CN108162300A - Mold for resin-molding, one-time forming die, secondary forming die and resin forming product manufacturing method - Google Patents
Mold for resin-molding, one-time forming die, secondary forming die and resin forming product manufacturing method Download PDFInfo
- Publication number
- CN108162300A CN108162300A CN201710996372.8A CN201710996372A CN108162300A CN 108162300 A CN108162300 A CN 108162300A CN 201710996372 A CN201710996372 A CN 201710996372A CN 108162300 A CN108162300 A CN 108162300A
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- China
- Prior art keywords
- mold
- resin
- molded product
- primary molded
- forming die
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Links
- 229920005989 resin Polymers 0.000 title claims abstract description 218
- 239000011347 resin Substances 0.000 title claims abstract description 218
- 238000000465 moulding Methods 0.000 title claims abstract description 58
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 93
- 238000000034 method Methods 0.000 claims abstract description 29
- 238000007654 immersion Methods 0.000 claims abstract description 24
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 17
- 230000002093 peripheral effect Effects 0.000 abstract description 23
- 230000003287 optical effect Effects 0.000 abstract description 10
- 238000007789 sealing Methods 0.000 description 15
- 239000003822 epoxy resin Substances 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- 238000002844 melting Methods 0.000 description 12
- 230000008018 melting Effects 0.000 description 12
- 230000002950 deficient Effects 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- 230000001681 protective effect Effects 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 238000013007 heat curing Methods 0.000 description 4
- 238000007493 shaping process Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000009738 saturating Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 239000004425 Makrolon Substances 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 208000007578 phototoxic dermatitis Diseases 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The present invention provides the manufacturing method of mold for resin-molding, one-time forming die, secondary forming die and resin forming product, for forming the resin forming product of exposed portion on the surface of optical element using two color forming techniques, inhibit leakage of the resin material to exposed portion while excessive pressure can not be brought to primary molded product, shape resin forming product.Resin formation part (16), pit part (17) are formed in the cavity recess portion (13) of secondary upper die mold (1) and positioned at the protrusion (18) of the outer peripheral edge of pit part (17).Resin formation part (16) is the part for the supporting member that primary molded product (8) is formed on the peripheral surface of primary molded product (8) shaped by transparent resin.The part of the lens section (19) of primary molded product (8) is covered when pit part (17) is resin seal.In addition, protrusion (18) is the immersion abutted with the outer peripheral edge of the lens section of primary molded product (8) (19) in resin seal to inhibit resin to lens section (19) side, and the part for exposing lens section (19).
Description
Technical field
The present invention relates to the manufactures of mold for resin-molding, one-time forming die, secondary forming die and resin forming product
Method.
Background technology
In the past, carried out embedded forming, the electronic components such as the insertion forming resin-encapsulated semiconductor and to manufacture resin close
Envelope encapsulation.In insertion forming, substrate of electronic component or subsidiary electronic component etc. is fixed on mould inside, makes melting
Resin be filled in cavity and cure, and make substrate of subsidiary electronic component etc. and ester moulding integrally.
According to the difference of the type for the electronic components such as semiconductor for being sealed in resin seal encapsulation, there are a kind of resin into
Shape product, the resin forming product resin is once-forming by optical elements such as lens, and part thereof of surface is made to be exposed to outside, and
And make the primary molded product of supporting optics integrally formed with secondary forming resin.
In such resin forming product, such as two color forming techniques can be utilized, i.e., with transparent resin raw material by lens
Wait optical elements it is once-forming, later, with the pigmentary resins raw material such as black make the primary molded product of supporting optics secondary into
Shape.
In two color forming techniques, using one-time forming die and secondary forming die, one-time forming die filling is transparent
Resin raw material and shape primary molded product, the resin raw material of secondary forming die filled coloring exposes optical element, makes branch
Hold the supporting member forming of optical element.
Make the optical elements such as lens and the integrally formed method of supporting member as using two color forming techniques, for example,
It is proposed there is the manufacturing method and mold for resin-molding of the resin forming product described in patent document 1.
In the mold for resin-molding recorded in patent document 1, the resin forming product 100 shown in Figure 11 is shaped.Tree
The transparent resin of resin-formed product 100 makes optical element 101 once-forming, exposes optical element 101, and in secondary forming
Make supporting member 102 integrally formed with pigmentary resin material.
Existing technical literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2012-51291 bulletins
Invention content
The subject that the invention solves
Here, insertions using the resin forming product described in patent document 1 as representative, using two color forming techniques into
In shape, in the case where manufacture makes a part for primary molded product be exposed to external resin forming product, in secondary forming tree
When fat seals, it is necessary to cover the exposed portion.Masking is for example by making have concave shape set on secondary forming die
Insert be closely attached on the peripheral surface of exposed portion and carry out.
When carrying out the masking, generated between exposed portion and insert gap or make exposed portion and insert this two
In the case that power that component is adjacent to is insufficient, when filling secondary forming pigmentary resin material, there are resin material leakages
And exposed portion is immersed in, the problem of resin is attached to the surface of exposed portion.If resin is attached to exposed portion, exposed division
The function that dividing should play is damaged, and product can be caused bad.
Therefore, in the manufacturing process of previous resin forming product, in order to inhibit resin to the immersion of exposed portion and
When being molded with secondary forming die, in the state of insert is made to be abutted with exposed portion, to the peripheral portion of exposed portion
Apply certain pressure.
Here, make the general hardness of transparent resins raw material such as the makrolon of exposed portion forming low, sometimes due to during masking
Generated pressure deforms in the inside of transparent resin.
If the inside in transparent resin deforms, following unfavorable condition can be generated：Generate the base from primary molded product
The stripping of plate side, be connected to semiconductor chip wire deformation.
The present invention be in view of above point and propose, and it is an object of the present invention to provide a kind of mold for resin-molding, once-forming
The manufacturing method of mold, secondary forming die and resin forming product, for forming exposed portion using two color forming techniques
Resin forming product inhibits leakage of the resin material to exposed portion while excessive pressure can not be brought to primary molded product, makes
Resin forming product shapes.
Means for solving the problems
To achieve these goals, mold for resin-molding of the invention is by one-time forming die and secondary forming die structure
Into the one-time forming die fills the moulding material of translucency into the first inner space formed by a pair of of mold and resin is close
The base material of the subsidiary electronic component of envelope；The secondary forming die fills thermosetting into the second inner space formed by another pair mold
The moulding material for the property changed, the resin seal in a manner of exposing the part for primary molded product shaped by the one-time forming die
The primary molded product, wherein, the one-time forming die has：Load the first mould of the base material of the subsidiary electronic component
Tool；And second mold, which forms small in first inner space being collectively formed with first mold
Space, the small spatial mode are contoured to the pit of exposed portion and are formed on the step of the periphery of the pit, it is described it is secondary into
Shape mold has：Load the third mold of the primary molded product；And the 4th mold, the 4th mold cover it is described primary
In the state of the exposed portion imitated using the small space in formed products and the part formed by the step, with
Second inner space is collectively formed in the third mold.
Here, it is attached to shape the resin seal into the first inner space of one-time forming die using one-time forming die
The primary molded product of the base material of having electronic part, the one-time forming die are filled out into the first inner space formed by a pair of of mold
Fill the moulding material of translucency and resin seal is attached to the base material of electronic component.In addition, subsidiary electronic component said here
Base material, refer to the various substrates such as the electronic circuit board including printed base plate or including lead frame etc. including
Base material.
It in addition, can be using secondary forming die forming exposing primary molded product partially to the second shaping dies
The resin forming product of resin seal is carried out in second inner space, the secondary forming die is to second formed by another pair mold
The moulding material of Thermocurable is filled in inner space, and to expose the one of primary molded product shaped by one-time forming die
The mode resin seal primary molded product divided.
In addition, the second mold can be utilized, dew is formed in the primary molded product being sealed by resin in the first inner space
Go out part, and the periphery in the exposed portion forms shape corresponding with step, second mold with one-time forming die
The first inner space for being collectively formed of the first mold in form small space, the small spatial mode be contoured to the pit of exposed portion with
And it is formed on the step of the periphery of the pit.In addition, the exposed portion said here for being formed on primary molded product is example
Such as become the part of lens optical element.
In addition, the exposed portion imitated using small space and the part formed by step in primary molded product is covered
In the state of, the 4th mold that the second inner space is collectively formed with third mold can be utilized, is made on one side by the second mold
The exposed portion of the primary molded product of pit formation not being thermally cured property resin covering and be exposed to outside, on one side inhibit resin
Immersion to the exposed portion.That is, when the resin of Thermocurable is filled in the second inner space, covered by the 4th mold
The exposed portion imitated using the small space in primary molded product and the part formed by step, can inhibit resin to exposing
Partial immersion.
It is imitated in the second inner space with the small space of utilization in primary molded product in addition, being imitated out in the 4th mold
The contact site that abuts of the part that is formed by step in the case of, using third mold and the 4th mold to primary molded product
When being molded, the contact site of the 4th mold is connect with what is imitated using the small space in primary molded product by the part that step is formed
It touches.By the contact, it can stop immersion of the heat reactive resin of melting to the exposed portion of primary molded product.In addition, for example,
When concave shape is in the part formed by step that the small space in using primary molded product is imitated, because of the heat cure of melting
Property resin so the displacement distance of resin is elongated, therefore can make resin be difficult to be attached to primary molded product by sunk part
Exposed portion.
In addition, in a second mold, the concave shape for being configured in the periphery of pit is formed step, in the 4th mold
In, the shape in the state of the exposed portion being formed of pits in covering primary molded product and the protrusion formed by concave shape
It is and primary when being molded using third mold and the 4th mold to primary molded product in the case of the second inner space
Protrusion that the concave shape of the second mold in formed products is correspondingly formed, be formed on exposed portion periphery protrusion quilt
4th mold covers.Thereby, it is possible to stop immersion of the heat-curing resin of melting to the exposed portion of primary molded product.Separately
Outside, the flowing of the heat-curing resin of melting can be prevented the protrusion of primary molded product application pressure, and resin can be made
It is difficult to be attached to the exposed portion of primary molded product.
In addition, to achieve these goals, one-time forming die of the invention is by first formed by a pair of of mold
The moulding material of translucency is filled in inner space and resin seal is attached to the base material of electronic component, shapes primary molded product,
The primary molded product is empty to the second inside by being formed as another pair mold of secondary forming die in about subsequent process
Between middle filling Thermocurable moulding material, and be sealed by resin in a manner of the part for exposing the primary molded product, wherein,
The one-time forming die has：Load the first mold of the base material of the subsidiary electronic component；And second mold, with institute
It states in first inner space that the first mold is collectively formed and forms small space, which is contoured to the recessed of exposed portion
Cheat and be formed on the step of the periphery of the pit.
It is here, close and resin by the moulding material that translucency is filled into the first inner space formed by a pair of of mold
The base material of the subsidiary electronic component of envelope, can shape to the first inner space resin seal be attached to electronic component base material it is primary into
Shape product.
In addition, by filling Thermocurable into the second inner space formed by another pair mold of secondary forming die
Moulding material, and resin seal is carried out in a manner of the part for exposing primary molded product, secondary forming mould can be formed in
Tool the second inner space in a manner of the part for exposing primary molded product to the primary molded product carry out resin seal and
Into resin forming product.
In addition, form the recessed of exposed portion using being formed to imitate in the first inner space being collectively formed with the first mold
Second mold in the small space of the step of the periphery of the pit is cheated and is formed on, it can be in the first inner space by resin
Exposed portion is formed in the primary molded product of sealing, and shape corresponding with step can be formed in the periphery of exposed portion.Cause
This, such as when with secondary forming die resin seal primary molded product, primary molded product is covered by using secondary forming die
Exposed portion and be accordingly formed on step exposed portion periphery part, resin material can be inhibited to exposed division
The immersion divided.
In addition, to achieve these goals, secondary forming die of the invention is into second formed by another pair mold
Fill the moulding material of Thermocurable in portion space, and this is primary for resin seal in a manner of the part for exposing primary molded product
Formed products, the primary molded product are set by filling the moulding material of translucency to the first inner space formed by a pair of of mold
Fat sealing is attached to the base material of electronic component to obtain, wherein, the secondary forming die has：Third mold, loads by described
One-time forming die forming, have the protrusion for the periphery for being exposed to external lens section and being configured in the lens section or
The primary molded product of recessed portion；And the 4th mold, the lens section and institute in the primary molded product is covered
In the state of stating protrusion or the recessed portion, second inner space is collectively formed with the third mold, it is described secondary
Shaping dies abuts with the protrusion of the primary molded product or the recessed portion and inhibits resin to the lens section
It immerses.
Here, by filling the moulding material of Thermocurable into the second inner space formed by another pair mold and right
Primary molded product carries out resin seal, and the primary molded product is saturating by being filled into the first inner space formed by a pair of of mold
The moulding material of photosensitiveness and resin seal is attached to the substrate of electronic component and is obtained, the moulding material with Thermocurable can be shaped
Resin further is carried out to the primary molded product that resin seal is attached to the base material of electronic component and is shaped in the first inner space
The resin forming product being sealed to form.
In addition, by into the second inner space formed by another pair mold fill Thermocurable moulding material and with
The mode for exposing a part for primary molded product carries out resin seal to the primary molded product, can shape once-forming to expose
The mode of a part for product carries out the primary molded product resin forming product that resin seal forms.
In addition, external lens section is exposed to by having of shaping of above-mentioned one-time forming die using mounting and is configured
In the third mold of the protrusion of the periphery of the lens section or the above-mentioned primary molded product of recessed portion and in covering primary molded product
Lens section and protrusion or recessed portion in the state of, the 4th mold of the second inner space is collectively formed with third mold,
Can make the lens section of primary molded product not the resin covering of being thermally cured property and be exposed to outside.That is, the resin of Thermocurable
When being filled in the second inner space, by the 4th mold cover primary molded product lens section, and can be formed resin not by
The region of filling.In addition, can make on one side the lens section of primary molded product not the resin covering of being thermally cured property and be exposed to outer
Portion inhibits immersion of the resin to the part of the exposing on one side.That is, the resin in Thermocurable is filled in the second inner space
When, protrusion or the recessed portion of the periphery for being configured in lens section in primary molded product are covered by the 4th mold, can be pressed down
Immersion of the resin processed to lens section.
In addition, it abuts to inhibit immersion of the resin to lens section, energy by the protrusion or recessed portion with primary molded product
Resin is enough made to be difficult to be attached to the lens section being exposed of resin forming product.
In addition, to achieve these goals, the manufacturing method of resin forming product of the invention has：Once-forming process,
The once-forming process is made primary by filling the moulding material of translucency into the first inner space of one-time forming die
Formed products shape, the primary molded product have be exposed to external lens section and the protrusion being configured in around the lens section or
Person's recessed portion；And secondary forming process, the secondary forming process make the protrusion or described recessed of the primary molded product
The recessed portion of second inner space of the concave portion with being located at secondary forming die or protrusion abut, and inside described second
The moulding material of Thermocurable is filled in space, to inhibit immersion of the moulding material to the lens section.
Here, by once-forming process, it can be formed in the first inner space and be carried out with the moulding material of translucency
The primary molded product that resin seal forms, the once-forming process to the first inner space of one-time forming die by filling
The moulding material of translucency and being formed be exposed to external lens section and the protrusion being configured in around lens section or
The primary molded product of recessed portion.It is exposed to external lens section in addition, being equipped in primary molded product and is configured in lens section
The protrusion of surrounding or recessed portion.
In addition, by secondary forming process, can make the being thermally cured property of lens section of primary molded product resin covering and
Outside is exposed to, which makes the protrusion of primary molded product or recessed portion and be located at the of secondary forming die
The recessed portion of two inner spaces or protrusion abut, and to the moulding material of the second inner space filling Thermocurable, with suppression
Immersion of the moulding material processed to lens section.That is, when the resin of Thermocurable is filled in the second inner space, it is primary by making
Either recessed portion is abutted with the recessed portion or protrusion for being located at the second inner space for the protrusion of formed products, can be by lens section shape
The region not being filled as resin.In addition, make the lens section of primary molded product not the resin covering of being thermally cured property and expose,
And immersion of the resin to the part of the exposing can be inhibited.
Invention effect
The mold for resin-molding of the present invention, one-time forming die, secondary forming die and resin forming product manufacturer
Method for being formed the resin forming product of exposed portion using two color forming techniques, can not bring primary molded product excessively
Pressure inhibit leakage of the resin material to exposed portion, shape resin forming product.
Description of the drawings
Fig. 1 is the embodiment for representing the resin sealing apparatus using the mold for resin-molding for applying the present invention
Outline figure.
Fig. 2 is the approximate three-dimensional map using the resin sealing apparatus for the mold for resin-molding for applying the present invention.
Fig. 3 (a) is the state of the upper die and lower die separation for the secondary forming die for having mold for resin-molding
Perspective illustration, (b) are the perspective illustrations of the internal structure for the secondary forming die for representing Fig. 3 (a).
Fig. 4 is the local wide figure on the upper mold for representing secondary forming die and the periphery of cavity recess portion.
Fig. 5 (a) is the vertical view and sectional view of the primary molded product shaped by one-time forming die, (b) be it is secondary into
The vertical view of the secondary upper die mold of shape mold and vertical view and sectional view when molding primary molded product, (c) is tree
The vertical view and sectional view of resin-formed product.
Fig. 6 (a) is the vertical view and sectional view of the primary molded product shaped by one-time forming die, (b) be it is secondary into
The vertical view of the secondary upper die mold of shape mold and vertical view and sectional view when molding primary molded product, (c) is tree
The vertical view and sectional view of resin-formed product.
Fig. 7 (a) is the sectional view for representing the upper model cavity block in other embodiment, and (b) is to represent another embodiment party
The sectional view of upper model cavity block in formula.
Fig. 8 (a) be represent be laid with protective film upper model cavity block sectional view, (b) be represent be laid with protective film other
Embodiment in upper model cavity block sectional view.
Fig. 9 (a)~(d) is the sectional view for representing to be formed on the pattern of the shape of the protrusion of cavity recess portion.
Figure 10 (a)~(c) is the process of the flow for the resin seal for representing the primary molded product using secondary forming die
Figure.
Figure 11 is the sectional view of previous resin forming product for representing to shape using two color forming techniques.
Specific embodiment
Hereinafter, with reference to attached drawing, the embodiment that the present invention will be described in detail.
As shown in Figure 1, resin sealing apparatus A is made of such as lower component：By secondary forming upper mold and secondary forming lower die structure
Into secondary forming die B, the secondary forming upper mold is by upper mold die holder 420 and secondary upper die mold (Japanese：チ ェ ス) 1 structure
Into the secondary forming lower die is made of lower die die holder 430 and secondary lower die mold 2；Resin injection device 3；And molding dress
4 are put, which drives upside down mold, is opened and closed mold.In addition, resin sealing apparatus A is with transport substrate and once
The base-board conveying devices of formed products, the product handling device (equal illustration omitted) for transporting the formed products after resin seal.It is secondary into
Shape mold B is an example of the secondary forming die of the present invention.In addition, in the present embodiment, by lower die die holder 430 relative to upper
The position of mould die holder 420 be set as " under ", upper mold die holder 420 is set as relative to the position of lower die die holder 430 " on ".
Secondary forming die B is with the mold of the epoxy resin sealing primary molded product of black, the primary molded product
By being configured with the resin sealing apparatus (not shown) of one-time forming die, with transparent resin to the base material of subsidiary electronic component into
Row resin seal forms.Secondary forming die B by the lens section that the transparent resin of primary molded product shapes so as to be exposed to outside
Mode carry out resin seal.In addition, resin sealing apparatus A is equipped with the device of secondary forming die B, but once-forming mould
Tool is also same apparatus structure (part of a upper die mold and a lower die mold is different), and is configured in others
Resin sealing apparatus.In the resin sealing apparatus for being configured with the one-time forming die, primary molded product is shaped, and utilizes substrate
Conveyer, primary molded product are transported to resin sealing apparatus A.
Upper mold die holder 420 is the component for supporting secondary upper die mold 1, and lower die die holder 430 is the secondary lower die mold 2 of bearing
Component.Secondary upper die mold 1 and secondary lower die mold 2 have the cavity of injection resin material, synergistically manufacture ester moulding
Product.Secondary upper die mold 1 and secondary lower die mold 2 can later be chatted according to the variety exchanging of formed products, detailed structure
It states.No matter in addition, in principle the type of formed products and identical upper mold die holder 420 and lower die die holder 430 can be used.
Resin injection device 3 is in the state of being molded to secondary forming device B, is made on one side by aftermentioned tank (day
Text：Port ッ ト) heating epoxy resin resin sheet melting, on one side squeeze out Thermocurable resin material device.
As shown in Figure 1, mold closing mechanism 4 has the multiple connecting rods 41 being generally parallel to each other set in the up-down direction.
The upper end of each connecting rod 41 is connected by stationary platen 42.Moreover, the lower end of each connecting rod 41 connects with base station plate (not shown)
It connects.
In addition, it can be embedded with movable platen up and down in a manner of passing through each connecting rod 41 respectively in each connecting rod 41
43.Movable platen 43 can be lifted using driving portion (illustration omitted) is lifted with required stroke, lifting driving portion tool
Standby hydraulic cylinder is driven by motor via actuators such as the toggle devices of ball-screw.
Upper mold die holder 420 is fixed in the lower surface of stationary platen 42.It is fixed on secondary in the downside of upper mold die holder 420
Mould mold 1.Lower die die holder 430 is fixed in the upper surface of movable platen 43.Be fixed in the upside of lower die die holder 430 it is secondary under
Mould mold 2.
As shown in Fig. 2, secondary lower die mold 2 makes drag cavity block 5 and 6 integration of tank block and is formed as thick plate-like.
The upper surface of drag cavity block 5 loads the primary molded product 8 that useful transparent resin resin seal substrate 7 forms.It is formed in tank block 6
There is the tank 9 of heated resin material.
As shown in Fig. 3 (a) and Fig. 3 (b), upper surface and the secondary upper mold of the drag cavity block 5 in secondary lower die mold 2
The lower surface interoperation of upper model cavity block 10 in mold 1 forms the land area of clamping primary molded product 8.
Secondary upper die mold 1 makes model cavity block 10 and defective material (Japanese：カ Le) block 11 is integrated and is formed as slab
Shape.The defective material portion 12 connected when defective material block 11 is formed with molding with tank block 6 (with reference to Fig. 3 (b)).In addition, in upper model cavity block
Cavity recess portion 13 is formed in 10, defective material portion 12 and cavity recess portion 13 are connected using resin passage 14.
When being molded to secondary upper die mold 1 and secondary lower die mold 2, cavity recess portion 13 be formed on once
The opposite position in region that formed products 8 are loaded, becomes the region that resin material is filled.It is opposite with the shape of cavity recess portion 13
It answers and shapes resin forming product 15, which carries out primary molded product 8 with epoxy resin resin seal into (ginseng
According to Fig. 5 (c)).It is described after the shape of resin forming product 15.
Primary molded product 8 has the hemispherical lens section 19 formed by transparent resin (with reference to Fig. 3 (a) and Fig. 3
(b)).Lens section 19 becomes and outside is exposed in the resin forming product 15 after secondary forming for example with optical element
Part.
As shown in figure 4, secondary upper die mold 1 cavity recess portion 13 be formed with resin formation part 16, pit part 17 and
Positioned at the protrusion of the outer peripheral edge of pit part 17 18.Resin formation part 16 is in the outer of the primary molded product 8 shaped by transparent resin
The part of the supporting member of primary molded product 8 is formed on circumferential surface.The saturating of primary molded product 8 is covered when pit part 17 is resin seal
The part in mirror portion 19.In addition, protrusion 18 is to abut and press down with the outer peripheral edge of the lens section of primary molded product 8 19 in resin seal
Immersion of the resin processed to 19 side of lens section, and the part for exposing lens section 19.Protrusion 18 is equivalent to the application claim
The component of " contact site ".
Primary molded product 8 and secondary forming die B is further illustrated using Fig. 5 (a)~Fig. 5 (c).Primary molded product 8 is logical
It crosses transparent resin to carry out resin seal in the upper surface of substrate 7 and formed, as shown in Fig. 5 (a), with main part 20 and above-mentioned
Lens section 19.In addition, the outer peripheral edge of the lens section 19 in main part 20 is formed with recessed portion 21.
When the recessed portion 21 of primary molded product 8 is the molding of secondary forming die B and in above-mentioned secondary upper die mold 1
The part that the protrusion 18 of cavity recess portion 13 abuts.The shape of main part 20, lens section 19 and recessed portion 21 in primary molded product 8
Shape is shaped using one-time forming die (not shown).That is, the cavity for forming a upper die mold of one-time forming die is recessed
Imitate the shape (equal illustration omitted) of primary molded product 8 in portion.Small space is formed in the cavity recess portion of a upper die mold, this is small
It imitates hemispherical pit part corresponding with the lens section 19 of primary molded product 8 and is formed on the outer peripheral edge of the pit part in space
The protrusion as step.
As shown in Fig. 5 (b), in the state of being molded by secondary forming die B, it is placed in secondary lower die mold 2
In the primary molded product 8 of upper surface of drag cavity block 5 be located at cavity with the upper model cavity block 10 in secondary upper die mold 1
The opposite position of recess portion 13.
The lens section 19 of primary molded product 8 is covered by the pit part 17 of cavity recess portion 13.In addition, primary molded product 8 is recessed
Concave portion 21 abuts (with reference to the figure of the downside of Fig. 5 (b)) with the protrusion 18 of cavity recess portion 13.In addition, the main part of primary molded product 8
20 peripheral surface is covered by the resin formation part 16 of cavity recess portion 13.Resin formation part 16 with supply epoxy resin, with tank 9 with
And the resin passage 14 that defective material portion 12 connects connects (with reference to the figure of the downside of Fig. 5 (b)).The epoxy resin of melting leads to via resin
Road 14 is filled in the resin formation part 16 of cavity recess portion 13.
When epoxy resin is filled, the resin material of melting fills up resin formation part 16, however cavity recess portion 13 is convex
Portion 18 is abutted with the recessed portion 21 of primary molded product 8, and can inhibit immersion of the resin material to lens section 19.In addition, when tree
When fat material will be immersed towards lens section 19, due to the shape flowing along recessed portion 21, so resin material is in order to reach lens
Displacement distance needed for portion 19 is elongated, and resin can be made to be difficult to be attached to lens section 19.In this case, because with recessed portion 21
Shape hinder towards lens section 19 resin immersion, so can be in the molding of secondary forming die not to lens section 19
And its region of periphery is molded with applying pressure.
As shown in Fig. 5 (c), with epoxy resin sealing primary molded product 8 resin forming product 15 have by epoxy resin into
Shape is in the supporting member 22 of the peripheral surface of primary molded product 8.It is not covered and exposes by supporting member 22 in addition, lens section 19 becomes
In external exposed division 23.
In above-mentioned primary molded product 8 and secondary forming die B, when secondary forming die B is molded, secondary upper mold mould
The pit part 17 of cavity recess portion 13 in tool 1 and protrusion 18 become lens section 19 and its outer peripheral edge of covering primary molded product 8
Recessed portion 21 state.As a result, in the resin forming product 15 after secondary forming, lens section 19 is exposed to outside, and ring
Oxygen resin is not attached to lens section 19.
Other embodiments in primary molded product (one-time forming die) and secondary forming die are illustrated.
As shown in Fig. 6 (a), primary molded product 24 is by the way that transparent resin resin seal is formed in the upper surface of substrate 25.Once into
Shape product 24 have main part 26 and lens section 27.In addition, the outer peripheral edge of the lens section 27 in main part 26 is formed with protrusion 28.
The protrusion 28 of primary molded product 24 is with being formed in secondary upper die mold 29 when secondary forming die molds
Cavity recess portion 30 recessed portion 31 abut part (with reference to Fig. 6 (b)).Main part 26, lens section in primary molded product 24
27 and protrusion 28 shape using one-time forming die (not shown) and shape.That is, form one-time forming die it is primary on
The cavity recess portion of mould mold imitates the shape (equal illustration omitted) of primary molded product 24.In the cavity recess portion shape of a upper die mold
Cheng You little spaces, the small space as step imitate corresponding with the lens section 27 of primary molded product 24 hemispherical pit part,
With the recessed portion as step of outer peripheral edge for being formed on the pit part.
As shown in Fig. 6 (b), in the state of being molded by secondary forming die, it is placed in secondary lower die mold 32
In drag cavity block 33 upper surface primary molded product 24 be located at and the upper model cavity block 34 in secondary upper die mold 29
The opposite position of cavity recess portion 30.
The lens section 27 of primary molded product 24 is covered by the pit part 35 of cavity recess portion 30.In addition, primary molded product 24
Protrusion 28 abuts (with reference to the figure of the downside of Fig. 6 (b)) with the recessed portion 31 of cavity recess portion 30.In addition, the master of primary molded product 24
The peripheral surface in body portion 26 is covered by the resin formation part 36 of cavity recess portion 30.Resin formation part 36 is connect with resin passage 37, should
Resin passage 37 connects (with reference to the figure of the downside of Fig. 6 (b)) with tank and defective material portion (not shown).The epoxy resin warp of melting
The resin formation part 36 of cavity recess portion 30 is filled in by resin passage 37.
When epoxy resin is filled, the resin material of melting fills up resin formation part 36, however cavity recess portion 30 is recessed
Concave portion 31 is abutted with the protrusion 31 of primary molded product 24, and can inhibit immersion of the resin material to lens section 27.In addition, two
During secondary shaping dies molding, by applying certain pressure in the position of the protrusion of primary molded product 24 31, can further it press down
Immersion of the resin material processed to lens section 27.At this point, since pressure when molding is not applied to the part of lens section 27, but
It is applied to positioned at the protrusion 31 of its outer peripheral edge, so the generation of the deformation of the inside of lens section 27 can be inhibited.
As shown in Fig. 6 (c), the resin forming product 38 formed with epoxy resin sealing primary molded product 24 has by asphalt mixtures modified by epoxy resin
The supporting member 39 that the peripheral surface that fat is formed in primary molded product 24 forms.In addition, lens section 27 becomes not by supporting member 39
It covers and is exposed to external exposed division 40.
In above-mentioned primary molded product 24 and secondary forming die, when secondary forming die molds, secondary upper mold mould
The pit part 35 and recessed portion 31 of cavity recess portion 30 in tool 29 are as the lens section 27 for covering primary molded product 24 and its outside
The state of the protrusion 28 of periphery.As a result, in the resin forming product 38 after secondary forming, lens section 27 is exposed to outside, and ring
Oxygen resin is not attached to lens section 27.
Another embodiment of secondary forming die will be illustrated next.
Cavity recess portion 45 in the cavity block 44 of secondary upper die mold shown in Fig. 7 (a) has pit part 46 and protrusion
47.Pit part 46 has the shape chimeric along the peripheral surface of the hemispherical lens section 49 of primary molded product 48.In addition, figure
Cavity recess portion 51 in the cavity block 50 of secondary upper die mold shown in 7 (b) has pit part 52 and recessed portion 53.Pit part
52 have the shape chimeric along the peripheral surface of the hemispherical lens section 55 of primary molded product 54.
Pit part 46 and pit part 52 shown in Fig. 7 (a) and Fig. 7 (b) in above-mentioned pit part 17, pit part 35
In slightly to generate space different (with reference to Fig. 5 (b) and Fig. 6 (b)) top of each lens section 19,27, become along each hemispherical
Lens section 49,55 hemispherical peripheral surface and the shape that is completely fitted.For each pit part 46,52 with above-mentioned shape
Secondary upper die mold cavity block 44,50, pass through protrusion 47, recessed portion 53 and each lens section 49,55 outer peripheral edge part
It abuts, immersion of the resin material 56 that can also inhibit to melt to each lens section 49,55 sides, and each lens section 49 of forming exposing,
55 resin forming product.
In addition, the structure as secondary forming die, as shown in Fig. 8 (a) and Fig. 8 (b), can also use uses buffering
Protective film 61 be adjacent to the structure of each cavity recess portion 59,60 in the cavity block 57,58 of secondary upper die mold.By making protective film
61 follow the peripheral surface of each primary molded product 62,63, can reduce secondary forming die molding when, to each primary molded product
62nd, the influence of 63 pressure.It is each with primary molded product by protrusion 66, recessed portion 67 in the structure using protective film 61
The part of the outer peripheral edge of lens section 64,65 is abutted, and can also inhibit the resin material 68 melted to each lens section 64,65 sides
Immersion, and shape the resin forming product for exposing each lens section 64,65.
By Fig. 9 (a)~Fig. 9 (d), illustrate the upper model cavity for being formed on secondary upper die mold cavity recess portion in the block
, the variation of the shape of protrusion.It is formed on the upper model cavity type in the block of the above-mentioned secondary upper die mold 1 shown in Fig. 9 (a)
The front end face that the protrusion 18 of chamber recess portion 13 abuts in cross section with primary molded product 8 is flat shape, from front end face to base portion
Side has inclined-plane.
The not only shape of such protrusion 18, and the protrusion 70 for being for example formed on cavity recess portion 69 is also front end face band
The shape of fillet, and there is inclined-plane from front end face to base portion side (with reference to Fig. 9 (b)).In addition, it is formed on the convex of cavity recess portion 71
Portion 72 is the flat shape of front end face, has inclined-plane from front end face to base portion side, and have between front end face and inclined-plane by smooth
Curved surface connection shape (with reference to Fig. 9 (c)).Moreover, being formed on the protrusion 74 of cavity recess portion 73 has the sharp shape in front end
Shape (with reference to Fig. 9 (d)).
Each protrusion 18,70,72 and 74 shown in Fig. 9 (a)~Fig. 9 (d) is outer with each lens section of primary molded product
The part of periphery abuts, and inhibits immersion of the resin material of melting to each lens section side.It is corresponding with protrusion 18,70,72 and 74
Primary molded product form the recess portion of the shape for imitating each protrusion.In addition, in 74 corresponding primary molded product of protrusion, lens
The periphery in portion is shaped as flat, and the sharp front end of protrusion 74 is pierced into the flat face, primary molded product and cavity recess portion 73
It abuts, immersion of the resin material to lens section side can be hindered.Like this, secondary upper mold mould can be formed on using various
The shape of the protrusion of cavity recess portion in tool.
Hereinafter, the flow for using the manufacture of the resin-seal molding product of above-mentioned secondary forming die B is illustrated.
As shown in Figure 10 (a), primary molded product 8 is transported to the secondary upper die mold 1 and two for forming secondary forming die B
Between secondary lower die mold 2.Base material is sealed to form shape by primary molded product 8 using one-time forming die with transparent resin, utilizes base
Plate conveyer transports (not shown).The primary molded product 8 being transported is placed in the upper surface of drag cavity block 5.
Later, above-mentioned movable platen 43 rises, and with the action, is fixed in movable platen 43 and lower die die holder
430 secondary lower die mold 2 rises, and becomes the drag cavity block 5 of secondary lower die mold 2 and the upper model of secondary upper die mold 1
The state that cavity block 10 molds.
At this point, the cavity recess portion 13 of upper model cavity block 10 covers primary molded product 8, in drag cavity block 5 and upper model cavity
Inner space (the second inner space for being equivalent to the application claim) is formed between block 10.In inner space, cavity is recessed
The pit part 17 in portion 13 covers the lens section 19 of primary molded product 8.In addition, the protrusion 18 of cavity recess portion 13 and primary molded product 8
Recessed portion 21 abut.
In the state of secondary forming die B is molded, make the resin sheet of epoxy resin heated by above-mentioned tank 9 on one side
Melting squeezes out the resin material 75 of Thermocurable using resin injection device 3 on one side.Resin material 75 flows through defective material from tank 9
Portion 12 and resin passage 14, are filled in cavity recess portion 13.Moreover, pressure is kept by the heat-curing resin 75 for making to melt
Cure to power, seal primary molded product 8 and form the resin forming product 15 shown in Figure 10 (c).
After resin seal, decline movable platen 43, with the action, secondary lower die mold 2 declines, and becomes secondary lower die
The state that the upper model cavity block 10 of the drag cavity block 5 of mold 2 and secondary upper die mold 1 molds is (on the left of Figure 10 (c)
Figure).There is resin forming product 15 lens section 19 to be exposed to external exposed division 23, pass through product in the state of defective material 76 is connected
Conveyer (not shown) is transported from the drag cavity block 5 of secondary lower die mold 2, by above flow, based on it is secondary into
The secondary forming completion of shape mold B, resin forming product 15 are shaped.
As described above, for forming the resin forming product of exposed portion, tree of the invention using two color forming techniques
Fat sealing can not inhibit while excessive pressure is brought to primary molded product leakage of the resin material to exposed portion with mold, make
Resin forming product shapes.
In addition, the resin forming product for forming exposed portion using two color forming techniques, of the invention is once-forming
Mold inhibits leakage of the resin material to exposed portion while excessive pressure can not be brought to primary molded product, makes ester moulding
Product shape.
In addition, the resin forming product for forming exposed portion using two color forming techniques, of the invention is secondary forming
Mold inhibits leakage of the resin material to exposed portion while excessive pressure can not be brought to primary molded product, makes ester moulding
Product shape.
Moreover, the resin forming product for forming exposed portion using two color forming techniques, ester moulding of the invention
The manufacturing method of product inhibits leakage of the resin material to exposed portion while excessive pressure can not be brought to primary molded product, makes
Resin forming product shapes.
Reference sign
1：Secondary upper die mold；2：Secondary lower die mold；3：Resin injection device；4：Mold closing mechanism (decompressor)；5：
Drag cavity block；6：Tank block；7：Substrate；8：Primary molded product；9：Tank；10：Upper model cavity block；11：Defective material block；12 defective material portions；
13；Cavity recess portion；14：Resin passage；15：Resin forming product；16：Resin formation part；17：Pit part；18：Protrusion；19：Lens
Portion；20：Main part；21：Recessed portion；22：Supporting member；23：Exposed division；24：Primary molded product；25：Substrate；26：Main part；
27：Lens section；28：Protrusion；29：Secondary upper die mold；30：Cavity recess portion；31：Recessed portion；32：Secondary lower die mold；33：Under
Model cavity block；34：Upper model cavity block；35：Pit part；36：Resin formation part；37：Resin passage；38：Resin forming product；39：
Supporting member；40：Exposed division；41：Connecting rod；42：Stationary platen；43：Movable platen；44：Upper model cavity block；45：Cavity is recessed
Portion；46：Pit part；47：Protrusion；48：Primary molded product；49：Lens section；50：Upper model cavity block；51：Cavity recess portion；52：It is recessed
Hole portion；53：Recessed portion；54：Primary molded product；55：Lens section；56：Resin material；57：Upper model cavity block；58：Upper model cavity
Block；59：Cavity recess portion；60：Cavity recess portion；61：Protective film；62：Primary molded product；63：Secondary forming product；64：Lens section；
65：Lens section；66：Protrusion；67：Recessed portion；68：Resin material；69：Cavity recess portion；70：Protrusion；71：Cavity recess portion；72：It is convex
Portion；73：Cavity recess portion；74：Protrusion；75：Resin material；76：Defective material；420：Upper mold die holder；430:Lower die die holder.
Claims (6)
1. a kind of mold for resin-molding, is made of one-time forming die and secondary forming die, the one-time forming die to by
The moulding material of filling translucency in the first inner space that a pair of of mold is formed and resin seal are attached to the base material of electronic component；
The secondary forming die fills the moulding material of Thermocurable into the second inner space formed by another pair mold, to expose
Primary molded product described in the mode resin seal of a part for primary molded product shaped as the one-time forming die, feature
It is,
The one-time forming die has：Load the first mold of the base material of the subsidiary electronic component；And second mold, it should
Second mold forms small space in first inner space being collectively formed with first mold, the small spatial mode profiling
Into exposed portion pit and be formed on the pit periphery step,
The secondary forming die has：Load the third mold of the primary molded product；And the 4th mold, the 4th mold
It the exposed portion imitated using the small space in the primary molded product is covered and is formed by the step
In the state of part, second inner space is collectively formed with the third mold.
2. mold for resin-molding according to claim 1, which is characterized in that
4th mold imitates out contact site, the contact site in second inner space in the primary molded product
The part formed by the step imitated using the small space is abutted.
3. according to mold for resin-molding described in claims 1 or 2, which is characterized in that second mold is to be configured
Be formed as the step in the concave shape of the periphery of the pit,
4th mold in the primary molded product is covered by the exposed portion of the pit formation and by institute
In the state of the protrusion for stating concave shape formation, second inner space is formed.
4. a kind of one-time forming die, by the forming material that translucency is filled into the first inner space formed by a pair of of mold
Material and resin seal is attached to the base material of electronic component, shape primary molded product, which will be in about subsequent process
The moulding material of Thermocurable is filled into the second inner space by being formed as another pair mold of secondary forming die, and
It is sealed by resin in a manner of the part for exposing the primary molded product, which is characterized in that
The one-time forming die has：Load the first mold of the base material of the subsidiary electronic component；And second mold,
Small space is formed in first inner space being collectively formed with first mold, which is contoured to exposed portion
Pit and be formed on the pit periphery step.
5. a kind of secondary forming die fills the forming material of Thermocurable into the second inner space formed by another pair mold
Material, and resin seal primary molded product in a manner of the part for exposing primary molded product, the primary molded product by by
The moulding material of the first inner space filling translucency that a pair of of mold is formed and resin seal be attached to the base material of electronic component
It obtains, which is characterized in that
The secondary forming die has：
Third mold, load it is being shaped by the one-time forming die, have and be exposed to external lens section and be configured in
The protrusion of the periphery of the lens section or the primary molded product of recessed portion；And
4th mold, the lens section and the shape of the protrusion or the recessed portion in the primary molded product is covered
Under state, second inner space is collectively formed with the third mold,
The secondary forming die abutted with the protrusion of the primary molded product or the recessed portion and inhibit resin to
The immersion of the lens section.
6. a kind of manufacturing method of resin forming product, which is characterized in that
The manufacturing method of the resin forming product has：
Once-forming process, the once-forming process is by filling translucency into the first inner space of one-time forming die
Moulding material and shape primary molded product, which, which has, is exposed to external lens section and is configured in the lens
Protrusion or recessed portion around portion；And
Secondary forming process, the secondary forming process make the primary molded product the protrusion or the recessed portion with being set
It is abutted in the recessed portion of the second inner space of secondary forming die or protrusion, and heat is filled to second inner space
The moulding material of curability, to inhibit immersion of the moulding material to the lens section.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-209934 | 2016-10-26 | ||
| JP2016209934A JP6217998B1 (en) | 2016-10-26 | 2016-10-26 | Resin sealing mold, primary molding mold, secondary molding mold, and resin molded product manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108162300A true CN108162300A (en) | 2018-06-15 |
| CN108162300B CN108162300B (en) | 2020-04-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710996372.8A Expired - Fee Related CN108162300B (en) | 2016-10-26 | 2017-10-24 | Resin sealing mold, primary molding mold, secondary molding mold, and method for producing resin molded article |
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|---|---|
| JP (1) | JP6217998B1 (en) |
| CN (1) | CN108162300B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111175859A (en) * | 2018-11-13 | 2020-05-19 | 株式会社小糸制作所 | 2-color formed lens |
| CN113261085A (en) * | 2018-12-21 | 2021-08-13 | 爱沛股份有限公司 | Resin molding die and resin molding method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6923820B2 (en) * | 2018-10-31 | 2021-08-25 | 日亜化学工業株式会社 | Manufacturing method of package and manufacturing method of light emitting device |
| CN113921426B (en) * | 2021-10-08 | 2022-08-30 | 江苏联康测控有限公司 | Novel radio frequency chip packaging equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102237381A (en) * | 2010-04-22 | 2011-11-09 | 采钰科技股份有限公司 | Method for forming image sensing device and molding apparatus |
| CN103108736A (en) * | 2010-09-02 | 2013-05-15 | 奥林巴斯株式会社 | Method for producing resin molded article and mold for resin molded article |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3026426B2 (en) * | 1996-08-29 | 2000-03-27 | 沖電気工業株式会社 | Resin-sealed semiconductor device, method of manufacturing the same, and mold structure thereof |
| JP2004127962A (en) * | 2002-09-30 | 2004-04-22 | Mitsui High Tec Inc | Resin sealing method of semiconductor device |
| JP4432090B2 (en) * | 2007-07-02 | 2010-03-17 | 株式会社山武 | Multi-molded body |
| JP5076198B2 (en) * | 2008-02-15 | 2012-11-21 | 三菱電機株式会社 | Resin molded part and its manufacturing method |
| JP2012254538A (en) * | 2011-06-07 | 2012-12-27 | Shinsei:Kk | Manufacturing method of complex optical component |
| JP5816399B2 (en) * | 2012-07-19 | 2015-11-18 | Ｔｏｗａ株式会社 | Mold, substrate adsorption mold, resin sealing device, and method for manufacturing resin-sealed electronic component |
-
2016
- 2016-10-26 JP JP2016209934A patent/JP6217998B1/en active Active
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102237381A (en) * | 2010-04-22 | 2011-11-09 | 采钰科技股份有限公司 | Method for forming image sensing device and molding apparatus |
| CN103108736A (en) * | 2010-09-02 | 2013-05-15 | 奥林巴斯株式会社 | Method for producing resin molded article and mold for resin molded article |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111175859A (en) * | 2018-11-13 | 2020-05-19 | 株式会社小糸制作所 | 2-color formed lens |
| CN113261085A (en) * | 2018-12-21 | 2021-08-13 | 爱沛股份有限公司 | Resin molding die and resin molding method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6217998B1 (en) | 2017-10-25 |
| JP2018069503A (en) | 2018-05-10 |
| CN108162300B (en) | 2020-04-10 |
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