CN110591382A - Low-density halogen-free flame-retardant graphene heat-conducting silica gel and preparation method thereof - Google Patents

Low-density halogen-free flame-retardant graphene heat-conducting silica gel and preparation method thereof Download PDF

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CN110591382A
CN110591382A CN201911008505.1A CN201911008505A CN110591382A CN 110591382 A CN110591382 A CN 110591382A CN 201911008505 A CN201911008505 A CN 201911008505A CN 110591382 A CN110591382 A CN 110591382A
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silica gel
low
component
retardant
parts
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杨波
文芳
李悦
张双红
黄国家
郭华超
李爽
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Guangzhou Special Pressure Equipment Inspection and Research Institute
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Guangzhou Special Pressure Equipment Inspection and Research Institute
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/02Flame or fire retardant/resistant
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/22Halogen free composition
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend

Abstract

The invention provides a low-density halogen-free flame-retardant graphene heat-conducting silica gel, which is prepared by introducing a phosphorus-nitrogen compound as a proper flame retardant, matching graphene as a heat-conducting filler and fumed silica as a reinforcing filler, matching the graphene with vinyl silicone oil with proper viscosity and vinyl content in a proper proportion, matching a platinum compound as a catalyst to obtain one component, mixing hydrogen-containing silicone oil and a catalytic inhibitor as the other component in a reasonable proportion, and preparing the low-density halogen-free flame-retardant graphene heat-conducting silica gel with self-extinguishing property, wherein harmful and irritating gases such as hydrogen halide and the like are not generated when the low-density halogen-free flame-retardant graphene heat-conducting silica gel is subjected to high temperature or combustion, so that the requirements of environmental protection and no pollution are met; and the density is low, the heat conductivity is good, and the LED packaging material can be widely applied to the fields of high-power LEDs, electric vehicle battery sealing and the like.

Description

Low-density halogen-free flame-retardant graphene heat-conducting silica gel and preparation method thereof
Technical Field
The invention belongs to the technical field of silicone rubber, and particularly relates to low-density halogen-free flame-retardant graphene heat-conducting silica gel and a preparation method thereof.
Background
The silicon rubber is widely applied to various industries due to the excellent performance, but the general silicon rubber is not immediately combusted when being close to flame, but is easily ignited and continuously combusted after being contacted with the flame for a certain time, has secondary risk of dripping, and limits the application of the silicon rubber in the fields of electronics and electricity, automobiles, aerospace and the like to a certain extent.
At present, research on flame retardants has been advanced to a certain extent, and there are many varieties of flame retardants suitable for silicone rubber, which have a wide choice but also have many disadvantages. The halogen flame retardant is one of the earliest flame retardant systems researched by human beings, and decabromodiphenyl ether is taken as a typical commercial flame retardant, so that the flame retardance of the silicone rubber can be greatly improved, and the flame retardant grade meets the UL94V-0 grade. However, silicone rubber containing halogen flame retardants easily produces gels, which shortens the storage period, and releases corrosive hydrogen halide gas and dioxin highly toxic substances at high temperature for a long time or after combustion, thus causing the risk of secondary pollution and secondary disaster in actual fire. The inorganic flame retardant has high density and can embody the flame retardant effect only by adding a large amount of the inorganic flame retardant. In addition, the conventional silicone rubber has poor thermal conductivity and a thermal conductivity of less than 0.2 W.m-1·K-1These greatly limit its application in the field of electronic components and the like.
Chinese patent CN107057369A discloses a liquid silicone rubber, which improves the flame retardant property to a certain extent by introducing aluminum hydroxide, but because of the aluminum hydroxide and the aluminum hydroxideThe compatibility of silica gel matrix is poor, so the mechanical property is influenced, and the specific gravity of the flame-retardant silica gel is very large. The Chinese invention patent CN106433140A discloses a flame-retardant silicone rubber, which improves the flame-retardant performance of the silicone rubber, but adopts decabromodiphenyl ether and chlorinated paraffin as fillers, and cannot meet the environmental protection requirement of the current halogen-free flame-retardant. The invention patent CN102337033A discloses an addition type high heat conduction organic silicon electronic pouring sealant, which is added with spherical aluminum oxide, boron nitride and silicon carbide crystal whisker to ensure that the heat conductivity of silicon rubber reaches 2.5 W.m-1·K-1The tensile strength reaches 1.5MPa, but the density is larger (2.5 g/cm)3) And the flame retardant is not flame retardant, and the preparation process is complicated. Chinese patent CN101402798 discloses a heat-conducting flame-retardant liquid silicone rubber for electronics, wherein the flame-retardant level reaches UL94V-0, and the heat conductivity can reach 2.5 W.m-1·K-1But a viscosity of 100000 mPas and a density of 2.4g/cm3And the requirement of electronic pouring sealant cannot be met.
Therefore, the development of the halogen-free flame-retardant heat-conducting double-component room temperature vulcanized silicone rubber which is low in cost, excellent in compatibility, low in density and excellent in flame retardance is of great significance.
Disclosure of Invention
Based on the above, an object of the present invention is to provide a low-density halogen-free flame retardant graphene thermal silica gel with good compatibility and thermal conductivity, low density and excellent flame retardancy.
In order to achieve the purpose, the specific technical scheme of the invention is as follows.
The low-density halogen-free flame-retardant graphene heat-conducting silica gel is prepared from the following raw materials:
the component A comprises the following raw materials in parts by weight:
100 parts of base material;
0.1-0.5 part of catalyst;
the base material is prepared from the following raw materials in parts by weight:
the component B comprises the following raw materials in parts by weight:
5-15 parts of hydrogen-containing silicone oil;
0.1-0.5 part of inhibitor;
the dosage ratio of the component A to the component B is 10: 1.
in one embodiment, the component A comprises the following raw materials in parts by weight:
100 parts of base material;
0.4-0.5 part of catalyst;
the base material is prepared from the following raw materials in parts by weight:
the component B comprises the following raw materials in parts by weight:
8-12 parts of hydrogen-containing silicone oil;
0.3-0.5 part of inhibitor.
In some embodiments, the vinyl silicone oil in the base material of the component A has viscosity of 500-5000 mPa & s at normal temperature and vinyl content of 0.16-1.3 wt%. More preferably, the vinyl silicone oil is a mixture of vinyl silicone oil having a viscosity of 1000 mPas at normal temperature and a vinyl content of 1.0 wt% and vinyl silicone oil having a viscosity of 5000 mPas at normal temperature and a vinyl content of 0.16 wt% in equal proportion
In some of these embodiments, the flame retardant is formed from a phosphorus-nitrogen compound comprising at least one of or a mixture of two or more of hexa (4-aminophenoxy) cyclotriphosphazene, hexa (4-formamidophenoxy) cyclotriphosphazene, hexaphenoxycyclotriphosphazene, and hexa (4-nitrophenoxy) cyclotriphosphazene.
In some of these embodiments, the flame retardant is at least one of hexa (4-aminophenoxy) cyclotriphosphazene, hexa (4-formamidophenoxy) cyclotriphosphazene, hexaphenoxycyclotriphosphazene, hexa (4-nitrophenoxy) cyclotriphosphazene, or a mixture of two or more thereof.
In some of these embodiments, the number of graphene layers is 1-10, more preferably 1-3.
In some embodiments, the fumed silica is a hydrophobically modified fumed silica.
In some embodiments, the catalyst is one or a mixture of two of chloroplatinic acid-divinyltetramethyldisiloxane complex and platinum (0) divinyltetramethyldisiloxane, and the mass content of platinum in the catalyst is 1000-3000 ppm.
In some embodiments, the hydrogen-containing silicone oil in component B is hydrogen-containing polysiloxane with hydrogen content of 0.18-0.75 wt% at normal temperature, and more preferably with hydrogen content of 0.18-0.36 wt%.
In some embodiments, the inhibitor in component B is at least one of methylbutynol, ethynylcyclohexanol, maleic acid or a derivative thereof containing alkynyl, fumaric acid or a derivative thereof containing alkynyl, polyvinyl polysiloxane, pyridine, organic phosphine, or phosphite, preferably methylbutynol, ethynylcyclohexanol.
The invention also aims to provide a preparation method of the low-density halogen-free flame-retardant graphene heat-conducting silica gel.
The preparation method of the low-density halogen-free flame-retardant graphene heat-conducting silica gel comprises the following steps:
(1) mixing vinyl silicone oil, a phosphorus-nitrogen flame retardant, fumed silica and graphene, and stirring to obtain a base material;
(2) adding a catalyst into the base material prepared in the step (1), stirring, and uniformly mixing to obtain a component A;
taking hydrogen-containing silicone oil at normal temperature, adding an inhibitor, stirring, and uniformly mixing to obtain a component B;
(3) mixing the prepared component A and the component B, vacuum degassing, and vulcanizing to obtain the composite material.
In some embodiments, the reaction temperature of the step (1) and the step (2) is normal temperature, and the stirring time is 10-30 min; and/or the conditions of the vulcanization are: the vulcanization temperature is 20-120 ℃, and the vulcanization time is 0.5-24.
The invention has the following beneficial effects:
according to the invention, the low-density halogen-free flame-retardant graphene heat-conducting silica gel with self-extinguishing property is prepared by introducing the phosphorus-nitrogen compound as a flame retardant, the graphene as a heat-conducting filler and the fumed silica as a reinforcing filler, and no harmful or irritating gases such as hydrogen halide and the like are generated when the silica gel is subjected to high temperature or is combusted, so that the requirements of environmental protection and no pollution are met; and the density is low, the heat conductivity is good, and the heat conducting material can be widely applied to the fields of electric vehicle battery sealing and the like.
According to the low-density halogen-free flame-retardant graphene heat-conducting silica gel, the flame retardant grade of the silicone rubber reaches UL94V-0 grade through the addition amount of a proper amount of flame retardant and heat-conducting filler, and good heat-conducting performance and mechanical performance can be kept, so that the defects that the existing electronic heat-conducting pouring sealant is too large in specific gravity and low in flame retardant performance are overcome, the application field of the organic silicon electronic pouring sealant is widened, and the market prospect is good.
Detailed Description
In order that the invention may be more readily understood, reference will now be made to the following more particular description of the invention, examples of which are set forth below. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. These embodiments are provided so that this disclosure will be thorough and complete. It is to be understood that the experimental procedures in the following examples, where specific conditions are not noted, are generally in accordance with conventional conditions, or with conditions recommended by the manufacturer. The various reagents used in the examples are commercially available.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the following examples, the number of graphene layers is mainly 1-10, and the graphene layers are purchased from Nanjing Xiancheng nanometer materials science and technology Co.
The hydrophobic modified fumed silica is purchased from: yichanghui silicon-rich materials Ltd.
The catalyst was purchased from: chloroplatinic acid-divinyltetramethyldisiloxane complex, platinum (0)1, 3-divinyltetramethyldisiloxane complex were purchased from Benst reagent.
Hydrogen-containing silicone oil (hydrogen-containing polysiloxane) and vinyl silicone oil are purchased from Shandong Dayi chemical Co., Ltd.
Example 1
The low-density halogen-free flame-retardant graphene heat-conducting silica gel comprises a component A and a component B, wherein the component A contains a base material, and the base material comprises the following components in parts by weight:
the component A comprises the following raw material components in parts by weight:
100 parts of base material;
0.5 part of a catalyst;
the catalyst is a platinum (0) divinyl tetramethyl disiloxane complex, and the mass content of platinum in the catalyst is 2000 ppm;
the component B comprises the following raw materials in parts by weight:
10 parts of hydrogen-containing silicone oil (the hydrogen content is 0.18 wt%);
0.5 part of inhibitor (methyl butynol);
the preparation method of the low-density halogen-free flame-retardant graphene heat-conducting silica gel comprises the following steps:
(1) sequentially mixing 50 parts by mass of vinyl silicone oil with the viscosity of 1000mPa & s and the vinyl content of 1.0 wt%, 50 parts by mass of vinyl silicone oil with the viscosity of 5000mPa & s and the vinyl content of 0.16 wt%, 30 parts of hexa (4-formamide phenoxy) cyclotriphosphazene, 5 parts of fumed silica and 100 parts of graphene, and strongly stirring for 30min to obtain a base material;
(2) at normal temperature, taking 100 parts of the base material prepared in the step (1), adding 0.5 part of catalyst, strongly stirring for 30min, and uniformly mixing to obtain a component A;
(3) at normal temperature, 10 parts of hydrogen-containing silicone oil with the hydrogen content of 0.18 wt% is taken, 0.5 part of inhibitor is added, strong stirring is carried out for 30min, and the component B is prepared after uniform mixing;
(4) uniformly mixing the prepared component A and the prepared component B according to the mass ratio of 10:1, carrying out vacuum degassing, vulcanizing on a mold, and vulcanizing at room temperature (25 ℃) for 24 hours to obtain the low-density halogen-free flame-retardant graphene heat-conducting silica gel.
The flame retardant rating of the silicon rubber reaches UL94V-0, and the heat conductivity coefficient at room temperature is 5.05 W.m-1·K-1Density of 1.20g/cm3
Example 2
The low-density halogen-free flame-retardant graphene heat-conducting silica gel comprises a component A and a component B, wherein the component A contains a base material, and the base material comprises the following components in parts by weight:
the component A comprises the following raw material components in parts by weight:
100 parts of base material;
0.5 part of a catalyst;
the catalyst is chloroplatinic acid-divinyl tetramethyl disiloxane complex, and the mass content of platinum in the catalyst is 3000 ppm.
The component B comprises the following raw materials in parts by weight:
10 parts of hydrogen-containing silicone oil (the hydrogen content is 0.18 wt%);
0.5 part of inhibitor (ethynylcyclohexanol).
The preparation method of the low-density halogen-free flame-retardant graphene heat-conducting silica gel comprises the following steps:
(1) sequentially mixing 50 parts by mass of vinyl silicone oil with the viscosity of 1000 mPas and the vinyl content of 1.0 wt%, 50 parts by mass of vinyl silicone oil with the viscosity of 5000 mPas and the vinyl content of 0.16 wt%, 30 parts of hexaphenoxycyclotriphosphazene, 5 parts of fumed silica and 50 parts of graphene, and strongly stirring for 30min to obtain a base material;
(2) at normal temperature, taking 100 parts of the base material prepared in the step (1), adding 0.5 part of catalyst, strongly stirring for 30min, and uniformly mixing to obtain a component A;
(3) at normal temperature, 10 parts of hydrogen-containing silicone oil with the hydrogen content of 0.18 wt% is taken, 0.5 part of inhibitor is added, strong stirring is carried out for 30min, and the component B is prepared after uniform mixing;
(4) uniformly mixing the prepared component A and the prepared component B according to the mass ratio of 10:1, carrying out vacuum degassing, and then vulcanizing on a mold, wherein the vulcanizing temperature is 120 ℃, and the vulcanizing time is 0.5h, so as to obtain the low-density halogen-free flame-retardant graphene heat-conducting silica gel.
The flame retardant grade of the low-density halogen-free flame-retardant graphene heat-conducting silica gel is up to UL94V-0, and the heat conductivity coefficient at room temperature is 4.20 W.m-1·K-1Density of 1.15g/cm3
Example 3
The low-density halogen-free flame-retardant graphene heat-conducting silica gel comprises a component A and a component B, wherein the component A contains a base material, and the base material comprises the following components in parts by weight:
the component A comprises the following raw material components in parts by weight:
100 parts of base material;
0.5 part of a catalyst (platinum (0) divinyltetramethyldisiloxane);
the component B comprises the following raw materials in parts by weight:
10 parts of hydrogen-containing silicone oil (the hydrogen content is 0.18 wt%);
0.5 part of inhibitor (ethynylcyclohexanol);
the preparation method of the low-density halogen-free flame-retardant graphene heat-conducting silica gel comprises the following steps:
(1) sequentially mixing 50 parts by mass of vinyl silicone oil with the viscosity of 1000 mPas and the vinyl content of 1.0 wt%, 50 parts by mass of vinyl silicone oil with the viscosity of 5000 mPas and the vinyl content of 0.16 wt%, 20 parts of (4-nitrophenoxy) cyclotriphosphazene, 10 parts of fumed silica and 80 parts of graphene, and strongly stirring for 30min to obtain a base material;
(2) at normal temperature, taking 100 parts of the base material prepared in the step (1), adding 0.5 part of catalyst, strongly stirring for 30min, and uniformly mixing to obtain a component A;
(3) at normal temperature, 10 parts of hydrogen-containing silicone oil with the hydrogen content of 0.18 wt% is taken, 0.5 part of inhibitor is added, strong stirring is carried out for 30min, and the component B is prepared after uniform mixing;
(4) uniformly mixing the prepared component A and the prepared component B according to the mass ratio of 10:1, carrying out vacuum degassing, and then vulcanizing on a mold, wherein the vulcanizing temperature is 120 ℃, and the vulcanizing time is 0.5h, so as to obtain the low-density halogen-free flame-retardant graphene heat-conducting silica gel.
The flame retardant grade of the low-density halogen-free flame-retardant graphene heat-conducting silica gel reaches UL94V-0, and the heat conductivity coefficient at room temperature is 4.76 W.m-1·K-1Density of 1.18g/cm3
Comparative example 1
The preparation method and conditions of the silica gel in the comparative experimental example are as in example 1, the silica gel is prepared without adding graphene, and the performance test results are shown in table 1 to prove the contribution of the graphene to the thermal conductivity of the silica gel.
Comparative example 2
The preparation method and conditions of the silica gel in the comparative experimental example are as in example 1, the silica gel is prepared without adding graphene or adding a flame retardant, and the performance test results are shown in table 1, so that the contribution of the flame retardant to the flame retardant performance of the silica gel is further proved.
The flame retardant rating is according to UL94 standard, according to the vertical burning test method of UL94V-0 ULV-1 ULV-2.
Thermal conductivity was measured according to ASTM D5470.
TABLE 1 results of Performance test of examples and comparative examples
According to the invention, through the introduction of the flame retardant and the heat-conducting filler, the flame retardant effect and the high heat-conducting property can be basically achieved while the good mechanical property and the low density of the silica gel are maintained.
The above results show that the low-density halogen-free flame-retardant graphene thermal silica gel prepared in example 1 has high flame-retardant grade and good thermal conductivity. In example 2, the flame retardant effect was good, but the thermal conductivity was slightly lower than that of example 1, which may be caused by the fact that the specific phosphorus-nitrogen flame retardant was selected differently from that of example 1. In example 3, the flame retardant effect and the thermal conductivity are lower than those of example 1, but the thermal conductivity is slightly better than that of example 2, which is probably because the specific phosphorus-nitrogen flame retardant is different and has different mixture ratio, and the optimal matching effect with the rest components is not achieved. In general, in the above examples 1 to 3, the phosphorus-nitrogen compound is introduced as a suitable flame retardant, the graphene is used as a heat conductive filler, the fumed silica is used as a reinforcing filler, and the phosphorus-nitrogen compound is mixed with the vinyl silicone oil with a suitable viscosity and a suitable vinyl content in a suitable ratio, so that the effects are significantly better than those of the comparative examples.
In contrast, in comparative example 1, although the flame retardant effect was good, the heat conductive effect was poor, probably because the heat conductive filler graphene was not added. In comparative example 2, no graphene or flame retardant is added, the flame retardant effect is not achieved, and the heat conduction effect is poorer than that of comparative example 1, which shows that the good heat conduction effect can be achieved only by the synergistic cooperation of the graphene and the flame retardant.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, however, as long as there is no contradiction between the combinations of the technical features, the scope of the present description should be considered as being described in the present specification.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. The low-density halogen-free flame-retardant graphene heat-conducting silica gel is characterized by being prepared from the following raw materials:
the component A comprises the following raw materials in parts by weight:
100 parts of base material;
0.1-0.5 part of catalyst;
the base material is prepared from the following raw materials in parts by weight:
the component B comprises the following raw materials in parts by weight:
5-15 parts of hydrogen-containing silicone oil;
0.1-0.5 part of inhibitor;
the dosage ratio of the component A to the component B is 10: 1.
2. the low-density halogen-free flame-retardant graphene heat-conducting silica gel according to claim 1, wherein the component A comprises the following raw materials in parts by weight:
100 parts of base material;
0.4-0.5 part of catalyst;
the base material is prepared from the following raw materials in parts by weight:
the component B comprises the following raw materials in parts by weight:
8-12 parts of hydrogen-containing silicone oil;
0.3-0.5 part of inhibitor.
3. The low-density halogen-free flame-retardant graphene thermal silica gel according to claim 1, wherein the vinyl silicone oil has a viscosity of 500 to 5000 mPa-s at normal temperature and a vinyl content of 0.16 to 1.3 wt%.
4. The low-density halogen-free flame-retardant graphene thermal silica gel according to claim 3, wherein the vinyl silicone oil is a mixture of vinyl silicone oil with a viscosity of 1000 mPa-s and a vinyl content of 1.0 wt% at normal temperature and vinyl silicone oil with a viscosity of 5000 mPa-s and a vinyl content of 0.16 wt% at normal temperature in equal proportion.
5. The low-density halogen-free flame-retardant graphene thermal silica gel according to claim 1, wherein the flame retardant is at least one or a mixture of two of hexa (4-aminophenoxy) cyclotriphosphazene, hexa (4-formamide phenoxy) cyclotriphosphazene, hexaphenoxycyclotriphosphazene and hexa (4-nitrophenoxy) cyclotriphosphazene.
6. The low-density halogen-free flame-retardant graphene thermal silica gel according to claim 1, wherein the number of graphene layers is 1-10; preferably 1-3 layers, and/or
The fumed silica is hydrophobic modified fumed silica; and/or
The catalyst is one or a mixture of two of chloroplatinic acid-divinyl tetramethyl disiloxane complex and platinum (0) divinyl tetramethyl disiloxane, and the mass content of platinum in the catalyst is 1000-3000 ppm.
7. The low-density halogen-free flame-retardant graphene thermal silica gel according to any one of claims 1 to 6, wherein the hydrogen-containing silicone oil is hydrogen-containing polysiloxane with hydrogen content of 0.18-0.75 wt% at normal temperature, and more preferably, hydrogen content of 0.18-0.36 wt%.
8. The low-density halogen-free flame-retardant graphene thermal silica gel according to any one of claims 1 to 6, wherein the inhibitor is at least one of methylbutynol, ethynylcyclohexanol, maleic acid containing alkynyl or a derivative thereof, fumaric acid containing alkynyl or a derivative thereof, polyvinyl polysiloxane, pyridine, organic phosphine, or phosphite, preferably methylbutynol or ethynylcyclohexanol.
9. The preparation method of the low-density halogen-free flame-retardant graphene thermal silica gel according to claims 1 to 8, which is characterized by comprising the following steps:
(1) mixing vinyl silicone oil, a phosphorus-nitrogen flame retardant, fumed silica and graphene, and stirring to obtain a base material;
(2) adding a catalyst into the base material prepared in the step (1), stirring, and uniformly mixing to obtain a component A;
taking hydrogen-containing silicone oil, adding an inhibitor, stirring, and uniformly mixing to obtain a component B;
(3) mixing the prepared component A and the component B, vacuum degassing, and vulcanizing to obtain the composite material.
10. The preparation method according to claim 9, wherein the reaction temperature in the step (1) and the reaction temperature in the step (2) are normal temperature, and the stirring time is 10-30 min; and/or the conditions of the vulcanization are: the vulcanization temperature is 20-120 ℃, and the vulcanization time is 0.5-24 h.
CN201911008505.1A 2019-10-22 2019-10-22 Low-density halogen-free flame-retardant graphene heat-conducting silica gel and preparation method thereof Pending CN110591382A (en)

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CN112251139A (en) * 2020-10-27 2021-01-22 深圳市誉隆新材料有限公司 Fire-resistant flame-retardant liquid polyorganosiloxane composition
CN113444487A (en) * 2020-09-14 2021-09-28 浙江大学山东工业技术研究院 Bi-component addition type heat-conducting silica gel for heat dissipation of LED lighting chip
CN113831738A (en) * 2021-09-28 2021-12-24 长春工业大学 Addition type liquid silicone rubber foam material and preparation method thereof
CN114349968A (en) * 2022-01-17 2022-04-15 万华化学(宁波)有限公司 POSS (polyhedral oligomeric silsesquioxane) modified phosphazene flame retardant and preparation method thereof, polycarbonate flame-retardant composite material and preparation method thereof

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CN105315672A (en) * 2015-12-07 2016-02-10 德阳烯碳科技有限公司 Preparation method of silicone rubber mat composite material containing carbon nanomaterial
CN106085345A (en) * 2016-07-27 2016-11-09 昆山市中迪新材料技术有限公司 Heat conduction casting glue material and preparation method thereof

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US20140235773A1 (en) * 2013-02-18 2014-08-21 Csi Chemical Company Limited Led device, polysiloxane compound and base formula for led device
CN105315672A (en) * 2015-12-07 2016-02-10 德阳烯碳科技有限公司 Preparation method of silicone rubber mat composite material containing carbon nanomaterial
CN106085345A (en) * 2016-07-27 2016-11-09 昆山市中迪新材料技术有限公司 Heat conduction casting glue material and preparation method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113444487A (en) * 2020-09-14 2021-09-28 浙江大学山东工业技术研究院 Bi-component addition type heat-conducting silica gel for heat dissipation of LED lighting chip
CN112251139A (en) * 2020-10-27 2021-01-22 深圳市誉隆新材料有限公司 Fire-resistant flame-retardant liquid polyorganosiloxane composition
CN113831738A (en) * 2021-09-28 2021-12-24 长春工业大学 Addition type liquid silicone rubber foam material and preparation method thereof
CN113831738B (en) * 2021-09-28 2023-02-28 长春工业大学 Addition type liquid silicone rubber foam material and preparation method thereof
CN114349968A (en) * 2022-01-17 2022-04-15 万华化学(宁波)有限公司 POSS (polyhedral oligomeric silsesquioxane) modified phosphazene flame retardant and preparation method thereof, polycarbonate flame-retardant composite material and preparation method thereof

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