CN112063176A - Addition type encapsulating silicon rubber for encapsulating transformer and preparation method thereof - Google Patents
Addition type encapsulating silicon rubber for encapsulating transformer and preparation method thereof Download PDFInfo
- Publication number
- CN112063176A CN112063176A CN202010949085.3A CN202010949085A CN112063176A CN 112063176 A CN112063176 A CN 112063176A CN 202010949085 A CN202010949085 A CN 202010949085A CN 112063176 A CN112063176 A CN 112063176A
- Authority
- CN
- China
- Prior art keywords
- component
- mass
- parts
- addition type
- potting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses addition type encapsulating silicon rubber for encapsulating a transformer and a preparation method thereof, wherein the addition type encapsulating silicon rubber is prepared by mixing a component A and a component B according to the mass ratio of 1:1, wherein the component A comprises the following components in parts by mass: 100 parts of heat-conducting base adhesive and 0.05-0.25 part of platinum catalyst. The component B comprises the following components in parts by mass: 100 parts of heat-conducting base adhesive, 1-5 parts of hydrogen-containing silicone oil and 0.01-0.15 part of inhibitor. The addition type encapsulating silicon rubber for the encapsulated transformer prepared by the invention has the advantages that the heat-conducting property of the prepared transformer shell reaches more than 0.6W/(m.K), and meanwhile, the prepared transformer shell has good insulativity, the linear shrinkage is less than 2%, the flowability is high, the foam is automatically discharged, the strength is high, the release property is good, the storage property is good, the innovation and the industrial value are realized, the preparation method is simple and easy to implement, the cost is low, and the addition type encapsulating silicon rubber is suitable for large-scale production.
Description
Technical Field
The invention relates to the technical field of addition type encapsulation silica gel, in particular to addition type encapsulation silica gel for encapsulating a transformer and a preparation method thereof.
Background
Compared with the condensed type encapsulating silicon rubber, the addition type encapsulating silicon rubber has the advantages of no byproduct generated in the vulcanization process, no heat release, small shrinkage, no corrosion, deep vulcanization and the like, has better sealing performance at high temperature than the condensed type encapsulating silicon rubber, and is suitable for being used as an encapsulating material of a high-temperature resistant insulating device. Particularly, the common transformer insulation shell is prepared by encapsulating epoxy resin compounded heat-conducting powder, and the problems of no high temperature resistance, easy aging and embrittlement, rapid mechanical property attenuation, solvent-containing and environmental-friendliness and the like exist all the time, so that the development of addition type encapsulating silicon rubber for encapsulating transformers has innovation and practical value.
In addition, the encapsulated addition type silicone rubber is relatively soft, environment-friendly, nontoxic, harmless and degradable after being vulcanized. The material can also be applied to the fields of electronics, automobiles, photovoltaics, aerospace, lamp packaging and the like, and has wide application range.
Disclosure of Invention
The invention aims to provide addition type encapsulating silicon rubber for encapsulating a transformer and a preparation method thereof
The invention adopts the following technical scheme:
an addition type encapsulating silicon rubber for encapsulating transformers is formed by mixing a component A and a component B according to the mass ratio of 1:1, and is characterized in that,
the component A comprises the following components in parts by mass:
100 portions of heat-conducting base rubber
0.05-0.25 part of platinum catalyst
The component B comprises the following components in parts by mass:
100 portions of heat-conducting base rubber
1-5 parts of hydrogen-containing silicone oil
0.01 to 0.15 portion of inhibitor
The heat-conducting base adhesive in the component A and the component B consists of 100 parts by mass of vinyl silicone oil, 20-40 parts by mass of MQ silicone resin, 10-30 parts by mass of fumed silica, 3-10 parts by mass of silane coupling agent and 80-120 parts by mass of heat-conducting powder.
Further, the vinyl silicone oil is vinyl-terminated polysiloxane having a viscosity of 500 to 2000mPa.s at 25 ℃ and a vinyl mass content of 0.6 to 1.6%.
Furthermore, the MQ silicon resin in the component A and the component B is vinyl-containing MQ silicon resin with the viscosity of 200-500 mPa.s and the vinyl mass content of 2.0-3.0% at 25 ℃.
Further, the fumed silica in the component A and the component B is subjected to hydrophobic treatment by a silane coupling agent, and the specific surface area is 200m2/g～220m2/g。
Further, the platinum catalyst in the component A is synthesized by complexing chloroplatinic acid and isopropanol, and the mass content of platinum is 1000-3000 ppm.
Further, the hydrogen-containing silicone oil in the component B is hydrogen-containing polysiloxane with viscosity of 60-300 mPa.s and hydrogen mass content of 0.1-1.5% at 25 ℃.
Further, the inhibitor in the component B is prepared by compounding 1,3,5, 7-tetravinyl-1, 3,5, 7-tetramethylcyclotetrasiloxane and ethynyl-1-cyclohexanol according to the molar ratio of 1: 1.
Further, the heat-conducting powder in the heat-conducting base glue in the component A and the component B is one or more of aluminum oxide with the particle size of 2-30 microns, zinc oxide with the particle size of 5-20 microns, boron nitride with the particle size of 3-10 microns and aluminum nitride with the particle size of 3-10 microns.
Further, the silane coupling agent in the component A and the component B is one or more of gamma-glycidoxypropyltrimethoxysilane, vinyltriethoxysilane, dimethyldiethoxysilane, dimethyldimethoxysilane and hexamethyldisilazane.
The preparation method of the addition type encapsulating silicon rubber for any encapsulating transformer is characterized by comprising the following steps:
the method comprises the following steps: mixing 100 parts by mass of octamethylcyclotetrasiloxane and 0.1-3 parts by mass of tetramethyldivinyldisiloxane, adding 0.1-0.5 part by mass of catalyst tetramethylammonium hydroxide under the stirring state, heating to 120-140 ℃, polymerizing for 2-6 h, heating to 150-200 ℃, removing low molecules for 6-10 h under the vacuum degree of-0.06-0.10 MPa, and cooling to obtain the vinyl polysiloxane;
step two: preparing heat-conducting base glue: firstly, adding 40-60 mass% of vinyl silicone oil and 20-40 mass% of MQ silicone resin into a kneader, stirring for 0.5-1 h, continuously adding 10-30 mass% of fumed silica, 80-120 mass% of heat-conducting powder and 3-10 mass% of silane coupling agent, stirring for 1-5 h at room temperature, heating to 100-180 ℃, stirring for 1-6 h under a vacuum condition, stopping vacuum, adding the rest mass% of vinyl silicone oil for dilution, and cooling to obtain base adhesive;
step three: preparing a component A: adding 100 parts by mass of base rubber into a kneader, adding a platinum catalyst in a formula amount, and uniformly stirring to obtain a component A;
step four: preparing a component B: adding 100 parts by mass of base rubber into a kneader, adding hydrogen-containing silicone oil and an inhibitor according to the formula amount, and uniformly stirring to obtain a component B;
step five: and (2) uniformly mixing the prepared component A and the component B according to the mass ratio of 1:1, and then carrying out mould pressing vulcanization on a flat vulcanizing machine, wherein the vulcanization temperature is 100-140 ℃, and the vulcanization time is 5-10 min, so as to obtain the addition type encapsulating silicone rubber for encapsulating transformers.
The addition type encapsulating silicon rubber for encapsulating transformers prepared by the invention has good thermal conductivity, good insulativity, small shrinkage, good fluidity, self-bubble discharge, high strength, good release property and long storage period, solves the problems of poor heat resistance, easy aging, acid and alkali resistance and environmental protection of the prior epoxy resin transformer shell, is simple and easy to implement, has low cost and is suitable for large-scale production.
Detailed Description
The following non-limiting examples 1-3 are provided to illustrate the present invention and are not intended to limit the present invention, and any modifications and variations of the present invention within the spirit of the present invention and the scope of the claims are included in the scope of the present invention.
Fumed silica related to the following examples N20 silica was provided by wacker corporation. The hydrogen-containing silicone oil is 702A provided by Jiangxi Xinjiayi. MQ silicone resin is S11 provided for Zhejiang Runzhe. The platinum catalyst was 2500ppm of platinum provided by Heley. The heat conducting powder is alumina with the particle size of 2-3 mu m: zinc oxide with a particle size of 10-20 μm: boron nitride with the grain diameter of 3-10 mu m is compounded in a ratio of 5:4: 1. The inhibitor is prepared by compounding 1,3,5, 7-tetravinyl-1, 3,5, 7-tetramethylcyclotetrasiloxane and ethynyl-1-cyclohexanol according to the molar ratio of 1: 1.
Example 1.
The method comprises the following steps: mixing 100Kg of octamethylcyclotetrasiloxane and 2Kg of tetramethyldivinyldisiloxane, adding 0.2Kg of catalyst tetramethylammonium hydroxide under the stirring state, heating to 120 ℃ for polymerization for 4 hours, heating to 200 ℃, removing low molecules for 6 hours under the vacuum degree of-0.08-0.09 MPa, and cooling to obtain vinyl polysiloxane, wherein the viscosity is 1500mPa.s at 25 ℃ and the vinyl mass percent is 0.68%.
Step two: preparing heat-conducting base glue: firstly, 60kg of vinyl silicone oil and 20kg of MQ silicone resin are added into a kneader and stirred for 1 hour, 25kg of fumed silica, 120kg of heat-conducting powder, 3kg of hexamethyldisilazane, 2kg of dimethyldiethoxysilane and 2kg of vinyltriethoxysilane are continuously added, the mixture is stirred for 5 hours at room temperature, the temperature is increased to 180 ℃, the mixture is stirred for 4 hours under the vacuum condition of-0.08-0.09 MPa, then the vacuum is stopped, 40kg of vinyl silicone oil is added for dilution, and the base adhesive is obtained after cooling;
step three: preparing a component A: 100kg of base rubber and 0.2kg of 2500ppm platinum catalyst are added into a kneader and stirred uniformly to obtain a component A;
step four: preparing a component B: adding 100kg of base rubber, 4kg of hydrogen-containing silicone oil and 0.1kg of inhibitor into a kneader, and uniformly stirring to obtain a component B;
step five: and (3) uniformly mixing the prepared component A and the component B according to the mass ratio of 1:1, and then carrying out mould pressing vulcanization on a flat vulcanizing machine, wherein the vulcanization temperature is 140 ℃, and the vulcanization time is 10min, so as to obtain the addition type encapsulating silicone rubber for the encapsulating transformer. The addition type encapsulating silicon rubber is prepared according to the following parameters:
| test items | Performance of |
| Appearance of the product | White viscous liquid |
| Hardness (Shao) | 68 |
| Tensile Strength (MPa) | 4.0 |
| Tear strength (KN/m) | 15 |
| Elongation at Break (%) | 150 |
| Viscosity (mpa.s) | 80000 |
| Thermal conductivity (W/(m.K)) | 0.8 |
| Breakdown voltage (KV/mm) | 18.5 |
Example 2
The method comprises the following steps: 100Kg of octamethylcyclotetrasiloxane and 3Kg of tetramethyldivinyldisiloxane are mixed, 0.2Kg of catalyst tetramethylammonium hydroxide is added under the stirring state, the temperature is raised to 120 ℃ for polymerization for 4 hours, the temperature is raised to 200 ℃, the low molecular weight is removed for 6 hours under the vacuum degree of-0.08 to 0.09MPa, and the vinyl polysiloxane is obtained after cooling, wherein the viscosity is 1000mPa.s at the temperature of 25 ℃, and the vinyl mass percent is 0.89%.
Step two: preparing heat-conducting base glue: firstly, 60kg of vinyl silicone oil and 25kg of MQ silicone resin are added into a kneader and stirred for 1 hour, 20kg of fumed silica, 120kg of heat-conducting powder, 6kg of hexamethyldisilazane, 2kg of dimethyldiethoxysilane and 2kg of vinyltriethoxysilane are continuously added, the mixture is stirred for 5 hours at room temperature, the temperature is increased to 180 ℃, the mixture is stirred for 4 hours under the vacuum condition of-0.08-0.09 MPa, then the vacuum is stopped, 40kg of vinyl silicone oil is added for dilution, and the base adhesive is obtained after cooling;
step three: preparing a component A: 100kg of base rubber and 0.2kg of 2500ppm platinum catalyst are added into a kneader and stirred uniformly to obtain a component A;
step four: preparing a component B: adding 100kg of base rubber, 4.2kg of hydrogen-containing silicone oil and 0.1kg of inhibitor into a kneader, and uniformly stirring to obtain a component B;
step five: and (3) uniformly mixing the prepared component A and the component B according to the mass ratio of 1:1, and then carrying out mould pressing vulcanization on a flat vulcanizing machine, wherein the vulcanization temperature is 140 ℃, and the vulcanization time is 10min, so as to obtain the addition type encapsulating silicone rubber for the encapsulating transformer.
In this example, the viscosity was adjusted based on example 1, and the effect of treating the powder was enhanced by increasing the amount of the silane coupling agent, thereby lowering the viscosity and improving the flowability. The addition type encapsulating silicon rubber is prepared according to the following parameters:
| test items | Performance of |
| Appearance of the product | White viscous liquid |
| Hardness (Shao) | 62 |
| Tensile Strength (MPa) | 5.0 |
| Tear strength (KN/m) | 17.6 |
| Elongation at Break (%) | 180 |
| Viscosity (mpa.s) | 55000 |
| Thermal conductivity (W/(m.K)) | 0.8 |
| Breakdown voltage (KV/mm) | 17.8 |
Example 3
The method comprises the following steps: 100Kg of octamethylcyclotetrasiloxane and 3Kg of tetramethyldivinyldisiloxane are mixed, 0.2Kg of catalyst tetramethylammonium hydroxide is added under the stirring state, the temperature is raised to 120 ℃ for polymerization for 4 hours, the temperature is raised to 200 ℃, the low molecular weight is removed for 6 hours under the vacuum degree of-0.08 to 0.09MPa, and the vinyl polysiloxane is obtained after cooling, wherein the viscosity is 1000mPa.s at the temperature of 25 ℃, and the vinyl mass percent is 0.89%.
Step two: preparing heat-conducting base glue: firstly, adding 70kg of vinyl silicone oil and 15kg of MQ silicone resin into a kneader, stirring for 1h, continuously adding 20kg of fumed silica, 100kg of heat-conducting powder, 6kg of hexamethyldisilazane, 2kg of dimethyldiethoxysilane and 2kg of vinyltriethoxysilane, stirring for 5h at room temperature, heating to 180 ℃, stirring for 4h under the vacuum condition of-0.08-0.09 MPa, stopping vacuum, adding 40kg of vinyl silicone oil for dilution, and cooling to obtain base adhesive;
step three: preparing a component A: 100kg of base rubber and 0.2kg of 2500ppm platinum catalyst are added into a kneader and stirred uniformly to obtain a component A;
step four: preparing a component B: adding 100kg of base rubber, 4.2kg of hydrogen-containing silicone oil and 0.1kg of inhibitor into a kneader, and uniformly stirring to obtain a component B;
step five: and (3) uniformly mixing the prepared component A and the component B according to the mass ratio of 1:1, and then carrying out mould pressing vulcanization on a flat vulcanizing machine, wherein the vulcanization temperature is 140 ℃, and the vulcanization time is 10min, so as to obtain the addition type encapsulating silicone rubber for the encapsulating transformer.
In this example, the viscosity was adjusted based on example 1, and the effect of treating the powder was enhanced by increasing the amount of the silane coupling agent, thereby lowering the viscosity and improving the flowability. The addition type encapsulating silicon rubber is prepared according to the following parameters:
example 4
The method comprises the following steps: 100Kg of octamethylcyclotetrasiloxane and 3Kg of tetramethyldivinyldisiloxane are mixed, 0.2Kg of catalyst tetramethylammonium hydroxide is added under the stirring state, the temperature is raised to 120 ℃ for polymerization for 4 hours, the temperature is raised to 200 ℃, the low molecular weight is removed for 6 hours under the vacuum degree of-0.08 to 0.09MPa, and the vinyl polysiloxane is obtained after cooling, wherein the viscosity is 1000mPa.s at the temperature of 25 ℃, and the vinyl mass percent is 0.89%.
Step two: preparing heat-conducting base glue: firstly, 60kg of vinyl silicone oil and 20kg of MQ silicone resin are added into a kneader and stirred for 1 hour, 25kg of fumed silica, 100kg of heat-conducting powder, 3kg of hexamethyldisilazane, 2kg of dimethyldiethoxysilane and 2kg of vinyltriethoxysilane are continuously added, the mixture is stirred for 5 hours at room temperature, the temperature is increased to 180 ℃, the mixture is stirred for 4 hours under the vacuum condition of-0.08-0.09 MPa, then the vacuum is stopped, 40kg of vinyl silicone oil is added for dilution, and the base adhesive is obtained after cooling;
step three: preparing a component A: 100kg of base rubber and 0.2kg of 2500ppm platinum catalyst are added into a kneader and stirred uniformly to obtain a component A;
step four: preparing a component B: adding 100kg of base rubber, 4kg of hydrogen-containing silicone oil and 0.1kg of inhibitor into a kneader, and uniformly stirring to obtain a component B;
step five: and (3) uniformly mixing the prepared component A and the component B according to the mass ratio of 1:1, and then carrying out mould pressing vulcanization on a flat vulcanizing machine, wherein the vulcanization temperature is 140 ℃, and the vulcanization time is 10min, so as to obtain the addition type encapsulating silicone rubber for the encapsulating transformer.
In this example, the filling amount of the heat conductive filler is reduced based on example 2, and although the heat conductivity is sacrificed, the viscosity is further reduced, and the fluidity and the physical strength are improved. The addition type encapsulating silicon rubber is prepared according to the following parameters:
| test items | Performance of |
| Appearance of the product | White viscous liquid |
| Hardness (Shao) | 60 |
| Tensile strength(MPa) | 4.5 |
| Tear strength (KN/m) | 17 |
| Elongation at Break (%) | 180 |
| Viscosity (mpa.s) | 50000 |
| Thermal conductivity (W/(m.K)) | 0.68 |
| Breakdown voltage (KV/mm) | 19.3 |
Example 5
The method comprises the following steps: 100Kg of octamethylcyclotetrasiloxane and 3Kg of tetramethyldivinyldisiloxane are mixed, 0.2Kg of catalyst tetramethylammonium hydroxide is added under the stirring state, the temperature is raised to 120 ℃ for polymerization for 4 hours, the temperature is raised to 200 ℃, the low molecular weight is removed for 6 hours under the vacuum degree of-0.08 to 0.09MPa, and the vinyl polysiloxane is obtained after cooling, wherein the viscosity is 1000mPa.s at the temperature of 25 ℃, and the vinyl mass percent is 0.89%.
Step two: preparing heat-conducting base glue: firstly, adding 40kg of vinyl silicone oil and 40kg of MQ silicone resin into a kneader, stirring for 1h, continuously adding 25kg of fumed silica, 100kg of heat-conducting powder, 3kg of hexamethyldisilazane, 2kg of dimethyldiethoxysilane and 2kg of vinyltriethoxysilane, stirring for 5h at room temperature, heating to 180 ℃, stirring for 4h under the vacuum condition of-0.08-0.09 MPa, stopping vacuum, adding 40kg of vinyl silicone oil for dilution, and cooling to obtain base adhesive;
step three: preparing a component A: 100kg of base rubber and 0.2kg of 2500ppm platinum catalyst are added into a kneader and stirred uniformly to obtain a component A;
step four: preparing a component B: adding 100kg of base rubber, 4kg of hydrogen-containing silicone oil and 0.1kg of inhibitor into a kneader, and uniformly stirring to obtain a component B;
step five: and (3) uniformly mixing the prepared component A and the component B according to the mass ratio of 1:1, and then carrying out mould pressing vulcanization on a flat vulcanizing machine, wherein the vulcanization temperature is 140 ℃, and the vulcanization time is 10min, so as to obtain the addition type encapsulating silicone rubber for the encapsulating transformer.
In this example, the ratio of silicone oil to silicone resin was changed based on example 3, and the physical strength was further improved. The addition type encapsulating silicon rubber is prepared according to the following parameters:
| test items | Performance of |
| Appearance of the product | White viscous liquid |
| Hardness (Shao) | 68 |
| Tensile Strength (MPa) | 5.2 |
| Tear strength (KN/m) | 15 |
| Elongation at Break (%) | 140 |
| Viscosity (mpa.s) | 55000 |
| Thermal conductivity (W/(m.K)) | 0.69 |
| Breakdown voltage (KV/mm) | 19.1 |
In examples 1 to 5, vinyl silicone oil was prepared as follows: mixing 100 parts by mass of octamethylcyclotetrasiloxane and 0.1-3 parts by mass of tetramethyldivinyldisiloxane, adding 0.01-0.5 part by mass of catalyst tetramethylammonium hydroxide under the stirring state, heating to 80-120 ℃, polymerizing for 2-6 h, heating to 150-200 ℃, removing low molecules for 6-10 h, and cooling to obtain the vinyl silicone oil.
Claims (10)
1. An addition type encapsulating silicon rubber for encapsulating transformers is formed by mixing a component A and a component B according to the mass ratio of 1:1, and is characterized in that,
the component A comprises the following components in parts by mass:
100 portions of heat-conducting base rubber
0.05-0.25 part of platinum catalyst
The component B comprises the following components in parts by mass:
100 portions of heat-conducting base rubber
1-5 parts of hydrogen-containing silicone oil
0.01 to 0.15 portion of inhibitor
The heat-conducting base adhesive in the component A and the component B consists of 100 parts by mass of vinyl silicone oil, 20-40 parts by mass of MQ silicone resin, 10-30 parts by mass of fumed silica, 3-10 parts by mass of silane coupling agent and 80-120 parts by mass of heat-conducting powder.
2. The addition type potting silicone rubber for potting transformers according to claim 1, wherein the vinyl silicone oil is a vinyl-terminated polysiloxane having a viscosity of 500 to 2000mpa.s at 25 ℃ and a vinyl mass content of 0.6 to 1.6%.
3. The addition type potting silicone rubber for potting transformers according to claim 1, wherein the MQ silicone resin in the A component and the B component is a vinyl-containing MQ silicone resin having a viscosity of 200 to 500mPa.s at 25 ℃ and a vinyl mass content of 2.0 to 3.0%.
4. The addition type potting silicone rubber for potting transformers according to claim 1, wherein the fumed silica in the component A and the component B is subjected to hydrophobic treatment by a silane coupling agent, and the specific surface area is 200m2/g～220m2/g。
5. The addition type potting silicone rubber for potting transformers according to claim 1, wherein the platinum catalyst in the component A is synthesized by coordination of chloroplatinic acid and isopropanol, and the mass content of platinum is 1000-3000 ppm.
6. The addition type potting silicone rubber for potting transformers according to claim 1, wherein the hydrogen-containing silicone oil in the component B is hydrogen-containing polysiloxane having a viscosity of 60 to 300mPa.s at 25 ℃ and a hydrogen mass content of 0.1 to 1.5%.
7. The addition type potting silicone rubber for potting transformers according to claim 1, wherein the inhibitor in the component B is prepared by compounding 1,3,5, 7-tetravinyl-1, 3,5, 7-tetramethylcyclotetrasiloxane and ethynyl-1-cyclohexanol in a molar ratio of 1: 1.
8. The addition type potting silicone rubber for potting transformers according to claim 1, wherein the heat conducting powder in the heat conducting base rubber in the component A and the component B is one or more of aluminum oxide with the particle size of 2-30 μm, zinc oxide with the particle size of 5-20 μm, boron nitride with the particle size of 3-10 μm, and aluminum nitride with the particle size of 3-10 μm.
9. The addition type potting silicone rubber for potting transformers according to claim 1, wherein the silane coupling agent in the a-component and the B-component is one or more of gamma-glycidoxypropyltrimethoxysilane, vinyltriethoxysilane, dimethyldiethoxysilane, dimethyldimethoxysilane, hexamethyldisilazane.
10. The method for preparing the addition type potting silicone rubber for the potting transformer of any one of claims 1 to 9, characterized by comprising the following steps:
the method comprises the following steps: mixing 100 parts by mass of octamethylcyclotetrasiloxane and 0.1-3 parts by mass of tetramethyldivinyldisiloxane, adding 0.1-0.5 part by mass of catalyst tetramethylammonium hydroxide under the stirring state, heating to 120-140 ℃, polymerizing for 2-6 h, heating to 150-200 ℃, removing low molecules for 6-10 h under the vacuum degree of-0.06-0.10 MPa, and cooling to obtain the vinyl polysiloxane;
step two: preparing heat-conducting base glue: firstly, adding 40-60 mass% of vinyl silicone oil and 20-40 mass% of MQ silicone resin into a kneader, stirring for 0.5-1 h, continuously adding 10-30 mass% of fumed silica, 80-120 mass% of heat-conducting powder and 3-10 mass% of silane coupling agent, stirring for 1-5 h at room temperature, heating to 100-180 ℃, stirring for 1-6 h under a vacuum condition, stopping vacuum, adding the rest mass% of vinyl silicone oil for dilution, and cooling to obtain base adhesive;
step three: preparing a component A: adding 100 parts by mass of base rubber into a kneader, adding a platinum catalyst in a formula amount, and uniformly stirring to obtain a component A;
step four: preparing a component B: adding 100 parts by mass of base rubber into a kneader, adding hydrogen-containing silicone oil and an inhibitor according to the formula amount, and uniformly stirring to obtain a component B;
step five: and (2) uniformly mixing the prepared component A and the component B according to the mass ratio of 1:1, and then carrying out mould pressing vulcanization on a flat vulcanizing machine, wherein the vulcanization temperature is 100-140 ℃, and the vulcanization time is 5-10 min, so as to obtain the addition type encapsulating silicone rubber for encapsulating transformers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010949085.3A CN112063176A (en) | 2020-09-10 | 2020-09-10 | Addition type encapsulating silicon rubber for encapsulating transformer and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010949085.3A CN112063176A (en) | 2020-09-10 | 2020-09-10 | Addition type encapsulating silicon rubber for encapsulating transformer and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112063176A true CN112063176A (en) | 2020-12-11 |
Family
ID=73663559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010949085.3A Pending CN112063176A (en) | 2020-09-10 | 2020-09-10 | Addition type encapsulating silicon rubber for encapsulating transformer and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112063176A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113061344A (en) * | 2021-03-30 | 2021-07-02 | 上海瑞起新材料科技有限公司 | Addition type liquid silicone rubber for composite insulator and preparation method thereof |
| CN113416419A (en) * | 2021-06-22 | 2021-09-21 | 惠州市永卓科技有限公司 | High-hardness addition type liquid silica gel and preparation method thereof |
| CN113462354A (en) * | 2021-07-20 | 2021-10-01 | 惠州市永卓科技有限公司 | Heat-conducting adhesive and preparation method thereof |
| CN115519868A (en) * | 2022-08-26 | 2022-12-27 | 广东君点科技有限公司 | Silicone oil permeation-preventing temperature-resistant pressure-resistant fluorosilicone rubber belt and preparation method thereof |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101054507A (en) * | 2007-05-30 | 2007-10-17 | 南京工业大学 | High heat conduction organosilicon filling and sealing gum |
| CN101875725A (en) * | 2010-07-14 | 2010-11-03 | 广州市高士实业有限公司 | Vinyl silicon resin for reinforcing organic silicon pouring sealant and preparation method thereof |
| CN102585228A (en) * | 2012-01-06 | 2012-07-18 | 中科院广州化学有限公司 | Organic silicon electronic-pouring sealant with high refractive index and high transparency, as well as preparation and application thereof |
| CN102876050A (en) * | 2012-11-05 | 2013-01-16 | 江苏天辰硅材料有限公司 | High-temperature vulcanized silicone rubber with ultralow hardness and method for preparing same |
| CN103131381A (en) * | 2013-03-06 | 2013-06-05 | 广州市高士实业有限公司 | High-performance environmentally-friendly flame retardant type organic electron pouring sealant and preparation method thereof |
| CN103756327A (en) * | 2013-11-07 | 2014-04-30 | 杭州硅畅科技有限公司 | Heat-conducting silicone rubber electronic casting glue and preparation method and application thereof |
| CN103834352A (en) * | 2014-02-26 | 2014-06-04 | 北京天山新材料技术股份有限公司 | Double-component high heat-conducting pouring sealant with excellent mechanical properties and preparation method thereof |
| CN106833509A (en) * | 2016-12-30 | 2017-06-13 | 常州碳星科技有限公司 | A kind of heat conduction organosilicon rubber battery casting glue and preparation method thereof |
| JP2018124545A (en) * | 2017-01-30 | 2018-08-09 | キヤノン株式会社 | Additive curable liquid silicone rubber mixture, member for electrophotography and manufacturing method thereof, and fixing device |
| CN109206917A (en) * | 2018-08-14 | 2019-01-15 | 江苏天辰新材料股份有限公司 | A kind of add-on type liquid silicon rubber and preparation method thereof of all-transparent cell-phone cover |
-
2020
- 2020-09-10 CN CN202010949085.3A patent/CN112063176A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101054507A (en) * | 2007-05-30 | 2007-10-17 | 南京工业大学 | High heat conduction organosilicon filling and sealing gum |
| CN101875725A (en) * | 2010-07-14 | 2010-11-03 | 广州市高士实业有限公司 | Vinyl silicon resin for reinforcing organic silicon pouring sealant and preparation method thereof |
| CN102585228A (en) * | 2012-01-06 | 2012-07-18 | 中科院广州化学有限公司 | Organic silicon electronic-pouring sealant with high refractive index and high transparency, as well as preparation and application thereof |
| CN102876050A (en) * | 2012-11-05 | 2013-01-16 | 江苏天辰硅材料有限公司 | High-temperature vulcanized silicone rubber with ultralow hardness and method for preparing same |
| CN103131381A (en) * | 2013-03-06 | 2013-06-05 | 广州市高士实业有限公司 | High-performance environmentally-friendly flame retardant type organic electron pouring sealant and preparation method thereof |
| CN103756327A (en) * | 2013-11-07 | 2014-04-30 | 杭州硅畅科技有限公司 | Heat-conducting silicone rubber electronic casting glue and preparation method and application thereof |
| CN103834352A (en) * | 2014-02-26 | 2014-06-04 | 北京天山新材料技术股份有限公司 | Double-component high heat-conducting pouring sealant with excellent mechanical properties and preparation method thereof |
| CN106833509A (en) * | 2016-12-30 | 2017-06-13 | 常州碳星科技有限公司 | A kind of heat conduction organosilicon rubber battery casting glue and preparation method thereof |
| JP2018124545A (en) * | 2017-01-30 | 2018-08-09 | キヤノン株式会社 | Additive curable liquid silicone rubber mixture, member for electrophotography and manufacturing method thereof, and fixing device |
| CN109206917A (en) * | 2018-08-14 | 2019-01-15 | 江苏天辰新材料股份有限公司 | A kind of add-on type liquid silicon rubber and preparation method thereof of all-transparent cell-phone cover |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113061344A (en) * | 2021-03-30 | 2021-07-02 | 上海瑞起新材料科技有限公司 | Addition type liquid silicone rubber for composite insulator and preparation method thereof |
| CN113416419A (en) * | 2021-06-22 | 2021-09-21 | 惠州市永卓科技有限公司 | High-hardness addition type liquid silica gel and preparation method thereof |
| CN113462354A (en) * | 2021-07-20 | 2021-10-01 | 惠州市永卓科技有限公司 | Heat-conducting adhesive and preparation method thereof |
| CN115519868A (en) * | 2022-08-26 | 2022-12-27 | 广东君点科技有限公司 | Silicone oil permeation-preventing temperature-resistant pressure-resistant fluorosilicone rubber belt and preparation method thereof |
| CN115519868B (en) * | 2022-08-26 | 2024-05-28 | 广东君点科技有限公司 | Silicone oil permeation-resistant temperature-resistant pressure-resistant fluorosilicone rubber belt and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112063176A (en) | Addition type encapsulating silicon rubber for encapsulating transformer and preparation method thereof | |
| CN111040698B (en) | Epoxy resin pouring sealant, preparation method and novel electric drive motor | |
| CN102618041B (en) | High heat-conducting insulating silicon rubber and preparation method thereof | |
| CN108410416B (en) | Encapsulating silica gel and preparation method and application thereof | |
| JP2010523747A (en) | Curable epoxy resin composition | |
| CN108441165B (en) | Low-specific-gravity organic silicon pouring sealant and preparation method thereof | |
| CN109370235B (en) | Double-component addition type organic silicon gel and preparation method thereof | |
| CN101942201A (en) | Room-temperature vulcanized antiflaming single-component dealcoholization-type silicone rubber sealant and preparation method thereof | |
| CN108239402A (en) | A kind of silicon rubber insulation glue composition and preparation method thereof | |
| CN113403022B (en) | Organic silicon heat-conducting pouring sealant and preparation method thereof | |
| CN114574154A (en) | Low-viscosity two-component heat-conducting pouring sealant and preparation method thereof | |
| CN111117259A (en) | Double-component heat-conducting interface material and use method and application thereof | |
| CN104845375B (en) | A kind of low-k liquid silastic composite and preparation method thereof | |
| CN105368068A (en) | High-temperature-resistant, high-breakdown-voltage and filler-free organic silicone rubber for sleeve | |
| CN103044924A (en) | Addition type liquid pouring sealant for semiconductor assembling piece and preparation method thereof | |
| CN111875852B (en) | Composite heat conduction material, silicone rubber and preparation method and application thereof | |
| WO1997003129A1 (en) | Epoxy resin composition | |
| CN113717489B (en) | Halogen-free flame-retardant thermoplastic elastomer | |
| CN114621726A (en) | Low-density ultrahigh-fluidity heat-conducting pouring sealant and preparation method thereof | |
| CN115029093A (en) | Epoxy resin pouring sealant for automobile film capacitor and preparation method thereof | |
| CN110746741A (en) | Resin composite material and preparation method and application thereof | |
| CN113061344A (en) | Addition type liquid silicone rubber for composite insulator and preparation method thereof | |
| CN112812753A (en) | High-thermal-conductivity organic silicon gel with core-shell structure | |
| CN104403185A (en) | Material for solar cell equipment and preparation method thereof | |
| CN116462974B (en) | Heat-conducting silica gel sheet and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20201211 |