CN105845805A - Glue overflow preventing technique for PCB packaging process - Google Patents
Glue overflow preventing technique for PCB packaging process Download PDFInfo
- Publication number
- CN105845805A CN105845805A CN201610278251.5A CN201610278251A CN105845805A CN 105845805 A CN105845805 A CN 105845805A CN 201610278251 A CN201610278251 A CN 201610278251A CN 105845805 A CN105845805 A CN 105845805A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- mould
- spill
- injection
- encapsulation process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 57
- 239000003292 glue Substances 0.000 title claims abstract description 41
- 238000012858 packaging process Methods 0.000 title abstract 2
- 238000002347 injection Methods 0.000 claims description 58
- 239000007924 injection Substances 0.000 claims description 58
- 239000000084 colloidal system Substances 0.000 claims description 26
- 238000005538 encapsulation Methods 0.000 claims description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 238000005488 sandblasting Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a glue overflow preventing technique for a PCB packaging process. A condition that packaging flue overflows into a circuit board is avoided in a PCB packaged by adopting the technique provided by the invention. Later-stage tin soldering operation for the PCB is facilitated, poor contact during a welding process can be reduced effectively and proportion of unqualified products can be reduced.
Description
Technical field
The present invention relates to mechanical processing technique field, be specifically related to a kind of pcb board encapsulation process adhesive-spill-preventing technique.
Background technology
Existing chip type LED is during encapsulation, usually occur that packing colloid overflows into the phenomenon in wiring board orifice ring, so can affect the scolding tin operation that pcb board is follow-up, the probability causing the bad product in production process raises, even there will be situation about cannot use and scrap, so can bring puzzlement to enterprise.
Summary of the invention
The present invention provides a kind of pcb board encapsulation process adhesive-spill-preventing technique, to solve the problems referred to above.
A kind of pcb board encapsulation process adhesive-spill-preventing technique that the embodiment of the present invention provides, described a kind of pcb board encapsulation process adhesive-spill-preventing technique, including using a gel-injection mould, offer the glue runner for colloid injection on described gel-injection mould, colloid leads glue groove pcb board Surface runoff molding, described pcb board is through twice copper facing, a nickel plating, the most silver-plated process, it is characterised in that: described technique comprises the following steps:
Step one: be positioned on gel-injection mould by pcb board, regulation gel-injection mould and the relative position of pcb board, to ensure that the position leading glue groove does not cover the orifice ring on pcb board, prevent the colloid led in glue groove from overflowing in orifice ring；
Step 2: the injection mold in step one is closed, and the pressure on described injection mold is regulated to 25～50kg, injection mold is heated to 140 DEG C～170 DEG C, and then the glue runner on injection mold injects quantitative colloid, opens injection mold after pressurize 20s～60s.
Step 3: until taking off from injecting glue template through the pcb board of injection again after the colloid on pcb board solidifies 80s～140s in step 2.
Preferably, step 2 be the mould in rapid is closed after again by described mould pressure regulation to 30kg.
Preferably, step 2 is again described mould to be heated to 160 DEG C～165 DEG C after the mould Guan Bi in rapid.
Preferably, step 2 is again described mould to be heated to 165 DEG C after the mould Guan Bi in rapid.
Preferably, the dwell time of described mould is 40s, and hardening time is 120s.
Preferably, described pcb board processes through full plate sandblasting and surface sand-blasting.
Preferably, described pcb board is through green oil development treatment.
Compared with prior art the invention have the advantages that
The injection mold that present invention process uses has good sealing, mould is provided with glue runner that colloid injects and leads glue groove with glue runner is connected, described in lead the width scalable of glue groove.
The colloid of a kind of pcb board encapsulation process adhesive-spill-preventing technique injection of the present invention is epoxy resin colloid, use and first mould is heated, then injecting glue, mould pressurize solidifies, the method of the mode once injection moulding of the last demoulding, the most convenient and swift but also the feature of splendid technique effect can be taken to.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in describing below is only some embodiments of the present invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the profile of the injection mold work process of the embodiment of the present invention.
Fig. 2 is the structural representation of pcb board in the embodiment of the present invention.
Fig. 3 is the flow chart of pcb board encapsulation process adhesive-spill-preventing technique of the present invention.
Reference:
1, gel-injection mould；
2, pcb board；
21, injection district；
22, orifice ring；
3, glue runner；
4, glue groove is led.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, all other embodiments that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of protection of the invention.
Embodiment:
The embodiment of the present invention provides a kind of pcb board encapsulation process adhesive-spill-preventing technique, as shown in Figure 1 and Figure 2, described a kind of pcb board encapsulation process adhesive-spill-preventing technique, including, use a gel-injection mould 1, offer the glue runner 3 for colloid injection on described gel-injection mould 1, colloid leads glue groove 4 described pcb board 2 Surface runoff molding, and described technique comprises the following steps:
Step one: be positioned on gel-injection mould 1 by described pcb board 2, regulation gel-injection mould 2 and the relative position of described pcb board 2, to ensure to lead the orifice ring 22 that the position of glue groove 4 does not cover on pcb board, prevent leading the colloid in glue groove 4 and overflow in orifice ring 22；
Step 2: the injection mold 1 in step one is closed, and the pressure on described injection mold 1 is regulated to 25～50kg, injection mold 1 is heated to 140 DEG C～170 DEG C, then the glue runner 3 on injection mold 1 injects quantitative colloid, opens the cope match-plate pattern of injection mold 1 after pressurize 20s～60s.
Step 3: until taking off from lower bolster through the pcb board 2 of injection again after the colloid on pcb board 2 solidifies 80s～140s in step 2.
The technological process of production of described pcb board is as shown in Figure 3.
Described injection mold 1 is made up of upper and lower two pieces of templates, following template is that a flat board is for placing pcb board 2, the glue runner 3 for injecting colloid it is provided with on cope match-plate pattern, it is provided with on the face that described cope match-plate pattern contacts with PCB and leads glue groove 4, described glue groove 4 of leading is connected with described glue runner 3, and colloid is flowed into by glue runner 3 and leads glue groove 4.
The described width leading glue groove 4 is adjustable, so to adapt to be molded on pcb board 2 width between district 21.During injection, described in lead glue groove 4 and contact with the injection district 21 of described pcb board 2, can effectively prevent colloid from overflowing into the orifice ring 22 of pcb board 2.
Described pcb board 2 is chip type LED unit composition, after injecting glue operation completes, is cut by pcb board 1 along the line of centres of described orifice ring and just obtains single chip type LED unit.
Preferably, step 2 be the injection mold 1 in rapid is closed after again by described injection mold 1 pressure regulation to 30kg.
Preferably, step 2 be the injection mold 1 in rapid is closed after more described injection mold 1 is heated to 160 DEG C～165 DEG C, best, step 2 be the injection mold 1 in rapid is closed after more described injection mold 1 is heated to 165 DEG C.
Preferably, the dwell time of described injection mold 1 is 40s, and hardening time is 120s.
Most preferred embodiment:
The embodiment of the present invention provides a kind of pcb board encapsulation process adhesive-spill-preventing technique, as shown in Figure 1 and Figure 2, described a kind of pcb board encapsulation process adhesive-spill-preventing technique, including, use a gel-injection mould 1, offer the glue runner 3 that injects for colloid on described gel-injection mould 1, colloid leads glue groove 4 in pcb board 2 Surface runoff molding, and described technique comprises the following steps:
Step one: be positioned on gel-injection mould 1 by pcb board 2, regulation gel-injection mould 1 and the relative position of pcb board 2, to ensure to lead the orifice ring 22 that the position of glue groove 3 does not cover on pcb board 2, prevent leading the colloid in glue groove 4 and overflow in orifice ring 22；
Step 2: the gel-injection mould 1 in step one is closed, and by described gel-injection mould 1 pressure regulation to 30kg, gel-injection mould 1 is heated to 165 DEG C, then the glue runner 3 on gel-injection mould 1 injects quantitative colloid, keep the 30kg pressure 40s of injection mold 1, opening gel-injection mould 1, the cope match-plate pattern of gel-injection mould 1 leaves pcb board 2.
Step 3: until taking off from lower bolster through the pcb board 2 of injection again after the colloid on pcb board 2 solidifies 120s in step 2.
A kind of pcb board encapsulation process adhesive-spill-preventing technique provided the embodiment of the present invention above is described in detail, principle and the embodiment of the present invention are set forth by specific case used herein, and the explanation of above example is only intended to help to understand the core concept of the present invention；Simultaneously for one of ordinary skill in the art, according to thought and the method for the present invention, the most all will change, in sum, this specification content should not be construed as limitation of the present invention.
Claims (7)
1. a pcb board encapsulation process adhesive-spill-preventing technique, including using a gel-injection mould, described gel-injection mould
On offer for colloid inject glue runner, colloid lead glue groove pcb board Surface runoff molding,
Described pcb board is through twice copper facing, a nickel plating, the most silver-plated process, it is characterised in that: institute
State technique to comprise the following steps:
Step one: be positioned on gel-injection mould by pcb board, regulation gel-injection mould is relative with pcb board
Position, to ensure that the position leading glue groove does not cover the orifice ring on pcb board, prevents from leading the glue in glue groove
Body overflows in orifice ring；
Step 2: the injection mold in step one is closed, and by the pressure on described injection mold
Injection mold, to 25～50kg, is heated to 140 DEG C～170 DEG C, then on injection mold by regulation
Glue runner inject quantitative colloid, open injection mold after pressurize 20s～60s.
Step 3: again will be through noting after 80s～140s until solidifying until the colloid on pcb board in step 2
The pcb board moulded takes off from injecting glue template.
Pcb board encapsulation process adhesive-spill-preventing technique the most according to claim 1, it is characterised in that: step 2
Be the mould in rapid is closed after again by described mould pressure regulation to 30kg.
Pcb board encapsulation process adhesive-spill-preventing technique the most according to claim 1, it is characterised in that: step 2
It is again described mould to be heated to 160 DEG C～165 DEG C after the mould Guan Bi in rapid.
Pcb board encapsulation process adhesive-spill-preventing technique the most according to claim 3, it is characterised in that: step 2
It is again described mould to be heated to 165 DEG C after the mould Guan Bi in rapid.
Pcb board encapsulation process adhesive-spill-preventing technique the most according to claim 2, it is characterised in that: described mould
The dwell time of tool is 40s, and hardening time is 120s.
Pcb board encapsulation process adhesive-spill-preventing technique the most according to claim 1, it is characterised in that: described PCB
Plate processes through full plate sandblasting and surface sand-blasting.
Pcb board encapsulation process adhesive-spill-preventing technique the most according to claim 1, it is characterised in that: described PCB
Plate is through green oil development treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610278251.5A CN105845805A (en) | 2016-04-28 | 2016-04-28 | Glue overflow preventing technique for PCB packaging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610278251.5A CN105845805A (en) | 2016-04-28 | 2016-04-28 | Glue overflow preventing technique for PCB packaging process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105845805A true CN105845805A (en) | 2016-08-10 |
Family
ID=56589998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610278251.5A Pending CN105845805A (en) | 2016-04-28 | 2016-04-28 | Glue overflow preventing technique for PCB packaging process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105845805A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115050272A (en) * | 2021-03-09 | 2022-09-13 | 西安青松光电技术有限公司 | COB module processing method, COB module and COB display screen |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101582475A (en) * | 2008-12-29 | 2009-11-18 | 佛山市国星光电股份有限公司 | Method for coating phosphor powder layer on LED chip and manufacture of LED device |
| CN101645433A (en) * | 2008-08-04 | 2010-02-10 | 佰鸿工业股份有限公司 | Circuit board structure with excess glue prevention layer, packaging method and manufacturing method thereof |
| US20100149806A1 (en) * | 2008-12-15 | 2010-06-17 | Chi To Yiu | Led lighting device and method of manufacturing the same |
| CN102185044A (en) * | 2011-04-01 | 2011-09-14 | 木林森股份有限公司 | High-power light emitting diode (LED) liquid silicone rubber encapsulation method and encapsulation mould |
| CN202308051U (en) * | 2011-11-03 | 2012-07-04 | 广东德豪润达电气股份有限公司 | LED packaging support and LED device |
| CN103258933A (en) * | 2012-04-09 | 2013-08-21 | 东莞市久祥电子有限公司 | Method for preventing glue overflowing in packaging process of wafer-type light-emitting diode (LED) circuit board through copper plating |
| CN103762298A (en) * | 2014-02-02 | 2014-04-30 | 芜湖市神龙新能源科技有限公司 | LED wafer combination package material and technology |
| CN104210064A (en) * | 2014-08-27 | 2014-12-17 | 广东威创视讯科技股份有限公司 | LED mold pressing molding device and molding method thereof |
-
2016
- 2016-04-28 CN CN201610278251.5A patent/CN105845805A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101645433A (en) * | 2008-08-04 | 2010-02-10 | 佰鸿工业股份有限公司 | Circuit board structure with excess glue prevention layer, packaging method and manufacturing method thereof |
| US20100149806A1 (en) * | 2008-12-15 | 2010-06-17 | Chi To Yiu | Led lighting device and method of manufacturing the same |
| CN101582475A (en) * | 2008-12-29 | 2009-11-18 | 佛山市国星光电股份有限公司 | Method for coating phosphor powder layer on LED chip and manufacture of LED device |
| CN102185044A (en) * | 2011-04-01 | 2011-09-14 | 木林森股份有限公司 | High-power light emitting diode (LED) liquid silicone rubber encapsulation method and encapsulation mould |
| CN202308051U (en) * | 2011-11-03 | 2012-07-04 | 广东德豪润达电气股份有限公司 | LED packaging support and LED device |
| CN103258933A (en) * | 2012-04-09 | 2013-08-21 | 东莞市久祥电子有限公司 | Method for preventing glue overflowing in packaging process of wafer-type light-emitting diode (LED) circuit board through copper plating |
| CN103762298A (en) * | 2014-02-02 | 2014-04-30 | 芜湖市神龙新能源科技有限公司 | LED wafer combination package material and technology |
| CN104210064A (en) * | 2014-08-27 | 2014-12-17 | 广东威创视讯科技股份有限公司 | LED mold pressing molding device and molding method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115050272A (en) * | 2021-03-09 | 2022-09-13 | 西安青松光电技术有限公司 | COB module processing method, COB module and COB display screen |
| CN115050272B (en) * | 2021-03-09 | 2023-09-22 | 西安青松光电技术有限公司 | COB module processing method, COB module and COB display screen |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160810 |