CN107868403A - 适用于软硬结合板的树脂组合物及其应用 - Google Patents
适用于软硬结合板的树脂组合物及其应用 Download PDFInfo
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- CN107868403A CN107868403A CN201611055176.2A CN201611055176A CN107868403A CN 107868403 A CN107868403 A CN 107868403A CN 201611055176 A CN201611055176 A CN 201611055176A CN 107868403 A CN107868403 A CN 107868403A
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- 239000011342 resin composition Substances 0.000 title abstract 3
- 239000003822 epoxy resin Substances 0.000 claims abstract description 53
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 53
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 26
- 150000001412 amines Chemical class 0.000 claims abstract description 26
- 229920000459 Nitrile rubber Polymers 0.000 claims abstract description 24
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229920001971 elastomer Polymers 0.000 claims abstract description 21
- 229920000570 polyether Polymers 0.000 claims abstract description 21
- 239000005060 rubber Substances 0.000 claims abstract description 21
- 238000010521 absorption reaction Methods 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims description 76
- 239000011347 resin Substances 0.000 claims description 76
- 238000000034 method Methods 0.000 claims description 30
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 27
- -1 ether amines Chemical class 0.000 claims description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 10
- 238000005259 measurement Methods 0.000 claims description 9
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 229920001577 copolymer Polymers 0.000 claims description 7
- 229920013646 Hycar Polymers 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 6
- 239000004848 polyfunctional curative Substances 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 5
- 239000003063 flame retardant Substances 0.000 claims description 5
- 238000007731 hot pressing Methods 0.000 claims description 5
- 239000011256 inorganic filler Substances 0.000 claims description 5
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 5
- 229920000098 polyolefin Polymers 0.000 claims description 5
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 5
- 239000012779 reinforcing material Substances 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- 229920001225 polyester resin Polymers 0.000 claims description 4
- 239000004645 polyester resin Substances 0.000 claims description 4
- 230000004580 weight loss Effects 0.000 claims description 4
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 3
- 125000003277 amino group Chemical group 0.000 claims description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920001195 polyisoprene Polymers 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 2
- CBECDWUDYQOTSW-UHFFFAOYSA-N 2-ethylbut-3-enal Chemical compound CCC(C=C)C=O CBECDWUDYQOTSW-UHFFFAOYSA-N 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- JTHNLKXLWOXOQK-UHFFFAOYSA-N n-propyl vinyl ketone Natural products CCCC(=O)C=C JTHNLKXLWOXOQK-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 47
- 229910052802 copper Inorganic materials 0.000 description 28
- 239000010949 copper Substances 0.000 description 28
- 239000000047 product Substances 0.000 description 26
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 25
- 239000004033 plastic Substances 0.000 description 23
- 229920003023 plastic Polymers 0.000 description 23
- 239000000758 substrate Substances 0.000 description 21
- 239000011889 copper foil Substances 0.000 description 19
- 239000000203 mixture Substances 0.000 description 19
- 239000010410 layer Substances 0.000 description 17
- 229920003986 novolac Polymers 0.000 description 16
- BSYJHYLAMMJNRC-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-ol Chemical compound CC(C)(C)CC(C)(C)O BSYJHYLAMMJNRC-UHFFFAOYSA-N 0.000 description 14
- 229940106691 bisphenol a Drugs 0.000 description 14
- 239000002585 base Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 10
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 10
- 239000004843 novolac epoxy resin Substances 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 239000004744 fabric Substances 0.000 description 9
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229920006287 phenoxy resin Polymers 0.000 description 7
- 239000013034 phenoxy resin Substances 0.000 description 7
- PXKLMJQFEQBVLD-UHFFFAOYSA-N Bisphenol F Natural products C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 239000010426 asphalt Substances 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000004305 biphenyl Substances 0.000 description 5
- 235000010290 biphenyl Nutrition 0.000 description 5
- 239000004643 cyanate ester Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 4
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 229930003836 cresol Natural products 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000004745 nonwoven fabric Substances 0.000 description 4
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 229920003048 styrene butadiene rubber Polymers 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- DSROZUMNVRXZNO-UHFFFAOYSA-K tris[(1-naphthalen-1-yl-3-phenylnaphthalen-2-yl)oxy]alumane Chemical compound C=1C=CC=CC=1C=1C=C2C=CC=CC2=C(C=2C3=CC=CC=C3C=CC=2)C=1O[Al](OC=1C(=C2C=CC=CC2=CC=1C=1C=CC=CC=1)C=1C2=CC=CC=C2C=CC=1)OC(C(=C1C=CC=CC1=C1)C=2C3=CC=CC=C3C=CC=2)=C1C1=CC=CC=C1 DSROZUMNVRXZNO-UHFFFAOYSA-K 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 3
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 3
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- AFTLIIOXEHXDOZ-UHFFFAOYSA-N buta-1,3-diene;furan-2,5-dione;styrene Chemical compound C=CC=C.O=C1OC(=O)C=C1.C=CC1=CC=CC=C1 AFTLIIOXEHXDOZ-UHFFFAOYSA-N 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- WOLATMHLPFJRGC-UHFFFAOYSA-N furan-2,5-dione;styrene Chemical compound O=C1OC(=O)C=C1.C=CC1=CC=CC=C1 WOLATMHLPFJRGC-UHFFFAOYSA-N 0.000 description 3
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- XSHWKULGRFTYIT-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1C=C XSHWKULGRFTYIT-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000004114 Ammonium polyphosphate Substances 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000009261 D 400 Substances 0.000 description 2
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 description 2
- YFPJFKYCVYXDJK-UHFFFAOYSA-N Diphenylphosphine oxide Chemical compound C=1C=CC=CC=1[P+](=O)C1=CC=CC=C1 YFPJFKYCVYXDJK-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000002841 Lewis acid Substances 0.000 description 2
- 239000002879 Lewis base Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- PZBFGYYEXUXCOF-UHFFFAOYSA-N TCEP Chemical compound OC(=O)CCP(CCC(O)=O)CCC(O)=O PZBFGYYEXUXCOF-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 2
- 229920001276 ammonium polyphosphate Polymers 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- UFZOLVFGAOAEHD-UHFFFAOYSA-N benzaldehyde;phenol Chemical compound OC1=CC=CC=C1.O=CC1=CC=CC=C1 UFZOLVFGAOAEHD-UHFFFAOYSA-N 0.000 description 2
- 229910001593 boehmite Inorganic materials 0.000 description 2
- 239000011469 building brick Substances 0.000 description 2
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- VONWDASPFIQPDY-UHFFFAOYSA-N dimethyl methylphosphonate Chemical compound COP(C)(=O)OC VONWDASPFIQPDY-UHFFFAOYSA-N 0.000 description 2
- 229940113088 dimethylacetamide Drugs 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- ASMQGLCHMVWBQR-UHFFFAOYSA-M diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)([O-])OC1=CC=CC=C1 ASMQGLCHMVWBQR-UHFFFAOYSA-M 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 150000007517 lewis acids Chemical class 0.000 description 2
- 150000007527 lewis bases Chemical class 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 2
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229960005382 phenolphthalein Drugs 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- XDOBJOBITOLMFI-UHFFFAOYSA-N pyrrole-2,5-dione;toluene Chemical compound CC1=CC=CC=C1.O=C1NC(=O)C=C1 XDOBJOBITOLMFI-UHFFFAOYSA-N 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 235000012222 talc Nutrition 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 229920001897 terpolymer Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- QQOWHRYOXYEMTL-UHFFFAOYSA-N triazin-4-amine Chemical compound N=C1C=CN=NN1 QQOWHRYOXYEMTL-UHFFFAOYSA-N 0.000 description 2
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 2
- HBGPNLPABVUVKZ-POTXQNELSA-N (1r,3as,4s,5ar,5br,7r,7ar,11ar,11br,13as,13br)-4,7-dihydroxy-3a,5a,5b,8,8,11a-hexamethyl-1-prop-1-en-2-yl-2,3,4,5,6,7,7a,10,11,11b,12,13,13a,13b-tetradecahydro-1h-cyclopenta[a]chrysen-9-one Chemical compound C([C@@]12C)CC(=O)C(C)(C)[C@@H]1[C@H](O)C[C@]([C@]1(C)C[C@@H]3O)(C)[C@@H]2CC[C@H]1[C@@H]1[C@]3(C)CC[C@H]1C(=C)C HBGPNLPABVUVKZ-POTXQNELSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- JPJGNZQDELRZGE-UHFFFAOYSA-N (phenyl-$l^{2}-phosphanyl)benzene Chemical compound C=1C=CC=CC=1[P]C1=CC=CC=C1 JPJGNZQDELRZGE-UHFFFAOYSA-N 0.000 description 1
- SBJVSHMZBIZBBY-UHFFFAOYSA-N 1,2-di(propan-2-yl)benzene;2-hydroperoxy-2-methylpropane Chemical compound CC(C)(C)OO.CC(C)C1=CC=CC=C1C(C)C SBJVSHMZBIZBBY-UHFFFAOYSA-N 0.000 description 1
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 1
- LLSBIRUUVPUDMV-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1.C1=CC=C2OC=CC2=C1 LLSBIRUUVPUDMV-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- PFRGGOIBYLYVKM-UHFFFAOYSA-N 15alpha-hydroxylup-20(29)-en-3-one Natural products CC(=C)C1CCC2(C)CC(O)C3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 PFRGGOIBYLYVKM-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- AFTPEBDOGXRMNQ-UHFFFAOYSA-N 2,2,4-Trimethylhexane Chemical compound CCC(C)CC(C)(C)C AFTPEBDOGXRMNQ-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- MMEDJBFVJUFIDD-UHFFFAOYSA-N 2-[2-(carboxymethyl)phenyl]acetic acid Chemical compound OC(=O)CC1=CC=CC=C1CC(O)=O MMEDJBFVJUFIDD-UHFFFAOYSA-N 0.000 description 1
- 125000000143 2-carboxyethyl group Chemical group [H]OC(=O)C([H])([H])C([H])([H])* 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- 150000004941 2-phenylimidazoles Chemical class 0.000 description 1
- ZPMCCZKDFLIVHD-UHFFFAOYSA-N 2-tert-butylperoxy-2-methylpropane;1,2-di(propan-2-yl)benzene Chemical compound CC(C)(C)OOC(C)(C)C.CC(C)C1=CC=CC=C1C(C)C ZPMCCZKDFLIVHD-UHFFFAOYSA-N 0.000 description 1
- MOSSLXZUUKTULI-UHFFFAOYSA-N 3-[3-(2,5-dioxopyrrol-3-yl)-4-methylphenyl]pyrrole-2,5-dione Chemical compound CC1=CC=C(C=2C(NC(=O)C=2)=O)C=C1C1=CC(=O)NC1=O MOSSLXZUUKTULI-UHFFFAOYSA-N 0.000 description 1
- HRCSALDOULKIIP-UHFFFAOYSA-N 3-methyl-2,4-dioxa-3$l^{5}-phosphabicyclo[3.3.1]nona-1(9),5,7-triene 3-oxide Chemical compound C1=CC(OP(C)(=O)O2)=CC2=C1 HRCSALDOULKIIP-UHFFFAOYSA-N 0.000 description 1
- 229960000549 4-dimethylaminophenol Drugs 0.000 description 1
- PNWSHHILERSSLF-UHFFFAOYSA-N 4-methylbenzene-1,3-dicarboxylic acid Chemical class CC1=CC=C(C(O)=O)C=C1C(O)=O PNWSHHILERSSLF-UHFFFAOYSA-N 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- 229910002706 AlOOH Inorganic materials 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 241000208340 Araliaceae Species 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 208000037427 Beta-propeller protein-associated neurodegeneration Diseases 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- BQFMRZSKOUHUII-UHFFFAOYSA-N C(C=1C(C(=O)OC)=CC=CC1)(=O)OC.CP Chemical compound C(C=1C(C(=O)OC)=CC=CC1)(=O)OC.CP BQFMRZSKOUHUII-UHFFFAOYSA-N 0.000 description 1
- NSQHUAHYTXRCOF-UHFFFAOYSA-N C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1.C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1.C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 NSQHUAHYTXRCOF-UHFFFAOYSA-N 0.000 description 1
- STJCGBYTFNBYJS-UHFFFAOYSA-N CC(C)(Cl)OP(O)(O)=O Chemical class CC(C)(Cl)OP(O)(O)=O STJCGBYTFNBYJS-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 241001232787 Epiphragma Species 0.000 description 1
- MHABMANUFPZXEB-UHFFFAOYSA-N O-demethyl-aloesaponarin I Natural products O=C1C2=CC=CC(O)=C2C(=O)C2=C1C=C(O)C(C(O)=O)=C2C MHABMANUFPZXEB-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 229920000388 Polyphosphate Polymers 0.000 description 1
- SOKRNBGSNZXYIO-UHFFFAOYSA-N Resinone Natural products CC(=C)C1CCC2(C)C(O)CC3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 SOKRNBGSNZXYIO-UHFFFAOYSA-N 0.000 description 1
- KZTYYGOKRVBIMI-UHFFFAOYSA-N S-phenyl benzenesulfonothioate Natural products C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- IGWHDMPTQKSDTL-JXOAFFINSA-N TMP Chemical compound O=C1NC(=O)C(C)=CN1[C@H]1[C@H](O)[C@H](O)[C@@H](COP(O)(O)=O)O1 IGWHDMPTQKSDTL-JXOAFFINSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- BQPNUOYXSVUVMY-UHFFFAOYSA-N [4-[2-(4-diphenoxyphosphoryloxyphenyl)propan-2-yl]phenyl] diphenyl phosphate Chemical compound C=1C=C(OP(=O)(OC=2C=CC=CC=2)OC=2C=CC=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OP(=O)(OC=1C=CC=CC=1)OC1=CC=CC=C1 BQPNUOYXSVUVMY-UHFFFAOYSA-N 0.000 description 1
- KMWBBMXGHHLDKL-UHFFFAOYSA-N [AlH3].[Si] Chemical compound [AlH3].[Si] KMWBBMXGHHLDKL-UHFFFAOYSA-N 0.000 description 1
- DBWGAXVWWNKFNI-UHFFFAOYSA-N [O].C1(=CC=CC=C1)[P]C1=CC=CC=C1 Chemical class [O].C1(=CC=CC=C1)[P]C1=CC=CC=C1 DBWGAXVWWNKFNI-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 150000001299 aldehydes Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- HHEFNVCDPLQQTP-UHFFFAOYSA-N ammonium perchlorate Chemical compound [NH4+].[O-]Cl(=O)(=O)=O HHEFNVCDPLQQTP-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000003542 behavioural effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- MYRTYDVEIRVNKP-UHFFFAOYSA-N divinylbenzene Substances C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 150000002168 ethanoic acid esters Chemical class 0.000 description 1
- SHZIWNPUGXLXDT-UHFFFAOYSA-N ethyl hexanoate Chemical compound CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 1
- NJXBVBPTDHBAID-UHFFFAOYSA-M ethyl(triphenyl)phosphanium;chloride Chemical compound [Cl-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 NJXBVBPTDHBAID-UHFFFAOYSA-M 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 238000005206 flow analysis Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000003863 metallic catalyst Substances 0.000 description 1
- SAWKFRBJGLMMES-UHFFFAOYSA-N methylphosphine Chemical compound PC SAWKFRBJGLMMES-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical compound CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 1
- 201000007614 neurodegeneration with brain iron accumulation 5 Diseases 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000004893 oxazines Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- NAKOELLGRBLZOF-UHFFFAOYSA-N phenoxybenzene;pyrrole-2,5-dione Chemical compound O=C1NC(=O)C=C1.O=C1NC(=O)C=C1.C=1C=CC=CC=1OC1=CC=CC=C1 NAKOELLGRBLZOF-UHFFFAOYSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 229920001296 polysiloxane Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N pyridine Substances C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- RIOQSEWOXXDEQQ-UHFFFAOYSA-O triphenylphosphanium Chemical compound C1=CC=CC=C1[PH+](C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-O 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M15/00—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment
- D06M15/19—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment with synthetic macromolecular compounds
- D06M15/37—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- D06M15/53—Polyethers
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M15/00—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment
- D06M15/19—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment with synthetic macromolecular compounds
- D06M15/37—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- D06M15/55—Epoxy resins
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M15/00—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment
- D06M15/19—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment with synthetic macromolecular compounds
- D06M15/37—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- D06M15/61—Polyamines polyimines
-
- D—TEXTILES; PAPER
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Abstract
本发明公开了一种树脂组合物,其包含环氧树脂、高分子量聚醚胺以及端氨基丁腈橡胶。前述树脂组合物可制成各类制品,例如半固化片、积层板、印刷电路板或软硬结合板,并满足低流胶量、低掉屑量、室温及高温剥离强度高、吸湿率低、成胶稳定性高等特性的至少一种、多种或全部。
Description
技术领域
本发明关于一种树脂组合物,特别关于一种在应用上可满足软硬结合板(rigid-flex board)及其他产品的特性需求的树脂组合物。
背景技术
熟知的印刷电路板主要采用玻璃纤维布作为基材,因此质地较坚硬,又称为硬板,不具可挠性。仅使用硬板制成的各类电子产品,由于结构配置的限制,在终端产品的体积与造型设计上造成许多限制。
为解决此类问题,业界以挠性材料例如聚酰亚胺膜(PI film)作为至少一部分主体的软性印刷电路板(flexible printed circuit,FPC),又称为软板。软板具有较轻薄、具可挠性、可依照空间改变形状制成立体配线等优点。然而,软板有成本较高、多层PCB加工困难、重量承载力较低等缺点,因此仅使用软板仍无法满足电子产品设计上的各种需求。
由此因应而生的是软板结合硬板使用的软硬结合板,又称为软硬复合板,其同时利用硬板具有的刚性与软板具有的挠性来满足各类产品结构设计的要求。传统的两硬板连结或硬板与软板连结需通过连接器(connector)及连接线来达成,但因为连接器体积大较占空间,无法满足高密度设计的需求,因此后来开发出使用低流胶的半固化片来贴合软板及硬板,以达到两硬板或硬板与软板的连结,可省去连接器的空间并减少讯号传递衰减的问题。
在设计与制造上,为能将软板及硬板贴合连接且同时避免污损软板及硬板上已蚀刻形成的电路图案,需采用具有低流胶(low flow)特性的半固化片。
然而,现有应用于此类半固化片(又称为粘结片)的树脂组合物,虽然可满足低流胶量(low flow in)的要求,但在其他特性上仍有令人不甚满意之处,例如半固化片在制备加工时产生的掉屑(落粉)造成污染而降低良率,以及高温对铜箔剥离强度不足等问题,因此有需要提出新的解决方案。
发明内容
据此,本发明提出一种树脂组合物,不仅可符合低流胶量特性,同时可达到至少一种其他性质的提升,因而可满足各种不同产品应用上的需求,例如制作成软硬结合板所需的低流胶的半固化片。
举例而言,在一个实施方式中,本发明公开了一种树脂组合物,其可满足低流胶量,例如其流胶量小于或等于60密耳(mil),优选小于或等于50、40、30、25、20或15密耳,例如介于15密耳及60密耳之间。
在一个实施方式中,本发明公开了一种树脂组合物及由其制成的制品,例如半固化片、积层板、印刷电路板或软硬结合板,除可满足前述低流胶量的特性外,更具有以下所列一种、多种或全部特性:
(1)低掉屑量(dust weight loss),例如掉屑量小于或等于0.3%,优选小于或等于0.2%、0.15%、0.10%或0.09%,例如介于0.09%及0.3%之间,优选为0.09%至0.2%之间;
(2)高温剥离强度(peel strength,P/S,即高温测试基板对铜箔剥离强度)高,例如在280℃下参考IPC-TM-650 2.4.8所述的方法测量而得到的剥离强度大于或等于5.0lb/in,优选大于或等于5.3lb/in,例如介于5.0lb/in及6.0lb/in之间;
(3)室温剥离强度(即室温测试基板对铜箔剥离强度)强度高,例如在室温(约25℃)下参考IPC-TM-650 2.4.8所述的方法测量而得到的剥离强度大于或等于6.8lb/in,优选大于或等于7.0lb/in、7.2lb/in、7.4lb/in或7.5lb/in,例如介于6.8lb/in及7.8lb/in之间;
(4)吸湿率低,例如在室温下参考IPC-TM-650 2.6.2.1a所述的方法测量而得到的吸水率小于或等于0.1%,优选小于或等于0.09%,更优选为约0.08%,例如吸水率介于0.08%及0.1%之间;
(5)制成的半固化片满足以下特性:以压力1452±70kgf/16in2的条件进行热压后,参考IPC-TM-650 2.3.17.2所述的方法测量而得到的流胶量小于或等于25密耳;和/或掉屑量小于或等于0.2%;
(6)制成的积层板满足以下特性:在280℃下参考IPC-TM-650 2.4.8所述的方法测量而得到的剥离强度大于或等于5.3lb/in;在室温下参考IPC-TM-650 2.4.8所述的方法测量而得到的对铜箔剥离强度大于或等于6.8lb/in;和/或在室温下参考IPC-TM-6502.6.2.1a所述的方法测量而得到的吸水率小于或等于0.1%;
(7)成胶兼容性和/或成胶稳定性高:树脂组合物在搅拌后放置于室温下静置12小时后不发生分层,且未形成颗粒状团聚,即肉眼无法观察到直径大于1mm的颗粒。
为达成前述任一种或多种功效的提升,在一个实施方式中,本发明公开了一种树脂组合物,其包含环氧树脂、高分子量聚醚胺(polyetheramine)以及端氨基丁腈橡胶。
若未特别指明,前述三种成分的任一种的用量,及各成分之间的比例关系,均可视需要进行调整。
在一个实施方式中,本发明公开了一种树脂组合物,其包含100重量份的环氧树脂;5至15重量份的高分子量聚醚胺;以及3至10重量份的端氨基丁腈橡胶。
在一个优选实施方式中,前述高分子量聚醚胺的重均分子量大于或等于1000,例如介于1000及5000之间,或介于1500及3000之间。
若未特别指明,任一种高分子量聚醚胺均可用于前述树脂组合物中。举例而言,高分子量聚醚胺可具有以下结构:
其中15≤x≤80,例如25≤x≤50。
在一个优选实施方式中,前述端氨基丁腈橡胶可为具有末端氨基结构的丁二烯-丙烯腈共聚物,例如端氨基丁二烯-丙烯腈共聚物(amine-terminated butadieneacrylonitrile copolymer,ATBN)。
举例而言,前述端氨基丁腈橡胶可为以下化合物的任一种或其组合:
其中60≤m≤75,且当x及y合计为100%时,x为60%至90%,y为10%至40%。
除前述三种主要成分外,树脂组合物还可视需要添加其他成分,例如胺类硬化剂、苯氧树脂、聚乙烯醇缩丁醛、聚苯醚、聚烯烃、聚酯树脂、苯乙烯马来酸酐、苯并噁嗪树脂、马来酰亚胺、氰酸酯树脂或其组合。
此外,树脂组合物也可视需要添加其他成分,例如阻燃剂、无机填料、硬化促进剂、溶剂、硅烷偶合剂或其组合。
具体实施方式
为使本领域技术人员可了解本发明的特点及功效,以下仅就说明书及权利要求书中提及的术语及用语进行一般性的说明及定义。除非另有指明,否则文中使用的所有技术及科学上的字词,皆具有本领域技术人员对于本发明所了解的通常意义,当有冲突情形时,应以本说明书的定义为准。
在本文中,用语“包含”、“包括”、“具有”、“含有”或其他任何类似用语均属于开放性连接词(open-ended transitional phrase),其意欲涵盖非排他性的包括物。举例而言,含有复数要素的一组合物或制品并不仅限于本文所列出的此等要素而已,而是还可包括未明确列出但却是该组合物或制品通常固有的其他要素。除此之外,除非有相反的明确说明,否则用语“或”是指涵括性的“或”,而不是指排他性的“或”。例如,以下任何一种情况均满足条件“A或B”:A为真(或存在)且B为伪(或不存在)、A为伪(或不存在)且B为真(或存在)、A和B均为真(或存在)。此外,在本文中,用语“包含”、“包括”、“具有”、“含有”的解读应视为已具体公开了并同时涵盖“由…所组成”及“实质上由…所组成”等封闭式或半封闭式连接词。
在本文中,所有以数值范围或百分比范围形式界定的特征或条件仅是为了简洁及方便。据此,数值范围或百分比范围的描述应视为已涵盖且具体公开了所有可能的子范围及范围内的个别数值,特别是整数数值。举例而言,“1至8”的范围描述应视为已经具体公开了如1至7、2至8、2至6、3至6、4至8、3至8等等所有子范围,特别是由所有整数数值所界定的子范围,且应视为已经具体公开了范围内如1、2、3、4、5、6、7、8等个别数值。除非另有指明,否则前述解释方法适用于本发明全文的所有内容,不论范围广泛与否。
若数量或其他数值或参数是以范围、优选范围或一系列上限与下限表示,则其应理解成是本文已特定公开了由任一对该范围的上限或优选值与该范围的下限或优选值构成的所有范围,不论该等范围是否有分别公开。此外,本文中若提到数值的范围时,除非另有说明,否则该范围应包括其端点以及范围内的所有整数与分数。
在本文中,在可达成发明目的的前提下,数值应理解成具有该数值有效位数的精确度。举例来说,数字40.0则应理解成涵盖从39.50至40.49的范围。
在本文中,对于使用马库什群组(Markush group)或选项式用语以描述本发明特征或实例的情形,本领域技术人员应了解马库什群组或选项列表内所有成员的子群组或任何个别成员亦可用于描述本发明。举例而言,若X描述成“选自于由X1、X2及X3所组成的群组”,亦表示已经完全描述出X为X1的主张与X为X1和/或X2的主张。再者,对于使用马库什群组或选项式用语以描述本发明的特征或实例者,本领域技术人员应了解马库什群组或选项列表内所有成员的子群组或个别成员的任何组合亦可用于描述本发明。据此,举例而言,若X描述成“选自于由X1、X2及X3所组成的群组”,且Y描述成“选自于由Y1、Y2及Y3所组成的群组”,则表示已经完全描述出X为X1或X2或X3而Y为Y1或Y2或Y3的主张。
以下具体实施方式本质上仅是示例性,并不欲限制本发明及其用途。此外,本文并不受前述背景技术或发明内容或以下具体实施方式或实施例中所描述的任何理论的限制。
树脂组合物
本发明的主要目的之一,在于提供一种树脂组合物,主要包含环氧树脂、高分子量聚醚胺以及端氨基丁腈橡胶三种成分。
前述三种成分的任一种的用量,及各成分的间的比例关系,均可视需要进行调整。举例而言,在一个实施方式中,本发明公开了一种树脂组合物,其包含100重量份的环氧树脂;5至15重量份的高分子量聚醚胺;以及3至10重量份的端氨基丁腈橡胶。就软硬结合板的应用而言,前述组分配比可达到较佳综合理想特性,然而在其他应用方面,树脂组合物的成分用量与比例并不受限于此。
在一实施方式中,前述环氧树脂可为本领域已知的各类环氧树脂,包括但不限于例如双酚A环氧树脂、双酚F环氧树脂、双酚S环氧树脂、双酚AD环氧树脂、苯酚酚醛(phenolnovolac)环氧树脂、三官能(trifunctional)环氧树脂、四官能(tetrafunctional)环氧树脂、多官能(multifunctional)环氧树脂、二环戊二烯(dicyclopentadiene,DCPD)环氧树脂、含磷环氧树脂、DOPO(9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide)环氧树脂、DOPO-HQ环氧树脂、对二甲苯(p-xylene)环氧树脂、萘型(naphthalene)环氧树脂(例如萘酚型环氧树脂)、苯并呋喃(benzofuran)型环氧树脂、异氰酸酯改性(isocyanate-modified)环氧树脂、酚基芳烷基酚醛(phenol aralkyl novolac)环氧树脂。其中,酚醛环氧树脂可为双酚A酚醛(bisphenol A novolac)环氧树脂、双酚F酚醛环氧树脂(bisphenolF novolac)、联苯型酚醛(biphenyl novolac)环氧树脂、酚苯甲醛(phenol benzaldehyde)环氧树脂、酚基苯烷基酚醛(phenol aralkyl novolac)环氧树脂或邻甲酚(o-cresolnovolac)环氧树脂;其中,含磷环氧树脂可为DOPO环氧树脂、DOPO-HQ环氧树脂或其组合。前述DOPO环氧树脂可选自含DOPO苯酚酚醛环氧树脂(DOPO-containing phenolic novolacepoxy resin)、含DOPO邻甲基酚酚醛环氧树脂(DOPO-containing cresol novolac epoxyresin)以及含DOPO双酚A酚醛环氧树脂(DOPO-containing bisphenol-A novolac epoxyresin)中的一种或两种以上;前述DOPO-HQ环氧树脂可选自含DOPO-HQ苯酚酚醛环氧树脂(DOPO-HQ-containing phenolic novolac epoxy resin)、含DOPO-HQ邻甲基酚酚醛环氧树脂(DOPO-HQ-containing cresol novolac epoxy resin)以及含DOPO-HQ双酚A酚醛环氧树脂(DOPO-HQ-containing bisphenol-A novolac epoxy resin)中的一种或两种以上。
在一个实施方式中,前述高分子量聚醚胺可以是重均分子量较大的聚醚胺,例如其重均分子量可大于或等于1000,例如介于1000及5000之间,或介于1500及3000之间。举例而言,高分子量聚醚胺可具有以下结构:
其中15≤x≤80,例如25≤x≤50。
适合的高分子量聚醚胺通常可由市售方式取得,例如Huntsman公司所销售的产品D-2000、D-2010及D-4000的任一种,或任两种或三种的组合。与此相较,通常单单仅使用低分子量的聚醚胺并无法达成本发明前述功效的任一种或多种,例如重均分子量小于500的聚醚胺,如Huntsman公司所销售的产品D-230及D-400。
在一个实施方式中,前述端氨基丁腈橡胶可为具有末端氨基结构的丁二烯-丙烯腈共聚物,例如端氨基丁二烯-丙烯腈共聚物(ATBN)。举例而言,前述端氨基丁腈橡胶可为以下化合物的任一种或其组合:
其中60≤m≤75,例如m为62,且当x及y合计为100%时,x为60%至90%,y为10%至40%。适合的端氨基丁腈橡胶通常可由市售方式取得,例如CVC Thermoset公司所销售的产品1300X21、1300X16、1300X35、1300X45及1300X42的任一种,或任两种或三种以上的组合,更优选可为1300X45(其结构如式(IV),其中x=82%、y=18%、m=62)。
除前述三种主要成分外,树脂组合物还可视需要添加其他成分,如各类硬化剂、例如胺类硬化剂、苯氧树脂、聚乙烯醇缩丁醛、聚苯醚、聚烯烃、聚酯树脂、苯乙烯马来酸酐、苯并噁嗪树脂、马来酰亚胺、氰酸酯树脂或其组合。举例而言,树脂组合物可视需要添加低流胶的树脂适用的硬化剂。
举例而言,胺类硬化剂可以是具有氨基官能基(amino)的树脂,优选具有双氨基官能基(diamino)的树脂。更具体而言,胺类硬化剂可为二氨基二苯砜(diamino diphenylsulfone)、二氨基二苯基甲烷(diamino diphenyl methane)、二氨基二苯醚(diaminodiphenyl ether)、二氨基二苯硫醚(diamino diphenyl sulfide)、双氰胺(dicyandiamide,DICY)的任一种或其组合。举例而言,双氰胺可包括但不限于业界所知的双氰胺,例如但不限于:购自勤裕公司的DICY,或是Asahi Denka所销售的Adeka HT2844(改性双氰胺),其结构如下:
以环氧树脂为100重量份计,双氰胺的添加量可为0.5至3重量份,优选可添加1至3重量份,更优选可添加2至3重量份。
举例而言,苯氧树脂可包括但不限于:购自InChem公司产品名为PKHA、PKHB、PKHB+、PKHC、PKHH、PKHJ、PKFE、PKHP-200的苯氧树脂,或是购自新日铁化学的产品YP50S。以环氧树脂为100重量份计,苯氧树脂的添加量可为10至30重量份,优选可添加15至25重量份。
举例而言,聚苯醚包括但不限于羟基聚苯醚。
举例而言,聚烯烃包含苯乙烯-丁二烯-二乙烯基苯三元聚合物(styrene-butadiene-divinylbenzene terpolymer)、苯乙烯-丁二烯-马来酸酐三元聚合物(styrene-butadiene-maleic anhydride terpolymer)、乙烯基-聚丁二烯-氨酯低聚物(vinyl-polybutadiene-urethane oligomer)、苯乙烯丁二烯共聚物(styrene-butadienecopolymer)、氢化苯乙烯丁二烯共聚物(hydrogenated styrene-butadiene copolymer)、苯乙烯异戊二烯共聚物(styrene-isoprene copolymer)、氢化苯乙烯异戊二烯共聚物(hydrogenated styrene-isoprene copolymer)或其组合。优选地,聚烯烃可为苯乙烯-丁二烯-二乙烯基苯三元聚合物、苯乙烯-丁二烯-马来酸酐三元聚合物、乙烯基-聚丁二烯-氨酯低聚物或其组合。
举例而言,聚酯树脂可由二羧酸基的芳香族化合物与二羟基的芳香族化合物进行酯化而成。如大日本油墨化学出售的商品名HPC-8000T65。
举例而言,前述苯乙烯马来酸酐中,苯乙烯(S)与马来酸酐(MA)的比例可为1/1、2/1、3/1、4/1、6/1、8/1或12/1,如Cray valley贩卖的商品名SMA-1000、SMA-2000、SMA-3000、EF-30、EF-40、EF-60及EF-80等苯乙烯马来酸酐共聚物。此外,所述苯乙烯马来酸酐共聚物亦可为酯化苯乙烯马来酸酐共聚物,如Cray valley贩卖的商品名SMA1440、SMA17352、SMA2625、SMA3840及SMA31890。
举例而言,苯并噁嗪树脂可为双酚A型苯并噁嗪树脂、双酚F型苯并噁嗪树脂或酚酞型苯并噁嗪树脂、双环戊二烯苯并噁嗪树脂、含磷苯并噁嗪树脂,如Huntsman生产的商品名LZ-8270、LZ-8280或LZ-8290,或昭和高分子公司生产的商品名HFB-2006M。
举例而言,马来酰亚胺可为4,4’-二苯甲烷双马来酰亚胺(4,4’-diphenylmethanebismaleimide)、苯甲烷马来酰亚胺低聚物(oligomer of phenylmethane maleimide)、间-苯撑双马来酰亚胺(m-phenylene bismaleimide)、双酚A二苯基醚双马来酰亚胺(bisphenol A diphenyl ether bismaleimide)、3,3’-二甲基-5,5’-二乙基-4,4’-二苯基甲烷双马来酰亚胺(3,3’-dimethyl-5,5’-diethyl-4,4’-diphenylmethanebismaleimide)、4-甲基-1,3-亚苯基双马来酰亚胺(4-methyl-1,3-phenylenebismaleimide)、1,6-双马来酰亚胺-(2,2,4-三甲基)己烷(1,6-bismaleimide-(2,2,4-trimethyl hexane)或其组合。
举例而言,氰酸酯树脂并无特别限制,任何具有Ar-O-C≡N结构的氰酸酯皆可,其中Ar可为经取代或未经取代的芳香族、酚醛、双酚A、双酚A酚醛、双酚F、双酚F酚醛或酚酞。
前述氰酸酯树脂的实例可为例如商品名为primaset PT-15、PT-30S、PT-60S、CT-90、BADCY、BA-100-10T、BA-200、BA-230S、BA-300S、BTP-2500、BTP-6020S、DT-4000、DT-7000、Methylcy、ME-240S等由Lonza生产的氰酸酯树脂。
此外,树脂组合物还可视需要包含各类添加物,例如阻燃剂、无机填料、硬化促进剂、溶剂、硅烷偶合剂或其组合。
举例而言,阻燃剂可为各类阻燃剂,包括但不限于含磷化合物、含氮化合物或其组合。
所述含磷化合物可以是下列至少一种化合物,但不以此为限:双酚二苯基磷酸酯(bisphenol diphenyl phosphate)、聚磷酸铵(ammonium polyphosphate)、对苯二酚-双-(二苯基磷酸酯)(hydroquinone bis-(diphenyl phosphate))、双酚A-双-(二苯基磷酸酯)(bisphenol A bis-(diphenylphosphate))、三(2-羧乙基)膦(tri(2-carboxyethyl)phosphine,TCEP)、三(氯异丙基)磷酸酯、磷酸三甲酯(trimethyl phosphate,TMP)、甲基膦酸二甲酯(dimethyl methyl phosphonate,DMMP)、间苯二酚双二甲苯基磷酸酯(resorcinol bis(dixylenyl phosphate),RDXP,如PX-200,购自大八化学)、磷腈化合物(phosphazene,如SPB-100,购自大冢化学)、间苯甲基膦(m-phenylenemethylphosphonate,PMP)、聚磷酸三聚氰胺(melamine polyphosphate)、9,10-二氢-9-氧杂-10-磷菲-10-氧化物(9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide,DOPO)、含DOPO酚树脂(如DOPO-HQ、DOPO-PN、DOPO-BPN)、含DOPO环氧树脂、含DOPO-HQ环氧树脂等,其中DOPO-BPN可为DOPO-BPAN、DOPO-BPFN、DOPO-BPSN等双酚酚醛化合物、二苯基磷氧(diphenyl phosphine oxide,DPPO)化合物、二苯基磷氧衍生物等。
所述含氮化合物可以是下列至少一种化合物,但不以此为限:氨基三嗪酚醛树脂(amino triazine novolac(ATN))、三聚氰胺氰尿酸酯(melamine cyanurate)及三-羟乙基异氰尿酸酯(trihydroxy ethyl isocyanurate)。
举例而言,无机填料可为各类无机填料,包括但不限于二氧化硅(熔融态、非熔融态、多孔质或中空型)、氧化铝、氢氧化铝、氧化镁、氢氧化镁、碳酸钙、氮化铝、氮化硼、碳化铝硅、碳化硅、二氧化钛、氧化锌、氧化锆、云母、勃姆石(boehmite,AlOOH)、煅烧滑石、滑石、氮化硅、煅烧高岭土中的至少一种或多种。
举例而言,硬化促进剂可为各类硬化促进剂,包括但不限于路易斯碱、路易斯酸或过氧化物等催化剂(catalyst)。其中,路易斯碱可包含咪唑(imidazole)、三氟化硼胺复合物、氯化乙基三苯基鏻(ethyltriphenyl phosphonium chloride)、2-甲基咪唑(2-methylimidazole,2MI)、2-苯基咪唑(2-phenyl-1H-imidazole,2PZ)、2-乙基-4-甲基咪唑(2-ethyl-4-methylimidazole,2E4MI)、三苯基膦(triphenylphosphine,TPP)与4-二甲基胺基吡啶(4-dimethylaminopyridine,DMAP)中的一种或多种。路易斯酸可包含金属盐类化合物,如锰、铁、钴、镍、铜、锌等金属盐化合物,如辛酸锌、辛酸钴等金属催化剂。其中,过氧化物可包含过氧化二异丙苯、过氧苯甲酸叔丁酯及二叔丁基过氧化二异丙基苯,优选为二叔丁基过氧化二异丙基苯。
举例而言,溶剂可为各类溶剂,包括但不限于甲醇、乙醇、乙二醇单甲醚、丙酮、丁酮(又称为甲基乙基酮)、甲基异丁基酮、环己酮、甲苯、二甲苯、甲氧基乙基乙酸酯、乙氧基乙基乙酸酯、丙氧基乙基乙酸酯、乙酸乙酯、二甲基甲酰胺、丙二醇甲基醚等溶剂或其混合溶剂。
举例而言,硅烷偶合剂可为各类硅烷偶合剂,包括但不限于硅烷化合物(silane)及硅氧烷化合物(siloxane)。
在一优选实施方式中,树脂组合物包含:100重量份的环氧树脂;5至15重量份的高分子量聚醚胺;以及3至10重量份的端氨基丁腈橡胶,其中:该高分子量聚醚胺具有以下结构:
25≤x≤50;以及该端氨基丁腈橡胶为端氨基丁二烯-丙烯腈共聚物。
树脂组合物的制品
前述树脂组合物可通过各种加工方式制成各类制品,例如适用于各类电子产品中的组件,其包括但不限于半固化片、积层板、印刷电路板及软硬结合板。
举例而言,本发明各实施方式的树脂组合物可制成半固化片(prepreg),其具有一补强材及设置于补强材上的层状物(绝缘层),该层状物由如前述树脂组合物经高温加热形成半固化态所固化而成,制作半固化片的烘烤温度为例如120℃至190℃之间。该补强材可为纤维材料、织布及无纺布,如玻璃纤维布等,以增加该半固化片的机械强度。优选地,该补强材亦可选择性经由硅烷偶合剂进行预处理。
在一个优选实施方式中,所述半固化片为低流胶的半固化片(low flowprepreg)。
举例而言,本发明各实施方式的树脂组合物可制成积层板(laminate,又称覆铜板,例如铜箔基板),其包含二层金属箔层及一层绝缘层(例如前述层状物),该绝缘层设置于该等金属箔之间,且该绝缘层可由前述树脂组合物在高温、高压下所固化而成,可适用的固化温度例如介于150℃至230℃之间。所述绝缘层可为前述半固化片或树脂膜;该金属箔的材质可为铜、铝、镍、铂、银、金或其合金,例如铜箔。
举例而言,本发明各实施方式的树脂组合物可制成软硬结合板(rigid-flexboard)。方式可为例如将软硬结合板与软板结合、软硬结合板与硬板结合、将软硬结合板的两面分别与软板及硬板结合等。举例而言,将低流胶的半固化片裁切成适用的形状及大小,以双面线路软板、低流胶的半固化片的顺序,或以双面线路软板、薄膜(例如覆盖膜(coverlayer),或粘合剂膜(adhesive film)加聚醯亚胺膜)、低流胶的半固化片的顺序,或以单面软板、低流胶的半固化片(单面软板的不含铜箔面和低流胶的半固化片接触)的顺序,或以硬性铜箔基板、低流胶的半固化片的顺序等四种方法叠合。根据前述任一种或一种以上的叠合方法进行排列组合,再以温度介于150℃至230℃之间在真空条件下进行高温高压的固化程序,得到所需的软硬结合板。
在一个实施方式中,所述软硬结合板可再进一步经由线路制备加工后制成印刷电路板。举例而言,印刷电路板的制造方法可使用熟知的制作软硬结合板的印刷电路板制作方法。
以下例示说明各类由本发明所述的树脂组合物制得的产品或待测样品及其制造方法。
半固化片:分别选用下述实施例的树脂组合物及下述对比实施例的树脂组合物,将各树脂组合物均匀混合后形成成胶(varnish),将成胶置入含浸槽中,再将玻璃纤维布(使用1080的E-玻璃纤维布(E-glass fiber fabric),购自Asahi公司)浸入上述含浸槽中,使树脂组合物附着在玻璃纤维布上,再在180℃下加热烘烤约4分钟,得到半固化片。
铜箔基板(5-ply,即五层的积层板):准备两张厚度为18微米的铜箔以及五张各待测样品所制得的半固化片,每一张半固化片的树脂含量约60%,依铜箔、五片半固化片及铜箔的顺序进行叠合,在真空条件、压力30kgf/cm2、190℃下压合1.5小时形成铜箔基板。其中,五张相互叠合的半固化片固化形成两铜箔间的绝缘层,绝缘层的树脂含量约60%。
不含铜基板(五层):将上述铜箔基板经蚀刻去除两铜箔,以获得不含铜基板(五层),该不含铜基板(五层)由五片半固化片所压合而成,不含铜基板(五层)的树脂含量约60%。
软硬结合板1:取一张双面线路软板(购自律胜材料的产品PDTL7123250)、一张覆盖膜(购自台虹保胶材料的产品FHK0525)、一张低流胶的半固化片、一张硬性铜箔基板(台光电子材料股份有限公司生产的EM-285铜箔基板),以双面线路软板、覆盖膜、低流胶的半固化片、硬性铜箔基板的顺序,在真空状态下,190℃及压力条件30kgf/cm2下压合1.5小时形成软硬结合板1。
软硬结合板2:取一张单面软板(购自长捷士的产品20RL810)、一张低流胶的半固化片、一张硬性铜箔基板(EM-285铜箔基板),以单面线路软板(以不含铜箔面和低流胶的半固化片接触)、低流胶的半固化片、硬性铜箔基板的顺序,在真空状态下,190℃及压力条件30kgf/cm2下压合1.5小时形成软硬结合板2。
特性说明
本发明所述的树脂组合物及各类由其制成的制品,例如半固化片、积层板、印刷电路板或软硬结合板,可达成以下所列一种、多种或全部理想特性:
低流胶量:例如其流胶量小于或等于60密耳,优选小于或等于50、40、30、25、20或16密耳,例如介于15及60密耳之间。一般而言,低流胶量的树脂组合物适合应用于软硬结合板,高流胶量的树脂组合物则相对较不适用于软硬结合板。
成胶兼容性及成胶稳定性高:树脂组合物在搅拌后放置于室温下静置12小时后不发生分层,且未形成颗粒状团聚,即肉眼无法观察到直径大于1mm的颗粒。一般而言,成胶兼容性不佳时,会造成分层的现象,若将玻璃纤维布含浸于易发生分层现象的成胶后压合成铜箔基板,将容易发生基板层间剥离及基板质量不稳定的现象;另一方面,成胶稳定性不佳时,会有成胶团聚的现象,将玻璃纤维布含浸于已发生团聚的成胶,会造成半固化片表面胶液分布不均匀,无法加工制成产品或良率较低。
低掉屑量(dust weight loss):例如掉屑量小于或等于0.3%,优选小于或等于0.2%、0.15%、0.10%或0.09%,例如介于0.09%及0.3%之间,优选为0.09%及0.2%之间。一般而言,掉屑超过0.3%时代表掉屑情形严重,造成电路板表面的电路图案污染,进而影响压合后产品的质量及良率。熟知的低流胶的半固化片常有掉屑量大的缺点,若进行电路板钻孔后将此等产品用于后端制程及压合时,会因掉屑问题而导致电路图案污染,易造成线路不正常连结而发生短路,或电路板增层时产生不平整,增加了成品的报废率。
高温剥离强度高:例如在280℃下参考IPC-TM-650 2.4.8所述的方法测量而得到的剥离强度大于或等于5.0lb/in,优选大于或等于5.3lb/in或5.5lb/in,例如介于5.0lb/in及6.0lb/in之间。一般而言,铜箔与基板绝缘层间在高温下剥离强度小于5lb/in的铜箔基板,在将电子组件以高温焊接至电路板时,焊垫(pad)脱落的机率较高,容易导致制成品良率降低。高温剥离强度大于5.0lb/in的实施例中,在将电子组件焊上电路板时焊垫脱落机率低、制成品良率高。
室温剥离强度高:例如在室温(约25℃)下参考IPC-TM-650 2.4.8所述的方法测量而得到的剥离强度大于或等于6.8lb/in,优选大于或等于7.0lb/in、7.2lb/in、7.4lb/in或7.5lb/in,例如介于6.8lb/in及7.8lb/in之间。
吸湿率低:例如在室温下参考IPC-TM-650 2.6.2.1a所述的方法测量而得到的吸水率小于或等于0.1%,优选小于或等于0.09%或0.08%,例如介于0.08%及0.1%之间。一般而言,基板含水率增加会造成基板吸湿后高温层间剥离机率提高、降低基板耐热性及电性变差。
制成的半固化片满足以下特性:以压力1452±70kgf/16in2的条件进行热压后,参考IPC-TM-650 2.3.17.2所述的方法测量而得到的流胶量小于或等于25密耳;且掉屑量小于或等于0.2%。
制成的积层板满足以下特性:在280℃下参考IPC-TM-650 2.4.8所述的方法测量而得到的剥离强度大于或等于5.3lb/in;在室温下参考IPC-TM-6502.4.8所述的方法测量而得到的剥离强度大于或等于6.8lb/in;和/或在室温下参考IPC-TM-650 2.6.2.1a所述的方法测量而得到的吸水率小于或等于0.1%。
有别于熟知采用不同组成成分或配比的树脂组合物,本发明涵盖可达成前述任一种、任两种或多种的组合或是前述全部特性的树脂组合物及其制品,因而更能满足业界的需求。
实施例
采用以下来源的各种原料,依照表1及表2的用量分别调配本发明实施例及本发明对比实施例的树脂组合物,并进一步制作成各类测试样本。
甲酚酚醛型环氧树脂(cresol novolac epoxy resin):产品名N-680,购自大日本油墨(D.I.C.)。
苯酚酚醛型环氧树脂(phenolic novolac epoxy resin):产品名PNE-177,购自长春人造树脂。
双酚A酚醛环氧树脂(bisphenol A novolac epoxy resin):产品名BNE-200,购自长春人造树脂。
DOPO-HQ型环氧树脂(DOPO-HQ epoxy resin):购自晋一化工股份有限公司。
低分子量聚醚胺(low-Mw polyetheramine):产品名D-400,重均分子量=430,购自Huntsman公司。
高分子量聚醚胺(high-Mw polyetheramine):产品名D-2010,重均分子量=2000,购自Huntsman公司。
DDS:二胺基二苯砜,购自Atul LTD公司。
DICY:双氰胺,购自勤裕有限公司(Kingyorker Enterprise Co.Ltd)。
ODA:4,4'-二胺基二苯醚,购自Sigma-Aldrich公司。
苯酚酚醛树脂(phenol-novolac):产品名TD-2090,购自DIC股份有限公司(DICCorporation)。
CTBN:端羧基丁二烯-丙烯腈共聚物,产品名1072CGX,购自ZEON CHEMICALS。
ATBN:端氨基丁二烯-丙烯腈共聚物,产品名1300X45,购自CVC ThermosetSpecialties。
苯氧树脂(phenoxy resin):产品名YP50S,购自新日铁化学。
2-MI:2-甲基咪唑,购自Sigma-Aldrich公司。
Silica:熔融二氧化硅,产品名525,购自硅比科。
DMAC:二甲基乙酰胺(dimethylacetamide)。
表1实施例树脂组合物的组成(单位:重量份)
表2对比实施例树脂组合物的组成(单位:重量份)
各特性的测试方法说明如下。
成胶兼容性:将树脂组合物依实施例或对比实施例所示比例均匀混合后充分搅拌形成成胶,将充分搅拌后的成胶放至于室温(约25℃)下静置12小时后,人员目视观察成胶分层状况,若成胶均匀未出现分层现象,判定为兼容,若成胶出现分层现象,则判定为分层。
成胶稳定性:将树脂组合物依实施例或对比实施例所示比例均匀混合后充分搅拌形成成胶,以肉眼观察成胶是否有颗粒状团聚(颗粒直径约大于或等于1mm)。
流胶量(flow in):取4in.×4in.半固化片3片,并利用手动冲模机冲出2个直径为25mm的圆孔,将冲孔后的半固化片,参考IPC-TM-650 2.3.17.2标准的定义,依“钢板/离形膜/缓冲材/离形膜/三片半固化片/15密耳基板/钢板”的顺序叠合后,以温度171±3℃,压力1452±70kgf/16in2的条件热压5分钟,将热压后样品放置在流胶量测量***(ResinFlow Analysis System,型号SP-IMSV7,购自三朋仪器股份有限公司)上测量流胶量。在流胶量测量中,未详述的测量条件可参考IPC-TM-650 2.3.17.2所述标准。
掉屑量:将半固化片裁成长宽尺寸为10cm×10cm大小,先秤其重量为W0,使用刀片将半固化片以每刀9cm长度,垂直于半固化片同一特定边,平行裁切30刀,再以2次/秒的频率,手部振幅约10cm,上下甩动50次后重新秤重,秤得重量为W1,以公式(掉屑量(%)=(W0-W1)/W0×100%)计算得出掉屑量,重复4次前述步骤及测量后取其平均值。
室温剥离强度(室温P/S):将铜箔基板(五层)裁成宽度为24mm长度大于60mm的长方形样本,并将表面铜箔蚀刻,仅留宽度为3.18mm和长度大于60mm的长条形铜箔,利用万能拉伸强度试验机,在常温下(约25℃)依IPC-TM-650 2.4.8所述方法进行测量,测出将铜箔拉离基板表面所需的力量大小(lb/in)。
高温剥离强度(高温P/S):将铜箔基板(五层)裁成宽度为24mm长度大于或等于60mm的长方形样本,并将表面铜箔蚀刻,仅留宽度为3.18mm和长度大于或等于60mm的长条形铜箔,利用万能拉伸强度试验机(购自岛津),测试方法参考IPC-TM-650 2.4.8所述的方法,差别在于高温基板对铜箔剥离强度的测试进一步使用密闭式高温炉(购自岛津)加热万能拉伸强度试验机的剥离强度测试套件与基板至280℃,使基板与周围环境温度皆为280℃,再测量将铜箔拉离基板表面所须的力量大小(lb/in)。
吸水率:取长宽尺寸为2in.×2in.不含铜基板(五层),放入105±10℃烘箱内烘烤1小时后取出,于室温(约25℃)冷却10分钟后秤得不含铜基板重量为W1,于室温将基板放入纯水中浸泡24小时后取出基板并将表面残留的水擦干,擦干后秤得重量为吸水后不含铜基板重量W2,由公式(吸水率(%)=(W2-W1)/W1×100%)计算得出吸水率。在吸水率测量中,未详述的测量条件可参考IPC-TM-650 2.6.2.1a所述标准。
测试结果如下表3及表4所示。
表3实施例的特性测试结果
表4对比实施例的特性测试结果
对照表1至表4可观察到以下现象。
观察实施例E1和对比实施例C1可知,使用高分子量聚醚胺作为硬化剂,搭配环氧树脂及端氨基丁腈橡胶使用,相较于低分子量聚醚胺,可达到较佳的成胶稳定性,制成半固化片时有较少的掉屑量,且制成不含铜基板时具有吸水率低的优点。
观察实施例E1和对比实施例C2至C4可知,使用高分子量聚醚胺作为硬化剂,搭配环氧树脂及端氨基丁腈橡胶使用,相较于采用聚醚胺以外的其他胺类硬化剂或酚类硬化剂,可达到较佳的成胶稳定性,制成半固化片时有较少的掉屑量,制成基板时具有良好的室温及高温铜箔剥离强度,且制成不含铜基板时具有吸水率低的优点,而低含水率能有效避免因基板含水所造成吸湿后高温层间剥离机率增加的问题。
观察实施例E1和对比实施例C9至C10可知,使用ATBN作为端氨基丁腈橡胶和高分子量聚醚胺及环氧树脂搭配,相较于使用CTBN(其他类丁腈橡胶),成胶具有较佳的兼容性,未出现分层,所制成的半固化片表面均匀,有较低的掉屑量,压合形成基板后也有较佳的铜箔与基板间粘合力。
综合观察各实施例及对比实施例,可知使用环氧树脂搭配高分子量聚醚胺及端氨基丁腈橡胶三者形成树脂组合物,可在保持优选室温剥离强度(例如室温剥离强度在6.8lb/in以上)及高温剥离强度(例如高温剥离强度在5.3lb/in以上)的状况下,达到改善掉屑的效果(例如掉屑量在0.2%以下),并产生低吸水率(例如吸水率在0.1%以下)等优点。
以上实施方式本质上仅为辅助说明,且并不欲用以限制申请目标的实施例或该等实施例的应用或用途。在本文中,用语“例示性”代表“作为一实例、范例或说明”。本文中任一种例示性的实施方式并不必然可解读为相对于其他实施方式而言为优选或较有利者。
此外,尽管已于前述实施方式中提出至少一例示性实施例或对比实施例,但应了解本发明仍可存在大量的变化。同样应了解的是,本文所述的实施例并不欲用以通过任何方式限制所请求的申请目标的范围、用途或组态。相反的,前述实施方式将可提供本领域技术人员一种简便的指引以实施所述的一或多种实施例。再者,可对组件的功能与排列进行各种变化而不脱离权利要求书所界定的范围,且权利要求书包含已知的均等物及在本专利申请案提出申请时的所有可预见均等物。
Claims (16)
1.一种树脂组合物,其包含环氧树脂、高分子量聚醚胺以及端氨基丁腈橡胶。
2.如权利要求1所述的树脂组合物,其包含:100重量份的环氧树脂;5至15重量份的高分子量聚醚胺;以及3至10重量份的端氨基丁腈橡胶。
3.如权利要求1所述的树脂组合物,其中,所述高分子量聚醚胺的重均分子量大于或等于1000。
4.如权利要求1所述的树脂组合物,其中,所述高分子量聚醚胺包括以下结构:
其中,15≤x≤80。
5.如权利要求1所述的树脂组合物,其中,所述端氨基丁腈橡胶包括端氨基丁二烯-丙烯腈共聚物。
6.如权利要求1所述的树脂组合物,其中,所述端氨基丁腈橡胶包括以下结构:
或其组合,
其中,60≤m≤75,且当x及y合计为100%时,x为60%至90%,y为10%至40%。
7.如权利要求1所述的树脂组合物,其进一步包含:胺类硬化剂、苯酚树脂、聚苯醚、聚乙烯醇缩丁醛、聚烯烃、聚酯树脂、苯乙烯马来酸酐、苯并噁嗪树脂、马来酰亚胺、氰酸酯树脂或其组合。
8.如权利要求1所述的树脂组合物,其进一步包含:阻燃剂、无机填料、硬化促进剂、溶剂、硅烷偶合剂或其组合。
9.一种树脂组合物,包含:
100重量份的环氧树脂;
5至15重量份的高分子量聚醚胺;以及
3至10重量份的端氨基丁腈橡胶,其中:
所述高分子量聚醚胺具有以下结构:
25≤x≤50;以及
所述端氨基丁腈橡胶为端氨基丁二烯-丙烯腈共聚物。
10.一种由权利要求1所述的树脂组合物制成的制品,其包括半固化片、积层板、印刷电路板或软硬结合板。
11.如权利要求10所述的制品,其流胶量小于或等于60密耳。
12.如权利要求10所述的制品,其裁切重量损失或掉屑量小于或等于0.3%。
13.如权利要求10所述的制品,其在280℃下参考IPC-TM-650 2.4.8所述的方法测量而得到的剥离强度大于或等于5lb/in。
14.如权利要求10所述的制品,其在室温下参考IPC-TM-650 2.4.8所述的方法测量而得到的剥离强度大于或等于6.8lb/in。
15.如权利要求10所述的制品,其在室温下参考IPC-TM-650 2.6.2.1a所述的方法测量而得到的吸水率小于或等于0.1%。
16.一种用于结合软板及硬板的半固化片,其包含补强材及包覆该补强材的绝缘材料,该绝缘材料由权利要求1所述的树脂组合物经过烘烤至半固化态而制成,其中:
所述半固化片具有以下特性:
以压力1452±70kgf/16in2的条件进行热压后,参考IPC-TM-650 2.3.17.2所述的方法测量而得到的流胶量小于或等于25密耳;以及
裁切重量损失或掉屑量小于或等于0.2%;
由该半固化片所制成的积层板具有以下特性:
在280℃下参考IPC-TM-650 2.4.8所述的方法测量而得到的剥离强度大于或等于5.3lb/in;
在室温下参考IPC-TM-650 2.4.8所述的方法测量而得到的剥离强度大于或等于6.8lb/in;以及
在室温下参考IPC-TM-650 2.6.2.1a所述的方法测量而得到的吸水率小于或等于0.1%。
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008028719A1 (de) * | 2006-09-08 | 2008-03-13 | Henkel Ag & Co. Kgaa | Kleb- oder dichtstoff mit modifizierten anorganischen partikeln |
CN101778901A (zh) * | 2007-08-17 | 2010-07-14 | 陶氏环球技术公司 | 两组成部分的耐碰撞环氧粘合剂 |
CN102432838A (zh) * | 2010-06-24 | 2012-05-02 | 迈图专业化学股份有限公司 | 用于复合材料的改进的环氧树脂体系 |
CN102844397A (zh) * | 2010-03-02 | 2012-12-26 | Sika技术股份公司 | 冲击韧性的室温下固化的双组分结构粘合剂 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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CN101778901A (zh) * | 2007-08-17 | 2010-07-14 | 陶氏环球技术公司 | 两组成部分的耐碰撞环氧粘合剂 |
CN102844397A (zh) * | 2010-03-02 | 2012-12-26 | Sika技术股份公司 | 冲击韧性的室温下固化的双组分结构粘合剂 |
CN102432838A (zh) * | 2010-06-24 | 2012-05-02 | 迈图专业化学股份有限公司 | 用于复合材料的改进的环氧树脂体系 |
Cited By (1)
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