CN108130039A - A kind of low-gravity low viscosity heat conduction casting glue and preparation method thereof - Google Patents
A kind of low-gravity low viscosity heat conduction casting glue and preparation method thereof Download PDFInfo
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- CN108130039A CN108130039A CN201711408415.2A CN201711408415A CN108130039A CN 108130039 A CN108130039 A CN 108130039A CN 201711408415 A CN201711408415 A CN 201711408415A CN 108130039 A CN108130039 A CN 108130039A
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- heat conduction
- casting glue
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- 239000003292 glue Substances 0.000 title claims abstract description 51
- 238000005266 casting Methods 0.000 title claims abstract description 50
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 229920002545 silicone oil Polymers 0.000 claims abstract description 29
- 239000000945 filler Substances 0.000 claims abstract description 21
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 19
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 19
- 239000004611 light stabiliser Substances 0.000 claims abstract description 15
- 239000003054 catalyst Substances 0.000 claims abstract description 13
- 239000004014 plasticizer Substances 0.000 claims abstract description 11
- 239000003112 inhibitor Substances 0.000 claims abstract description 6
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 5
- 239000002994 raw material Substances 0.000 claims description 10
- 229910052739 hydrogen Inorganic materials 0.000 claims description 9
- 239000001257 hydrogen Substances 0.000 claims description 9
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 8
- 150000002431 hydrogen Chemical class 0.000 claims description 7
- 229920003023 plastic Polymers 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 7
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical class N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 6
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims description 6
- 150000002148 esters Chemical class 0.000 claims description 6
- 239000004005 microsphere Substances 0.000 claims description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 5
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical class [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 5
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 5
- 229920001568 phenolic resin Polymers 0.000 claims description 5
- 239000005011 phenolic resin Substances 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- -1 acetylenedicarboxylic acid ester Chemical class 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical class [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 claims description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 208000020442 loss of weight Diseases 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 2
- PFRGGOIBYLYVKM-UHFFFAOYSA-N 15alpha-hydroxylup-20(29)-en-3-one Natural products CC(=C)C1CCC2(C)CC(O)C3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 PFRGGOIBYLYVKM-UHFFFAOYSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- SOKRNBGSNZXYIO-UHFFFAOYSA-N Resinone Natural products CC(=C)C1CCC2(C)C(O)CC3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 SOKRNBGSNZXYIO-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001345 alkine derivatives Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 150000003022 phthalic acids Chemical class 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/18—Spheres
- C08L2205/20—Hollow spheres
Abstract
The invention discloses a kind of preparation method of low-gravity low viscosity heat conduction casting glue, including 100 parts of vinyl silicone oils, 4 25 parts of crosslinking agents, 60 220 parts of low-gravity heat fillings, 4 80 parts of low-gravity fillers, 3 10 parts of plasticizer, 15 parts of light stabilizers, 0.05 0.5 parts of catalyst, 0.002 0.06 parts of inhibitor.Product of the present invention has good thermal conductivity and anti-flammability, low viscosity, and good leveling property is formed by curing soft rubber-like, good impact resistance, insulation, moisture-proof and chemical mediator-resitant property.The invention also discloses a kind of preparation method of low-gravity low viscosity casting glue, which includes A and B component, and preparation method includes preparing base rubber, prepares three steps of component A and B component.
Description
Technical field
The present invention relates to a kind of low-gravity low viscosity heat conduction casting glues and preparation method thereof, belong to casting glue technical field.
Background technology
Not heat release when addition-type silicon rubber cures, no small molecule by-product release, shrinking percentage is small, energy deep cure, sizing
Glue sample simple for process, being formed after curing can keep elasticity for a long time in -65~200 DEG C of temperature ranges, have excellent electrical
Performance and chemical stability, water-fast, resistance to ozone, resistance to irradiation, weather-resistant and curingprocess rate can be controlled etc. excellent with temperature
Point, therefore the demand of plus type thermal conductivity potting plastic is all increasing every year.
Under the background of low-carbon economy, the economic model of promotion is low stain, low consumption, low emission.In recent years, world master
Big country is wanted to pay special attention to low-carbon economy, one after another under low-carbon economy under the premise of greatly develop new-energy automobile.New energy
Automotive light weight technology is to reduce discharge, energy saving effective way, but using battery pack as power source, huge battery system is tight
Ghost image rings course continuation mileage.It is reported that car weight often reduces 10%, oil consumption can reduce by 6%~8%, and discharge capacity can reduce by 5%~6%.Cause
This, domestic relevant policies requirement proposes, vehicle body loss of weight 25% is realized to new-energy automobile in 2017, to the year two thousand twenty loss of weight 30%
Target.
Since battery can generate amount of heat during charging and discharging, heat accumulation can cause battery overheat to explode
And cause fire, because the industry introduces heat conduction, flame-proof organosilicon casting glue, the heat that conduction battery generates improves battery work
Temperature prevents battery from overheating and fire occurs or avoids battery and shell that short circuit occurs, while plays damping and the work that is adhesively fixed
With protection inside battery electronic device.
Commercially available new energy car battery organic silicon potting adhesive at this stage, thermal conductivity factor is low, than great, flame retardant property
Difference, and viscosity is unfavorable for greatly embedding.Therefore, the low-gravity low viscosity heat conduction casting glue for developing a excellent combination property is ten
Divide what is had to, this is of great significance to the safety and lightweight of new-energy automobile.
Invention content
In view of the above problems, the present invention provides a kind of low-gravity low viscosity heat conduction casting glue, the proportion of the heat conduction casting glue
Flame-retarded heat-conducting performance low, viscosity is small, excellent.
The present invention also provides a kind of preparation methods of low-gravity low viscosity heat conduction casting glue
For realization more than goal of the invention, the technical solution adopted in the present invention is：
A kind of low-gravity low viscosity heat conduction casting glue, including A and B component, component A includes the original of following mass fraction meter
Material：
B component includes the raw material of following mass fraction meter：
Further, the vinyl silicone oil in the component A and B component is vinyl-terminated silicone fluid, the friendship in the B component
Join the side chain containing hydrogen silicone oil that agent is low viscosity.
Further, the component A and the viscosity of the vinyl silicone oil in B component are 200-1000mpa.s, and vinyl contains
It measures as 0.1%-0.75%；
Further, the viscosity of the side chain containing hydrogen silicone oil of the low viscosity is 20-600mpa.s, hydrogen content 0.1%-
0.75%.
Further, the catalyst in the component A for chloroplatinic acid, chloroplatinic acid-isopropanol, Karst catalyst it is arbitrary
It is a kind of.
Further, the platinum content of the catalyst is 1000ppm-10000ppm.
Further, the low-gravity heat conductive flame-retarding filler in the component A and B component is modified aluminas, modified oxidized
Magnesium, modified zinc oxide, modified aluminium nitride, one kind of modified boron nitride or arbitrary two or more mixing.
Further, the low-gravity filler in the component A and B component is hollow micro- for hollow glass micropearl, phenolic resin
One kind or arbitrary two or more mixing in pearl, plastic microsphere.
Further, the plasticizer in the component A and B component is methyl-silicone oil, phthalic acid two (2- ethyl hexyls)
Ester, one kind of dioctyl phthalate or arbitrary two or more mixing.
Further, the light stabilizer in the component A and B component be light stabilizer 770, light stabilizer 9 44, light it is steady
Determine one kind of agent 622 or arbitrary two or more mixing.
Further, the inhibitor in the B component is acetylenedicarboxylic acid ester, 3- methyl-1s-butine -3- alcohol, amine oxide
A kind of or arbitrary two or more mixing.
A kind of preparation method of low-gravity low viscosity heat conduction casting glue of the present invention, comprises the steps of：
(1) component A is prepared
It is under normal temperature condition, vinyl silicone oil, low-gravity heat conductive flame-retarding filler, low-gravity filler, plasticizer and light is steady
Determine agent to be added in planet reaction kettle, mix 2-3 hour, then add in catalyst mixing half an hour, component A is made；
(2) component B is prepared
Under normal temperature condition, by vinyl silicone oil, crosslinking agent, low-gravity heat conductive flame-retarding filler, low-gravity filler, plasticizer
It is added in planet reaction kettle with light stabilizer, mixes 2-3 hour, then add in inhibitor mixed half an hour, group is made
Divide B；
(3) low-density heat conduction casting glue is prepared
By the component A being prepared and component B according to mass ratio 1:1 is mixed 10-40 minutes, 5-10 points of vacuum defoamation
Low-density heat conduction casting glue is prepared in clock, ambient temperature curing 10-24h.
The beneficial effects of the invention are as follows：
The present invention provides a kind of low-gravity low viscosity heat conduction casting glue, which hinders including suitable low-gravity heat conduction
Filler, low-gravity filler, plasticizer and light stabilizer are fired, low-density, low viscosity, heat conductivility and fire-retardant have been prepared jointly
The heat conduction casting glue haveing excellent performance；It is compared with the heat conduction casting glue of mainstream in the market, density reduces by 50%, can be substantially reduced new
The battery weight of energy automobile meets the requirement for the low-carbon economy that countries in the world are advocated.For the application request of client, lead to
The adjustment to raw materials such as powders in formula is crossed, prepares the heat conduction casting glue of different viscosities proportion, therefore the heat conduction casting glue should
It is extensive with prospect.
The present invention also provides a kind of preparation methods of low-gravity low viscosity heat conduction casting glue, and the preparation process is simple, right
Equipment requirement is not high, the shorter production cycle, is suitble to industrialized production.
Specific embodiment
Specific embodiment is given below, the present invention is further elaborated.
Performance test standard employed in the following example is：
Viscosity is according to GB/T 2794-1995 standard rotary viscosity design determinings；
Hardness is according to GB/T 531-1992 standard tests；
Density is according to GB/T 533-2008 standard tests；
Thermal conductivity factor is according to ASTM D5470-2006 standard tests；
Flame retardant property is according to GB-T2409 standard tests；
Embodiment 1
A kind of low-density heat conduction casting glue includes A and B component, and component A includes the raw material of following mass fraction meter：
B component includes the raw material of following mass fraction meter：
The preparation process of the low-density low viscosity heat conduction casting glue is：
(1) component A is prepared
Under normal temperature condition, by 100 parts of vinyl silicone oils, 60 parts of modified aluminas, 4 parts of hollow glass micropearls, 3 parts of methyl
Silicone oil and 1 part 770 are added in planet reaction kettle, mix 2-3 hour, then add in 0.05 part of chloroplatinic acid mix it is half small
When, component A is made；
(2) component B is prepared
Under normal temperature condition, by 100 parts of vinyl silicone oils, 4 parts of containing hydrogen silicone oils, 3 parts of methyl-silicone oils, 60 parts it is modified oxidized
Aluminium, 4 parts of hollow glass micropearls and 1 part 770 are added in planet reaction kettle, mix 2-3 hour, then add in 0.002 part of fourth
Two acid esters of alkynes mixes half an hour, and component B is made；
(3) low-density heat conduction casting glue is prepared
By the component A being prepared and component B according to mass ratio 1:1 is mixed 10-40 minutes, 5-10 points of vacuum defoamation
Low-density heat conduction casting glue is prepared in clock, ambient temperature curing 10-24h.
Embodiment 2
A kind of low-density heat conduction casting glue includes A and B component, and component A includes the raw material of following mass fraction meter：
| Vinyl silicone oil | 100 |
| Modified aluminium nitride (low-gravity heat conductive flame-retarding filler) | 100 |
| Phenolic resin cenosphere (low-gravity filler) | 25 |
| Phthalic acid two (2- ethyl hexyls) ester (plasticizer) | 5 |
| 9 44 (light stabilizers) | 2 |
| Chloroplatinic acid-isopropanol (catalyst) | 0.15 |
B component includes the raw material of following mass fraction meter：
The preparation process of the low-density low viscosity heat conduction casting glue is：
(1) component A is prepared
Under normal temperature condition, by 100 parts of vinyl silicone oils, 100 parts of modified aluminium nitride, 25 phenolic resin cenospheres, 5 parts
(2- ethyl hexyls) ester of phthalic acid two and 2 part 944 are added in planet reaction kettle, are mixed 2-3 hour, are then added in 0.15
Part chloroplatinic acid-isopropanol mixing half an hour, is made component A；
(2) component B is prepared
Under normal temperature condition, by 100 parts of vinyl silicone oils, 8 parts of containing hydrogen silicone oils, 5 parts of phthalic acids two (2- ethyl hexyls)
Ester, 110 parts of modified aluminium nitride, 24 parts of phenolic resin cenospheres and 2 part 994 are added in planet reaction kettle, and mixing is 2-3 small
When, 0.032 part of 3- methyl-1-butine-3- alcohol mixing half an hour is then added in, component B is made；
(3) low-density heat conduction casting glue is prepared
By the component A being prepared and component B according to mass ratio 1:1 is mixed 10-40 minutes, 5-10 points of vacuum defoamation
Low-density heat conduction casting glue is prepared in clock, ambient temperature curing 10-24h.
Embodiment 3
A kind of low-density heat conduction casting glue includes A and B component, and component A includes the raw material of following mass fraction meter：
| Vinyl silicone oil | 100 |
| Modified boron nitride (low-gravity heat conductive flame-retarding filler) | 180 |
| Plastic microsphere (low-gravity filler) | 40 |
| Dioctyl phthalate (plasticizer) | 8 |
| 622 (light stabilizers) | 3 |
| Karst catalyst (catalyst) | 0.25 |
B component includes the raw material of following mass fraction meter：
| Vinyl silicone oil | 100 |
| Containing hydrogen silicone oil (crosslinking agent) | 8 |
| Dioctyl phthalate (plasticizer) | 7 |
| Modified boron nitride (low-gravity heat conductive flame-retarding filler) | 180 |
| Plastic microsphere (low-gravity filler) | 30 |
| 622 (light stabilizers) | 3 |
| Amine oxide (inhibitor) | 0.040 |
The preparation process of the low-density low viscosity heat conduction casting glue is：
(1) component A is prepared
Under normal temperature condition, by 100 parts of vinyl silicone oils, 180 parts of modified boron nitride, 40 parts of plastic microspheres, 8 O-phthalics
Dioctyl phthalate and 3 part 622 are added in planet reaction kettle, mix 2-3 hour, and then 0.25 part of Karst catalyst of addition mixes
Half an hour is closed, component A is made；
(2) component B is prepared
Under normal temperature condition, by 100 parts of vinyl silicone oils, 8 parts of containing hydrogen silicone oils, 7 parts of dioctyl phthalates, 180 parts
Modified boron nitride, 30 parts of plastic microspheres and 3 part 622 are added in planet reaction kettle, are mixed 2-3 hour, are then added in 0.040
Part amine oxide mixing half an hour, component B is made；
(3) low-density heat conduction casting glue is prepared
By the component A being prepared and component B according to mass ratio 1:1 is mixed 10-40 minutes, 5-10 points of vacuum defoamation
Low-density heat conduction casting glue is prepared in clock, ambient temperature curing 10-24h.
The casting glue product of Example 1-3 carries out performance contrast test, and test result is shown in Table 1.
The casting glue product performance index of 1 embodiment 1-3 of table
From table 1 it follows that heat conduction casting glue of the present invention has relatively low, the very low density of viscosity, higher hardness, excellent
Different fire-retardant and heat conductivility, meets the real requirement of batteries of electric automobile, and safety coefficient is high.
Above-described embodiment is used for illustrating the present invention rather than limiting the invention, in the claims in the present invention
In protection domain, to any modifications and changes that the present invention makes, protection scope of the present invention is both fallen within.
Claims (12)
1. a kind of low-gravity low viscosity heat conduction casting glue, which is characterized in that including A and B component, component A includes following mass parts
The raw material of number meter：
B component includes the raw material of following mass fraction meter：
2. low-gravity low viscosity heat conduction casting glue as described in claim 1, which is characterized in that in the component A and B component
Vinyl silicone oil is vinyl-terminated silicone fluid, and the crosslinking agent in the B component is the side chain containing hydrogen silicone oil of low viscosity.
3. low-gravity low viscosity heat conduction casting glue as claimed in claim 2, which is characterized in that the side chain of the low viscosity is hydrogeneous
The viscosity of silicone oil is 20-600mpa.s, hydrogen content 0.1%-0.75%.
4. low-gravity low viscosity heat conduction casting glue as described in claim 1, which is characterized in that in the component A and B component
The viscosity of vinyl silicone oil is 200-1000mpa.s, contents of ethylene 0.1%-0.75%.
5. low-gravity low viscosity heat conduction casting glue as described in claim 1, which is characterized in that the catalyst in the component A
For any one of chloroplatinic acid, chloroplatinic acid-isopropanol, Karst catalyst.
6. low-gravity low viscosity heat conduction casting glue as claimed in claim 5, which is characterized in that the platinum content of the catalyst is
1000ppm-10000ppm。
7. low-gravity low viscosity heat conduction casting glue as described in claim 1, which is characterized in that in the component A and B component
Low-gravity heat conductive flame-retarding filler is modified aluminas, modified oxidized magnesium, modified zinc oxide, modified aluminium nitride, is modified boron nitride
A kind of or arbitrary two or more mixing.
8. low-gravity low viscosity heat conduction casting glue as described in claim 1, which is characterized in that in the component A and B component
Low-gravity filler is hollow glass micropearl, phenolic resin cenosphere, one kind in plastic microsphere or arbitrary two or more mixed
It closes.
9. low-gravity low viscosity heat conduction casting glue as described in claim 1, which is characterized in that in the component A and B component
Plasticizer for methyl-silicone oil, phthalic acid two (2- ethyl hexyls) ester, dioctyl phthalate one kind or it is arbitrary two kinds with
On mixing.
10. low-gravity low viscosity heat conduction casting glue as described in claim 1, which is characterized in that in the component A and B component
Light stabilizer be light stabilizer 770, one kind of light stabilizer 9 44, light stabilizer 622 or arbitrary two or more mixing.
11. low-gravity low viscosity heat conduction casting glue as described in claim 1, which is characterized in that the inhibitor in the B component
For acetylenedicarboxylic acid ester, 3- methyl-1s-butine -3- alcohol, one kind of amine oxide or arbitrary two or more mixing.
12. a kind of preparation method of low-gravity low viscosity heat conduction casting glue described in any one of claim 1 to 11 claim,
It is characterized in that, it comprises the steps of：
(1) component A is prepared
Under normal temperature condition, by vinyl silicone oil, low-gravity heat conductive flame-retarding filler, low-gravity filler, plasticizer and light stabilizer
It is added in planet reaction kettle, mixes 2-3 hour, then add in catalyst mixing half an hour, component A is made；
(2) component B is prepared
Under normal temperature condition, by vinyl silicone oil, crosslinking agent, low-gravity heat conductive flame-retarding filler, low-gravity filler, plasticizer and light
Stabilizer is added in planet reaction kettle, mixes 2-3 hour, then adds in inhibitor mixed half an hour, and component B is made；
(3) low-density heat conduction casting glue is prepared
By the component A being prepared and component B according to mass ratio 1:1 is mixed 10-40 minutes, vacuum defoamation 5-10 minutes,
Low-density heat conduction casting glue is prepared in ambient temperature curing 10-24h.
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| CN201711408415.2A CN108130039A (en) | 2017-12-22 | 2017-12-22 | A kind of low-gravity low viscosity heat conduction casting glue and preparation method thereof |
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| WO2020039761A1 (en) * | 2018-08-23 | 2020-02-27 | 信越化学工業株式会社 | Thermally-conductive silicone composition and thermally-conductive silicone cured product |
| CN112322028A (en) * | 2020-11-05 | 2021-02-05 | 深圳市傲川科技有限公司 | Polyurethane low-density heat-conducting gel and preparation method thereof |
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