CN212062397U - Suction nozzle mounting seat device for inner pin jointing machine - Google Patents
Suction nozzle mounting seat device for inner pin jointing machine Download PDFInfo
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- CN212062397U CN212062397U CN202020338509.8U CN202020338509U CN212062397U CN 212062397 U CN212062397 U CN 212062397U CN 202020338509 U CN202020338509 U CN 202020338509U CN 212062397 U CN212062397 U CN 212062397U
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- suction nozzle
- vacuum
- round hole
- mounting seat
- feet
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Abstract
The utility model discloses a suction nozzle mount pad device for inner pin bonder, it relates to the reel formula and covers crystal packaging technical field. The suction nozzle mounting seat device comprises a horizontally-placed rectangular structure mounting seat, wherein a fixed rod is vertically arranged at the geometric center of the bottom surface of the mounting seat, a first vacuum round hole is formed in the fixed rod in a penetrating mode along the axis direction of the fixed rod, two suction nozzle feet are vertically arranged at two end portions of the top surface of the mounting seat respectively, the two suction nozzle feet are mutually symmetrical along the fixed rod in space, a second vacuum round hole is formed in the suction nozzle feet in a penetrating mode along the axis direction of the suction nozzle feet, and the first vacuum round hole and the second vacuum round hole are mutually communicated through a vacuum straight pipe arranged in the mounting seat; a clamping seat is installed on one side edge of the installation seat in a butt joint mode, and a U-shaped notch is formed in the middle of the edge of the outer side of the clamping seat. The utility model discloses change original single-pin position suction nozzle into two-pin position suction nozzle, increased adsorption efficiency, make things convenient for the bigger IC of adsorption volume.
Description
Technical Field
The utility model relates to a flip chip package technical field of winding up formula, concretely relates to suction nozzle mount pad device for interior pin bonder.
Background
Tape-on-film (COF) packages have the advantages of reduced thickness and weight, and are commonly used in electronic products. The tape-type chip-on-film package structure uses a film substrate with fine pitch pins as a chip carrier and is combined with the chip in an inner pin bonding mode to provide an electrical path and mechanical support between the chip and the substrate, and an inner pin bonding machine is used in the process. The inner pin jointing machine comprises a pepper pot (called wafer sheet in English, and is called pepper pot in the industry due to its external shape), an ejector pin, a suction nozzle and other operation components, wherein the ejector pin is positioned inside the pepper pot, and the suction nozzle is positioned above the pepper pot. In the production process of COF, firstly, a wafer silicon chip is cut into independent small crystal grains (about 3000-5000 crystal grains can be cut from one wafer) in a cutting mode, and in order to avoid scattering after cutting, the wafer silicon chip is attached to a sticky blue film before cutting, so that the cutting is convenient; then the blue film is placed on the annular bearing frame, the pepper tank is located below the blue film, when the pepper tank moves under the blue film, the mechanism for bearing the pepper tank descends to a certain height first, moves to the position of the next crystal grain, then rises to be attached to the blue film, the mechanism simultaneously establishes vacuum, the blue film firmly adsorbs the column, then the ejector pin penetrates through the vacuum hole position on the top surface of the pepper tank and rises to the height set by the mechanism to jack up the crystal grain to a certain height, the height can just lift up the crystal grain and peel the blue film to a certain position, so that the suction nozzle moves to adsorb the crystal grain through vacuum establishment, the pepper tank is closed in vacuum, the suction nozzle sucks the crystal grain away, conveys the crystal grain to a hot pressing head, and presses down at high temperature to be combined with a tape to manufacture a product.
In the prior art, only a single-pin suction nozzle is arranged on a suction nozzle Holder (a suction nozzle mounting seat), and when the single-pin suction nozzle meets some ICs (crystal grains) with large volume, the original suction nozzle pin is not picked up or is picked up askew and other abnormal conditions in the picking up process, so that the IC is scrapped and lost, and the waste of company cost is caused.
SUMMERY OF THE UTILITY MODEL
To the deficiencies existing in the prior art, the utility model provides a suction nozzle mount pad device for inner pin bonder.
In order to achieve the above purpose, the present invention is realized by the following technical solution:
a suction nozzle mounting seat device for an inner pin jointing machine comprises a horizontally-placed rectangular structure mounting seat, wherein a fixed rod is vertically mounted at the geometric center of the bottom surface of the mounting seat, a first vacuum round hole is formed in the fixed rod in a penetrating mode along the axis direction of the fixed rod, two suction nozzle feet are respectively and vertically mounted at two end portions of the top surface of the mounting seat, the two suction nozzle feet are mutually symmetrical in space along the fixed rod, a second vacuum round hole is formed in each suction nozzle foot in a penetrating mode along the axis direction of the suction nozzle foot, and the first vacuum round hole and the second vacuum round hole are mutually communicated through a vacuum straight pipe arranged in the mounting seat; a clamping seat is installed on one side edge of the installation seat in a butt joint mode, and a U-shaped notch is formed in the middle of the edge of the outer side of the clamping seat.
Furthermore, the suction nozzle feet are respectively positioned at two end parts of the vacuum straight pipe, and the distance between the two suction nozzle feet is 11 mm.
Further, the diameter of the second vacuum round hole in the suction nozzle foot is 1 mm.
Further, the diameter of the first vacuum round hole in the fixing rod is 1.8 mm.
Further, the diameters of the first vacuum round hole and the second vacuum round hole are smaller than the diameter of the vacuum straight pipe.
Furthermore, the clamping seat and the mounting seat are integrally made of the same material.
Furthermore, the screens seat is the rectangle structure, screens seat both sides edges and corners department is equipped with the chamfer respectively.
Compared with the prior art, the beneficial effects of the utility model reside in that:
the utility model changes the original single-pin suction nozzle into double-pin suction nozzle, which increases the adsorption capacity and facilitates the adsorption of larger IC; the utility model can increase the vacuum introduction amount by increasing the diameter of the vacuum round hole in the suction nozzle foot, thereby achieving the purpose of increasing the vacuum value and ensuring that the IC picking is more stable; the utility model can satisfy the picking capacity that the length of IC exceeds 22mm by increasing the distance between the two suction nozzle feet to 11 mm; the utility model discloses IC picks up the ability stronger, and the pick-up process is more stable, reduces IC and picks up failure probability, reduces the IC loss, improves work efficiency, improves the productivity.
Drawings
The present invention will be described in detail with reference to the accompanying drawings and specific embodiments:
fig. 1 is a first schematic structural diagram of the present invention;
FIG. 2 is a second schematic structural view of the present invention;
fig. 3 is a top view of the present invention;
fig. 4 is a side view of the present invention.
Description of reference numerals: 1-mounting a base; 2-fixing the rod; 201-a first vacuum circular hole; 3-suction nozzle foot; 301-a second vacuum round hole; 4-vacuum straight pipe; 5-a clamping seat; 6-U-shaped notch; 7-chamfering.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
As shown in fig. 1 to 4, the suction nozzle mount pad device for an inner pin bonder of the present invention is shown, including a horizontally placed rectangular parallelepiped structure mount pad 1, a fixing rod 2 is vertically installed at the geometric center of the bottom surface of the mount pad 1, a first vacuum circular hole 201 is formed in the fixing rod 2 along the axial direction, a suction nozzle pin 3 is vertically installed at each of two end portions of the top surface of the mount pad 1, the two suction nozzle pins 3 are spatially symmetrical to each other along the fixing rod 2, a second vacuum circular hole 301 is formed in the suction nozzle pin 3 along the axial direction, and the first vacuum circular hole 201 and the second vacuum circular hole 301 are communicated with each other through a vacuum straight pipe 4 disposed inside the mount pad 1; a clamping seat 5 is installed on one side edge of the installation seat 1 in a butt joint mode, and a U-shaped notch 6 is formed in the middle of the outer side edge of the clamping seat 5.
By the technical scheme, the original single-pin suction nozzle is changed into a double-pin suction nozzle, so that the adsorption capacity is increased, and an IC with a larger volume can be conveniently adsorbed; the fixed rod 1 is used for being installed on vacuum-pumping equipment, and the fixed rod 1 can be used for fixing a suction nozzle installation seat and can also be used as a vacuum pipeline; the U-shaped notch on the clamping seat is used for clamping other parts of the inner pin jointing machine to assist in fixing the suction nozzle mounting seat and prevent the suction nozzle mounting seat from shaking in the using process; the rubber suction nozzle is arranged on the suction nozzle foot 3 and is used for sucking IC (crystal grain), the IC (crystal grain) is made of silicon material, if the suction nozzle foot 3 is directly used for sucking the IC, the vacuum adsorption is unstable, the suction by the rubber suction nozzle is more stable during the adsorption, and the IC is not easy to crash; the utility model relates to a two suction nozzle feet 3 just can satisfy current IC's absorption and pick up, if design more suction nozzle feet 3, the cost will increase, and the board operation is no matter how many suction nozzle feet 3, only once inhales a crystalline grain, and in addition, a rubber suction nozzle is just 50 yuan, and almost need change a day, and suction nozzle foot 3 has more the cost can be higher.
As a preferable technical solution, as shown in fig. 3 and 4, the nozzle pins 3 are respectively located at two end portions of the vacuum straight pipe 4, and the distance between the two nozzle pins 3 is 11 mm; through the technical scheme, the distance between the two suction nozzle pins 3 is improved from 5mm to 11mm, the pickup function of the IC with the length exceeding 22mm can be met, and the IC pickup capacity is increased.
As a preferable technical solution, as shown in fig. 3 and 4, the diameter of the second vacuum round hole 301 in the nozzle foot 3 is 1mm, the diameter of the first vacuum round hole 201 in the fixing rod 2 is 1.8mm, and the diameters of the first vacuum round hole 201 and the second vacuum round hole 301 are both smaller than the diameter of the vacuum straight pipe 4; through this technical scheme, the diameter of second vacuum round hole 301 in the suction nozzle foot 3 is improved to 1mm by 0.8mm, increases the vacuum and establishes the ability for IC picks up more stably.
As a preferable technical solution, as shown in fig. 1 to 3, the card seat 5 and the mounting seat 1 are integrally made of the same material, and by this technical solution, the structural stability between the card seat 5 and the mounting seat 1 can be increased.
As a preferred technical scheme, as shown in fig. 1 to 3, the clamping seat 5 is of a rectangular structure, and chamfers 7 are respectively arranged at edges and corners of two sides of the clamping seat 5, so that the hands of workers can be prevented from being scratched through the treatment of the chamfers 7, and the safety during manual installation is improved.
It is above only the utility model discloses a preferred embodiment, the utility model discloses a scope of protection does not only confine above-mentioned embodiment, the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (7)
1. A nozzle mount apparatus for an inner pin bonder, comprising: the vacuum suction nozzle comprises a horizontally placed cuboid structure mounting seat, wherein a fixed rod is vertically arranged at the geometric center of the bottom surface of the mounting seat, a first vacuum round hole is formed in the fixed rod in a penetrating manner along the axis direction of the fixed rod, two suction nozzle feet are respectively and vertically arranged at two end parts of the top surface of the mounting seat, the two suction nozzle feet are mutually symmetrical along the fixed rod in space, a second vacuum round hole is formed in the suction nozzle feet in a penetrating manner along the axis direction of the suction nozzle feet, and the first vacuum round hole and the second vacuum round hole are mutually communicated through a vacuum straight pipe arranged in the mounting seat; a clamping seat is installed on one side edge of the installation seat in a butt joint mode, and a U-shaped notch is formed in the middle of the edge of the outer side of the clamping seat.
2. The nozzle mount apparatus for an inner pin bonder as claimed in claim 1, wherein: the suction nozzle feet are respectively positioned at two end parts of the vacuum straight pipe, and the distance between the two suction nozzle feet is 11 mm.
3. The nozzle mount apparatus for an inner pin bonder as claimed in claim 2, wherein: the diameter of the second vacuum round hole in the suction nozzle foot is 1 mm.
4. The nozzle mount apparatus for an inner pin bonder as claimed in claim 3, wherein: the diameter of the first vacuum round hole in the fixing rod is 1.8 mm.
5. The nozzle mount apparatus for an inner pin bonder as claimed in claim 4, wherein: the diameters of the first vacuum round hole and the second vacuum round hole are smaller than the diameter of the vacuum straight pipe.
6. The nozzle mount apparatus for an inner pin bonder as claimed in claim 1, wherein: the clamping seat and the mounting seat are integrally made of the same material.
7. The nozzle mount apparatus for an inner pin bonder as claimed in claim 6, wherein: the screens seat is the rectangle structure, screens seat both sides edges and corners department is equipped with the chamfer respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020338509.8U CN212062397U (en) | 2020-03-17 | 2020-03-17 | Suction nozzle mounting seat device for inner pin jointing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020338509.8U CN212062397U (en) | 2020-03-17 | 2020-03-17 | Suction nozzle mounting seat device for inner pin jointing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212062397U true CN212062397U (en) | 2020-12-01 |
Family
ID=73529392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020338509.8U Active CN212062397U (en) | 2020-03-17 | 2020-03-17 | Suction nozzle mounting seat device for inner pin jointing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212062397U (en) |
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2020
- 2020-03-17 CN CN202020338509.8U patent/CN212062397U/en active Active
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Address after: 230000 in Hefei Comprehensive Bonded Zone, Xinzhan District, Hefei City, Anhui Province Patentee after: Hefei xinhuicheng Microelectronics Co.,Ltd. Address before: 230000 in Hefei Comprehensive Bonded Zone, Xinzhan District, Hefei City, Anhui Province Patentee before: Hefei Xinhuicheng Microelectronics Co.,Ltd. |