CN105280506B - The resin encapsulation method and resin encapsulation equipment of electronic unit - Google Patents
The resin encapsulation method and resin encapsulation equipment of electronic unit Download PDFInfo
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- CN105280506B CN105280506B CN201510169123.2A CN201510169123A CN105280506B CN 105280506 B CN105280506 B CN 105280506B CN 201510169123 A CN201510169123 A CN 201510169123A CN 105280506 B CN105280506 B CN 105280506B
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- mould
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- 229920005989 resin Polymers 0.000 title claims abstract description 170
- 239000011347 resin Substances 0.000 title claims abstract description 170
- 238000000034 method Methods 0.000 title claims abstract description 87
- 238000005538 encapsulation Methods 0.000 title claims abstract description 40
- 239000000463 material Substances 0.000 claims abstract description 69
- 230000007246 mechanism Effects 0.000 claims abstract description 53
- 230000008569 process Effects 0.000 claims description 72
- 238000000465 moulding Methods 0.000 claims description 48
- 239000000758 substrate Substances 0.000 claims description 47
- 238000007789 sealing Methods 0.000 claims description 12
- 238000012546 transfer Methods 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 2
- 238000007667 floating Methods 0.000 abstract description 25
- 238000012423 maintenance Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000009467 reduction Effects 0.000 abstract description 3
- 230000008439 repair process Effects 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 52
- 208000015943 Coeliac disease Diseases 0.000 description 33
- 239000004065 semiconductor Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 230000006837 decompression Effects 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 230000037361 pathway Effects 0.000 description 4
- 238000001721 transfer moulding Methods 0.000 description 4
- 230000003321 amplification Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The present invention relates to the resin encapsulation methods and resin encapsulation equipment of a kind of electronic unit.Easy resin encapsulation method and easy mode structure during by using the resin material for using high fluidity realize the cost reduction for manufacturing resin encapsulation equipment and simplify the operation of its Maintenance and Repair.Have the resin-encapsulated mould including upper die and lower die, be configured to be opened and closed upper die and lower die via clasp mould mechanism.Cavity block is configured to be moved to along open mold direction via the relocation mechanism with the pin that floats to the die joint of upper mold.Cavity and the exhaust hole slot connected with the cavity are set on the die joint of cavity block.In the connecting portion of cavity and exhaust hole slot, the embedded hole towards open mold direction is set.In the floating pin retainer upper edge open mold direction of corresponding embedded hole, gas vent block is set.Gas vent block can be slided and be closely fitted into embedded hole.
Description
Technical field
The present invention relates to one kind to be used for using resin material to small-sized electronic part such as semiconductor lead frame or semiconductor
Semiconductor chip on substrate is packaged the resin encapsulation method of molding electronic unit and the electronics for implementing this method
The improvement of the resin encapsulation equipment of component.
More specifically, be related to a kind of improved resin encapsulation method and resin encapsulation equipment, when to supply be placed on tree
When electronic unit before resin-encapsulated in the cavity of fat Encapsulation Moulds on substrate carries out resin-encapsulated, the tree in cavity can be prevented
The gap that fat is not filled by inside and outside state and resin package covers is formed, and the row that can be effectively prevented outside communicate-type intracavitary
The resin leakage in stomata portion.
Further, it is related to a kind of simplification for implementing the tree of the structure of the resin encapsulation equipment of above-mentioned resin encapsulation method
Fat packaging method and resin encapsulation equipment.
Background technology
For example, in terminal (convex block) electrical connection substrate (semiconductor substrate) and chip (semiconductor chip) via overshooting shape
Flip-chip installation in, it is generally the case that liquid encapsulating material (underfill) is filled into the core connected by convex block
The gap of piece and substrate.
In addition, in recent years, for the purpose of reducing assembly cost etc., so-called use transfer molding is advanced by liquid package material
Material is filled into the technological development of the molded underfill in the gap of chip and substrate.In order to carry out the molded underfill, so that
Liquid encapsulating material is effective and is positively filled into for the purpose of the gap of chip and substrate, needs using after including ultramicron
Filler (packing material) high fluidity resin material (ultra-low viscosity resin).
But as technical matters when carrying out above-mentioned molded underfill, there is the resin from exhaust hole portion
Leakage.That is, the resin material being injected into cavity is applied due to the use of the resin material of high fluidity and in resin forming
Resin pressure etc. as defined in adding, therefore the resin material in cavity is caused easily to be flowed out from exhaust hole portion to outside.
Further, for the purpose of preventing the resin leakage from exhaust hole portion, such as far as possible by the depth of exhaust hole slot
When being set as shallower, the function of making residual air in cavity etc. to outside discharge is damaged, and result causes the problem of more serious,
The inside and outside that the molding resin-encapsulated formed body (resin package covers) in cavity can not be prevented securely from forms gap (gas
Bubble) and defect portion disadvantage.
Therefore, applicant the position in the open mold direction as resin forming mould and with the protrusion of molded product
The exhaust hole pin installing plate for being equipped with exhaust hole pin is continuously arranged in the position that mechanism overlaps, also, the exhaust hole pin is disposed in
The position of exhaust hole slot.Moreover, carry out the resinous wood into cavity in the state of exhaust hole slot is opened via the exhaust hole pin
Expect the decompression process in injection process and cavity.And then, it is proposed that following scheme：With the tail end of resin material injection process
In consistent manner, the state being set to off exhaust hole slot using the exhaust hole pin, thus when to electronic unit progress resin-encapsulated
During molding, gas vent function is not damaged, is also prevented from the resin leakage (referring to patent document 1) from exhaust hole slot.
For the technical solution shown in patent document 1, even if in the resin-encapsulated for the resin material for using high fluidity
In molding, also can by residual air inside cavity etc. is made to be effectively discharged out to outside be prevented securely from resin-encapsulated into
The formation of the internal voids of type body etc..
In addition, the resin material since high fluidity can be efficiently used, can make liquid encapsulating material effective
And positively it is filled into the gap of the chip and substrate in being flip-chip mounted.Therefore, it is possible to realize the molding bottom for utilizing transfer molding
It fills in portion.
In addition, can be effectively prevented be injected into the molten resin material of the high fluidity in cavity by exhaust hole slot to
Outside outflow.
However, due to patent document 1 be the position in the open mold direction as resin forming mould and with molded product
The exhaust hole pin installing plate for being equipped with exhaust hole pin is continuously arranged, also, the exhaust hole pin is matched in the position that prominent mechanism overlaps
The structure at the position of gas vent groove portion is located at, it can be seen that the mode structure and the effect complexity this point based on the structure.
Patent document 1：Special open 2013-049253 bulletins are (with reference to paragraph [0030] and Fig. 4)
Invention content
The present invention has further developed the invention of motion, and its object is to by using the resin for using high fluidity
Material, simpler resin encapsulation method and more easy mode structure, to realize the entirety for manufacturing resin encapsulation equipment
Property cost reduction and simplify its Maintenance and Repair operation.
The resin encapsulation method of electronic unit according to the present invention includes：Prepare the resin-encapsulated of electronic component package
The resin encapsulation equipment preparatory process of device, the resin encapsulation equipment of the electronic component package have including at least stent
The resin-encapsulated mould of the electronic unit of (upper mold 5) and the But moving die (lower die 8) opposite with the stent (upper mold 5), it is described movable
Mould is configured to retreat relative to the stent via the clasp mould mechanism 9 for carrying out open mold movement, 16 quilt of cavity block
It is configured to be moved to the stent along open mold direction via the relocation mechanism with elastomeric element (floating pin 18)
Die joint, cavity 20 and connected with the cavity 20 connection exhaust hole slot 22 be arranged on the die joint of the cavity block 16, it is embedding
It closes hole 24 and is arranged on the connecting portion of the cavity 20 and the exhaust hole slot 22 along the open mold direction, gas vent block 23 is along institute
State the position (float pin retainer 17) that open mold direction is arranged on the stent of the corresponding embedded hole 24, the exhaust
Hole block 23 can slide and be closely fitted into the embedded hole 24；
Substrate supply step before resin-encapsulated, substrate W is moved to institute before being equipped with the resin-encapsulated of the electronic unit
State the substrate supply that the But moving die is supplied between stent and the But moving die (5,8) and by substrate W before the resin-encapsulated
Portion 26；
Resin material supply step, by resin material (ultra-low viscosity resin) R with high fluidity be supplied to it is described can
The resin supply unit set on dynamic model (in barrel 10a)；
Molding process for the first time, substrate supply step and the resin material supply step before the resin-encapsulated is carried out
Later, the die joint for making the stent via the clasp mould mechanism 9 is engaged with the die joint of the But moving die；
Spatial portion depressurizes process in mould, when the first time molding process, to the die joint of the stent with it is described
Spatial portion is depressurized in mould between the die joint of But moving die；
Molten resin material pressurization transfer process, spatial portion depressurizes process quilt by spatial portion in the mould in the mould
In the state of decompression, heating fusing is carried out to the resin material R for being supplied to the resin supply unit (in barrel 10a), and
And the resin material after melting is made to pressurize by the resin channels (sprue 19 and cast gate 21) in spatial portion in the mould
It is transplanted in the cavity 20；
Second molding process makes the cavity block 16 of the stent resist the elasticity in the relocation mechanism
The elasticity of component (floating pin 18) and further move and (move up)；
Gas vent block mobile process in second of molding process, makes the gas vent block 23 relatively move (downwards
It is mobile) so that the front end face (lower surface 23a) of the gas vent block 23 is consistent with the die joint of the cavity block 16；
Cavity sealing process in gas vent block mobile process, passes through the front end face pair with the gas vent block 23
The wiring substrate surface (upper surface) and the gas vent that are supplied to before the resin-encapsulated of substrate supply unit 26 in substrate W of engagement
The front end face of block 23 is crimped, so as to seal the cavity 20 of the cavity block 16.
Resin forming process (transfer modling process) after the cavity sealing process, makes the resin after melting
Further pressurization is transplanted in the cavity 20 and it is made to be filled into the cavity 20 material；With
Molded product removal process, after the resin forming process, via the clasp mould mechanism 9, to the fixation
Mould and the But moving die are molded, and in this state, are taken out in the inside of the cavity 20 and the resin channels
The molding molded product of internal curing (resin-encapsulated metacoxal plate W1).
In addition, for the resin encapsulation equipment of electronic unit according to the present invention,
Has the electricity including at least stent (upper mold 5) and the But moving die (lower die 8) opposite with the stent (upper mold 5)
The resin-encapsulated mould of subassembly,
The But moving die (lower die 8) is configured to the clasp mould mechanism 9 via progress open mold movement relative to institute
Stent (upper mold 5) advance and retreat are stated,
Cavity block 16 is configured to via the relocation mechanism with elastomeric element (floating pin 18) along open mold direction
The die joint of the stent (upper mold 5) is moved to,
Cavity 20 and connected with the cavity 20 connection exhaust hole slot 22 be arranged on the die joint of the cavity block 16,
Embedded hole 24 is arranged on the connecting portion of the cavity 20 and the exhaust hole slot 22 along the open mold direction,
The position that gas vent block 23 is arranged on the stent of the corresponding embedded hole 24 along the open mold direction is (floating
Dynamic pin retainer 17), and the gas vent block 23 can slide and be closely fitted into the embedded hole 24.
In addition, the resin encapsulation equipment of electronic unit according to the present invention have including at least stent (upper mold 5) and
The resin-encapsulated mould of the electronic unit of the But moving die (lower die 8) opposite with the stent (upper mold 5), the But moving die (lower die
8) it is configured to retreat relative to the stent (upper mold 5) via the clasp mould mechanism 9 for carrying out open mold movement,
15 and first cavity block 16 of sprue block is configured to via the floating with elastomeric element (floating pin 18)
Mechanism is moved to the die joint of the stent along open mold direction,
Sprue 19 as resin distributary division is arranged on the die joint of sprue block 15,
The cast gate 21 of connection is connected with the sprue 19, connect with the cast gate 21 cavity 20 that connects and with the type
The exhaust hole slot 22 of the connection connection of chamber 20 is arranged on the die joint of the first cavity block 16,
Embedded hole 24 is arranged on the connecting portion of the cavity 20 and the exhaust hole slot 22 along the open mold direction,
It (floats and sells in the position that gas vent block 23 is arranged on the stent of the corresponding embedded hole 24 along the open mold direction
Retainer 17), and the gas vent block 23 can slide and be closely fitted into the embedded hole 24,
Have and be arranged on and the fixation for supplying the barrel block 10 of the resin supply unit (barrel 10a) of resin material R
The position of the opposite But moving die (lower die 8) of mould (upper mold 5),
Lateral mass 11 is arranged on the side position of the barrel block 10,
Second-Type cavity block 16 is mounted on the die joint of the lateral mass 11,
The Second-Type cavity block 12 is configured to via the relocation mechanism with elastomeric element 14 along the open mold
Direction is moved,
The mechanism of decompressor in mould is provided with, the mechanism of decompressor makes stent (upper mold 5) via clasp mould mechanism 9 in the mould
During the molding of first time that die joint is engaged with the die joint of But moving die (lower die 8), to the die joint of the stent with it is described can
Spatial portion is depressurized in mould between the die joint of dynamic model,
Also, the floating is resisted via the clasp mould mechanism 9 on the basis of the state when molding the first time
The elasticity of mechanism and further press the die joint of the stent (upper mold 5) and the die joint of the But moving die (lower die 8)
During second of molding, the gas vent block 23 relatively moves, so as to the front end face (lower surface 23a) of at least described gas vent block
The position consistency identical with parting line P.L faces.
According to the present invention, even if in the resin-encapsulated molding of the electronic unit for the resin material R for using high fluidity,
The residual air inside cavity 20 etc. can be made to be effectively discharged out to outside.
Therefore, it is possible to be effectively prevented in the inside and outside with the integrally formed resin package covers 29 of resin-encapsulated metacoxal plate W1
Form gap and defect portion etc..
In addition, gas vent block 23 is formed by being fixed on 4 side of cope plate, also, the gas vent block 23 is in upper and lower two mould
5th, during 8 molding, as sealing a part for the seal member of cavity 20 and the cavity 20.Moreover, in upper and lower two mould 5,8
Cavity sealing process is carried out when molding process, so as to be effectively prevented the melting tree for the high fluidity being injected into cavity 20
Fat material is flowed out by exhaust hole slot 22 to outside.
It is therefore not necessary to complicated mode structure, such as by moving up and down exhaust hole slot 23 via special driving mechanism
And it is opened and closed exhaust hole slot etc..
Therefore, in the structure for the resin material for using high fluidity, can use simpler resin encapsulation method and
More easy mode structure, and can realize the whole cost reduction for manufacturing resin encapsulation equipment and simplify its maintenance inspection
The operation repaiied.
Description of the drawings
Fig. 1 is using the general principal view of the resin encapsulation equipment according to the present invention of transfer molding unit, is shown
The die opening state of its upper mold and lower die.
Fig. 2 is the general principal view of the resin encapsulation equipment of corresponding diagram 1, and (1) of Fig. 2 is to represent that semiconductor package is die-filling to open
The longitudinal section view of mould state, (2) of Fig. 2 are the longitudinal section views for representing its first time molding state, (3) of Fig. 2 be represent its
The longitudinal section view of secondary mould closing state.
Fig. 3 is the die-filling major part amplification longitudinal section view of the semiconductor package of corresponding diagram 2 (1).
(1) of Fig. 4 is the die-filling major part amplification longitudinal section view of the semiconductor package of (2) of corresponding diagram 2, and (2) of Fig. 4 are
Longitudinal section view is further amplified in its major part.
(1) of Fig. 5 is the die-filling major part amplification longitudinal section view of the semiconductor package of (3) of corresponding diagram 2, and (2) of Fig. 5 are
Longitudinal section view is further amplified in its major part.
(1) of Fig. 6 and (2) of Fig. 6 are the Action Specification figures sold that floats.
Fig. 7 is the die-filling longitudinal section view of the semiconductor package of corresponding diagram 3, shows molded product reaching its upper mold and lower die
Between state.
Specific embodiment
In the following, based on embodiment shown in FIG. 1, the present invention will be described.
Fig. 1 schematically shows one of the resin encapsulation equipment according to the present invention using so-called transfer molding unit
The overall structure of embodiment.
The resin encapsulation equipment has：The pedestal 1 of the device；Pull rod 2 is arranged on erected state on pedestal 1；Fixed plate
3, mounted on the upper end of pull rod 2；Cope plate 4, mounted on the lower part of fixed plate 3；The upper mold 5 (stent) of resin forming,
It is installed in the lower part of cope plate 4；Movable plate 6 is mounted in the lower position insertion of upper mold 5 in pull rod 2；Lower template 7, is mounted on
The top of movable plate 6；The lower die 8 (But moving die) of resin forming is installed in the top of lower template 7；With clasp mould mechanism 9 etc.,
Using being arranged to can to make by the way that movable plate 6 is made vertically to move the opposite die joint of upper and lower two mould 5,8 to engage or
Servomotor deviated from etc..
The resin encapsulation equipment has including at least upper mold 5 (stent) and lower die 8 opposite with upper mold 5 and being configured (can
Dynamic model) electronic unit resin-encapsulated mould.Resin-encapsulated mould can via clasp mould mechanism 9 into exercise lower die 8 relative to upper
The open mold movement that mould 5 is retreated.
Barrel block 10 is equipped with, also, insertion is equipped with resin pressurization in barrel block 10 in the central portion of lower die 8
Plunger 13.
In addition, put in the left and right sides orientation of the barrel block 10 on the die joint of lateral mass 11 set with can on move down
Dynamic state insertion is equipped with drag cavity block 12 (Second-Type cavity block).
Further, drag cavity block 12 has generates the floating of resilient urging force upward using the elasticity of elastomeric element 14
Motivation structure (floating structure).Drag cavity block 12 can carry out the movement to open mold direction via relocation mechanism as a result,.And
And as described later, the superjacent air space portion of the drag cavity block 12 is set to the supply unit 26 of substrate.
Sprue is provided on the die joint (lower surface) of the upper mold 5 opposite with the position of the barrel block 10 in lower die 8
Block 15, in addition, being provided with model cavity at the position of the die joint of the upper mold 5 opposite with each drag cavity block 12 in lower die 8
Block 16 (the first cavity block).
Sprue block 15 and upper model cavity block 16 are supported on via multiple floating pins 18 on cope plate 4.In floating pin 18
It is embedded with floating pin retainer 17.The pin retainer 17 that floats as a result, is configured in the upper surface of sprue block 15 and upper model cavity
Between the upper surface of block 16 and cope plate 4.In the present embodiment, it is formed by having the floating pin 18 as elastomeric element
Relocation mechanism, sprue block 15 and upper model cavity block 16 are configured to be moved to along open mold direction via the relocation mechanism
The die joint of upper mold 5 (stent).
It is formed on the lower surface of sprue block 15 (die joint) and divides as shunting the resin of molten resin material
The sprue 19 in stream portion.
The cavity 20 of resin forming is formed on the die joint of upper model cavity block 16.
It is narrow that being provided with the connecting portion of sprue 19 in upper model cavity block 16 is formed towards 20 side of cavity
Cast gate 21.Cast gate 21 is the molten resin material inlet into cavity 20.
For upper model cavity block 16, on the die joint positioned at the upper model cavity block 16 with 21 opposite side of cast gate, with institute
The depth needed is provided with the exhaust hole slot 22 for being formed to connect with cavity 20.
As described above, be formed on the die joint of cavity block 16 connected with sprue 19 connection cast gate 21,
The cavity 20 of connection is connected with cast gate 21 and the exhaust hole slot 22 of connection is connected with cavity 20.
In addition, the cavity 20 and the connecting portion of exhaust hole slot 22 in upper model cavity block 16 are formed with embedded hole 24.It is chimeric
Hole 24 is for embedded installation gas vent block 23.Connecting portion said here is the molten resin being flowed into from cast gate 21 in cavity 20
The position that material eventually arrives at.Embedded hole 24 is formed along open mold direction, also, can slidably and closely in embedded hole 24
(i.e. close connection) insertion gas vent block 23 is installed.Gas vent block 23 is fixed at along open mold direction as upper mold 5
On the lower surface of the floating pin retainer 17 at the position of (stent) side.Gas vent block 23 is set via the pin fixation of retainer 17 of floating
It puts in 4 side of cope plate, is arranged in the aftermentioned molding of two moulds 5,8 up and down, when the elasticity for resisting floating pin 18 pushes up
During dynamic upper mold 5, moved relatively downward relative to the upper model cavity block 16 of upper mold 5.
Although gas vent block 23 is configured to move relatively downward relative to upper model cavity block 16, upper and lower two
When mould 5,8 molds, when the upper surface of sprue block 15 and the upper surface of upper model cavity block 16 and the following table for the pin retainer 17 that floats
When face engages, each portion is set in a manner that the lower surface 23a for making gas vent block 23 is the height and position identical with parting line P.L faces
Movement (with reference to Fig. 5).
In addition, the tree that there is the part for forming cavity 20 on the cavity composition surface of gas vent block 23 is shown in the various figures
The structure of fat filling part 23b.Resin filling part 23b is formed the rectangular-shaped recess portion in section.As the lower surface 23a of gas vent block
Height and position when being located at the height and position identical with parting line P.L faces so that the top surface of resin filling part 23b and cavity 20
Top surface sets the movement (with reference to Fig. 5) in each portion for the mode of identical height and position.
Further, it is also possible to the cavity 20 of resin filling part 23b to including gas vent block 23 implement for easily carry out into
The appropriate pattern draft (not shown) of demoulding after type.
Furthermore it is also possible to using the structure that above-mentioned resin filling part 23b is not provided in gas vent block 23.That is, upper
The cavity 20 of specified volume is formed in model cavity block 16, and does not form a part for cavity 20 in gas vent block 23, and make
The resin leakage for only having aftermentioned gas vent function He coming from cavity 20 prevent function.
In addition, exhaust hole slot 22 is connect via appropriate suction pathway 25 with vacuum pump (not shown).The resin-encapsulated fills
It puts with the mechanism of decompressor in the mould formed by having the vacuum pump.The mechanism of decompressor makes when upper and lower two mould 5,8 molds in mould
Vacuum pump work from there through suction pathway 25 and exhaust hole slot 22, depressurizes the inside of cavity 20.
Lower die 8 has structure shown below.That is, it is arranged at the position of the lower die 8 opposite with the sprue block 15 of upper mold 5
There is the barrel block 10 of barrel 10a (resin supply unit) for having resin supply, it is embedded in barrel 10a that resin pressurization is installed
Plunger 13.
It is provided on the die joint of the lower die 8 opposite with the cavity 20 set on the die joint of upper mold 5 and is put for supplying
Put the substrate supply unit 26 of substrate W before resin-encapsulated.That is, the energy on the position of the lower die 8 opposite with the position of upper model cavity 20
Enough insertions up or down are equipped with drag cavity block 12.The insertion of drag cavity block 12 be mounted on barrel block 10 and lateral mass 11 it
Between.Drag cavity block 12 has relocation mechanism.Relocation mechanism have be present in the lower surface of drag cavity block 12 and lower template 7 it
Between compressed spring or the elastomeric elements 14 such as disk spring, relocation mechanism by the fexible bias pressure of the elastomeric element 14 and generate to
The resilient urging force of top.It is made of the side of the upper surface of drag cavity block 12, the side of barrel block 10 and lateral mass 11 upper
Side space portion is substrate supply unit 26 (with reference to Fig. 3).
In addition, it in the present embodiment, as substrate before resin-encapsulated, has been illustrated and has wiring substrate 27a and at this
Via the substrate W of the semiconductor chip 27c of soldering projection 27b installations on wiring substrate 27a.
In addition, the cast gate 21 of the sprue 19 of sprue block 15 and upper model cavity block 16 is formed shown in (2) and Fig. 4 of Fig. 2
First time molding when for the molten resin material that fusing is heated in the barrel 10a of barrel block 10 to be transplanted in cavity 20
Resin channels.And then when molding first time, barrel 10a, sprue 19, cast gate 21, cavity 20, embedded hole 24 and air-breathing
Each position in path 25 is formed in spatial portion in the mould that can be ventilated formed between the die joint of upper and lower two mould 5,8.
In the following, the position relationship of upper mold 5 and the gas vent block 23 during to the die sinking of two moulds 5,8 up and down shown in FIG. 1 carry out it is detailed
It describes in detail bright.The die sinking of upper and lower two mould 5,8 is carried out by moving down lower die 8 via clasp mould mechanism 9.In the die sinking,
The state being as follows.That is, the die joint due to upper and lower two mould 5,8 detaches, as shown in Figure 1, upper mold 5, i.e. sprue
Block 15 and upper model cavity block 16 move down to 8 side of lower die by the fexible bias pressure for the pin 18 that floats and stop at defined height
Position (with reference to Fig. 3).On the other hand, retainer 17 is sold via floating to be fixed on cope plate 4, arrange due to gas vent block 23
Stomata block 23 itself does not move down.However, the knot that sprue block 15 and upper model cavity block 16 are moved down to 8 side of lower die
Fruit, gas vent block 23 are relatively moved upward.
In the following, it is illustrated about the method that above-mentioned resin encapsulation equipment is used to carry out resin-encapsulated to electronic unit.
When two moulds 5,8 up and down shown in (1) of Fig. 2 mold, first, loading machine (not shown) is moved in via appropriate, will electricity be installed
Substrate W is moved between upper and lower two mould and is supplied to the substrate supply unit 26 of lower die 8 before the resin-encapsulated of subassembly, and will tool
Resin material (ultra-low viscosity resin) R for having high fluidity is supplied in the barrel 10a of lower die 8 (with reference to Fig. 3).
Moreover, before above-mentioned resin-encapsulated is carried out after substrate supply step and resin material supply step, via opening
Clamping 9, the molding moved up into enforcement lower template 7 and lower die 8 (with reference to Fig. 1).
It in the molding, first moves up lower die 8, thus carries out the die joint (upper surface) of lower die 8 and upper mold 5
The first time molding process of die joint (lower surface) engagement (with reference to (2) of Fig. 2).Process, the material of lower die 8 are molded by first time
Cylinder block 10 die joint (upper surface) and lateral mass 11 die joint (upper surface) and upper mold 5 sprue block 15 die joint (under
Surface) and upper model cavity block 16 die joint (lower surface) engagement (with reference to Fig. 2 (2)).However, at this point, as shown in amplifying Fig. 4
Like that, therefore the not flexible deformation of floating pin 18, keeps the gap moved up for sprue block 15 and upper model cavity block 16
S.Therefore, the height and position of gas vent block 23 for being fixed on 4 side of cope plate via the pin retainer 17 that floats does not change.Therefore,
It can be ensured that the ventilation between the lower surface 23a of gas vent block 23 and the die joint (that is, parting line P.L faces) of upper model cavity block 16
State.In addition, at this point, the wiring substrate 27a of substrate W before the resin-encapsulated of substrate supply unit 26 is supplied to via application elastic portion
The drag cavity block 12 of the resilient urging force of part 14 and be pushed upwardly.Therefore, by pressing the upper surface side of wiring substrate 27a
And it is installed to be the close-connected state of die joint with the cavity 20 of upper model cavity block 16.
In addition, when molding first time, spatial portion, i.e. barrel in the mould that is formed between the die joint of upper and lower two mould 5,8
10a, sprue 19, cast gate 21, cavity 20, embedded hole 24 and suction pathway 25 each position be the state that can be ventilated.Therefore,
In this state, by making the work (not shown) of the vacuum pump in mould in the mechanism of decompressor, spatial portion in mould is subtracted
Spatial portion depressurizes process in the mould of pressure.
In addition, the resin material R being supplied in the barrel 10a of lower die 8 is heated by the resin set on upper and lower two mould 5,8
Heater (not shown) is melted by heating, and sprue 19 by the plus-pressure as caused by plunger 13 and upward adds
It is injected into cavity 20 by cast gate 21 while pressure.The process is the molten resin material pressurization transfer work using plunger 13
Sequence.The process can carry out after spatial portion decompression process or carry out parallel with the decompression process in mould.That is, by
Molten resin material pressurization transfer process is carried out in the state of after being depressurized to spatial portion in mould, so as to make to remain in mould
The burning gases class that the heating of the air and resin material R of interior spatial portion generates when melting energetically is arranged into mould outside spatial portion
Go out.
Further, it is also possible to from persistently being carried out in mould when first time molding process to before will carry out second of molding process
Spatial portion depressurizes process.Second of molding process is illustrated below.
Next, on the basis of first time molding state, via clasp mould mechanism 9, lower die 8 is made to resist floating pin 18
Elasticity and be moved further up, thus as Fig. 2 (3) shown in, into exercise sprue block 15 upper surface and upper model cavity block
Second of molding process that 16 upper surface is engaged with the lower surface for the pin retainer 17 that floats.By carrying out second of molding work
Sequence, gap S actually disappear.
Therefore, the opposite height and position of the gas vent block 23 of 4 side of cope plate is fixed on via the pin retainer 17 that floats just
It can change, thus in order to make the parting of the height and position of the lower surface 23a (front end face) of gas vent block 23 and upper model cavity block 16
The height and position in face (P.L faces) is consistent, into the height and position and cavity of the top surface for the resin filling part 23b for exercising gas vent block 23
The consistent gas vent block mobile process of the height and position of 20 top surface (with reference to Fig. 5).
Moreover, by carrying out the gas vent block mobile process, the chimeric work of hole block 23 and upper model cavity block 16 is exhausted
Sequence.Be fitted into process at this, when the height and position of the lower surface 23a of gas vent block be located at least in it is identical with spue line P.L faces
During height and position, carried out in a manner that the top surface for making resin filling part 23b is identical height and position with the top surface of cavity 20 embedding
Conjunction is handled.And then at this point, due to the lower surface 23a of gas vent block 23 and with the lower surface 23a wiring substrate 27a's engaged
Upper surface is by the opposite power for moving down state for maintaining gas vent block 23, and by the resiliency urged of elastomeric element 14
Power, therefore two surfaces become the state mutually crimped.Cavity sealing process is carried out by the crimping on the two sides.By being somebody's turn to do
Process becomes the state interdicted actually and conscientiously between cavity 20 and exhaust hole slot 22.
In addition, as Fig. 6 schematic diagrams, floating pin 18 is deformed when molding process second due to elasticity.As a result, such as
Shown in (1) of Fig. 6, gap S is formed between pin retainer 17 and sprue block 15 floating, so that in upper and lower two mould 5,8
During die sinking and its when first time molds process, sprue block 15 and upper model cavity block 16 can move up.However, such as Fig. 6
(2) shown in, in second of molding process, the upper surface of the upper surface of sprue block 15 and upper model cavity block 16 is protected with the pin that floats
The lower surface engagement of frame 7 is held, then is deformed by the pin 18 that floats and actually disappeared and gap S.
In addition, floating pin 18 is in second molding process, when by the clamping pressure as caused by upper and lower two mould 5,8 with
The mode flexible deformation reduced to upper and lower axle direction, so as to which the pin for being housed in the pin retainer 17 that floats is kept in frame aperture 17a.
Further, the floating pin 18 is by releasing the clamping pressure caused by upper and lower two mould 5,8 and as molding for the first time
During process or upper and lower two mould 5,8 mold when state when, then shape is restored to original state.Sprue block 15 and upper as a result,
Model cavity block 16 can be moved down into the original lower position shown in (1) of Fig. 6.
Has the relocation mechanism of the floating pin 18 with required elasticity, but can also replace in addition, being shown in figure
This is using the relocation mechanism for having the elastomeric elements such as compressed spring or disk spring, even and obviously such structure also can
Access same function and effect.
After cavity sealing process, carry out that the molten resin material in barrel 10a is made further to pressurize by plunger 13
It is transplanted on the resin forming process (transfer modling process) in cavity 20 and it being made to be filled into cavity 20.
In addition, in resin forming process, because molten state resin material R (hereinafter referred to as molten resin material) by
It is injected into cavity 20 by resin channels (sprue 19, cast gate 21) to the plus-pressure of plunger 13.And then molten resin material
Material is filled by injection in the resin filling part 23b for the gas vent block 23 that molten resin material reaches final period.At this point, due to
The upper surface of the lower surface 23a and wiring substrate 27a of gas vent block 23 are sealed, therefore can be effective by cavity sealing process
Ground prevents from being filled into the part of the molten resin material of the resin filling part 23b of cavity 20 and gas vent block 23 from sealing position
It is flowed out by exhaust hole slot 22 to outside.
In addition, since the position that molten resin material reaches the resin filling part 23b in final period is tieed up as described above
Hold in decompression state, thus can be filled into be mixed into the molten resin material at the position residual air etc. disadvantage prevent in
Possible trouble.
In addition, for example, even if assuming there is seldom air in the site residues, also provided caused by by by plunger 13
Resin plus-pressure and the formation in gap can be effectively prevented.
In addition, for example implement to take out the base after the resin-encapsulated of curing molding in cavity 20 and resin channels as follows
The molded product removal process of plate (molded product) W1.That is, by moving down 8 side of lower die via clasp mould mechanism 9, first, into
Row first time die sinking process corresponding with the state of the first time molding process of (2) of progress Fig. 2, next, carrying out with Fig. 2's
(1) after corresponding second of die sinking process of original die opening state shown in, molded product taking-up is carried out under the die opening state
Process.Molded product removal process can be by under die opening state, via moving out loading machine (not shown) by base after resin-encapsulated
Plate W1 is moved out outside device and is implemented.
In addition, as shown in fig. 7, the resin-encapsulated metacoxal plate W1 vertically taken out between two moulds 5,8 is is formed as and resin
The curing molding body 28 of the corresponding shape of channel (sprue 19, cast gate 21) and be formed as the resin with cavity 20 and gas vent block
The substrate that 29 integration of resin package covers of the corresponding shapes of filling part 23b forms.Since resin package covers 29 are by having height
The resin material R of mobility and be molded, therefore into exercise molten resin material be successfully filled into wiring substrate 27a and semiconductor
The molded underfill of the connecting portion 30 of chip 27c.Therefore, when carrying out flip-chip connection via soldering projection 27b, pass through
Resin is made to be filled into the gap between chip and substrate to protect connecting portion 30, thus, it is possible to improve the reliability of molded product.
According to the present embodiment, even if in the resin-encapsulated molding of the electronic unit for the resin material R for using high fluidity,
Also the residual air inside cavity 20 etc. can be made to be effectively discharged out to outside, thus can be effectively prevented with resin-encapsulated
The inside and outside of the integrally formed resin package covers 29 of metacoxal plate W1 forms gap and defect etc., and can be effectively prevented injection
Molten resin material to the high fluidity in cavity 20 is flowed out by exhaust hole slot 22 to outside.
In addition, gas vent block 23 is made to be fixed on cope plate 4.And then gas vent block 23 is configured to close in upper and lower two mould 5,8
As for sealing a part for the seal member of cavity 20 and cavity 20 during mould.Moreover, it is molded to upper and lower two mould 5,8
First time/second molding process when carry out cavity sealing process, be injected into cavity 20 so as to be effectively prevented
The molten resin material of high fluidity is flowed out by exhaust hole slot 22 to outside.It is therefore not necessary to such as complicated mode structure, i.e., logical
Cross moves up and down exhaust hole slot 23 to be opened and closed exhaust hole slot 22 etc. via special driving mechanism.Therefore, it realizes following excellent
Practicability effect：It is compared with the past to use more simply for the structure for using the resin material with high fluidity
Resin encapsulation method and more easy mode structure, and can realize for manufacture resin encapsulation equipment globality cost drop
Operation that is low and simplifying its Maintenance and Repair.
In addition, replace implement illustration shown in the mode structure being made of upper mold 5 and lower die 8, can also use by upper mold with
The apparatus structure that lower die is arranged and forms on the contrary up and down.
The present invention is not limited to the above embodiments, without departing from the scope of spirit of the present invention, can as required,
Arbitrary and suitable change simultaneously selectively uses.
As the resin material used in the present invention, thermosetting resin material and thermoplastic resin material can be used
Material.In addition, as the resin material used in the present invention, there is liquid or powdered, graininess, bulk.
In addition, for example, as the resin material for having high fluidity function used in the present invention, can enumerate ultralow viscous
The resin of degree.The resin of this ultra-low viscosity is at normal temperatures liquid or solid-like, when heating these resins, because resin has
High fluidity and as molten condition, which is ultra-low viscosity.
Reference sign
1 pedestal
2 pull rods
3 fixed plates
4 cope plates
5 upper molds
6 movable plates
7 lower templates
8 lower dies
9 clasp mould mechanisms
10 barrel blocks
10a barrels
11 lateral mass
12 drag cavity blocks (Second-Type cavity block)
13 plungers
14 elastomeric elements
15 sprue blocks
Model cavity block (the first cavity block) on 16
17, which float, sells retainer
18, which float, sells
19 sprues
20 cavities
21 cast gates
22 exhaust hole slots
23 gas vent blocks
The lower surface of 23a gas vent blocks
23b resin filling parts
24 embedded holes
25 suction pathways
26 substrate supply units
27a wiring substrates
27b soldering projections
27c semiconductor chips
28 curing molding bodies
29 resin package covers
30 connecting portions
R resin materials
S gaps
Substrate before W resin-encapsulateds
W1 resin-encapsulated metacoxal plates
P.L parting lines
Claims (3)
1. a kind of resin encapsulation method of electronic unit, including：
Prepare the resin encapsulation equipment preparatory process of the resin encapsulation equipment of electronic component package, the electronic component package is used
Resin encapsulation equipment have including at least stent and the resin-encapsulated of the electronic unit of the But moving die opposite with the stent
Mould, the But moving die are configured to retreat relative to the stent via the clasp mould mechanism for carrying out open mold movement,
Cavity block is configured to be moved to point of the stent along open mold direction via the relocation mechanism with elastomeric element
Type face, cavity and connects the exhaust hole slot of connection with the cavity and is arranged on the die joint of the cavity block, and embedded hole is along institute
The connecting portion that open mold direction is arranged on the cavity and the exhaust hole slot is stated, gas vent block is set along the open mold direction
At the position of the stent of the correspondence embedded hole, the gas vent block can be slided and is closely fitted into described chimeric
Hole；
Substrate supply step before resin-encapsulated, substrate is moved to the fixation before being equipped with the resin-encapsulated of the electronic unit
The substrate supply unit of the But moving die is supplied between mould and the But moving die and by substrate before the resin-encapsulated；
Resin material with high fluidity is supplied to the resin supply set on the But moving die by resin material supply step
Portion；
Molding process for the first time, before the resin-encapsulated is carried out substrate supply step and the resin material supply step it
Afterwards, the die joint of the stent is made to engage with the die joint of the But moving die via the clasp mould mechanism；
Spatial portion depressurizes process in mould, when the first time molding process, to the die joint of the stent with it is described movable
Spatial portion is depressurized in mould between the die joint of mould；
Molten resin material pressurization transfer process, spatial portion depressurizes process by spatial portion in the mould and is depressurized in the mould
In the state of, heating fusing is carried out to the resin material for being supplied to the resin supply unit, and make described after melting
Resin material is transplanted on by the resin channels pressurization in spatial portion in the mould in the cavity；
Second molding process makes the cavity block of the stent resist the elastomeric element in the relocation mechanism
Elasticity and further move；
Gas vent block mobile process in second of molding process, makes the gas vent block relatively move, so that described
The front end face of gas vent block is consistent with the die joint of the cavity block；
Cavity sealing process in the gas vent block mobile process, connects by Dui with the front end face of the gas vent block
That closes is supplied to before the resin-encapsulated of the substrate supply unit before the wiring substrate surface of substrate and the described of the gas vent block
End face is crimped, so as to seal the cavity of the cavity block；
After the cavity sealing process, the resin material after melting is further pressurizeed transfer for resin forming process
In to the cavity and it is made to be filled into the cavity；With
Molded product removal process, after the resin forming process, via the clasp mould mechanism, to the stent and institute
It states But moving die to be molded, and in this state, takes out the internal curing in the inside of the cavity and the resin channels
Molding molded product,
The gas vent block has the resin filling for the part for constructing the cavity on the composition surface between the cavity
Portion,
The movement of each section is set to, when the height and position of lower surface of the gas vent block and the height and position pair of parting line
When being identical height and position together, the top surface of the resin filling part and the top surface of the cavity are in identical height and position.
2. a kind of resin encapsulation equipment of electronic unit, which is characterized in that
Have the resin-encapsulated mould of the electronic unit including at least stent and the But moving die opposite with the stent,
The But moving die is configured to retreat relative to the stent via the clasp mould mechanism for carrying out open mold movement,
Cavity block is configured to be moved to the stent along open mold direction via the relocation mechanism with elastomeric element
Die joint,
Cavity and connected with the cavity connection exhaust hole slot be arranged on the die joint of the cavity block,
Embedded hole is arranged on the connecting portion of the cavity and the exhaust hole slot along the open mold direction,
Gas vent block is arranged on the position of the stent of the corresponding embedded hole, and the row along the open mold direction
Stomata block can slide and be closely fitted into the embedded hole,
The gas vent block has the resin filling for the part for constructing the cavity on the composition surface between the cavity
Portion,
The movement of each section is set to, when the height and position of lower surface of the gas vent block and the height and position pair of parting line
When being identical height and position together, the top surface of the resin filling part and the top surface of the cavity are in identical height and position.
3. a kind of resin encapsulation equipment of electronic unit, has But moving die including at least stent and opposite with the stent
Electronic unit resin-encapsulated mould, the But moving die be configured to via carry out open mold movement clasp mould mechanism phase
It retreats for the stent,
The resin encapsulation equipment of the electronic unit is characterized in that,
Sprue block and the first cavity block are configured to move along open mold direction via the relocation mechanism with elastomeric element
The die joint of the stent is moved,
Sprue as resin distributary division is arranged on the die joint of the sprue block,
The cast gate of connection is connected with the sprue, the cavity of connection is connected with the cast gate and connection is connected with the cavity
Exhaust hole slot is arranged on the die joint of the first cavity block,
Embedded hole is arranged on the connecting portion of the cavity and the exhaust hole slot along the open mold direction,
Gas vent block is arranged on the position of the stent of the corresponding embedded hole, and the gas vent along the open mold direction
Block can slide and be closely fitted into the embedded hole,
Have for supply the barrel block of the resin supply unit of resin material be arranged on it is opposite with the stent described movable
The position of mould,
Lateral mass is arranged on the side position of the barrel block,
Second-Type cavity block is embedded on the die joint of the lateral mass,
The Second-Type cavity block is configured to move along the open mold direction via the relocation mechanism with elastomeric element,
The mechanism of decompressor in mould is provided with, the mechanism of decompressor is in the parting for making the stent via the clasp mould mechanism in the mould
During the first time molding that face is engaged with the die joint of the But moving die, to point of the die joint and the But moving die of the stent
Spatial portion is depressurized in mould between type face,
Also, the relocation mechanism is resisted via the clasp mould mechanism on the basis of the state when molding the first time
Elasticity and when further pressing second of the die joint of the stent and the die joint of the But moving die and molding, the exhaust
Hole block relatively moves, front end face and the position consistency identical with parting line face so as at least described gas vent block,
The gas vent block has the resin filling for the part for constructing the cavity on the composition surface between the cavity
Portion,
The movement of each section is set to, when the height and position of lower surface of the gas vent block and the height and position pair of parting line
When being identical height and position together, the top surface of the resin filling part and the top surface of the cavity are in identical height and position.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-111374 | 2014-05-29 | ||
| JP2014111374A JP6320172B2 (en) | 2014-05-29 | 2014-05-29 | Resin sealing method and resin sealing device for electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105280506A CN105280506A (en) | 2016-01-27 |
| CN105280506B true CN105280506B (en) | 2018-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510169123.2A Active CN105280506B (en) | 2014-05-29 | 2015-04-10 | The resin encapsulation method and resin encapsulation equipment of electronic unit |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP6320172B2 (en) |
| KR (1) | KR101667879B1 (en) |
| CN (1) | CN105280506B (en) |
| MY (1) | MY172522A (en) |
| SG (1) | SG10201504081PA (en) |
| TW (1) | TWI602680B (en) |
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|---|---|---|---|---|
| JP6654861B2 (en) * | 2015-11-09 | 2020-02-26 | Ｔｏｗａ株式会社 | Resin sealing device and resin sealing method |
| EP3188260B1 (en) * | 2015-12-31 | 2020-02-12 | Dow Global Technologies Llc | Nanostructure material structures and methods |
| JP6654971B2 (en) * | 2016-06-17 | 2020-02-26 | 本田技研工業株式会社 | Molding method and molding system for resin molded member |
| JP6436260B1 (en) * | 2018-05-31 | 2018-12-12 | 株式会社玉谷製作所 | Pin, sleeve or nesting |
| JP6981935B2 (en) * | 2018-08-23 | 2021-12-17 | アピックヤマダ株式会社 | Mold mold and resin molding device equipped with it |
| JP7149411B2 (en) * | 2018-08-30 | 2022-10-06 | ハスキー インジェクション モールディング システムズ リミテッド | Molding apparatus and method |
| JP6678973B1 (en) * | 2019-04-09 | 2020-04-15 | アサヒ・エンジニアリング株式会社 | Resin sealing device and resin sealing method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100515717C (en) * | 1999-12-16 | 2009-07-22 | 第一精工株式会社 | Resin packaging method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61292926A (en) * | 1985-06-21 | 1986-12-23 | Hitachi Hokkai Semiconductor Ltd | Molding method and molding equipment |
| JPH06210658A (en) * | 1993-01-19 | 1994-08-02 | Toshiba Corp | Mold device for resin molding |
| JP2875479B2 (en) * | 1994-09-08 | 1999-03-31 | 日本ペルノックス株式会社 | Semiconductor sealing method |
| JP2007152831A (en) * | 2005-12-07 | 2007-06-21 | Sharp Corp | Movable air vent, mold forming apparatus provided with it and manufacturing method of electronic members |
| JP5138470B2 (en) * | 2008-06-06 | 2013-02-06 | アピックヤマダ株式会社 | Transfer molding apparatus and transfer molding method using the same |
| JP5140517B2 (en) * | 2008-08-07 | 2013-02-06 | アピックヤマダ株式会社 | Resin molding apparatus and resin molding method |
| JP5906528B2 (en) * | 2011-07-29 | 2016-04-20 | アピックヤマダ株式会社 | Mold and resin molding apparatus using the same |
| JP5744683B2 (en) * | 2011-08-31 | 2015-07-08 | Ｔｏｗａ株式会社 | Resin sealing molding method and apparatus for electronic parts |
| JP2013184413A (en) * | 2012-03-08 | 2013-09-19 | Sumitomo Heavy Ind Ltd | Resin sealing device and resin sealing method |
| JP5930394B2 (en) * | 2012-07-06 | 2016-06-08 | アピックヤマダ株式会社 | Resin molding equipment |
| JP6058431B2 (en) * | 2013-03-08 | 2017-01-11 | アピックヤマダ株式会社 | Resin molding apparatus and resin molding method |
| JP6259263B2 (en) * | 2013-11-11 | 2018-01-10 | アピックヤマダ株式会社 | Resin mold and resin mold molding method |
-
2014
- 2014-05-29 JP JP2014111374A patent/JP6320172B2/en active Active
-
2015
- 2015-04-10 CN CN201510169123.2A patent/CN105280506B/en active Active
- 2015-04-14 KR KR1020150052469A patent/KR101667879B1/en active IP Right Grant
- 2015-04-17 TW TW104112302A patent/TWI602680B/en active
- 2015-05-25 SG SG10201504081PA patent/SG10201504081PA/en unknown
- 2015-05-27 MY MYPI2015001389A patent/MY172522A/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100515717C (en) * | 1999-12-16 | 2009-07-22 | 第一精工株式会社 | Resin packaging method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI602680B (en) | 2017-10-21 |
| JP6320172B2 (en) | 2018-05-09 |
| MY172522A (en) | 2019-11-28 |
| KR101667879B1 (en) | 2016-10-19 |
| JP2015226014A (en) | 2015-12-14 |
| TW201603986A (en) | 2016-02-01 |
| SG10201504081PA (en) | 2015-12-30 |
| KR20150137992A (en) | 2015-12-09 |
| CN105280506A (en) | 2016-01-27 |
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