CN103972364A - Method for manufacturing LED light source - Google Patents
Method for manufacturing LED light source Download PDFInfo
- Publication number
- CN103972364A CN103972364A CN201410194651.9A CN201410194651A CN103972364A CN 103972364 A CN103972364 A CN 103972364A CN 201410194651 A CN201410194651 A CN 201410194651A CN 103972364 A CN103972364 A CN 103972364A
- Authority
- CN
- China
- Prior art keywords
- led
- light source
- led light
- led chip
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 239000012780 transparent material Substances 0.000 claims abstract description 5
- 239000003292 glue Substances 0.000 claims description 17
- 239000011521 glass Substances 0.000 claims description 11
- 238000005266 casting Methods 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 241000218202 Coptis Species 0.000 description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 238000004804 winding Methods 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007527 glass casting Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
A method for manufacturing an LED light source is characterized by sequentially comprising the following steps that (a) a substrate is made of transparent materials, wherein a groove is formed in the surface of the substrate; (b) the bottom of the groove is coated with fluorescent gum; (c) an LED chip is fixed to the fluorescent gum at the bottom of the groove; (d) electrodes of the LED chip are connected in series by a metal wire; (e) the LED chip and the metal wire are coated with fluorescent gum. According to the method for manufacturing the LED light source, a traditional manufacturing process of an LED light source is simplified and material consumption is reduced.
Description
Technical field
The present invention relates to LED light source field, particularly a kind of manufacture method of LED light source.
Background technology
LED is a kind of semiconductor light sources, have energy-conservation, volume is little, long etc. advantage of life-span, progressively substitutes in recent years conventional incandescent, will become main from now on lighting source.
The method of manufacturing at present LED light source has following 2 kinds: method 1, is packaged into LED chip the lamp pearl of plug-in unit or paster, then the materials such as lamp pearl, circuit board, radiator, power supply, shell are assembled into LED lamp; Method 2, is directly fixed on LED chip on the metal or ceramic substrate with layer printed circuit board, then bonding wire, puts glue, is solidified into LED light emitting module, then the materials such as LED light emitting module and circuit board, radiator, power supply, shell are assembled into LED lamp; Method 1 is manufactured LED lamp need to adopt lamp bead seal dress and two encapsulation flow processs of LED lamp assembling, and technological process is many, cost is high, heat dissipation design is complicated; Although method 2 is manufactured LED lamp and has been saved LED lamp bead seal dress link, many aluminium base (or ceramic substrate) manufacturing process with circuit board printed layers, technological process also a little many, still need radiator, cost also higher.
Summary of the invention
The present invention, for overcoming the deficiencies in the prior art, provides a kind of manufacture method of LED light source, and the method is applicable to manufacture in enormous quantities LED lamp.
Technical scheme of the present invention is to comprise successively following processing step:
(a) manufacture the reeded base plate of surface band with transparent material;
(b) be coated with fluorescent glue in the bottom of groove;
(c) row or multiple row LED chip are fixed on the fluorescent glue of bottom portion of groove;
(d) with gold thread, the electrode series winding of LED chip is connected;
(e) on LED chip and gold thread, be coated with fluorescent glue.
The invention has the beneficial effects as follows: adopt a transparent material (for example glass) not only for the substrate of LED chip die bond, bonding wire, simultaneously but also be the fin of LED chip, while or the shell of LED lamp, not only reduce material cost, also simplified the technological process of production.
Brief description of the drawings
Fig. 1 is the structural representation of LED light source module of the present invention;
Fig. 2 is the cutaway view of LED light source module in Fig. 1;
Fig. 3 is a kind of LED bulb lamp schematic diagram of manufacturing according to the present invention program;
Fig. 4 is according to the partial sectional view of a kind of LED bulb lamp schematic diagram of the present invention program's manufacture in Fig. 3;
Fig. 5 is according to the end view of a kind of LED bulb lamp schematic diagram of the present invention program's manufacture in Fig. 3.
Embodiment
Fig. 1, Fig. 2 are respectively structural representation and the cutaway views of LED light source module of the present invention, Figure 1 shows that the schematic diagram after having manufactured, can see surface glass plate 1 and with the fluorescent glue 5 of glass plate 1 groove surfaces; The internal structure of the visible LED light source module of the present invention of the direction of A-A shown in Fig. 2 cutaway view, according to shown in Fig. 2, manufacture method of the present invention being described below:
(a) with the reeded glass plate 1 of glass casting strip;
(b) be coated with fluorescent glue 4 at the bottom portion of groove of glass plate 1;
(c) a row LED chip 2(is generally used to blue chip) be uniformly-spaced fixed on fluorescent glue 4;
(d) with gold thread 3, the electrode series winding of LED chip 2 is connected;
(e) on LED chip 2 and gold thread 3, be coated with again one deck fluorescent glue 5.
Shown in Fig. 3～Fig. 5, be the schematic diagram that adopts a kind of LED lamp of manufacture method production of the present invention, wherein Fig. 3 is that front view, Fig. 5 are that end view, Fig. 4 are the partial sectional views of Fig. 3; In Fig. 3, LED lamp is made up of several parts such as lamp holder 8, plastic rubber connector 7, glass plate 1, LED filaments 6; From the Fig. 3 shown in Fig. 4, the partial sectional view of LED filament 6 can be found out, the chief component glass plate 1 of this bulb lamp and LED filament 6 are to adopt method of the present invention to manufacture, and concrete manufacture method is described below:
S1, the reeded pyriform glass plate 1 of casting strip;
S2, is coated with one deck fluorescent glue 4 at the bottom portion of groove of glass plate 1;
S3, optional step: adopt and heat or the method rapid curing fluorescent glue 4 such as light is solid;
S4, blue-light LED chip 2 on equally spaced consolidating on fluorescent glue 4;
S4, uses gold thread 3 by blue-light LED chip 2 electrodes series winding welding;
S5 is coated with one deck fluorescent glue 5 on blue-light LED chip 2 and gold thread 3 again;
S6, optional step: adopt and heat or the method rapid curing fluorescent glue 5 such as light is solid;
S7, the assembling parts such as the LED filament 6 that lamp holder 8, plastic rubber connector 7, glass plate 1 and above-mentioned S2～S6 step are manufactured become LED lamp as shown in Figure 3;
S8, optional step: as required, the lamp of LED shown in Fig. 3 can add power module.
Claims (3)
1. a manufacture method for LED light source, is characterized in that comprising successively following processing step:
(a) manufacture the reeded substrate of surface band with transparent material;
(b) be coated with fluorescent glue at the bottom portion of groove of substrate;
(c) LED chip is fixed on the fluorescent glue of bottom portion of groove;
(d) with metal wire, the electrode of LED chip is connected;
(e) on LED chip and metal wire, be coated with fluorescent glue.
2. the manufacture method of a kind of LED light source according to claim 1, is characterized in that: described in step (a), transparent material can be glass or resin, and the groove on surface can casting.
3. the manufacture method of a kind of LED light source according to claim 1, is characterized in that: described in step (b), step (c), step (e), fluorescent glue can mix with fluorescent material and epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410194651.9A CN103972364A (en) | 2014-05-10 | 2014-05-10 | Method for manufacturing LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410194651.9A CN103972364A (en) | 2014-05-10 | 2014-05-10 | Method for manufacturing LED light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103972364A true CN103972364A (en) | 2014-08-06 |
Family
ID=51241643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410194651.9A Pending CN103972364A (en) | 2014-05-10 | 2014-05-10 | Method for manufacturing LED light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103972364A (en) |
Cited By (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105849919A (en) * | 2014-06-20 | 2016-08-10 | 福建永德吉灯业股份有限公司 | LED lighting element visible to the eye |
| GB2547085A (en) * | 2015-12-19 | 2017-08-09 | Jiaxing Super Lighting Electric Appliance Co Ltd | LED filament |
| GB2543139B (en) * | 2015-08-17 | 2018-05-23 | Jiaxing Super Lighting Electric Appliance Co Ltd | LED light bulb and LED filament thereof |
| US9995474B2 (en) | 2015-06-10 | 2018-06-12 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED filament, LED filament assembly and LED bulb |
| US10240724B2 (en) | 2015-08-17 | 2019-03-26 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament |
| US10359152B2 (en) | 2015-08-17 | 2019-07-23 | Zhejiang Super Lighting Electric Appliance Co, Ltd | LED filament and LED light bulb |
| US10473271B2 (en) | 2015-08-17 | 2019-11-12 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament module and LED light bulb |
| US10487987B2 (en) | 2015-08-17 | 2019-11-26 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament |
| US10544905B2 (en) | 2014-09-28 | 2020-01-28 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
| US10655792B2 (en) | 2014-09-28 | 2020-05-19 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
| US10677396B2 (en) | 2006-07-22 | 2020-06-09 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED light bulb with symmetrical filament |
| US10784428B2 (en) | 2014-09-28 | 2020-09-22 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
| US10790419B2 (en) | 2017-12-26 | 2020-09-29 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| US10790420B2 (en) | 2017-12-26 | 2020-09-29 | Jiaxing Super Lighting Electric Appliance Co., Ltd | Light bulb with a symmetrical LED filament |
| US10794545B2 (en) | 2014-09-28 | 2020-10-06 | Zhejiang Super Lighting Electric Appliance Co., Lt | LED light bulb with segmented LED filament |
| US10845008B2 (en) | 2014-09-28 | 2020-11-24 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
| US10982817B2 (en) | 2014-09-28 | 2021-04-20 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with a flexible LED filament |
| US10982816B2 (en) | 2014-09-28 | 2021-04-20 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb having uniform light emmision |
| US11015764B2 (en) | 2014-09-28 | 2021-05-25 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with flexible LED filament having perpendicular connecting wires |
| US11073248B2 (en) | 2014-09-28 | 2021-07-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
| US11085591B2 (en) | 2014-09-28 | 2021-08-10 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with curved filament |
| US11168844B2 (en) | 2015-08-17 | 2021-11-09 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb having filament with segmented light conversion layer |
| US11259372B2 (en) | 2015-06-10 | 2022-02-22 | Zhejiang Super Lighting Electric Appliance Co., Ltd | High-efficiency LED light bulb with LED filament therein |
| US11421827B2 (en) | 2015-06-19 | 2022-08-23 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| US11525547B2 (en) | 2014-09-28 | 2022-12-13 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with curved filament |
| US11543083B2 (en) | 2014-09-28 | 2023-01-03 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| US11686436B2 (en) | 2014-09-28 | 2023-06-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and light bulb using LED filament |
| US11690148B2 (en) | 2014-09-28 | 2023-06-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201868426U (en) * | 2010-10-28 | 2011-06-15 | 王元成 | LED light source |
| CN201866576U (en) * | 2010-10-28 | 2011-06-15 | 王元成 | LED bulb |
| US20120261692A1 (en) * | 2011-04-12 | 2012-10-18 | Hon Hai Precision Industry Co., Ltd. | Led package structure |
-
2014
- 2014-05-10 CN CN201410194651.9A patent/CN103972364A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201868426U (en) * | 2010-10-28 | 2011-06-15 | 王元成 | LED light source |
| CN201866576U (en) * | 2010-10-28 | 2011-06-15 | 王元成 | LED bulb |
| US20120261692A1 (en) * | 2011-04-12 | 2012-10-18 | Hon Hai Precision Industry Co., Ltd. | Led package structure |
Cited By (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10677396B2 (en) | 2006-07-22 | 2020-06-09 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED light bulb with symmetrical filament |
| CN105849919A (en) * | 2014-06-20 | 2016-08-10 | 福建永德吉灯业股份有限公司 | LED lighting element visible to the eye |
| US10655792B2 (en) | 2014-09-28 | 2020-05-19 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
| US11686436B2 (en) | 2014-09-28 | 2023-06-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and light bulb using LED filament |
| US11997768B2 (en) | 2014-09-28 | 2024-05-28 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| US11085591B2 (en) | 2014-09-28 | 2021-08-10 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with curved filament |
| US11543083B2 (en) | 2014-09-28 | 2023-01-03 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| US11525547B2 (en) | 2014-09-28 | 2022-12-13 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with curved filament |
| US11187384B2 (en) | 2014-09-28 | 2021-11-30 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
| US11168845B2 (en) | 2014-09-28 | 2021-11-09 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb having muti-section bending filament |
| US11168843B2 (en) | 2014-09-28 | 2021-11-09 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
| US10544905B2 (en) | 2014-09-28 | 2020-01-28 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
| US11125393B2 (en) | 2014-09-28 | 2021-09-21 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament light bulb having different surface roughness filament base layer |
| US11892127B2 (en) | 2014-09-28 | 2024-02-06 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED bulb lamp |
| US10982817B2 (en) | 2014-09-28 | 2021-04-20 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with a flexible LED filament |
| US11690148B2 (en) | 2014-09-28 | 2023-06-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
| US11629825B2 (en) | 2014-09-28 | 2023-04-18 | Zhejiang Super Lighting Electric Appliance Co., Lt | LED light bulb with curved filament |
| US11073248B2 (en) | 2014-09-28 | 2021-07-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
| US10711951B1 (en) | 2014-09-28 | 2020-07-14 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with curved filament |
| US11028970B2 (en) | 2014-09-28 | 2021-06-08 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament light bulb having organosilicon-modified polyimide resin composition filament base layer |
| US10784428B2 (en) | 2014-09-28 | 2020-09-22 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
| US11015764B2 (en) | 2014-09-28 | 2021-05-25 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with flexible LED filament having perpendicular connecting wires |
| US10982819B2 (en) | 2014-09-28 | 2021-04-20 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with bendable LED filament |
| US10794545B2 (en) | 2014-09-28 | 2020-10-06 | Zhejiang Super Lighting Electric Appliance Co., Lt | LED light bulb with segmented LED filament |
| US10982816B2 (en) | 2014-09-28 | 2021-04-20 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb having uniform light emmision |
| US10982818B2 (en) | 2014-09-28 | 2021-04-20 | Zhejiang Super Lighting Electric Appliance Co., Ltd | High light-emitting efficiency LED light bulb having filament with controlled refractive index differences of multiple interfaces |
| US10845008B2 (en) | 2014-09-28 | 2020-11-24 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
| US10976009B2 (en) | 2014-09-28 | 2021-04-13 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament light bulb |
| US10627098B2 (en) | 2015-06-10 | 2020-04-21 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb having the same |
| US11259372B2 (en) | 2015-06-10 | 2022-02-22 | Zhejiang Super Lighting Electric Appliance Co., Ltd | High-efficiency LED light bulb with LED filament therein |
| US9995474B2 (en) | 2015-06-10 | 2018-06-12 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED filament, LED filament assembly and LED bulb |
| US11421827B2 (en) | 2015-06-19 | 2022-08-23 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| US10619800B2 (en) | 2015-08-17 | 2020-04-14 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED light bulb |
| US11168844B2 (en) | 2015-08-17 | 2021-11-09 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb having filament with segmented light conversion layer |
| GB2543139B (en) * | 2015-08-17 | 2018-05-23 | Jiaxing Super Lighting Electric Appliance Co Ltd | LED light bulb and LED filament thereof |
| US10228093B2 (en) | 2015-08-17 | 2019-03-12 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED light bulb and LED filament thereof |
| US10767817B2 (en) | 2015-08-17 | 2020-09-08 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED light bulb and LED filament thereof |
| US11035525B2 (en) | 2015-08-17 | 2021-06-15 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb |
| US10704741B2 (en) | 2015-08-17 | 2020-07-07 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED filament and light bulb |
| US10690293B2 (en) | 2015-08-17 | 2020-06-23 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED light bulb with two sets of filaments |
| US10240724B2 (en) | 2015-08-17 | 2019-03-26 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament |
| US10976010B2 (en) | 2015-08-17 | 2021-04-13 | Zhejiang Super Lighting Electric Appliance Co., Lt | LED filament and led light bulb |
| US10527233B2 (en) | 2015-08-17 | 2020-01-07 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED light bulb and LED Filament thereof |
| US10359152B2 (en) | 2015-08-17 | 2019-07-23 | Zhejiang Super Lighting Electric Appliance Co, Ltd | LED filament and LED light bulb |
| US10487987B2 (en) | 2015-08-17 | 2019-11-26 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament |
| US10473271B2 (en) | 2015-08-17 | 2019-11-12 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament module and LED light bulb |
| GB2547085B (en) * | 2015-12-19 | 2019-04-03 | Jiaxing Super Lighting Electric Appliance Co Ltd | LED filament |
| GB2547085A (en) * | 2015-12-19 | 2017-08-09 | Jiaxing Super Lighting Electric Appliance Co Ltd | LED filament |
| US10804446B2 (en) | 2017-12-26 | 2020-10-13 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED light bulb with spectral distribution of natural light |
| US10868225B2 (en) | 2017-12-26 | 2020-12-15 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED light bulb having filament with lighting face of LED chip located in the lower surface of top layer |
| US10797208B2 (en) | 2017-12-26 | 2020-10-06 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED light bulb with conductive sections and exposed wires |
| US11121292B2 (en) | 2017-12-26 | 2021-09-14 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED light bulb having filament with being partially coated by light conversion layer |
| US10790419B2 (en) | 2017-12-26 | 2020-09-29 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| US10944028B2 (en) | 2017-12-26 | 2021-03-09 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED light bulb having filament with conductive section providing with rivet structure |
| US10790420B2 (en) | 2017-12-26 | 2020-09-29 | Jiaxing Super Lighting Electric Appliance Co., Ltd | Light bulb with a symmetrical LED filament |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103972364A (en) | Method for manufacturing LED light source | |
| CN102072422B (en) | Encapsulating structure | |
| CN103322525B (en) | LED (light-emitting diode) lamp and filament thereof | |
| WO2015081804A1 (en) | Spiral led filament and light bulb using spiral led filament | |
| US7808004B2 (en) | Light emitting diode package structure and method of manufacturing the same | |
| JP2007049167A (en) | Plcc package equipped with integrally-formed lens, and manufacturing method therefor | |
| CN103791286B (en) | Linear LED light source and linear LED lamp | |
| CN109980070B (en) | Wafer-level chip-level CSP (chip scale package) structure and preparation method thereof | |
| CN103904197A (en) | LED lamp filament piece, manufacturing method of LED lamp filament piece and LED lamp filament piece bulb | |
| WO2008138183A1 (en) | Side emission type led | |
| CN102881812B (en) | Manufacturing method for Light emitting diode packaging structure | |
| CN101276866B (en) | High power LED bracket as well as high power LED made by the same | |
| CN201708188U (en) | Ceramic high-power light emitting diode | |
| CN105870297A (en) | LED light source and packaging method thereof | |
| CN104952864A (en) | LED (light emitting diode) lamp filament and manufacturing method thereof | |
| CN102810618B (en) | Semiconductor packaging structure | |
| WO2019148934A1 (en) | Lighting fixture, in-line led bead, and manufacturing method | |
| CN205592654U (en) | LED light reflecting strip and use this LED light reflecting strip's LED filament ball bubble lamp and LED fluorescent tube | |
| CN104576900A (en) | Packaging method of LED chip | |
| CN104091880A (en) | Ultrathin and high-efficiency BT (Bismaleimide Triazine)-type LED (Light-Emitting Diode) filament and manufacturing process thereof | |
| CN105757467A (en) | LED light-emitting lamp bar as well as LED filament bulb lamp and LED lamp tube using same | |
| CN206349399U (en) | White light is without encapsulation LED flips lamp grain | |
| CN104282820A (en) | Light-emitting diode and encapsulating method thereof | |
| CN103542298B (en) | The LED fluorescent tube encapsulating structure that a kind of production efficiency is high | |
| CN207977348U (en) | Lamps and lanterns and direct insertion LED lamp bead |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140806 |