 128 and have with long side wall 1224 same
Structure, and equally mount anti-overflow item 16.
The present invention also provides a kind of dispensing method, the dispensing method of embodiment of the present invention, which can be used for manufacturing, forms this
The in-out box 10 of invention embodiment.Specifically, the dispensing method of embodiment of the present invention work will be retouched in detail below
It states.
Fig. 7 and Fig. 8 are please referred to, the dispensing method of embodiment of the present invention includes the following steps：
S12：Shell 12 and panel assembly 14 are provided, shell 12 includes bottom wall 124 and the side that the side from bottom wall 124 extends
Wall 126, bottom wall 124 surround fluted 122 with side wall 126, and shell 12 includes inwardly projecting from side wall 126 and along side wall 126
The anti-overflow item 16 of circumferentially extending；
S14：By the setting of panel assembly 14 in groove 122, anti-overflow item 16 seals the edge of side wall 126 and panel assembly 14
Gap 11 between 142；
S16：Heated shell 12；
S18：Gap 11 between the top of side wall 126 1262 and edge 142 joint filling glue is set and by heating after
Shell 12 improve joint filling glue temperature to increase the mobility of joint filling glue；With
S20：Cure joint filling glue to be fixedly connected with shell 12 and panel assembly 14.
The dispensing method of embodiment of the present invention is by pre-setting anti-overflow item 16 so that anti-overflow item 16 seals side wall 126
Gap 11 between edge 142 is filled out when to prevent the follow-up joint filling glue that fixed shell 12 and panel assembly 14 are arranged again
It stitches glue and penetrates into the pollution shell 12 of groove 122 and/or panel assembly 14.In addition, heat can be transmitted to by the shell 12 after heating
Joint filling glue is conducive to joint filling glue and fills to gap 11 so that gap 11 can be set to increase the mobility of joint filling glue
Count into smaller size.
In step S14, panel assembly 14 can be drawn by sucker, be then charged into groove 122, and make anti-overflow item 16
It is contacted with edge 142, so as to seal the gap 11 between side wall 126 and edge 142.It is pointed out that anti-overflow item 16
Seal the gap 11 of side wall 126 and 142 lower part of edge.
In step S18, joint filling glue can be located at by dispenser point in the top in gap 11.Joint filling glue can be certainly
So solidification, can also cure by other means.For example, when joint filling glue is UV glue, glue can be irradiated by ultraviolet light
Water is so that glue curing.
It should be pointed out that in present embodiment, step S16 is carried out before step S18, in other embodiments, step
Rapid S16 can be carried out at the same time with step S18.
As shown in figure 8, in some embodiments, step S16 is specifically included：
Use 13 clamping shell 12 of jig；
Utilize 13 heated shell 12 of jig.
In this way, jig 13 can not only fix shell 12, shell 12 can also be heated.In one example, it controls
It is provided with the heating element such as adding thermal resistance in tool 13, after adding thermal resistance electrified regulation, 13 overall temperature rise of jig,
So as to pass through jig heated shell 12.
In some embodiments, step S16 is specifically included：
Heater strip (not shown) is installed on housing 12；
The heater strip is heated with heated shell 12.
In this way, heater strip installing is on housing 12 so that the efficiency that shell 12 heats is higher.After the completion of step S18, add
Heated filament can stop heating, in order to joint filling glue curing.After joint filling glue curing, heater strip can be dismantled from shell
Get off.
In some embodiments, step S12 includes the following steps：
Anti-overflow item 16 is provided；With
Circumferential direction along side wall 126 mounts anti-overflow item 16 on the inside of side wall 126.
In this way, anti-overflow item 16 can be arranged onto side wall 126.Specifically, anti-overflow item 16 includes glue-line, can pass through glue
Layer will be in the attachment to the inside of side wall 126 of anti-overflow item 16 in a manner of glued.In one example, it can first be fixed using fixture
Shell 12, then by the anti-overflow item 16 of manipulator clamping, last control machinery hand movement by the setting of anti-overflow item 16 to arrive side wall 126
Inside on.
Referring to Fig. 9, in some embodiments, anti-overflow item 16 can be formed by anti-overflow glue curing.Anti-overflow glue can
To be located on the inside of side wall 126 by dispenser point.The curing mode of anti-overflow glue can be identical with the mode of joint filling glue.
In some embodiments, joint filling glue includes silicone adhesive.
The bonding force of silicone adhesive is strong, and moisture resistance is good.Using silicone adhesive as anti-overflow glue, can be consolidated by anti-overflow glue
Leakproofness and the moisture resistance for changing the anti-overflow item 16 formed are more preferable.In addition, silicone adhesive also adapts to larger temperature change, to make
Sealing effect will not be reduced because of temperature change by obtaining anti-overflow item 16.Certainly, joint filling glue may be silicone adhesive.Anti-overflow glue and
Joint filling glue may be the preferable glue of other mobility such as UV glue.
In some embodiments, the step of curing anti-overflow glue also specifically includes：
It is more than five minutes to cure anti-overflow glue in 20-25 DEG C of environment.
In one example, cure anti-overflow glue in 20 DEG C of environment, hardening time is 15 minutes；In another example
In, cure anti-overflow glue in 22 DEG C of environment, hardening time is 12 minutes；In another example, in 25 DEG C of environment
Cure anti-overflow glue, hardening time is 6 minutes.Herein not within the scope of 20-25 DEG C solidification temperature and more than five minutes
Hardening time in range does concrete restriction.
In this way, 20-25 DEG C is normal temperature environment, cure the condition of cure that anti-overflow glue makes anti-overflow glue in normal temperature environment
Simply, easy to implement, to reduce the manufacturing cost of in-out box 10.
In some embodiments, the time is fully cured less than anti-overflow glue in the hardening time of anti-overflow glue.At one
In example, the time that is fully cured of anti-overflow glue is more than 25min, and in the present invention, the hardening time of anti-overflow glue is 10min.
In this way, anti-overflow glue curing for a period of time after, by panel assembly 14 be arranged in groove 122, can make
Panel assembly 14 is arranged in groove when anti-overflow glue is also uncured for tight ness rating ratio between panel assembly 14 and groove 122
Tight ness rating in the case of in 122 is small, facilitates the dismounting during subsequent maintenance.In addition, before anti-overflow glue is fully cured,
Panel assembly 14 is arranged in groove 122, it can be to avoid since anti-overflow glue is fully cured and reduces close caused by mobility
It is poor to seal effect.
It is appreciated that after anti-overflow glue is fully cured, anti-overflow glue loses mobility, at this time sets panel assembly 14
It sets in groove 122, anti-overflow glue can not be deformed upon according to the extruding of panel assembly 14 and groove 122 and be obtained preferably close
Seal effect.In addition, the anti-overflow item 16 that the anti-overflow glue after being fully cured is formed is not smooth and has certain hardness, can cause
When panel assembly 14 is placed into groove 122, obstruction is generated.
Referring to Fig. 10, in some embodiments, anti-overflow item 16 can be from inside convex of the side wall 126 of groove 122
It rises.In this way, eliminating the process of the attachment of anti-overflow item 16 to the inside of side wall 126, be conducive to improve packaging efficiency.
In some embodiments, anti-overflow item 16 is an integral molding structure with side wall 126.In this way, can give birth in large quantity
Shell 12 of the production with anti-overflow item 16.Be conducive to improve production efficiency.In addition, be integrally formed can for anti-overflow item 16 and side wall 126
To reduce number of parts, during subsequent maintenance and dismounting, it is not easy to lose part.At this point, anti-overflow item 16 and cover board 146
Lower surface 1464 be bonded to seal the gap between medial surface 1222 and edge 142, as shown in Figure 10.
In some embodiments, groove 122 is generally rectangular shaped, and side wall 126 includes long side wall 1224 and connection long side wall
1224 short side wall 1226.Circumferential along side wall 126 includes following step the step of mounting anti-overflow item 16 on the inside of side wall 126
Suddenly：
Length direction along long side wall 1224 mounts anti-overflow item 16 on the inside of long side wall 1224.
In this way, may be implemented anti-overflow item 16 being arranged on the inside of the long side wall 1224 of side wall 126.
In some embodiments, anti-overflow item is mounted on the inside of long side wall 1224 along the length direction of long side wall 1224
16 the step of, includes the following steps：
Length direction along long side wall 1224 continuously mounts anti-overflow item 16 on the inside of long side wall 1224.
In this way, the size of long side wall 1224 is larger, anti-overflow item 16 is arranged along the length direction of long side wall 1224 in long side wall
Be conducive to seal the gap 11 between side wall 126 and edge 1226 on 1224.In addition, anti-overflow item 16 is continuous in long side wall 1224
Distribution can prevent from leading to that continuous sealing ring cannot be formed to make on the inside of sealing due to the discontinuously arranged of anti-overflow item 16
The effect in the gap 11 between face 1222 and edge 142 is poor.
In some embodiments, groove 122 is generally rectangular shaped, and side wall 126 includes medial surface 1222, and medial surface 1222 wraps
It includes long side surface 1223 and connects the short sides 1225 of long side surface 1223.Short sides 1225 are formed with step 128, and step 128 includes
Step surface 1282, connection step surface 1282 and long side surface 1223 rank below 1284 and connect step surface 1282 rank above
1286.Circumferential along medial surface 1222 includes the following steps the step of mounting anti-overflow item 16 on medial surface 1222：
Anti-overflow item 16 is continuously mounted below rank 1284 length direction is 1284 below the rank.
In this way, continuously distributed on can making anti-overflow item 16 1284 below the rank, prevent discontinuous due to anti-overflow item 16
It is distributed and causes anti-overflow item 16 that cannot form continuous sealing ring and to seal gap 11 between side wall 126 and edge 142
Effect is poor.
It is appreciated that the anti-overflow item 16 mounted in long side wall 1224 and short side wall 1226 is continuous, in this way, along inside
The anti-overflow item 16 circumferentially mounted in face 1222 can form the sealing ring of a closure.
1 is please referred to Fig.1, in some embodiments, step S14 includes the following steps：
The setting bonding glue on step surface 1282；
Panel assembly 14 is supported on step surface 1282；With
Solidification bonding glue is to be bonded step surface 1282 and panel assembly 14.
In this way, panel assembly 14 is able to bear against and is fixed on step surface by being bonded the bonding adhesive tape 19 that glue curing is formed
On 1282.Step 128 plays the role of a support to panel assembly 14, is conducive to panel assembly 14 and steadily connects with shell 12
It connects.
Specifically, bonding glue can be identical with the ingredient of joint filling glue, such as is above-mentioned silicone adhesive.In addition, face
Board group part 14 includes touch panel 144 and the cover board 146 being covered on touch panel 144, and the longitudinal size of cover board 146, which is more than, to be touched
The longitudinal size of panel 144 is controlled, the cover board 146 of panel assembly 14 is born against on step surface 1282, the touch surface of panel assembly 14
Plate 144 is sealed with below rank 1284 by anti-overflow item 16.
In some embodiments, panel assembly 14 includes touch panel 144 and the cover board being covered on touch panel 144
146, the lateral dimension of cover board 146 is more than the lateral dimension of touch panel 144 so that edge 142 is in cover board 146 and touch panel
Cascaded surface is formed between 144, edge 142 includes side edge thereof 1462 and touch panel edge 1442, and step S14 includes following step
Suddenly：
Panel assembly 14 is arranged in groove 122, and make anti-overflow item 16 seal side wall 126 and touch panel edge 1442 it
Between gap 11.
In this way, realizing that anti-overflow item 16 seals the gap 11 between side wall 126 and touch panel edge 1442.After can preventing
When the continuous joint filling glue that solidification shell 12 and panel assembly 14 are set again, joint filling glue penetrate into groove 122 pollute shell 12 and/or
Panel assembly 14.
In some embodiments, panel assembly 14 includes touch panel 144 and the cover board being covered on touch panel 144
146.The lateral dimension of cover board 146 is more than the lateral dimension of touch panel 144 so that edge 142 is in cover board 146 and touch panel
Cascaded surface is formed between 144, edge 142 includes side edge thereof 1462 and touch panel edge 1442.
Step S18 includes：
Joint filling glue is arranged in gap 11 between the top of side wall 126 1262 and side edge thereof 1462；
Step S20 includes：
Cure joint filling glue to be fixedly connected with shell 12 and side edge thereof 1462.
In this way, shell 12 and side edge thereof 1462 are connected and are consolidated by the joint filling glue 18 formed by joint filling glue curing
It is fixed, to make panel assembly 14 be fixed in groove 122.
In some embodiments, gap 11 is formed with towards upper opening 112, and step is at the top of side wall 126 1262
Gap 11 between side edge thereof 1462 is arranged joint filling glue and includes the following steps：
It is placed in gap 11 from opening 112 by joint filling glue.
Joint filling glue can be placed in gap 11 by Glue dripping head generally in needle-shaped by opening 112.In one example, may be used
First to use fixture fixation to accommodate in-out box 10, then Glue dripping head was moved along one week of gap 11, passed through opening
Joint filling glue is placed in gap 11 by 112.In this way, realizing the filling of bonding glue.
In some embodiments, step S20 includes：
It is more than five minutes to cure joint filling glue in 20-25 DEG C of environment.
In one example, cure joint filling glue in 20 DEG C of environment, hardening time is 15 minutes；In another example
In, cure joint filling glue in 22 DEG C of environment, hardening time is 12 minutes；In another example, in 25 DEG C of environment
Cure joint filling glue, hardening time is 6 minutes.Herein not within the scope of 20-25 DEG C solidification temperature and more than five minutes
Hardening time in range does concrete restriction.
In this way, realizing the solidification of joint filling glue.It is appreciated that after joint filling glue is fully cured, joint filling glue loses
Mobility, the joint filling adhesive tape 18 being fully cured have certain hardness so that follow-up removal is positioned at the upper surface 148 of panel assembly 14
And the joint filling glue in the outside 121 of shell 12 is inconvenient, it could even be possible to damaging the upper table of panel assembly 14 in removal process
Face 148 and the outside of shell 12 121.Joint filling glue of the solidification more than five minutes is also not up to complete in 20-25 DEG C of environment
Cured state is conducive to subsequently remove the gap-filling glue positioned at the upper surface 148 of panel assembly 14 and the outside 121 of shell 12
Water.In addition, 20-25 DEG C is normal temperature environment, cures joint filling glue in normal temperature environment and makes the condition of cure of joint filling glue simple,
It is easy to implement, to reduce the manufacturing cost of in-out box 10.
In some embodiments, dispensing method is further comprising the steps of after step S20：
Remove the joint filling glue (not shown) positioned at the upper surface 148 of panel assembly 14 and the outside 121 of shell 12.
During by joint filling glue from 112 points of opening into gap 11, since gap 11 is very narrow, when from Glue dripping head
When the dispensing amount of outflow is excessive, gap-filling glue water is easy to spill into the outside 121 of shell 12 and the upper surface 148 of panel assembly 14.
Therefore, it after curing joint filling glue, also needs to wipe in joint filling glue so that the outside 121 of shell 12 and panel assembly 14
There is no joint filling glue for upper surface 148.
In some embodiments, the joint filling positioned at the upper surface 148 of panel assembly 14 and the outside 121 of shell 12 is removed
The step of glue, includes the following steps：
The joint filling glue positioned at the upper surface 148 of panel assembly 14 and the outside 121 of shell 12 is wiped using non-dust cloth.
Non-dust cloth soft surface has good cleaning efficiency, using non-dust cloth erasing joint filling glue will not damage surface
While outside 121 of upper surface 148 and shell 12 on board group part 14, higher cleaning efficiency can be obtained.In an example
In son, first fixture can be used to fix in-out box 10, then pass through manipulator clamping non-dust cloth, last control machinery hand
Movement is to wipe the joint filling glue positioned at the upper surface 148 of panel assembly 14 and the outside 121 of shell 12.
2 are please referred to Fig.1, the in-out box 10 of embodiment of the present invention can be applied to electronic device 100.Electronics fills
It includes ontology 20 to set 100, and in-out box 10 is arranged on ontology 20.Electronic device 100 includes but not limited to mobile phone, tablet
Computer or wearable device.
Specifically, electronic device 100 further includes battery cover (not shown), and battery cover is located at shell 12 and panel assembly
On 14 opposite sides.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the present invention.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：
Can these embodiments be carried out with a variety of variations in the case of not departing from the principle of the present invention and objective, modification, replace and become
Type, the scope of the present invention are limited by claim and its equivalent.
Claims (20)
1. a kind of dispensing method, which is characterized in that include the following steps：
Shell and panel assembly are provided, the shell includes bottom wall and the side wall that the side from the bottom wall extends, the bottom wall
Surrounded with the side wall fluted, the shell includes inwardly projecting from the side wall and along the anti-of the circumferentially extending of the side wall
Overflow item；
The panel assembly is arranged in the groove, the anti-overflow item seals the edge of the side wall and the panel assembly
Between gap；
Heat the shell；
The gap between the top of the side wall and the edge is arranged joint filling glue and passes through the shell after heating
Body improves the temperature of the joint filling glue to increase the mobility of the joint filling glue；With
Cure the joint filling glue to be fixedly connected with the shell and the panel assembly.
2. dispensing method as described in claim 1, which is characterized in that the step of heating shell includes：
Use shell described in jig clamping；
The shell is heated using the jig.
3. dispensing method as described in claim 1, which is characterized in that the step of heating shell includes：
Heater strip is installed on the housing；
The heater strip is heated to heat the shell.
4. dispensing method as described in claim 1, which is characterized in that the step of offer shell and panel assembly includes：
The anti-overflow item is provided；With
Circumferential direction along the side wall mounts the anti-overflow item on the inside of the side wall.
5. dispensing method as claimed in claim 4, which is characterized in that the groove is generally rectangular shaped, and the side wall includes length
Side wall and the short side wall for connecting the long side wall, it is described described anti-along circumferentially being mounted on the inside of the side wall for the side wall
Excessive the step of, includes the following steps：
Length direction along the long side wall mounts the anti-overflow item on the inside of the long side wall.
6. dispensing method as claimed in claim 5, which is characterized in that the length direction along the long side wall is in the length
The step of described anti-overflow is mounted on the inside of side wall includes the following steps：
Length direction along the long side wall continuously mounts the anti-overflow item on the inside of the long side wall.
7. dispensing method as claimed in claim 4, which is characterized in that the groove is generally rectangular shaped, and the side wall includes interior
Side, the medial surface include long side surface and connect the short sides of the long side surface, and the short sides are formed with step, described
Rank includes step surface, connects below the rank of the step surface and the long side surface and above the rank of the connection step surface, described
Circumferential along the side wall includes the following steps the step of mounting described anti-overflow on the inside of the side wall：
Length direction below the rank continuously mounts the anti-overflow item.
8. dispensing method as claimed in claim 7, which is characterized in that described that the panel assembly is arranged in the groove
Step includes the following steps：
The setting bonding glue on the step surface；
The panel assembly is supported on the step surface；With
Cure the bonding glue to be bonded the step surface and the panel assembly.
9. dispensing method as described in claim 1, which is characterized in that the panel assembly includes touch panel and is covered in institute
The cover board on touch panel is stated, the lateral dimension of the cover board is more than the lateral dimension of the touch panel so that the edge exists
Form cascaded surface between the cover board and the touch panel, the edge includes side edge thereof and touch panel edge, described
By panel assembly setting in the groove, the step of anti-overflow item seals the gap between the side wall and the edge
Including：
The panel assembly is arranged in the groove, and the anti-overflow item is made to seal the side wall and the touch surface edges of boards
Gap between edge.
10. dispensing method as described in claim 1, which is characterized in that the panel assembly includes touch panel and is covered in
The lateral dimension of cover board on the touch panel, the cover board is more than the lateral dimension of the touch panel so that the edge
Cascaded surface is formed between the cover board and the touch panel, the edge includes side edge thereof and touch panel edge, institute
The step of stating the setting joint filling glue of the gap between the top of the side wall and the edge includes the following steps：
The joint filling glue is arranged in gap between the top of the side wall and the side edge thereof；
The solidification joint filling glue to include the step of being fixedly connected with the shell and the panel assembly：
Cure the joint filling glue to be fixedly connected with the medial surface and the side edge thereof.
11. dispensing method as described in claim 1, which is characterized in that the gap is formed with towards upper opening, it is described
The step of joint filling glue is arranged in the gap between the top of the side wall and the edge includes the following steps：
The joint filling glue is placed in the gap from the opening.
12. dispensing method as described in claim 1, which is characterized in that the step of solidification joint filling glue include with
Lower step：
It is more than five minutes to cure the joint filling glue in 20-25 DEG C of environment.
13. dispensing method as described in claim 1, which is characterized in that the dispensing method is in the solidification gap-filling glue
It is further comprising the steps of after the step of water：
Remove the joint filling glue positioned at the upper surface of the panel assembly and the outside of the shell.
14. dispensing method as claimed in claim 13, which is characterized in that the removal is positioned at the upper surface of the panel assembly
And the outside of the shell joint filling glue the step of include the following steps：
The joint filling glue positioned at the upper surface of the panel assembly and the outside of the shell is wiped using non-dust cloth.
15. a kind of in-out box, which is characterized in that including：
Shell, the shell include bottom wall and the side wall that the side from the bottom wall extends, and the bottom wall is surrounded with the side wall
Fluted, the shell includes inwardly projecting from the side wall and along the anti-overflow item of the circumferentially extending of the side wall；
The panel assembly being housed in the groove, the panel assembly includes the edge with the side wall relative engagement, described
Anti-overflow item seals the gap between the side wall and the edge；
Joint filling glue is set between the side wall and the edge and the heating joint filling glue is to increase the joint filling glue
Mobility after the joint filling adhesive tape for being fixedly connected with the shell and the panel assembly that is formed by curing.
16. in-out box as claimed in claim 15, which is characterized in that the panel assembly includes touch panel and covers
The cover board on the touch panel is covered, the lateral dimension of the cover board is more than the lateral dimension of the touch panel so that described
Edge forms cascaded surface between the cover board and the touch panel, and the edge includes side edge thereof and touch surface edges of boards
Edge, the anti-overflow item seal the gap between the side wall and the touch panel edge, and the joint filling adhesive tape is fixedly connected with institute
State the top of side edge thereof and the side wall.
17. in-out box as claimed in claim 15, which is characterized in that the madial wall includes long side wall and connection institute
The short side wall of long side wall is stated, the anti-overflow item is arranged along the length direction of the long side wall on the inside of the long side wall.
18. in-out box as claimed in claim 15, which is characterized in that the groove is generally rectangular shaped, the side wall
Including medial surface, the medial surface includes long side surface and connects the short sides of the long side surface, and the short sides are formed with step,
The panel assembly is supported on the step and is adhesively fixed with the step.
19. in-out box as claimed in claim 18, which is characterized in that the panel assembly includes touch panel and covers
The cover board on the touch panel is covered, the lateral dimension of the cover board is more than the lateral dimension of the touch panel so that described
Edge forms cascaded surface between the cover board and the touch panel, the cover plate support on the step and with described
Rank is adhesively fixed, and the touch panel is located at the side of the step.
20. a kind of electronic device, which is characterized in that including：
Ontology；
In-out box described in claim 15-19 any one, the in-out box setting is on the body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810403603.4A CN108412865A (en) | 2018-04-28 | 2018-04-28 | Dispensing method, in-out box and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810403603.4A CN108412865A (en) | 2018-04-28 | 2018-04-28 | Dispensing method, in-out box and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108412865A true CN108412865A (en) | 2018-08-17 |
Family
ID=63137297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810403603.4A Pending CN108412865A (en) | 2018-04-28 | 2018-04-28 | Dispensing method, in-out box and electronic device |
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| CN (1) | CN108412865A (en) |
Cited By (1)
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| CN109769049A (en) * | 2019-01-10 | 2019-05-17 | Oppo（重庆）智能科技有限公司 | Electronic equipment |
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