CN107770975A - A kind of anti-corrugation compression methods of PCB - Google Patents
A kind of anti-corrugation compression methods of PCB Download PDFInfo
- Publication number
- CN107770975A CN107770975A CN201711051578.XA CN201711051578A CN107770975A CN 107770975 A CN107770975 A CN 107770975A CN 201711051578 A CN201711051578 A CN 201711051578A CN 107770975 A CN107770975 A CN 107770975A
- Authority
- CN
- China
- Prior art keywords
- pressing
- frame
- fusion
- copper foil
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a kind of anti-corrugation compression methods of PCB, including：Each laminate material lamination pressed needed for pcb board is fixed on the operating desk of pressing machine；The fusion frame for enclosing plank material frame is arranged in the sheet material periphery that lamination is set；On fusion frame surface, prepreg is set；Prepreg is subjected to pre-pressing with merging frame so that the fusion frame height degree after pre-pressing is less than lamination height 0.5mm ~ 1.0mm；Fusion frame after pre-pressing is cooled down by room temperature or refrigerant cools down, promotes prepreg to solidify again；One whole copper foil is laid on the surface of sheet material and fusion frame, and in copper foil surface marking sheet material profile；After pressing, gong plate is carried out along copper foil surface profile, sheet material word fusion inframe is cut into separation, pass through the grid type graphic designs with certain effects, thermal loss is reduced, while increases Area of bearing and avoids copper foil from wrinkling, larger Area of bearing coordinates prepreg while adds the adhesion of corresponding circle of sensation, merge graphics frame to design using copper sheet, avoid corrugation from extending.
Description
Technical field
The present invention relates to pcb board manufacture field, more particularly to a kind of anti-corrugation compression methods of PCB.
Background technology
Pcb board structure is Multi-layer force fit structure, when PCB is pressed, often makes surface copper foil interference, is reserved at sheet edge
Go out a phenomena such as part is avoided because of sheet material breathing, displacement, sheet edge interference part, which is utilized, just generates corresponding circle of sensation
Process, but existing corresponding circle of sensation process is not reasonable, and corresponding circle of sensation wrinkles after causing pressing.Meanwhile because of integration region
Adhesion is poor, and layer is inclined after causing pressing, and very big puzzlement is brought to production.
The content of the invention
To achieve the above object, the present invention adopts the following technical scheme that：A kind of anti-corrugation compression methods of PCB, including it is as follows
Step：
S1：Lamination, each laminate material lamination pressed needed for pcb board is fixed on the operating desk of pressing machine；
S2：Fusion frame is set, the fusion frame for enclosing plank material frame is arranged in the sheet material periphery that lamination is set；
S3：Prepreg is set, prepreg is set on fusion frame surface；
S4：Prepreg is subjected to pre-pressing with merging frame so that the fusion frame height degree after pre-pressing is less than lamination height 0.5mm
~1.0mm；
S5：Cooling, the fusion frame after pre-pressing is cooled down by room temperature or refrigerant cools down, promotes prepreg to solidify again；
S6：Copper foil is laid, one whole copper foil is laid on the surface of sheet material and fusion frame, and in copper foil surface marking sheet material wheel
It is wide；
S7：Carry out process for pressing；
S8：Plate is cut out, after pressing, sheet edge is cut, gong plate is carried out along copper foil surface profile, sheet material word is merged
Inframe cuts separation, completes pcb board laminate fusion.
Further, in the S1 steps, one whole copper foil is laid before lamination in the operating table surface of pressing machine in advance, then
Performing the two-sided pressing of S1-S8 steps production successively has the pcb board of copper foil.
Further, the prepreg in the S3 steps is the nonmetallic materials with PUR property.
Further, the fusion frame surface is wrapped with copper sheet.
The present invention operation principle be：The interlayer sheet material pressed needed for pcb board is cropped neat into rear lamination to pile up in pressing
On the operating desk of machine, fusion frame, fusion block and the prepreg for being arranged on fusion block surface are set gradually in sheet material side, is formed
Corresponding circle of sensation.One whole copper foil is laid in sheet material and corresponding circle of sensation surface, process for pressing is carried out, passes through corresponding circle of sensation prolonging in sheet edge
The effect of stretching so that move to fusion area edge outside the fold that sheet edge is formed originally, keep smooth between sheet material and corresponding circle of sensation.
Sheet material is separated with corresponding circle of sensation finally by cutting, obtaining smooth pressing has the pcb board on copper foil top layer.
Fusion figure is set in corresponding circle of sensation, by the grid type graphic designs with certain effects, reduces thermal loss,
Increasing Area of bearing simultaneously avoids copper foil from wrinkling, and larger Area of bearing coordinates prepreg while adds the combination of corresponding circle of sensation
Power, fusion graphics frame are designed using copper sheet, avoid corrugation from extending.
Beneficial effects of the present invention are：Fusion figure is set in corresponding circle of sensation, passes through the grid type figure with certain effects
Shape designs, and reduces thermal loss, while increases Area of bearing and avoid copper foil from wrinkling, and larger Area of bearing coordinates prepreg same
When add the adhesion of corresponding circle of sensation, fusion graphics frame is designed using copper sheet, avoids corrugation extension.
Embodiment
The anti-corrugation compression methods of a kind of PCB that one embodiment of the invention provides, comprise the following steps：
S1：Lamination, each laminate material lamination pressed needed for pcb board is fixed on the operating desk of pressing machine；
S2：Fusion frame is set, the fusion frame for enclosing plank material frame is arranged in the sheet material periphery that lamination is set；
S3：Prepreg is set, prepreg is set on fusion frame surface；
S4：Prepreg is subjected to pre-pressing with merging frame so that the fusion frame height degree after pre-pressing is less than lamination height 0.5mm
~1.0mm；
S5：Cooling, the fusion frame after pre-pressing is cooled down by room temperature or refrigerant cools down, promotes prepreg to solidify again；
S6：Copper foil is laid, one whole copper foil is laid on the surface of sheet material and fusion frame, and in copper foil surface marking sheet material wheel
It is wide；
S7：Carry out process for pressing；
S8：Plate is cut out, after pressing, sheet edge is cut, gong plate is carried out along copper foil surface profile, sheet material word is merged
Inframe cuts separation, completes pcb board laminate fusion.
Further, in the S1 steps, one whole copper foil is laid before lamination in the operating table surface of pressing machine in advance, then
Performing the two-sided pressing of S1-S8 steps production successively has the pcb board of copper foil.
Further, the prepreg in the S3 steps is the nonmetallic materials with PUR property.
Further, the fusion frame surface is wrapped with copper sheet.
The present invention operation principle be：The interlayer sheet material pressed needed for pcb board is cropped neat into rear lamination to pile up in pressing
On the operating desk of machine, fusion frame, fusion block and the prepreg for being arranged on fusion block surface are set gradually in sheet material side, is formed
Corresponding circle of sensation.One whole copper foil is laid in sheet material and corresponding circle of sensation surface, process for pressing is carried out, passes through corresponding circle of sensation prolonging in sheet edge
The effect of stretching so that move to fusion area edge outside the fold that sheet edge is formed originally, keep smooth between sheet material and corresponding circle of sensation.
Sheet material is separated with corresponding circle of sensation finally by cutting, obtaining smooth pressing has the pcb board on copper foil top layer.
Fusion figure is set in corresponding circle of sensation, by the grid type graphic designs with certain effects, reduces thermal loss,
Increasing Area of bearing simultaneously avoids copper foil from wrinkling, and larger Area of bearing coordinates prepreg while adds the combination of corresponding circle of sensation
Power, fusion graphics frame are designed using copper sheet, avoid corrugation from extending.
Beneficial effects of the present invention are：Fusion figure is set in corresponding circle of sensation, passes through the grid type figure with certain effects
Shape designs, and reduces thermal loss, while increases Area of bearing and avoid copper foil from wrinkling, and larger Area of bearing coordinates prepreg same
When add the adhesion of corresponding circle of sensation, fusion graphics frame is designed using copper sheet, avoids corrugation extension.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (4)
1. a kind of anti-corrugation compression methods of PCB, it is characterised in that comprise the following steps：
S1：Lamination, each laminate material lamination pressed needed for pcb board is fixed on the operating desk of pressing machine；
S2：Fusion frame is set, the fusion frame for enclosing plank material frame is arranged in the sheet material periphery that lamination is set；
S3：Prepreg is set, prepreg is set on fusion frame surface；
S4：Prepreg is subjected to pre-pressing with merging frame so that the fusion frame height degree after pre-pressing is less than lamination height 0.5mm
~1.0mm；
S5：Cooling, the fusion frame after pre-pressing is cooled down by room temperature or refrigerant cools down, promotes prepreg to solidify again；
S6：Copper foil is laid, one whole copper foil is laid on the surface of sheet material and fusion frame, and in copper foil surface marking sheet material wheel
It is wide；
S7：Carry out process for pressing；
S8：Plate is cut out, after pressing, sheet edge is cut, gong plate is carried out along copper foil surface profile, sheet material word is merged
Inframe cuts separation, completes pcb board laminate fusion.
2. the anti-corrugation compression methods of PCB according to claim 1, it is characterised in that：In the S1 steps, exist in advance before lamination
One whole copper foil is laid in the operating table surface of pressing machine, then perform the two-sided pressing of S1-S8 steps production successively to have the PCB of copper foil
Plate.
3. the anti-corrugation compression methods of PCB according to claim 1, it is characterised in that：Prepreg in the S3 steps is
Nonmetallic materials with PUR property.
4. the anti-corrugation compression methods of PCB according to claim 1, it is characterised in that：The fusion frame surface is wrapped with copper sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711051578.XA CN107770975A (en) | 2017-10-31 | 2017-10-31 | A kind of anti-corrugation compression methods of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711051578.XA CN107770975A (en) | 2017-10-31 | 2017-10-31 | A kind of anti-corrugation compression methods of PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107770975A true CN107770975A (en) | 2018-03-06 |
Family
ID=61271422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711051578.XA Pending CN107770975A (en) | 2017-10-31 | 2017-10-31 | A kind of anti-corrugation compression methods of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107770975A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004273531A (en) * | 2003-03-05 | 2004-09-30 | Shinko Electric Ind Co Ltd | Copper-foil composite sheet for printed wiring board and method of manufacturing printed wiring board using the sheet |
| CN105430941A (en) * | 2015-11-02 | 2016-03-23 | 深圳崇达多层线路板有限公司 | Technology for improving thick copper board stitching white edge |
| CN206341474U (en) * | 2016-12-30 | 2017-07-18 | 广合科技（广州）有限公司 | A kind of anti-corrugation PCB layer pressure fusion structure |
-
2017
- 2017-10-31 CN CN201711051578.XA patent/CN107770975A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004273531A (en) * | 2003-03-05 | 2004-09-30 | Shinko Electric Ind Co Ltd | Copper-foil composite sheet for printed wiring board and method of manufacturing printed wiring board using the sheet |
| CN105430941A (en) * | 2015-11-02 | 2016-03-23 | 深圳崇达多层线路板有限公司 | Technology for improving thick copper board stitching white edge |
| CN206341474U (en) * | 2016-12-30 | 2017-07-18 | 广合科技（广州）有限公司 | A kind of anti-corrugation PCB layer pressure fusion structure |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180306 |