CN107995799A - A kind of U-shaped chip for pcb board is shelved - Google Patents
A kind of U-shaped chip for pcb board is shelved Download PDFInfo
- Publication number
- CN107995799A CN107995799A CN201711431062.8A CN201711431062A CN107995799A CN 107995799 A CN107995799 A CN 107995799A CN 201711431062 A CN201711431062 A CN 201711431062A CN 107995799 A CN107995799 A CN 107995799A
- Authority
- CN
- China
- Prior art keywords
- board
- shelved
- shaped chip
- bottom plate
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 claims abstract description 35
- 239000010453 quartz Substances 0.000 claims abstract description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000005452 bending Methods 0.000 claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 239000004575 stone Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 241001442589 Convoluta Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10068—Non-printed resonator
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The present invention relates to a kind of U-shaped chip for pcb board to shelve, including two frame bodies being oppositely arranged for clamping quartz crystal slice, the frame body includes being fixed on the bottom plate of pcb board upper surface, the U-board for being inserted and fixed quartz crystal slice, the bending section of the U-board, which has, extends downward into the supporting part of bottom plate, which can realize being fixedly connected for bottom plate and U-board.The U-shaped chip mount structure function admirable of the present invention, it is simple in structure, it can effectively reduce the height dimension of piezoelectric component and component.
Description
Technical field
The invention belongs to quartz-crystal resonator installing area, and in particular to a kind of U-shaped chip for pcb board is shelved.
Background technology
Common quartz crystal slice mount structure is the coil structures shown in Fig. 1-Fig. 3, wherein, the both ends of the structure are
2-3 coil spring circles, to be straight dry, one end is welded on metallic support for centre, and the other end is used to fix quartz crystal slice.Common quartz
The effective height size that crystal resonator is welded on pcb board is：10mm or so.
In order to meet the needs of quartz-crystal resonator, quartz-crystal filter and its Related product minimize, it is badly in need of carrying
For a kind of small-sized mounting bracket for being used for installing quartz wafer.
The content of the invention
In order to solve the above-mentioned problems in the prior art, the present invention provides a kind of U-shaped chip dress for pcb board
Frame.The technical problem to be solved in the present invention is achieved through the following technical solutions：
A kind of U-shaped chip for pcb board is shelved, including for clamping two frame bodies being oppositely arranged of quartz crystal slice, should
Frame body includes being fixed on the bottom plate of pcb board upper surface, the U-board for being inserted and fixed quartz crystal slice, the U-board it is curved
Pars convoluta, which has, extends downward into the supporting part of bottom plate, which can realize being fixedly connected for bottom plate and U-board.
A kind of above-mentioned U-shaped chip for pcb board is shelved, the U-board include vertically stretch bending section,
First plate body and second plate body horizontally extending from two ends of bending section, shape between the first plate body and the second plate body
Into the cavity for quartz crystal slice insertion.
A kind of above-mentioned U-shaped chip for pcb board is shelved, and technique is equipped with first plate body and the second plate body
Hole.
A kind of above-mentioned U-shaped chip for pcb board is shelved, and the pcb board is equipped with the copper foil weldering for being used to weld bottom plate
Disk, the bottom plate are equipped with the through hole passed through for filler, solder or conducting resinl.
A kind of above-mentioned U-shaped chip for pcb board is shelved, and the height of the U-board is at least common or standard packaging
Quartz crystal slice height 1/2.
Beneficial effects of the present invention：
The U-shaped chip mount structure function admirable of the present invention, it is simple in structure, it can effectively reduce piezoelectric component and component
Height dimension, realizes that component minimizes.
The present invention is described in further details below with reference to accompanying drawings and embodiments.
Brief description of the drawings
Fig. 1 is the front schematic view of ball spring coil.
Fig. 2 is the side schematic view of ball spring coil.
Fig. 3 is the mount structure schematic diagram of ball spring coil.
Fig. 4 is the positive structure schematic that U-shaped chip is shelved.
Fig. 5 is the dimensional structure diagram that U-shaped chip is shelved.
Fig. 6 is the top view that U-shaped chip is shelved.
Fig. 7 is the U-shaped mount structure schematic diagram loaded onto after quartz wafer.
Fig. 8 is installed in the schematic diagram of the U-shaped mount structure for the carry wafer that pcb board is loaded onto.
In figure：100th, ball spring coil；1st, pcb board；11st, copper foil pad；2nd, quartz crystal slice；3rd, frame body；31st, bottom plate；
32nd, U-board；32-1, bending section；32-2, the first plate body；32-3, the second plate body；33rd, supporting part；4th, solder.
Embodiment
Reach technological means and effect that predetermined purpose is taken for the present invention is further explained, below in conjunction with attached drawing and reality
Example embodiment, architectural feature and its effect to the present invention are applied, is described in detail as follows.
In the description of the present invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " on ", " under ",
The orientation or position relationship of the instruction such as "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer " are
Based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, rather than instruction or dark
Show that the device of meaning or element there must be specific orientation, with specific azimuth configuration and operation, thus it is it is not intended that right
The limitation of the present invention.
In addition, term " first ", " second ", " the 3rd " etc. are only used for description purpose, and it is not intended that instruction or hint
Relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, the feature of " first ", " second " etc. is defined
It can express or implicitly include one or more this feature.In the description of the present invention, unless otherwise indicated, it is " more
It is a " it is meant that two or more.
Term " installation ", " connected ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or removable
Connection is unloaded, or is integrally connected；Can mechanically connect or be electrically connected；It can be directly connected, can also be in
Between medium be indirectly connected, can be the connection inside two elements.For the ordinary skill in the art, can pass through
Concrete condition understands the concrete meaning of above-mentioned term in the present invention.
Common 2 mount structure of quartz crystal slice is coil structures, and both ends are 2-3 coil spring circles, and centre is straight dry, one
End is welded on metallic support, and the other end is used to fix quartz crystal slice 2, and structure is shown in attached drawing 1, Fig. 2 and Fig. 3, common quartz-crystal
Body resonator is welded on pcb board 1, and the effective height size in the case of realizing certain function under equal projected area is：
10mm（Left and right）.
With reference to Fig. 4-Fig. 8, the U-shaped chip of the present embodiment is shelved to be set relatively including two for clamping quartz crystal slice 2
The frame body 3 put, the frame body 3 include being fixed on the bottom plate 31 of 1 upper surface of pcb board, the U for being inserted and fixed quartz crystal slice 2
Shape plate 32, the bending section 32-1 of U-board 32 have the supporting part 33 for extending downward into bottom plate 31, which can realize bottom plate
31 and U-board 32 be fixedly connected.
Specifically, U-board 32 includes vertically stretching bending section 32-1, from two ends edge of bending section 32-1
The the first plate body 32-2 and the second plate body 32-3 of horizontal direction extension, form between the first plate body 32-2 and the second plate body 32-3 and supply
The cavity that quartz crystal slice 2 is inserted into, is equipped with fabrication hole on the first plate body 32-2 and the second plate body 32-3, which is used for increasing
Circulation and the area of big solder or conducting resinl and quartz crystal slice.Preferably, it also is provided with for filler, solder or leads on bottom plate 31
The through hole that electric glue passes through
It may be noted that as the case may be, in the present embodiment, also may be used on bottom plate 31, the first plate body 32-2 and the second plate body 32-3
To be not provided with fabrication hole.
And the effective height that the U-shaped chip of the present embodiment is shelved after installing quartz-crystal resonator is less than or equal to 5mm, directly
Height reduction 5mm or so, concrete operation method that the present embodiment U-shaped chip is shelved：U-shaped chip is shelved and first welds or pastes
On pcb board 1 on copper foil pad 11 reserved in advance, quartz crystal slice 2 is then inserted into this U-shaped and is shelved, Ran Houjin
The processes such as row dispensing, baking, whole process are completed by quartz-crystal resonator technical process, finally carry out sealing treatment, so that
The height dimension of quartz-crystal resonator, quartz-crystal filter and its Related product is greatly lowered.
The U-shaped chip of the present embodiment is shelved and common mount structure（Spring ring）Compare, easy to weld in the plane, also
It is that directly reliably can be welded or pasted on the reserved pad of pcb board 1, using ball spring coil due to bottom spring
Coil structures reliably can not directly weld or paste in pcb board 1, thus the present invention use bottom plane structure, so with pcb board 1
Effectively contact, the increase of contact area, easy to weld and greatly improve soldering reliability.
The U-shaped structure that U-shaped chip is shelved can effectively play the role of fixed quartz crystal slice 2, and middle aperture makes
Subsequent point glue process reliability improves, while decreases one section of height that old-fashioned spring ring bottom is welded on support lead column
Size, effectively reduces quartz-crystal resonator height dimension.
The U-shaped chip of the present embodiment shelves function admirable, simple in structure, can effectively reduce piezoelectric component and component
Height dimension.U-shaped chip shelves the height dimension that can effectively reduce quartz-crystal resonator, is effectively reduced so as to reach
The purpose of quartz-crystal filter and its subassembly product height dimension, be quartz-crystal resonator, quartz-crystal filter and its
The miniaturization of Related product lays the foundation.
Above content is that a further detailed description of the present invention in conjunction with specific preferred embodiments, it is impossible to is assert
The specific implementation of the present invention is confined to these explanations.For general technical staff of the technical field of the invention,
On the premise of not departing from present inventive concept, some simple deduction or replace can also be made, should all be considered as belonging to the present invention's
Protection domain.
Claims (5)
1. a kind of U-shaped chip for pcb board is shelved, it is characterised in that including for clamping quartz crystal slice（2）Two phases
To the frame body of setting（3）, the frame body（3）Including being fixed on pcb board（1）The bottom plate of upper surface（31）, for being inserted and fixed stone
English crystal wafer（2）U-board（32）, the U-board（32）Bending section（32-1）With extending downward into bottom plate（31）Branch
Support part（33）, the supporting part（33）Bottom plate can be achieved（31）And U-board（32）Be fixedly connected.
2. U-shaped chip as claimed in claim 1 is shelved, it is characterised in that the U-board（32）Including vertically stretching
Bending section（32-1）, from bending section（32-1）Horizontally extending the first plate body in two ends（32-2）With the second plate
Body（32-3）, the first plate body（32-2）With the second plate body（32-3）Between formed supply quartz crystal slice（2）The cavity of insertion.
3. U-shaped chip as claimed in claim 2 is shelved, it is characterised in that first plate body（32-2）With the second plate body
（32-3）On be equipped with fabrication hole.
4. U-shaped chip as claimed in claim 1 is shelved, it is characterised in that the pcb board（1）It is equipped with and is used to weld bottom plate
（31）Copper foil pad（11）, the bottom plate（31）It is equipped with the through hole passed through for filler, solder or conducting resinl.
5. as claim 1-4 any one of them U-shaped chips are shelved, it is characterised in that the U-board（32）Height at least
For the 1/2 of common or standard packaging quartz crystal slice height.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711431062.8A CN107995799A (en) | 2017-12-26 | 2017-12-26 | A kind of U-shaped chip for pcb board is shelved |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711431062.8A CN107995799A (en) | 2017-12-26 | 2017-12-26 | A kind of U-shaped chip for pcb board is shelved |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107995799A true CN107995799A (en) | 2018-05-04 |
Family
ID=62041904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711431062.8A Pending CN107995799A (en) | 2017-12-26 | 2017-12-26 | A kind of U-shaped chip for pcb board is shelved |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107995799A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05136646A (en) * | 1991-03-08 | 1993-06-01 | Nippon Dempa Kogyo Co Ltd | Crystal resonator |
| CN202889304U (en) * | 2012-10-10 | 2013-04-17 | 日照汇丰电子有限公司 | Crystal resonator symmetrical reed |
| CN106921360A (en) * | 2017-03-02 | 2017-07-04 | 金华市创捷电子有限公司 | Quartz-crystal resonator |
| CN207652801U (en) * | 2017-12-26 | 2018-07-24 | 咸阳振峰电子有限公司 | A kind of U-shaped chip for pcb board is shelved |
-
2017
- 2017-12-26 CN CN201711431062.8A patent/CN107995799A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05136646A (en) * | 1991-03-08 | 1993-06-01 | Nippon Dempa Kogyo Co Ltd | Crystal resonator |
| CN202889304U (en) * | 2012-10-10 | 2013-04-17 | 日照汇丰电子有限公司 | Crystal resonator symmetrical reed |
| CN106921360A (en) * | 2017-03-02 | 2017-07-04 | 金华市创捷电子有限公司 | Quartz-crystal resonator |
| CN207652801U (en) * | 2017-12-26 | 2018-07-24 | 咸阳振峰电子有限公司 | A kind of U-shaped chip for pcb board is shelved |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |