CN109401725A - A kind of new-energy automobile high thermal conductivity encapsulating silicon rubber - Google Patents
A kind of new-energy automobile high thermal conductivity encapsulating silicon rubber Download PDFInfo
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- CN109401725A CN109401725A CN201811435524.8A CN201811435524A CN109401725A CN 109401725 A CN109401725 A CN 109401725A CN 201811435524 A CN201811435524 A CN 201811435524A CN 109401725 A CN109401725 A CN 109401725A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The present invention provides a kind of automobile-used high thermal conductivity encapsulating silicon rubber, the silicon rubber is by the component A (methylvinyl-polysiloxane including 20~50wt%, the methylhydrogenpolysi,oxane of 4~20wt%, the heat filling of 20~40wt%, the glass microballoon of 10~30wt% and the inhibitor of 0.01~0.1wt%) and the B component (methylvinyl-polysiloxane including 30~60wt%, the heat filling of 20~40wt%, the glass microballoon of 10~20wt%, the tackifier of 0.05~3wt% and the catalyst of 0.05~2wt%) it is uniformly mixed by weight 1:1, solidification obtains；The present invention is by introducing glass microballoon, can obtain it is a kind of there is high thermal conductivity, hardness, shear strength and flame retardant property and the lesser encapsulating silicon rubber of each component viscosity, can satisfy that car lithium battery is moderate for high thermal conductivity, the hardness of encapsulating silicon rubber and the requirement of high fluidity.
Description
Technical field
The invention belongs to silastic material field more particularly to a kind of new-energy automobile high thermal conductivity encapsulating silicon rubber.
Background technique
Vehicle lithium battery material has numerous electronic components, high-power circuit module, large-scale integrated circuit board etc. multiple
Miscellaneous electrical component, said elements needs are filled closing, with fixation component therein, protect it from environment influence.Electrically
The filling of element is closed common casting glue and is carried out, the casting glue used need to have good insulation performance, lower water absorption rate,
Preferable absorbing and securely and the performances such as component are not corroded to the bonding of electronic component and plate, with vehicle lithium electricity
The increase of pond group energy density and the wherein raising of electronic component power, it is also higher and higher for the requirement of casting glue at present,
Casting glue material is not required nothing more than with excellent high voltage withstanding, thermally conductive and flame retardant property, but also requires it that there is preferable dissipate
Hot property, local temperature caused by can not being shed with the heat for preventing vehicle lithium battery group from generating in high power operation is excessively high,
And then cause fire.
Encapsulating glue material main component currently used for electronic product protection is mostly dual composition addition type silicon rubber, and first group
Divide is mostly containing vinyl polysiloxane (also known as vinyl silicone oil), filler and crosslinking agent hydrogen-based polysiloxanes (also known as Silicon Containing Hydrogen
Oil) mixture, the second component be mostly the mixture containing vinyl silicone oil, filler and catalyst, above two component is mixed
After conjunction, elastomer-forming can be solidified at ambient temperature or elevated temperature, that is, can reach the purpose of protection electronic component, this add-on type
Liquid silastic Embedding Material have do not release low molecule by-product, stress it is smaller, can deep layer vulcanization, corrosion-free, cross-linked structure
Easy to control, the advantages that vulcanizate shrinking percentage is small, product can not only vulcanize at normal temperature, but also can heat vulcanization, in addition, add-on type liquid
Body silicon rubber also has that sizing material viscosity is low, good fluidity, can be poured, can use pumping and static mixing, has simple process, fast
Prompt, energy-efficient advantage.
However, needing for the better thermally conductive and flame retardant property of the silicon rubber assigned in dual composition addition type silicon rubber
More thermally conductive and fire-retardant filler is added in glue, the increase of filler quantity will lead to the viscous of the mixture of vinyl silicone oil and filler
Degree and density increase rapidly, when filler is added to it is a certain amount of when, the mobility of sizing can be very poor, can not be used as electronic component
The casting glue of protection come using, moreover, because in polysiloxanes inevitably contain a certain amount of low molecule volatile substances,
So that obtained casting glue product generates certain contraction with liquid curing because of soluble matter volatilization during cured, work as contraction
Rate may generate stress when excessive, so that there is a situation where drift even open circuits for part electronic component.
For example, a kind of preparation method of halogen-free flame-retarded heat-conducting organic silicon electronic potting adhesive is disclosed in CN101735619A,
Including by vinyldimethicone, supporting material, heat filling and it is approximately fire-retardant and be added vacuum kneader in,
100~150 DEG C, under 0.06~0.1MPa of vacuum degree, 30~120min is blended and obtains base-material, later, in 100 parts of base-material plus
Enter 0.2~45 part of containing hydrogen silicone oil and 0.002~0.01 part of cross-linked inhibitor obtains component A, platinum content is added in base-material is
The platinum catalyst of 1000~5000ppm, 10~30min of stirring obtain B component, component A and B component are blended to obtain the electronics
Casting glue；A kind of two-component casting glue of low viscosity high thermal conductivity is disclosed in CN10196258A, is pressed by component A and B component
The weight ratio of 100:80~125 forms, and component A is by the conduction powder of 40~90wt%, the low-viscosity (mobile) liquid of 4.5~50wt%
The toner of silicone oil, the silane-cure agent of 0.5~10wt% and 0~5wt% forms, and B component is by the thermally conductive of 40~90wt%
Material, the low-viscosity (mobile) liquid silicone oil of 9.5~54wt%, the catalyst of 0.04~1wt% and 0~5wt% toner composition.On
The viscosity for stating encapsulating silicon rubber obtained in the prior art is higher, and more than 30A (shore hardness), thermal conductivity exists hardness after solidification
0.6W/mK or less, it is difficult to meet damping property of the lithium battery encapsulating silastic material for mobility before solidifying and after solidifying
The requirement of energy.
Therefore, on the basis of existing technology, those skilled in the art needs to research and develop a kind of novel silastic material,
Making it before curing has lower viscosity and preferably mobility, and hardness is lower after hardening, thermal conductivity is higher, makes its satisfaction
Demand of the vehicle lithium battery material for encapsulating integrality and heat dissipation performance.
Summary of the invention
In view of the deficiencies of the prior art, the present invention intends to provide a kind of novel silastic material, make it
There is lower viscosity and preferably mobility before curing, hardness is lower after hardening, thermal conductivity is higher, meets it automobile-used
Demand of the lithium battery material for encapsulating integrality and heat dissipation performance.
For this purpose, one of the objects of the present invention is to provide a kind of new-energy automobile high thermal conductivity encapsulating silicon rubber,
The silicon rubber is uniformly mixed by component A and B component by weight 1:1, and solidification obtains.
The component A count by weight percentage, including following component:
Wherein, count by weight percentage, the content of methylvinyl-polysiloxane component can for 21wt%,
The content of 25wt%, 30wt%, 35wt%, 40wt%, 45wt% or 48wt% etc., methylhydrogenpolysi,oxane component can be
The content of 6wt%, 8wt%, 10wt%, 12wt%, 14wt%, 16wt% or 18wt% etc., heat filling component can be
22wt%, 24wt%, 26wt%, 28wt%, 30wt%, 32wt%, 34wt%, 36wt% or 38wt% etc., glass microballoon group
The content divided can be 12wt%, 14wt%, 16wt%, 18wt%, 20wt%, 22wt%, 24wt%, 26wt% or 28wt%
Deng, inhibitor component content can for 0.02wt%, 0.03wt%, 0.04wt%, 0.05wt%, 0.06wt%,
0.07wt%, 0.08wt% or 0.09wt% etc..
The B component count by weight percentage, including following component:
Wherein, count by weight percentage, the content of methylvinyl-polysiloxane component can for 32wt%,
34wt%, 36wt%, 38wt%, 40wt%, 42wt%, 45wt%, 48wt%, 51wt%, 54wt% or 58wt% etc., it is thermally conductive
The content of filler component can for 22wt%, 24wt%, 26wt%, 28wt%, 30wt%, 32wt%, 34wt%, 36wt% or
38wt% etc., the content of glass microballoon component can for 11wt%, 12wt%, 13wt%, 14wt%, 15wt%, 16wt%,
17wt%, 18wt% or 19wt% etc., the content of tackifier component can for 0.06wt%, 0.09wt%, 0.15wt%,
The content of 0.4wt%, 0.6wt%, 1wt%, 1.5wt%, 2wt%, 2.5wt% or 2.8wt% etc., catalytic component can be
0.06wt%, 0.09wt%, 0.12wt%, 0.2wt%, 0.4wt%, 0.6wt%, 0.9wt%, 1.2wt%, 1.5wt%,
1.8wt% or 1.9wt% etc..
Wherein, " high thermal conductivity " encapsulating silicon rubber of the present invention refers to the silicon rubber of thermal conductivity > 0.65W/mK.
In the present invention, becoming for the glass microballoon is silica glass, and the introducing of glass microballoon can lubricate silicon rubber
The molecule segment of high polymer in glue reduces tangling between molecule segment, improves flexible, reduces other fillers for encapsulating adhesiveness
Promotion effect, and then reduce component A and the B component viscosity before curing of silicon rubber, improve the mobility of casting glue entirety,
The density of silicon rubber is reduced, while the thermal conductivity of the encapsulating silicon rubber after solidifying can also be improved, improves its heat dissipation performance.
Preferably, the viscosity of the component A be 3000~4200cps, for example, 3200cps, 3400cps, 3600cps,
3800cps or 3900cps etc..
Preferably, the viscosity of the B component be 3500~4000cps, for example, 3550cps, 3600cps, 3650cps,
3700cps, 3750cps, 3800cps, 3850cps, 3900cps or 3950cps etc..
Preferably, the component A count by weight percentage, is grouped as by following group:
The B component count by weight percentage, is grouped as by following group:
Preferably, count by weight percentage, activity on the silicon atoms is directly connected in the methylhydrogenpolysi,oxane
The content of hydrogen be 0.01~1.5wt%, for example, 0.02wt%, 0.03wt%, 0.04wt%, 0.05wt%, 0.06wt%,
0.08wt%, 0.1wt%, 0.12wt% or 0.14wt% etc., further preferably 0.8~1wt%.
Preferably, the weight average molecular weight of the methylhydrogenpolysi,oxane be 500~500000, for example, 600,1000,
2000,3000,5000,8000,12000,40000,80000,100000,150000,250000,400000 or 450000 etc.,
Further preferably 10000~50000.
Preferably, the methylhydrogenpolysi,oxane has structural formula as shown in Equation 1:
Wherein, R1Selected from methyl, ethyl or phenyl, R2For hydrogen atom, p and q are positive integer.
Preferably, count by weight percentage, the content of the methylvinyl-polysiloxane medium vinyl be 0.1~
4wt%, for example, 0.2wt%, 0.5wt%, 0.8wt%, 1.2wt%, 1.6wt%, 2wt%, 2.5wt%, 3wt% or
3.5wt% etc..
Preferably, the weight average molecular weight of the methylvinyl-polysiloxane be 500~500000, for example, 600,
1000,2000,3000,5000,8000,12000,40000,80000,100000,150000,250000,400000 or
450000 etc., further preferably 10000~50000.
Preferably, the methylvinyl-polysiloxane has structural formula as shown in Equation 2:
Wherein, R3And R4It is each independently selected from methyl, ethyl or phenyl, a is positive integer.
Preferably, the partial size of the heat filling is 0.01~20 μm, for example, 0.02 μm, 0.05 μm, 0.1 μm, 0.3 μ
M, 0.6 μm, 1 μm, 2 μm, 4 μm, 8 μm, 12 μm, 16 μm or 19 μm etc..
Preferably, the heat filling is silica, calcium carbonate, aluminium oxide, alumino-silicate, aluminium hydroxide, nitridation
In boron, aluminium nitride or silicon carbide any one or at least two mixture..
Preferably, the partial size of the glass microballoon is 1~100 μm, for example, 2 μm, 5 μm, 20 μm, 50 μm, 100 μm, 200
μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm or 950 μm etc., the glass microballoon of above-mentioned particle size range
Optimal for the lubricant effect of polymer segment, more than above-mentioned particle size range, then lubricant effect declines and has not for adhesion strength
Benefit influence, lower than above-mentioned particle size range then glass microballoon lubricant effect decline acutely, further preferably 35~40 μm.
Preferably, the glass microballoon is solid glass micro-bead, and density is 2~2.6g/cm3, for example, 2.05g/cm3、
2.1g/cm3、2.15g/cm3、2.2g/cm3、2.25g/cm3、2.3g/cm3、2.35g/cm3、2.4g/cm3、2.45g/cm3、
2.5g/cm3Or 2.55g/cm3Deng, solid glass pearl is more advantageous to solidify after silicon rubber thermal conductivity raising.
Preferably, the tackifier are the Nanjing KH-550 type tackifier of chemical company's production, KH-560 type thickening forward
Agent, KH-570 type tackifier, KH-792 type tackifier, vinyltrimethoxysilane, methyltrimethoxysilane, vinyl three
In Ethoxysilane or methyltriethoxysilane any one or at least two mixture, the introducing of tackifier can fit
When the rate of descent of control encapsulating adhesiveness, it is allowed to be suitable for different applications.
Preferably, the inhibitor be divinyl tetramethyl disiloxane, acetylene cyclohexanol, diallyl formamide,
In t etram-ethyltetravinylcyclotetrasiloxane or diallyl fumarate any one or at least two mixture.
Preferably, the catalyst is platinum catalyst.
Preferably, the platinum catalyst is the mixture of the complex of platinum or the chelate of platinum and organopolysiloxane.
Preferably, the silicon rubber is mixed evenly by component A and B component 1:1 in mass ratio, under vacuum after row's bubble,
At 100~180 DEG C (for example, 110 DEG C, 120 DEG C, 130 DEG C, 140 DEG C, 150 DEG C, 160 DEG C or 170 DEG C etc.) solidification 30~
120min (for example, 40min, 50min, 60min, 70min, 80min, 90min, 100min or 110min etc.) is obtained.
Numberical range of the present invention not only includes enumerated point value, further includes the above-mentioned numerical value not included
Arbitrary point value between range, as space is limited and for concise consideration, range described in the present invention no longer exclusive list includes
Specific point value.
Compared with prior art, the invention has the benefit that
The present invention by introducing glass microballoon in traditional two-component silicone rubber, and suitably adjust each component proportion and
The type of glass microballoon can obtain a kind of hardness with higher shear intensity in 36 or so (shore A), and thermal conductivity reaches
0.88W/mK, flame retardant property are the two-component response type encapsulating silicon that UL-94V0 rank and each component viscosity are respectively less than 4200cps
Rubber, can satisfy that car lithium battery is moderate for high thermal conductivity, the hardness of encapsulating silicon rubber and the requirement of high fluidity.
Specific embodiment
The technical scheme of the invention is further explained by means of specific implementation.
Following all viscosity datas " measure transparent and opaque liquid kinetic viscosity according to Unite States Standard ASTM D445-2017
The standard test method of (and dynamic viscosity calculating) " described in method measurement.
Embodiment 1
It is prepared via a method which encapsulating silicon rubber 1:
By the way that component A and B component 1:1 in mass ratio to be mixed evenly, under vacuum after row's bubble, solidify at 140 DEG C
60min is obtained.
The component A is mixed to get by following component: the content for the vinyl that 39.4kg weight average molecular weight is 10000 is
The methyl hydrogen that the active hydrogen content that methylvinyl-polysiloxane, the 10kg weight average molecular weight of 4wt% is 15000 is 0.8wt%
Polysiloxanes, the silicon carbide heat filling that 35.5kg average grain diameter is 10 μm, the density that 15kg average grain diameter is 38 μm are
2.45g/cm3Solid glass micro-bead and 0.1kg inhibitor divinyl tetramethyl disiloxane, the viscosity of component A be
3680cps。
The B component is mixed to get by following component: the content for the vinyl that 49.4kg weight average molecular weight is 25000 is
The methylvinyl-polysiloxane of 0.8wt%, the alpha-silicon nitride powders that 33kg average grain diameter is 10 μm, 15kg average grain diameter are 38 μm
Density be 2.45g/cm3Hollow glass micropearl, 2kg tackifier vinyltrimethoxysilane and 0.6kg catalyst chlorine platinum
The mixture of acid and vinylsiloxane mass ratio 2:1, the viscosity of B component are 3810cps.
Embodiment 2
It is prepared via a method which encapsulating silicon rubber 2:
By the way that component A and B component 1:1 in mass ratio to be mixed evenly, under vacuum after row's bubble, solidify at 140 DEG C
60min is obtained.
The component A is mixed to get by following component: the content for the vinyl that 20kg weight average molecular weight is 10000 is
The methyl hydrogen that the active hydrogen content that methylvinyl-polysiloxane, the 20kg weight average molecular weight of 4wt% is 15000 is 0.8wt%
Polysiloxanes, the silicon carbide heat filling that 40kg average grain diameter is 10 μm, the density that 19.9kg average grain diameter is 38 μm are
2.45g/cm3Solid glass micro-bead and 0.1kg inhibitor divinyl tetramethyl disiloxane, the viscosity of component A be
3220cps。
The B component is mixed to get by following component: the content for the vinyl that 40kg weight average molecular weight is 25000 is
The methylvinyl-polysiloxane of 0.8wt%, the alpha-silicon nitride powders that 40kg average grain diameter is 10 μm, 17kg average grain diameter are 38 μm
Density be 2.45g/cm3Hollow glass micropearl, 2.4kg tackifier vinyltrimethoxysilane and 0.6kg catalyst chlorine
The mixture of platinic acid and vinylsiloxane mass ratio 2:1, the viscosity of B component are 3530cps.
Embodiment 3
It is prepared via a method which encapsulating silicon rubber 3:
It is only that the glass microballoon being added in component A and B component replaces with being averaged for phase homogenous quantities with the difference of embodiment 1
The density that partial size is 98 μm is 2.1g/cm3Solid glass micro-bead.
The viscosity of component A is 3880cps in the encapsulating silicon rubber that embodiment 3 obtains, and the viscosity of B component is 3840cps.
Embodiment 4
It is prepared via a method which encapsulating silicon rubber 4:
It is only that the glass microballoon being added in component A and B component replaces with being averaged for phase homogenous quantities with the difference of embodiment 1
The density that partial size is 2 μm is 2.6g/cm3Solid glass micro-bead.
The viscosity of component A is 4140cps in the encapsulating silicon rubber that embodiment 4 obtains, and the viscosity of B component is 3990cps.
Embodiment 5
It is prepared via a method which encapsulating silicon rubber 5:
It is only that the glass microballoon being added in component A and B component replaces with being averaged for phase homogenous quantities with the difference of embodiment 1
The density that partial size is 38 μm is 0.57g/cm3Hollow glass micropearl.
The viscosity of component A is 3070cps in the encapsulating silicon rubber that embodiment 5 obtains, and the viscosity of B component is 3500cps.
Embodiment 6
It is prepared via a method which encapsulating silicon rubber 6:
It is only that the glass microballoon being added in component A and B component replaces with being averaged for phase homogenous quantities with the difference of embodiment 1
The density that partial size is 150 μm is 1.98g/cm3Hollow glass micropearl.
The viscosity of component A is 4200cps in the encapsulating silicon rubber that embodiment 6 obtains, and the viscosity of B component is 3950cps.
Reference examples 1
It is prepared via a method which encapsulating silicon rubber 7:
It is only that with the difference of embodiment 1, is added without hollow glass micropearl in component A and B component.
The viscosity of component A is 5040cps in the encapsulating silicon rubber that reference examples 1 obtain, and the viscosity of B component is 4560cps.
Encapsulating silicon rubber 1~7 obtained in the various embodiments described above and reference examples is tested by following test method,
Test result is listed in table 1:
(1) shear strength test
According in standard GB/T/T 13936-2014 " vulcanized rubber and metal adhesive tensile shear strength measuring method "
The method tests the shear strength after encapsulating silicon rubber 1~7 solidifies between two layers of aluminium layer respectively.
(2) hardness test
According to method described in standard GB/T/T 531-1999 " the pocket hardometer penetration hardness test method of rubber "
Test the shore hardness (A) after encapsulating silicon rubber 1~7 solidifies.
(3) thermal conductivity is tested
Encapsulating silicon is tested according to method described in Unite States Standard ASTM E1461-01 " flicker method measurement thermal diffusion coefficient "
Rubber 1~7 solidify after thermal conductivity.
(4) flame retardant property
It is tested and is filled according to method described in standard GB/T/T 10707-2008 " the measurement standard of rubber combustion performance "
Seal the flame retardant property (vertical combustion, UL-94) after silicon rubber 1~7 solidifies.
The performance comparison table of encapsulating silicon rubber 1~7 obtained in each embodiment of table 1 and reference examples
In conclusion the present invention is in traditional two-component silicone rubber by introducing glass microballoon, and suitably adjust each group
Point proportion and glass microballoon type, a kind of hardness with higher shear intensity can be obtained in 36 or so (shore A), led
Heating rate reaches 0.88W/mK, and flame retardant property is the two-component reaction that UL-94V0 rank and each component viscosity are respectively less than 4200cps
Type encapsulating silicon rubber can satisfy that car lithium battery is moderate for high thermal conductivity, the hardness of encapsulating silicon rubber and high fluidity
It is required that.
The Applicant declares that the foregoing is merely a specific embodiment of the invention, but protection scope of the present invention not office
It is limited to this, it should be clear to those skilled in the art, any to belong to those skilled in the art and take off in the present invention
In the technical scope of dew, any changes or substitutions that can be easily thought of, and all of which fall within the scope of protection and disclosure of the present invention.
Claims (10)
1. a kind of new-energy automobile high thermal conductivity encapsulating silicon rubber, which is characterized in that the silicon rubber is pressed by component A and B component
Weight ratio 1:1 is uniformly mixed, and solidification obtains；
The component A count by weight percentage, including following component:
The B component count by weight percentage, including following component:
2. silicon rubber according to claim 1, which is characterized in that the viscosity of the component A is 3000~4200cps；
Preferably, the viscosity of the B component is 3500~4000cps；
Preferably, the component A count by weight percentage, is grouped as by following group:
The B component count by weight percentage, is grouped as by following group:
3. silicon rubber according to claim 1 or 2, which is characterized in that count by weight percentage, the poly- silicon of methyl hydrogen
The content that reactive hydrogen on the silicon atoms is directly connected in oxygen alkane is 0.01~1.5wt%, preferably 0.8~1wt%；
Preferably, the weight average molecular weight of the methylhydrogenpolysi,oxane be 500~500000, further preferably 10000~
50000；
Preferably, the methylhydrogenpolysi,oxane has structural formula as shown in Equation 1:
Wherein, R1Selected from methyl, ethyl or phenyl, R2For hydrogen atom, p and q are positive integer.
4. silicon rubber described according to claim 1~one of 3, which is characterized in that count by weight percentage, the methyl second
The content of alkenyl polysiloxanes medium vinyl is 0.1~4wt%；
Preferably, the weight average molecular weight of the methylvinyl-polysiloxane is 500~500000, further preferably 10000
~50000；
Preferably, the methylvinyl-polysiloxane has structural formula as shown in Equation 2:
Wherein, R3And R4It is each independently selected from methyl, ethyl or phenyl, a is positive integer.
5. silicon rubber described according to claim 1~one of 4, which is characterized in that the partial size of the heat filling be 0.01~
20μm；
Preferably, the heat filling is silica, calcium carbonate, aluminium oxide, alumino-silicate, aluminium hydroxide, boron nitride, nitrogen
Change in aluminium or silicon carbide any one or at least two mixture..
6. silicon rubber described according to claim 1~one of 5, which is characterized in that the partial size of the glass microballoon is 1~100 μ
M, preferably 35~40 μm.
Preferably, the glass microballoon is solid glass micro-bead, and density is 2~2.6g/cm3。
7. silicon rubber described according to claim 1~one of 6, which is characterized in that the tackifier be KH-550 type tackifier,
KH-560 type tackifier, KH-570 type tackifier, KH-792 type tackifier, vinyltrimethoxysilane, methyl trimethoxy oxygroup
In silane, vinyltriethoxysilane or methyltriethoxysilane any one or at least two mixture.
8. silicon rubber described according to claim 1~one of 7, which is characterized in that the inhibitor is divinyl tetramethyl
In disiloxane, acetylene cyclohexanol, diallyl formamide, t etram-ethyltetravinylcyclotetrasiloxane or diallyl fumarate
Any one or at least two mixture.
9. silicon rubber described according to claim 1~one of 8, which is characterized in that the catalyst is platinum catalyst；
Preferably, the platinum catalyst is the mixture of the complex of platinum or the chelate of platinum and organopolysiloxane.
10. silicon rubber described according to claim 1~one of 9, which is characterized in that the silicon rubber is pressed by component A and B component
Mass ratio 1:1 is mixed evenly, and under vacuum after row's bubble, solidifies 30~120min at 100~180 DEG C and obtains.
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| CN110845989A (en) * | 2019-12-02 | 2020-02-28 | 苏州太湖电工新材料股份有限公司 | Two-component organic silicon pouring sealant and application method thereof |
| CN115124845A (en) * | 2022-08-03 | 2022-09-30 | 天津泽希新材料有限公司 | Heat-conducting high polymer material and preparation method and application thereof |
| CN115595091A (en) * | 2022-11-23 | 2023-01-13 | 江西天永诚高分子材料有限公司（Cn） | Ultralow-density and super-flame-retardant organic silicon heat-insulation pouring sealant and preparation method thereof |
| CN115612446A (en) * | 2022-10-27 | 2023-01-17 | 江西蓝星星火有机硅有限公司 | Heat-conducting addition type organic silicon composition for encapsulation |
| US11780983B2 (en) | 2017-02-08 | 2023-10-10 | Elkem Silicones USA Corp. | Secondary battery pack with improved thermal management |
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| CN110845989B (en) * | 2019-12-02 | 2021-09-03 | 苏州太湖电工新材料股份有限公司 | Two-component organic silicon pouring sealant and application method thereof |
| CN115124845A (en) * | 2022-08-03 | 2022-09-30 | 天津泽希新材料有限公司 | Heat-conducting high polymer material and preparation method and application thereof |
| CN115612446A (en) * | 2022-10-27 | 2023-01-17 | 江西蓝星星火有机硅有限公司 | Heat-conducting addition type organic silicon composition for encapsulation |
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