CN209119105U - A kind of large-size images sensor-packaging structure - Google Patents
A kind of large-size images sensor-packaging structure Download PDFInfo
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- CN209119105U CN209119105U CN201920085926.3U CN201920085926U CN209119105U CN 209119105 U CN209119105 U CN 209119105U CN 201920085926 U CN201920085926 U CN 201920085926U CN 209119105 U CN209119105 U CN 209119105U
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- base plate
- circuit base
- sensor
- packaging structure
- size images
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Abstract
The utility model discloses a kind of large-size images sensor-packaging structures, including circuit base plate, one side surface of the circuit base plate has intermediate image sensing unit and the welding disking area around the setting of image sensing area, several tin creams are distributed in the welding disking area, it further include imaging sensor, described image sensor is formed on an above-mentioned side surface for circuit base plate and correspondence image sensing unit and welding disking area are arranged；When the circuit base plate is printed, the circuit base plate is towards being provided with several support components on a side surface of imaging sensor, to support imaging sensor, the support component is formed in the white space of circuit base plate, avoids the setting of image sensing area the support component.By the way that support component is arranged between circuit base plate and imaging sensor, enough welding spaces are provided, avoidable tin cream collapses out pad problem, Improving The Quality of Products.
Description
Technical field
The utility model relates to image sensor package technical fields, relate more specifically to a kind of large-size images sensor
Encapsulating structure.
Background technique
LGA package is fully located at component base using by pad, also known as without the image sensor package of soldered ball.Usually
LGA package is divided into two kinds: one kind is using Socket, also referred to as Socket T, using needle-shaped piugging technology；It is another
Kind uses SMT welding technique, and technically reliable is at low cost, therefore is widely adopted, however SMT is welded on vacuum tin cream and flowed back
Cheng Zhong, when tin cream reaches fusing point formation liquid, because welding insufficient space or tin cream are affected by gravity and collapse out pad, refluxing stage
Tin cream can not bounce back, and cause to lead to the problem of excessive tin, even tin, and on the other hand when tin cream bumps melt, imaging sensor can be stayed,
The height of the imaging sensor welded contact formed by tin cream reflux course is approximately less than original image sensor tin cream
The height of salient point, when especially for larger-size imaging sensor, disadvantages mentioned above is become apparent, so as to cause production first-pass yield
It is low, it reprocesses at high cost.
Utility model content
In order to solve the deficiencies in the prior art, the utility model provides that a kind of welding space is sufficient, promotes encapsulation
The large-size images sensor-packaging structure of quality.
The utility model technical effect to be achieved is realized by following scheme: a kind of large-size images sensor encapsulation
Structure, including circuit base plate, a side surface of the circuit base plate have intermediate image sensing unit and set around image sensing area
Several tin creams are distributed in the welding disking area set, the welding disking area, further include imaging sensor, and described image sensor is formed
On an above-mentioned side surface for circuit base plate and correspondence image sensing unit and welding disking area are arranged；When the circuit base plate is printed,
The circuit base plate is towards several support components are provided on a side surface of imaging sensor, and the support component is to prop up
Imaging sensor is supportted, the support component is formed in the white space of circuit base plate, avoids the setting of image sensing area.
Preferably, the support component is chip element.
Preferably, the support component is formed in the periphery and/or the interior edge enclosed of welding disking area.
Preferably, described image sensing unit and when the equal square structure of welding disking area, the support component is symmetrically formed at
Welding disking area periphery and/or interior four enclosed angular position.
Preferably, the size of described image sensor is not less than 50mm*50mm.
Preferably, the upper surface or lower surface of the circuit base plate are additionally provided with stiffening plate.
Preferably, one side of the circuit base plate towards imaging sensor is arranged in the stiffening plate, is made only in image sensing
The image sensing area of device.
Preferably, the circuit base plate is also provided with groove in the position of corresponding stiffening plate setting, and the stiffening plate is held
It sets in groove.
Preferably, the stiffening plate is stainless steel substrates.
The utility model has the advantage that
It is empty to provide enough welding by the way that support component is arranged between circuit base plate and imaging sensor for the utility model
Between, avoidable tin cream collapses out pad problem, Improving The Quality of Products.
Detailed description of the invention
Fig. 1 is the planar structure signal that the utility model large-size images sensor-packaging structure does not include imaging sensor
Figure；
Fig. 2 is the planar structure signal that large-size images sensor-packaging structure includes imaging sensor in the utility model
Figure；
Fig. 3 is the side view structure signal that large-size images sensor-packaging structure includes imaging sensor in the utility model
Figure；
Fig. 4 is that large-size images sensor-packaging structure includes the planar structure signal for including stiffening plate in the utility model
Figure.
Specific embodiment
The utility model is described in detail with reference to the accompanying drawings and examples, the examples of the embodiments are in attached drawing
In show, in which the same or similar labels are throughly indicated same or similar elements or with the same or similar functions
Element.The embodiments described below with reference to the accompanying drawings are exemplary, it is intended to for explaining the utility model, and cannot understand
For limitations of the present invention.
In the description of the present invention, it should be understood that term " length ", " width ", "upper", "lower", " preceding ",
The orientation or positional relationship of the instructions such as " rear ", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" be based on
Orientation or positional relationship shown in the drawings, is merely for convenience of describing the present invention and simplifying the description, rather than instruction or dark
Show that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as pair
The limitation of the utility model.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu
Calmly ", the terms such as " setting " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；
It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, can also may be used also indirectly connected through an intermediary
To be the interaction relationship of connection or two elements inside two elements.For the ordinary skill in the art,
The concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In conjunction with shown in Fig. 1-Fig. 3, the utility model embodiment provides a kind of large-size images sensor-packaging structure, including
Circuit base plate 1, a side surface of the circuit base plate 1 have intermediate image sensing unit A and the weldering around image sensing area A setting
Several tin creams (circle shape as shown in the figure) are distributed in disk area B, the welding disking area B.Described image sensor encapsulation knot
Structure further includes imaging sensor 2, and described image sensor 2 is formed on an above-mentioned side surface for circuit base plate 1 and correspondence image
Sensing unit A and welding disking area B setting.
When in order to encapsulate imaging sensor 2, prevent because of 2 gravity of imaging sensor, the image when tin cream flows back into liquid
Tin cream is squeezed out pad by sensor 2 to be caused refluxing stage tin cream that can not bounce back to lead to the problem of excessive tin, even tin and image sensing
The problem of device 2 stays, the utility model proposes when the circuit base plate 1 printing, the circuit base plate 1 is towards imaging sensor 2
A side surface on be provided with several support components 3, the support component 3 is to support imaging sensor 3, the support member
Part 3 is formed in the white space of circuit base plate 1, avoids image sensing area A setting.
As the further improvement of the utility model embodiment, the support component 3 is chip element, in this way, can not
Other processing and fabricating is needed, cost is saved.The fixed form of the support component 3 and circuit base plate 1 and imaging sensor 2 is existing
There is technology existing, the utility model is not especially limited.
As the further improvement of the utility model embodiment, the size of described image sensor 2 is not less than 50mm*
50mm.The chip element, which is formed on circuit base plate 1, supports the height in 2 direction of imaging sensor not less than 0.3mm.
As the further improvement of the utility model embodiment, the support component 3 is formed in the periphery of welding disking area B
And/or the interior edge enclosed, can play support imaging sensor 2 to greatest extent makes imaging sensor 2 and tin cream with enough
Space.
As the further improvement of the utility model embodiment, described image sensing unit A and the equal square structure of welding disking area B
When, the support component 3 is symmetrically formed at the periphery welding disking area B and/or interior four enclosed angular position, is more advantageous to image
The stability of 2 encapsulating structure of sensor.
As shown in figure 4, the circuit base plate 1 is providing for electronic component electrical connection in the utility model embodiment
Person, the upper surface or lower surface of the circuit base plate 1 are also provided with stiffening plate 4, the intensity of circuit base plate 1 can be improved,
Be conducive to the encapsulation of large-size images sensor 2 and promote quality.The stiffening plate 4 can be set in circuit base plate 1 towards figure
As the one side of sensor 2, the image sensing area A of imaging sensor 2 can also be only formed in.
As a further improvement, the circuit base plate 1 is also provided with groove (in figure in the position that corresponding stiffening plate 4 is arranged
It is not shown), the stiffening plate 4 is placed in groove, can also be to packaging height not while improving 1 intensity of circuit base plate
It has a negative impact.
Preferably, the stiffening plate 4 passes through glue bonding or surface mounting technology (surface mount
Technology, SMT) scolding tin mode is fixed on circuit base plate 1, and stiffening plate 4 is mounted using metal adhesive-layer in the present embodiment
To the upper surface of circuit base plate 1.Stiffening plate 4 is with very strong hardness and on-deformable plate structure, can be high-intensitive
Sheet metal, ceramic substrate etc. more specifically, such as can be stainless steel substrates, in addition, not to the thickness of stiffening plate 4
It is limited, supports imaging sensor 2 can be realized, and circuit base plate 1 and imaging sensor will not be caused in mould model
Subject to deformation, warpage.
Finally, it should be noted that above embodiments are only to illustrate the technical solution of the utility model embodiment rather than right
It is limited, although the utility model embodiment is described in detail referring to preferred embodiment, this field it is common
Technical staff should understand that still be modified or replaced equivalently the technical solution of the utility model embodiment, and this
A little ranges modified or equivalent replacement cannot also make modified technical solution be detached from the utility model embodiment technical solution.
Claims (9)
1. a kind of large-size images sensor-packaging structure, including circuit base plate, during a side surface of the circuit base plate has
Between image sensing area and the welding disking area around the setting of image sensing area, several tin creams are distributed in the welding disking area, special
Sign is, further includes imaging sensor, described image sensor is formed on an above-mentioned side surface for circuit base plate and corresponding diagram
As sensing unit and welding disking area are arranged；When the circuit base plate is printed, side table of the circuit base plate towards imaging sensor
Several support components are provided on face, to support imaging sensor, the support component is formed online the support component
The white space of base board avoids the setting of image sensing area.
2. a kind of large-size images sensor-packaging structure as described in claim 1, which is characterized in that the support component is
Chip element.
3. a kind of large-size images sensor-packaging structure as claimed in claim 1 or 2, which is characterized in that the support member
Part is formed in the periphery and/or the interior edge enclosed of welding disking area.
4. a kind of large-size images sensor-packaging structure as claimed in claim 3, which is characterized in that described image sensing unit
When square structure equal with welding disking area, the support component is symmetrically formed at welding disking area periphery and/or interior four enclosed angle
At position.
5. a kind of large-size images sensor-packaging structure as described in claim 1, which is characterized in that described image sensor
Size be not less than 50mm*50mm.
6. a kind of large-size images sensor-packaging structure as described in claim 1, which is characterized in that the circuit base plate
Upper surface or lower surface are additionally provided with stiffening plate.
7. a kind of large-size images sensor-packaging structure as claimed in claim 6, which is characterized in that the stiffening plate setting
In circuit base plate towards the one side of imaging sensor, it is made only in the image sensing area of imaging sensor.
8. a kind of large-size images sensor-packaging structure as claimed in claim 7, which is characterized in that the circuit base plate exists
The position of corresponding stiffening plate setting is also provided with groove, and the stiffening plate is placed in groove.
9. a kind of large-size images sensor-packaging structure as claimed in claim 7 or 8, which is characterized in that the stiffening plate
For stainless steel substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920085926.3U CN209119105U (en) | 2019-01-18 | 2019-01-18 | A kind of large-size images sensor-packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920085926.3U CN209119105U (en) | 2019-01-18 | 2019-01-18 | A kind of large-size images sensor-packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209119105U true CN209119105U (en) | 2019-07-16 |
Family
ID=67209411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920085926.3U Active CN209119105U (en) | 2019-01-18 | 2019-01-18 | A kind of large-size images sensor-packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209119105U (en) |
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2019
- 2019-01-18 CN CN201920085926.3U patent/CN209119105U/en active Active
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