CN108172679A - Lamps and lanterns, direct insertion LED lamp bead and manufacturing method - Google Patents
Lamps and lanterns, direct insertion LED lamp bead and manufacturing method Download PDFInfo
- Publication number
- CN108172679A CN108172679A CN201810097285.3A CN201810097285A CN108172679A CN 108172679 A CN108172679 A CN 108172679A CN 201810097285 A CN201810097285 A CN 201810097285A CN 108172679 A CN108172679 A CN 108172679A
- Authority
- CN
- China
- Prior art keywords
- pin
- lamp bead
- flat stent
- led
- led lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
The present invention relates to field of light fittings, especially a kind of direct insertion LED lamp bead, including paster LED, paster LED includes LED wafer, the first flat stent, the second flat stent and for coating the LED wafer and fixing the first encapsulating structure of the first flat stent, the second flat stent, LED lamp bead further include the first pin being electrically connected with the first flat stent, the second pin being electrically connected with the second flat stent and for coat first encapsulating structure and fix first pin, the second pin the second encapsulating structure.In lamps and lanterns in the present invention, direct insertion LED lamp bead and manufacturing method, direct insertion LED lamp bead is by the use of the paster LED after sorting as light source, and the obtained consistency of direct insertion LED lamp bead is good, and the resin of production loss and the first pin, second pin are few.In the present invention, by paster LED and the first pin, second pin is directly connected to, the first pin, second pin have increase heat dissipation effect, so as to get direct insertion LED lamp bead improve the service life, reduce light decay.
Description
Technical field
The present invention relates to lighting area, especially lamps and lanterns, direct insertion LED lamp bead and manufacturing methods.
Background technology
Light emitting diode English full name is LightEmittingDiode (abbreviation LED), is a kind of novel solid state light emitter.
It is born in the 1960s, nineteen twenty-three Matt Rosoff (Lossen.o.w) has when studying semiconductor SiC in the P-N junction of impurity
There is light emitting, have investigated light emitting diode (LED：LightEmittingDiode), is carried no weight always with electronics work
The fast development of industry, in the sixties, display technology obtains rapid development LED and is just gradually valued by people.The advantages of LED
For long lifespan (＞ 100,000Hrs), driving voltage low (1.8~4.5V), power consumption few (40~1000mW), opposite cold light source
(radiation small), light speed fast (time constant is 10-7~10-9S), avoid doubtful lighting effect, small, multicolour,
Vibration strength particularly good (total solids encapsulates, not cracky), monochromaticjty good (emission wavelength stabilization), green non-pollution.
Refer to Fig. 1, the Chinese invention patent (applicant of publication No. CN1883057：Nichia Chemical Industries, Ltd,
Inventor：High island is excellent；Tortoise island is just quick；Jade puts wide people；Wu Shi is along department；The rugged good allusion quotation in village；Put down the lower Shanxi of wood) disclose a kind of light-emitting device
(direct insertion LED lamp bead) has, the light-emitting component 10 (LED wafer) of ultraviolet region and with the cup for placing light-emitting component 10
It cathode side lead frame 13a (the first pin) and is located off the anode-side lead frame 13b of lead frame 13a positions (second draws
Foot) and application member 12 (the first encapsulating structure) comprising the fluorophor 11 being arranged in 13a glasss of lead frame and covering it is whole
Transparent molding parts 15 (the second encapsulating structure), and as fluorophor 11 use multiple Direct Transfer type fluorophor.
Moreover, the positive electrode 3 of light-emitting component 10, lead frame 13b, the negative electrode of light-emitting component 10 are connected to by conducting wire 14
4, lead frame 13a is connected to by conducting wire 14, and light-emitting component 10, conducting wire 14, the cup of lead frame 13a and lead frame 13b
Fore-end is covered by transparent molding parts 15.
The manufacture of the light-emitting device is as follows：
First, with die bonder, in cup chip welding (bonding) light-emitting component 10 upward of lead frame 13a：Core
After piece welding, lead frame 13 is transplanted on bonding equipment, the negative electrode 4 of light-emitting component is connect with gold thread (electric conductivity electric wire) lead
It closes in the upper part of the cup of lead frame 13a, and by 3 wire bond of positive electrode on the lead frame 13b of the opposing party；Secondly, it is transplanted on
Fluorophor 11 and application member 12 are injected into the cup of lead frame 13a by molding device with the distributor of molding device.Note
Mixing phosphor 11 uniform in a ratio of the desired and application member 12 before entering.The luminescent color of light-emitting device is mainly by multiple fluorescence
The luminescent color of body and determine；It injects after fluorophor 11 and application member 12, lead frame 13 is immersed in and is pre-filled with
After the mold molding box of molding parts 15, unloading drag box makes hardening of resin, shines dress with regard to that can produce bullet type as shown in Figure 1
It puts.
Refer to Fig. 2,3, the Chinese invention patent (applicant of publication No. CN106449937A：Day sub- chemical industry strain formula
Commercial firm, inventor：If your wooden work() disclosing a kind of light-emitting device 100 (paster LED), it has：Matrix 101 is provided with packet
Include the recess S of bottom surface and side wall；And a pair of conductive component 102, upper surface are exposed in the bottom surface of recess S.Conductive member 102
Its lower surface is made to be formed as the outer surface of light-emitting device 100 and set, and formed under light-emitting device 100 together with matrix 101
The part on surface.In recess S, load and led by conductive member 102 with electric conductivity using engagement member (not shown)
The light-emitting component 102 that line 105 etc. is electrically connected.Furthermore to cover the light-emitting component 103 (LED wafer) etc. in recess S
Mode, the containment member 104 (the first encapsulating structure) of translucency is set.
The manufacture of the light-emitting device is as follows：
First, prepare the support substrate being made of metallic plate etc.；Then, it is formed to reflect between conductive member and carrys out self-luminous
The matrix of the light of element；Then, light-emitting component using engagement member is engaged in the bottom surface of matrix recess portion, is led using electric conductivity
Line can be electrically connected with conductive member；Later, in containment member of the filling containing translucent resin in recess portion；Structure is sealed by curing
Part can obtain the aggregate of light-emitting device, and stripping, which removes, from the aggregate supports substrate；Finally, it cuts off between recess portion and recess portion
Side wall and make its singualtion, so as to obtain the light-emitting device with 1 recess portion as shown in Figure 1.
The pin for being typically due to direct insertion LED lamp bead is carefully grown, the formed precision requirement of pin height, in automated production
The color of direct insertion LED, the consistency of brightness influenced by the cup forming progress of pin especially 13a is poor.And patch
The stent that LED the is used platy structure short to be wide does not need to setting cup type on stent and constructs, the stent that paster LED uses
Required precision is low, and the paster LED consistency produced is good.
But in the prior art, inevitably generated in direct insertion LED lamp bead manufacturing process substandard products, difference (color,
Brightness).Substandard products can cause the producer to lose the resin of the second encapsulating structure part and the first pin, second pin.
Invention content
Present invention aims at a kind of direct insertion LED lamp bead is provided, direct insertion LED lamp bead is made to be obtained in producing direct insertion
The consistency of LED lamp bead is good, and the resin of production loss and the first pin, second pin are few.
The object of the invention, which also resides in, provides a kind of lamps and lanterns, by the use of direct insertion LED lamp bead as light source, the resin of production loss
It is few with the first pin, second pin.
The object of the invention also resides in the manufacturing method for providing direct insertion LED lamp bead, the one of direct insertion LED lamp beads obtained
Cause property is good, and the resin of production loss and the first pin, second pin are few.
In order to achieve the above-mentioned advantages, the present invention provides a kind of direct insertion LED lamp bead, including paster LED, which includes LED
Chip, the first flat stent, the second flat stent and for coating the LED wafer and fixing the first flat stent, the second flat branch
First encapsulating structure of frame, which is characterized in that the LED lamp beads further include the first pin being electrically connected with the first flat stent,
The second pin that is electrically connected with the second flat stent and for coat first encapsulating structure and fix first pin, this
Second encapsulating structure of two pins.
In one embodiment of the invention, the described first flat stent is bonded with the upper end end face of first pin, institute
The second flat stent is stated to be bonded with the upper end end face of the second pin.
In one embodiment of the invention, the described first flat stent is bonded with the upper side of first pin, institute
The second flat stent is stated to be bonded with the upper side of the second pin.
In one embodiment of the invention, the direct insertion LED lamp bead described in a kind of lamps and lanterns includes the following steps：
E, by first of the paster LED after sorting the flat stent, the second flat stent respectively with the first pin on LED support plate
Bar, the connection of second pin bar；
F, the second packaging plastic is covered outside the first encapsulating structure and forms uncured second encapsulating structure；
G, heating makes the surface cure of uncured second encapsulating structure；
H, the first pin shaft of trimming LED support plate, second pin connecting rod form the first pin, second pin, are formed
Direct insertion LED lamp bead.
In one embodiment of the invention, the step E includes：A1, in the described first flat stent and/or described
One pin shaft coats tin cream on the second flat stent and/or the second pin bar；A2, the first flat stent and first are drawn
Foot lever is bonded, the second flat stent and the fitting of second pin bar；A3, by the tin cream heating and melting；A4, increase the first flat stent and the
Pressure between one pin shaft, the second flat stent and second pin bar；The tin cream that A5, cooling are melted draws the first flat stent and first
Foot lever, the second flat stent connect fixation with second pin bar.
In one embodiment of the invention, second packaging plastic is epoxy, organosilicon and silicon-modified epoxy tree
It is one or more in fat.
In one embodiment of the invention, the paster LED after the sorting in the step A is obtained by following steps：
S101, two electrodes of LED wafer are electrically connected respectively with the first flat stent, with the second flat stent；
S102, it the first packaging plastic is covered outside LED wafer forms uncured first encapsulating structure；
Uncured first encapsulating structure is fully cured in S103, heating, and first encapsulating structure is made to fix the first flat branch
Frame, the second flat stent form paster LED；
S104, sorting paster LED；
In one embodiment of the invention, first packaging plastic is uniformly mixed by fluorescent powder and encapsulation glue.
In one embodiment of the invention, the step S104 includes：By multiple paster LEDs according to colour temperature and/or
Brightness is classified, and obtains the paster LED after multigroup sorting.
In lamps and lanterns in the present invention, direct insertion LED lamp bead and manufacturing method, after direct insertion LED lamp bead is using sorting
For paster LED as light source, the obtained consistency of direct insertion LED lamp bead is good, and the resin of production loss and the first pin, second are drawn
Foot is few.In the present invention, by paster LED and the first pin, second pin is directly connected to, the first pin, and second pin, which has, to be increased
Add the effect of heat dissipation, so as to get direct insertion LED lamp bead improve the service life, reduce light decay.
Description of the drawings
Fig. 1 show a kind of structure diagram of existing direct insertion LED lamp bead.
Fig. 2 show the structure diagram of existing paster LED.
Fig. 3 show the sectional view of Fig. 2 paster LEDs.
Fig. 4 show the structure diagram of the direct insertion LED lamp bead of first embodiment of the invention.
Fig. 5 show the structure diagram of the paster LED of the direct insertion LED lamp bead of Fig. 4.
Fig. 6 show the first flat stent of the paster LED of Fig. 5 and the structure diagram of the second flat stent.
Fig. 7 show the first pin of direct insertion LED lamp bead of Fig. 4 and the structure diagram of second pin.
Fig. 8 show the paster LED and first and second of the manufacturing method of the direct insertion LED lamp bead of first embodiment of the invention
Status diagram before pin connection.
Fig. 9 show the manufacturing method of the direct insertion LED lamp bead of Fig. 6 paster LED connect with first and second pin after shape
State schematic diagram.
The paster LED that Figure 10 show the manufacturing method of the direct insertion LED lamp bead of Fig. 9 coats the shape after the second encapsulating structure
State schematic diagram.
The state that Figure 11 show after the first and second pin shaft excision of the manufacturing method of the direct insertion LED lamp bead of Figure 10 is shown
It is intended to.
Figure 12 show the paster LED of Fig. 1 the first flat stent connect with LED wafer before status diagram.
Figure 13 show the paster LED of Figure 12 the first flat stent connect with LED wafer after status diagram.
Figure 14 show the status diagram after the first encapsulating structure of encapsulation of the paster LED of Figure 13.
Figure 15 show the manufacturing method of the direct insertion LED lamp bead of second embodiment of the invention paster LED and first,
Status diagram after the connection of two pins.
Figure 16 show the manufacturing method of the direct insertion LED lamp bead of third embodiment of the invention paster LED and first,
Status diagram after the connection of two pins.
Figure 17 show the manufacturing method of the direct insertion LED lamp bead of fourth embodiment of the invention paster LED and first,
Status diagram after the connection of two pins.
Figure 18 show the partial enlarged view of Fig. 8.
Figure 19 show the partial enlarged view of Figure 15.
Figure 20 show the partial enlarged view of Figure 16.
Specific embodiment
The technological means and effect taken further to illustrate the present invention to reach predetermined goal of the invention, below in conjunction with
Attached drawing and preferred embodiment to proposing specific embodiment, structure, feature and its effect according to the present invention, are described in detail as after.
Fig. 4 show the structure diagram of the direct insertion LED lamp bead of first embodiment of the invention.Fig. 4 is referred to, the present invention
The direct insertion LED lamp bead 10 of first embodiment, including paster LED 11, the second encapsulating structure 13, the first pin 15, second pin
17.Paster LED 11 is fully accommodated in the second encapsulating structure 13；First pin 15 and 17 upper end of second pin are contained in
In two encapsulating structures 13；There is gap between first pin 15 and second pin 17；First pin 15 and second pin 17 it is upper
End end face is bonded respectively with the first flat stent 111 of paster LED 11, the second flat stent 113.
Fig. 5 show the structure diagram of the paster LED of the direct insertion LED lamp bead of Fig. 4.Refer to Fig. 5, paster LED 11
(B.SMD, surface mount diode) selects 0603 type paster LED, which includes
LED wafer 110, conducting wire 110a, the first flat stent 111, the second flat stent 113 and for coating LED wafer 110 and fixing
First encapsulating structure 115 of one flat stent 111, the second flat stent 113.
In other embodiments, paster LED can also select the paster LED of other specifications, such as 1206,2810,3020,
3528th, 5050 type paster LED, paster LED color can select it is monochromatic, double-colored, full-color in one kind.
LED wafer 110 is the main raw material(s) of paster LED 11, and LED patches rely primarily on LED wafer 110 to shine.
The upper surface of LED wafer 110 is equipped with positive and negative electrode.LED wafer 110 is fixed on by elargol 110b on the first flat stent 111, silver
Glue 110b is a kind of nonconducting elargol.
Conducting wire 110a be used for by the positive and negative electrode of LED wafer 110 respectively with the first flat stent 111, with the second flat stent 113
Electrical connection.
Fig. 6 show the first flat stent of the paster LED of Fig. 5 and the structure diagram of the second flat stent.Refer to Fig. 6,
First flat stent 111 includes the first upper substrate 111a, the first lower substrate 111b and for connecting the first upper substrate 111a and the
The first connecting plate 111c of one lower substrate 111b.Second flat stent 113 includes the second upper substrate 113a, the second lower substrate 113b
And the second connecting plate 113c for connecting the second upper substrate 113a and the second lower substrate 113b.
Second encapsulating structure 13 is for the first encapsulating structure 115 of cladding and fixes the first pin 15, second pin 17.Second
Encapsulating structure 13 can be made of translucent materials such as epoxy, organosilicon and modifying epoxy resin by organosilicon.
Fig. 7 show the first pin of direct insertion LED lamp bead of Fig. 4 and the structure diagram of second pin.Fig. 5 is shown
For processing the structure diagram of the supporting plate 20 of the first pin and second pin.Refer to Fig. 4, the 5, first pin 15, second
Pin 17 is again by being formed after cutting by the supporting plate 20 formed after metallic plate punching press.
Supporting plate 20 includes transversely arranged middle part connecting rod 21, lower connecting plate 23, spaced more the vertical
One pin shaft 25, second pin bar 27.Middle part connecting rod 21, lower connecting plate 23 draw for the first pin shaft 25 of holding, second
The relative position of foot lever 27 prevents the first pin shaft 25, second pin bar 27 from deforming.
First pin 15, the structure that second pin 17 includes is similar, the first pin 15 include the first rod-shaped leg 151,
153 and first upper end end 155 of first connecting portion.First upper end end 155 and the section of first connecting portion 153 are more than first
The section of leg 151, the upper surface of the first upper end end 155 is the plane with the first flat cradle fits.In this way, in LED wafer
When shining, first flat stent or first encapsulating structure of the heat through metal, the first upper end end 155, first connecting portion 153 is efficiently
Rate is transmitted to the first leg 151 and radiates in an atmosphere, to prevent the temperature of LED wafer excessively high.
Similar second pin 17 includes the second rod-shaped leg 151,153 and second upper end end of second connecting portion
155。
Fig. 8 show the paster LED and first and second of the manufacturing method of the direct insertion LED lamp bead of first embodiment of the invention
Status diagram before pin connection.Fig. 9 show the manufacturing method of the direct insertion LED lamp bead of Fig. 6 paster LED and first,
Status diagram after the connection of two pins.Figure 10 show the paster LED cladding of the manufacturing method of the direct insertion LED lamp bead of Fig. 9
Status diagram after second encapsulating structure.
The state that Figure 11 show after the first and second pin shaft excision of the manufacturing method of the direct insertion LED lamp bead of Figure 10 is shown
It is intended to.Fig. 8,9,10,11,18 are referred to, in the present embodiment, the manufacturing method of direct insertion LED lamp bead includes the following steps：
I, by first of the paster LED 11 after sorting the flat stent 111, the second flat stent 113 respectively on supporting plate 20
First pin shaft 25, second pin bar 27 connect；
J, the second packaging plastic is covered outside the first encapsulating structure 115 and forms uncured second encapsulating structure 13；
K, heating makes the surface cure of uncured second encapsulating structure 13；
D, trimming the first pin shaft 25 of supporting plate 20, second pin bar 27, head rod, the second connecting rod form the
One pin 15, second pin 17 form direct insertion LED lamp bead 10.
Further, the first flat stent 111 is bonded with the upper end end face of the first pin 15 in step A, the second flat stent 113
It is bonded with the upper end end face of second pin 17.By 11 and first pin 15 of paster LED, second pin 17 is directly connected to, and first draws
Foot 15, second pin 17 have increase heat dissipation effect, so as to get direct insertion LED lamp bead 10 improve the service life, reduce light decay.
Further, step A includes：
A1, in the first flat 111 and/or first pin shaft 25 of stent, the second flat stent 113 and/or second pin bar 27
Coat tin cream 116；
A2, the first flat 111 and first pin shaft 25 of stent is bonded, the second flat stent 113 and second pin bar 27 are bonded；
A3, by 116 heating and melting of tin cream；A4, increase the first flat 111 and first pin shaft 25 of stent, the second flat stent 113
Pressure between second pin bar 27；
The tin cream 116 that A5, cooling are melted makes the first flat 111 and first pin shaft 25 of stent, the second flat stent 113 and second
The connection of pin shaft 27 is fixed.
Wherein, the second packaging plastic of step B is one kind or more in epoxy, organosilicon and modifying epoxy resin by organosilicon
Kind.
Figure 12 show the paster LED of Fig. 1 the first flat stent connect with LED wafer before status diagram, Tu13Suo
Be shown as the paster LED of Figure 12 the first flat stent connect with LED wafer after status diagram, Figure 14 show the patch of Figure 13
Status diagram after the first encapsulating structure of encapsulation of LED.Refer to Figure 12,13,14, the patch after sorting in step A
LED11 is obtained by following steps：
S101, two electrodes of LED wafer 110 are electrically connected respectively with the first flat stent 111, with the second flat stent 113；
S102, it the first packaging plastic is covered outside LED wafer 110 forms uncured first encapsulating structure 115；
Uncured first encapsulating structure 115 is fully cured in S103, heating, the first encapsulating structure 115 is made to fix first flat
Stent 111, the second flat stent 113 form paster LED 11；
S104, multiple paster LEDs 11 according to colour temperature and/or brightness are classified, obtains the paster LED 11 after multigroup sorting；
Wherein, the first packaging plastic in step S102 is uniformly mixed by fluorescent powder and encapsulation glue.
Figure 15 show the manufacturing method of the direct insertion LED lamp bead of second embodiment of the invention paster LED and first,
Status diagram after the connection of two pins.Figure 15,19 are referred to, in the present embodiment, two paster LEDs draw respectively positioned at first
The both sides of foot, second pin, the first flat stent 111 are bonded with the side of the upper end of the first pin 15, the second flat stent 113 and
The side fitting of the upper end of two pins 17.
Figure 16 show the manufacturing method of the direct insertion LED lamp bead of third embodiment of the invention paster LED and first,
Status diagram after the connection of two pins.Figure 16,20 are referred to, in the present embodiment, two paster LEDs draw respectively positioned at first
The both sides of foot, second pin.First flat stent 111 of one of paster LED is bonded with the upper side of the first pin 15, the
Two flat stents 113 are bonded with the upper side of second pin 17, the first flat stent 111 and second pin of another paster LED
17 upper side fitting, the second flat stent 113 are bonded with the upper side of the first pin 15.
Figure 17 show the manufacturing method of the direct insertion LED lamp bead of fourth embodiment of the invention paster LED and first,
Status diagram after the connection of two pins.Refer to Figure 17, in the present embodiment, two paster LEDs respectively be located at the first pin,
The upper end end face of second pin.First flat stent 111 of one of paster LED is bonded with the upper end end face of the first pin 15,
Second flat stent 113 is bonded with the upper end end face of second pin 17, and the first flat stent 111 of another paster LED draws with second
The upper end end face fitting of foot 17, the second flat stent 113 are bonded with the upper end end face of the first pin 15.
In third and fourth embodiment of the present invention, the LED patches for including two reverse parallel connections of direct insertion LED lamp bead,
That is the work of LED wafer is not limited by current direction.
The present invention also provides a kind of lamps and lanterns to include any one direct insertion LED lamp bead.
In lamps and lanterns in the present invention, direct insertion LED lamp bead and manufacturing method, after direct insertion LED lamp bead is using sorting
For paster LED as light source, the obtained consistency of direct insertion LED lamp bead is good, and the resin of production loss and the first pin, second are drawn
Foot is few.In the present invention, by paster LED and the first pin, second pin is directly connected to, the first pin, and second pin, which has, to be increased
Add the effect of heat dissipation, so as to get direct insertion LED lamp bead improve the service life, reduce light decay.
Such as following table, two flat stents of paster LED of the invention use are easy to process, rigidity is good, precision is high, obtained patch
LED homogeneity is good, and yields is high.Again by the screening to paster LED, the colour temperature of obtained paster LED, brightness uniformity are more
It is good, resin and stent are saved, and be fully cured so as to shorten overall hardening time because withouting waiting for the first encapsulation.
In addition by paster LED and the first pin, second pin is directly connected to, the first pin, and second pin has the function of heat dissipation, makes
Obtained direct insertion LED lamp bead improves the service life, reduces light decay.
Calculate by applicant, the direct insertion LED light of the more identical credit rating of direct insertion LED lamp bead of the scheme of the application
The cost of pearl is lower, production efficiency higher, has good market prospects.
More than, only it is presently preferred embodiments of the present invention, not makees limitation in any form to the present invention, although this
Invention is disclosed above with preferred embodiment, however is not limited to the present invention, any person skilled in the art,
It does not depart from the range of technical solution of the present invention, when the technology contents using the disclosure above make a little change or are modified to equivalent
The equivalent embodiment of variation, as long as being without departing from technical solution of the present invention content, technical spirit according to the present invention is to above real
Any simple modification, equivalent variations and the modification that example made are applied, in the range of still falling within technical solution of the present invention.
Claims (10)
1. a kind of direct insertion LED lamp bead, including paster LED, which includes LED wafer, the first flat stent, the second flat branch
Frame and for coating the LED wafer and fixing the first encapsulating structure of the first flat stent, the second flat stent, feature exists
In the LED lamp bead further includes the first pin being electrically connected with the first flat stent, be electrically connected with the second flat stent second
Pin and for coat first encapsulating structure and fix first pin, the second pin the second encapsulating structure.
2. direct insertion LED lamp bead according to claim 1, which is characterized in that the first flat stent draws with described first
The upper end end face fitting of foot, the second flat stent are bonded with the upper end end face of the second pin.
3. direct insertion LED lamp bead according to claim 1, which is characterized in that the first flat stent draws with described first
The upper side fitting of foot, the second flat stent are bonded with the upper side of the second pin.
A kind of 4. lamps and lanterns, which is characterized in that the direct insertion LED lamp bead described in including any one in claims 1 to 3.
5. a kind of manufacturing method of direct insertion LED lamp bead, which is characterized in that include the following steps：
A, by first of the paster LED after sorting the flat stent, the second flat stent respectively on LED support plate the first pin shaft,
Second pin bar connects；
B, the second packaging plastic is covered outside the first encapsulating structure and forms uncured second encapsulating structure；
C, heating makes the surface cure of uncured second encapsulating structure；
D, the first pin shaft of trimming LED support plate, second pin connecting rod form the first pin, second pin, form straight cutting
Formula LED lamp bead.
6. the manufacturing method of direct insertion LED lamp bead according to claim 5, which is characterized in that the step E includes：A1、
The tin coating in the described first flat stent and/or first pin shaft, the second flat stent and/or the second pin bar
Cream；A2, the first flat stent and the first pin shaft are bonded, the second flat stent and the fitting of second pin bar；A3, the tin cream is heated
Melt；Pressure between A4, the first flat stent of increase and the first pin shaft, the second flat stent and second pin bar；A5, cooling are melted
Tin cream the first flat stent and the first pin shaft, the second flat stent is made to connect fixation with second pin bar.
7. direct insertion LED lamp bead according to claim 7, which is characterized in that second packaging plastic is epoxy, organosilicon
With it is one or more in modifying epoxy resin by organosilicon.
8. direct insertion LED lamp bead according to claim 7, which is characterized in that the patch after sorting in the step A
LED is obtained by following steps：
S101, two electrodes of LED wafer are electrically connected respectively with the first flat stent, with the second flat stent；
S102, it the first packaging plastic is covered outside LED wafer forms uncured first encapsulating structure；
Uncured first encapsulating structure is fully cured in S103, heating, and first encapsulating structure is made to fix the first flat stent, be somebody's turn to do
Second flat stent forms paster LED；
S104, sorting paster LED.
9. direct insertion LED lamp bead according to claim 8, which is characterized in that first packaging plastic is by fluorescent powder and envelope
Dress glue is uniformly mixed.
10. direct insertion LED lamp bead according to claim 8, which is characterized in that the step S104 includes：It will be multiple
Paster LED is classified according to colour temperature and/or brightness, obtains the paster LED after multigroup sorting.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810097285.3A CN108172679A (en) | 2018-01-31 | 2018-01-31 | Lamps and lanterns, direct insertion LED lamp bead and manufacturing method |
| PCT/CN2018/115115 WO2019148934A1 (en) | 2018-01-31 | 2018-11-13 | Lighting fixture, in-line led bead, and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810097285.3A CN108172679A (en) | 2018-01-31 | 2018-01-31 | Lamps and lanterns, direct insertion LED lamp bead and manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108172679A true CN108172679A (en) | 2018-06-15 |
Family
ID=62512454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810097285.3A Pending CN108172679A (en) | 2018-01-31 | 2018-01-31 | Lamps and lanterns, direct insertion LED lamp bead and manufacturing method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108172679A (en) |
| WO (1) | WO2019148934A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109192837A (en) * | 2018-08-07 | 2019-01-11 | 天台天宇光电股份有限公司 | A kind of direct insertion LED lamp bead of built-in patch formula LED |
| WO2019148934A1 (en) * | 2018-01-31 | 2019-08-08 | 吴相勇 | Lighting fixture, in-line led bead, and manufacturing method |
| EP3683849A1 (en) * | 2019-01-16 | 2020-07-22 | Zhejiang Hongda Optoelectronics Technology Co., Ltd. | In-line led lamp bead and packaging process thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1825641A (en) * | 2005-02-22 | 2006-08-30 | 安捷伦科技有限公司 | Semiconductor light emitting device and method of manufacture |
| KR20120000739A (en) * | 2010-06-28 | 2012-01-04 | 삼성엘이디 주식회사 | Led module on heat sink and method of manufacturing the same |
| CN102709440A (en) * | 2012-05-23 | 2012-10-03 | 李海涛 | Paster LED (light-emitting diode) support, paster LED manufacturing method and paster LED |
| CN106992237A (en) * | 2017-02-28 | 2017-07-28 | 江西省木林森照明有限公司 | A kind of Novel LED support and LED lamp bead |
| CN107228284A (en) * | 2017-06-01 | 2017-10-03 | 江西宝晟自动化设备有限公司 | The LED plug-in unit indicator lamps that built-in patch LED, Zener or both all cover |
| CN206849865U (en) * | 2017-06-27 | 2018-01-05 | 深圳市汇大光电科技股份有限公司 | Paster LED traffic lamp source |
| CN207977348U (en) * | 2018-01-31 | 2018-10-16 | 吴相勇 | Lamps and lanterns and direct insertion LED lamp bead |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW521409B (en) * | 2000-10-06 | 2003-02-21 | Shing Chen | Package of LED |
| CN202695546U (en) * | 2012-05-21 | 2013-01-23 | 王定锋 | Light emitting diode (LED) support with surface mount device resistors and LED device with same |
| CN203963576U (en) * | 2014-06-19 | 2014-11-26 | 深圳市阿里山电子集团有限公司 | The compound color LED of a kind of paster straight cutting |
| CN203932055U (en) * | 2014-06-26 | 2014-11-05 | 深圳市阿里山电子集团有限公司 | The square color LED lamp that has three rims of a cup on a pin support |
| CN204885211U (en) * | 2015-08-25 | 2015-12-16 | 广东金鉴检测科技有限公司 | LED support and LED packaging structure |
| CN205985069U (en) * | 2016-08-29 | 2017-02-22 | 厦门华联电子有限公司 | Pasterization cut straightly LED |
| CN108172679A (en) * | 2018-01-31 | 2018-06-15 | 吴相勇 | Lamps and lanterns, direct insertion LED lamp bead and manufacturing method |
-
2018
- 2018-01-31 CN CN201810097285.3A patent/CN108172679A/en active Pending
- 2018-11-13 WO PCT/CN2018/115115 patent/WO2019148934A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1825641A (en) * | 2005-02-22 | 2006-08-30 | 安捷伦科技有限公司 | Semiconductor light emitting device and method of manufacture |
| KR20120000739A (en) * | 2010-06-28 | 2012-01-04 | 삼성엘이디 주식회사 | Led module on heat sink and method of manufacturing the same |
| CN102709440A (en) * | 2012-05-23 | 2012-10-03 | 李海涛 | Paster LED (light-emitting diode) support, paster LED manufacturing method and paster LED |
| CN106992237A (en) * | 2017-02-28 | 2017-07-28 | 江西省木林森照明有限公司 | A kind of Novel LED support and LED lamp bead |
| CN107228284A (en) * | 2017-06-01 | 2017-10-03 | 江西宝晟自动化设备有限公司 | The LED plug-in unit indicator lamps that built-in patch LED, Zener or both all cover |
| CN206849865U (en) * | 2017-06-27 | 2018-01-05 | 深圳市汇大光电科技股份有限公司 | Paster LED traffic lamp source |
| CN207977348U (en) * | 2018-01-31 | 2018-10-16 | 吴相勇 | Lamps and lanterns and direct insertion LED lamp bead |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019148934A1 (en) * | 2018-01-31 | 2019-08-08 | 吴相勇 | Lighting fixture, in-line led bead, and manufacturing method |
| CN109192837A (en) * | 2018-08-07 | 2019-01-11 | 天台天宇光电股份有限公司 | A kind of direct insertion LED lamp bead of built-in patch formula LED |
| EP3683849A1 (en) * | 2019-01-16 | 2020-07-22 | Zhejiang Hongda Optoelectronics Technology Co., Ltd. | In-line led lamp bead and packaging process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019148934A1 (en) | 2019-08-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105140381B (en) | Without substrate LED filament and its manufacturing method and without substrate LED filament lamp | |
| US20170365747A1 (en) | Led with high thermal conductivity particles in phosphor conversion layer | |
| CN103972364A (en) | Method for manufacturing LED light source | |
| CN108172679A (en) | Lamps and lanterns, direct insertion LED lamp bead and manufacturing method | |
| CN201708188U (en) | Ceramic high-power light emitting diode | |
| CN101859866A (en) | Support for manufacturing LED and method for encapsulating high-power white light LED | |
| TW201338215A (en) | Method for manufacturing LED package | |
| CN102593326A (en) | Light-emitting diode (LED) packaging structure and process based on fluorescent powder dispersive excitation technology | |
| CN101338865A (en) | Low attenuation high light efficiency LED illuminating apparatus and preparation method | |
| CN105633248B (en) | LED lamp and preparation method thereof | |
| CN207977348U (en) | Lamps and lanterns and direct insertion LED lamp bead | |
| CN106684231B (en) | A kind of CSP chip scale packages and packaging method | |
| CN205863219U (en) | A kind of LED encapsulation of Multi-core | |
| CN100463239C (en) | Light emitted semiconductor assembly package structure and producing method thereof | |
| TWI438940B (en) | Method for manufacturing led package | |
| CN206480621U (en) | A kind of LED chip inverted structure | |
| US20150029723A1 (en) | Light-emitting diode package structure and light-emitting diode light bulb | |
| JP2002232013A (en) | Semiconductor light emitting element | |
| CN106025047A (en) | LED Package and packaging method thereof | |
| CN203085634U (en) | LED package structure and lamp using LED package structure | |
| TW201725760A (en) | Heterogeneous LED luminous source assembly and manufacturing process thereof | |
| CN208093557U (en) | A kind of direct-injection type light source | |
| KR20030063832A (en) | White Light-emitting Diode and Method of Manufacturing the Same | |
| CN105552199B (en) | A kind of LED light source and preparation method thereof that full angle is luminous | |
| CN205828428U (en) | A kind of LED encapsulation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |