CN105430922A - Manufacturing method for embedding metal matrix into printed board - Google Patents
Manufacturing method for embedding metal matrix into printed board Download PDFInfo
- Publication number
- CN105430922A CN105430922A CN201510964698.3A CN201510964698A CN105430922A CN 105430922 A CN105430922 A CN 105430922A CN 201510964698 A CN201510964698 A CN 201510964698A CN 105430922 A CN105430922 A CN 105430922A
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- CN
- China
- Prior art keywords
- printed board
- metal substrate
- metal
- groove
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to a manufacturing method for embedding a metal matrix into a printed board. The manufacturing method comprises the steps of (1) finishing circuit manufacturing on a line layer needing to be laminated; (2) obtaining an outline of the metal matrix needing to be embedded in a milling or punching manner; (3) forming a corresponding embedded groove in the printed board according to the outline and the size of the metal matrix in a milling or punching manner; (4) embedding the metal matrix into the embedded groove of the printed board; and (5) laminating the circuit layer and the printed board embedded with the metal matrix together by using prepreg. The manufacturing method reduces the lamination times and reduces the moulding of the prepreg without controlling the milling groove depth; and in addition, simple product manufacturing, higher efficiency and better quality are realized.
Description
Technical field
The invention belongs to metal-base printed wiring board manufacture technology field, be specifically related to a kind of manufacture method of printed board metal inlaying base.
Background technology
Embedded with metal base is the local heat sinking function in order to increase printed board, is generally in traditional FR4 printed board, be bumped into copper billet or aluminium block (also can be other materials).When in manufacturing process, Metal Substrate is bumped into FR4 printed board, need the milling of FR4 substrate empty, retain certain thickness dielectric layer and line layer, again Metal Substrate and prepreg shaping after put in the good groove of gong, by the mode of pressing, metal derby and FR4 printed board are cohered, there is following defect in the method: 1. prepreg needs gong profile; 2. gong groove depth control precision is difficult to reach requirement, is difficult to the thickness requirement of the dielectric layer ensureing Metal Substrate and line layer; 3. need increase pressing number of times.
Summary of the invention
For the deficiency of above-mentioned prior art, the invention provides and a kind ofly reduce pressing number of times, reduce prepreg shaping and the manufacture method without the need to the printed board metal inlaying base that controls gong groove depth.
Object of the present invention is achieved by the following technical programs:
A manufacture method for printed board metal inlaying base, comprising:
(1) by required pressing line layer complete circuit make;
(2) gong goes out or goes out the profile of the Metal Substrate that need be bumped into;
(3) go out according to the profile of Metal Substrate and size gong in printed board or go out corresponding caulking groove;
(4) Metal Substrate is bumped in the caulking groove of printed board;
(5) prepreg is utilized line layer and the printed board being inlaid with Metal Substrate to be pressed together.
Further, the groove width 0.1 ~ 0.2mm larger than the every limit of the size of Metal Substrate of described printed board upper embedded groove, and four of described caulking groove angles are chamfering, four angles of described Metal Substrate are right angle; After Metal Substrate is bumped into caulking groove, four right angles of Metal Substrate and four chamferings of caulking groove tangent.
Further, the groove width of described printed board upper embedded groove 0.15mm larger than the every limit of the size of Metal Substrate.
Further, the thickness of described Metal Substrate and the consistency of thickness of printed board.
Further, the circuit of described line layer makes, and can make, also can make for multilayer line for single or double.
Compared with prior art, tool of the present invention has the following advantages: decrease pressing number of times, decreases the shaping of prepreg, and without the need to controlling gong groove depth, production is simple, efficiency is higher, quality is better.
Accompanying drawing explanation
Fig. 1 is the structural representation that in the present invention, Metal Substrate is bumped into printed board upper embedded groove.
Fig. 2 utilizes prepreg that the structural representation of pressing is carried out in line layer and the printed board being inlaid with Metal Substrate in the present invention.
Embodiment
The embodiment provided below in conjunction with accompanying drawing is described in further detail the present invention.
As depicted in figs. 1 and 2, a kind of manufacture method of printed board metal inlaying base, comprising:
(1) by required pressing line layer 1 complete circuit make;
(2) gong goes out or goes out the profile of the Metal Substrate 2 that need be bumped into;
(3) go out according to the profile of Metal Substrate 2 and size gong in printed board 3 or go out corresponding caulking groove 31;
(4) Metal Substrate 2 is bumped in the caulking groove 31 of printed board 3;
(5) prepreg 4 is utilized line layer 1 and the printed board 3 being inlaid with Metal Substrate 2 to be pressed together.During pressing, prepreg 4, between line layer 1 and printed board 3, by prepreg 4 polymerization reaction take place generation solid polymer at high temperature under high pressure, thus makes line layer 1 be bonded together with the printed board 3 being inlaid with Metal Substrate 2.
Further, the thickness of Metal Substrate 2 and the consistency of thickness of printed board 3, the groove width 0.1 ~ 0.2mm larger than the every limit of the size of Metal Substrate 2 of printed board 3 upper embedded groove 31, preferred value is 0.15mm.And four of caulking groove 31 angles are chamfering, four angles of Metal Substrate 2 are right angle.After Metal Substrate 2 is bumped into caulking groove 31, four right angles of Metal Substrate 2 and four chamferings of caulking groove 31 tangent, to make gap between Metal Substrate 2 and caulking groove wall even, the gap after such pressing could meet filler requirement.
Further, the circuit of line layer 1 makes, and can make, also can make for multilayer line for single or double.
As described above, be only preferred embodiment of the present invention, when not limiting scope of the invention process with this, the simple equivalence namely generally done according to the present patent application the scope of the claims and invention description content changes and modifies, and all still remains within the scope of the patent.
Claims (5)
1. a manufacture method for printed board metal inlaying base, is characterized in that, comprising:
(1) by required pressing line layer complete circuit make;
(2) gong goes out or goes out the profile of the Metal Substrate that need be bumped into;
(3) go out according to the profile of Metal Substrate and size gong in printed board or go out corresponding caulking groove;
(4) Metal Substrate is bumped in the caulking groove of printed board;
(5) prepreg is utilized line layer and the printed board being inlaid with Metal Substrate to be pressed together.
2. the manufacture method of a kind of printed board metal inlaying base according to claim 1, it is characterized in that: the groove width 0.1 ~ 0.2mm larger than the every limit of the size of Metal Substrate of described printed board upper embedded groove, and four of described caulking groove angles are chamfering, four angles of described Metal Substrate are right angle; After Metal Substrate is bumped into caulking groove, four right angles of Metal Substrate and four chamferings of caulking groove tangent.
3. the manufacture method of a kind of printed board metal inlaying base according to claim 2, is characterized in that: the groove width 0.15mm larger than the every limit of the size of Metal Substrate of described printed board upper embedded groove.
4. the manufacture method of a kind of printed board metal inlaying base according to claim 2, is characterized in that: the thickness of described Metal Substrate and the consistency of thickness of printed board.
5. the manufacture method of a kind of printed board metal inlaying base according to claim 1, is characterized in that: the circuit of described line layer makes, and can make, also can make for multilayer line for single or double.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510964698.3A CN105430922B (en) | 2015-12-18 | 2015-12-18 | A kind of production method of printed board metal inlaying base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510964698.3A CN105430922B (en) | 2015-12-18 | 2015-12-18 | A kind of production method of printed board metal inlaying base |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105430922A true CN105430922A (en) | 2016-03-23 |
| CN105430922B CN105430922B (en) | 2018-12-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510964698.3A Active CN105430922B (en) | 2015-12-18 | 2015-12-18 | A kind of production method of printed board metal inlaying base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105430922B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106132089A (en) * | 2016-06-30 | 2016-11-16 | 景旺电子科技(龙川)有限公司 | A kind of printed wiring board buries copper billet method |
| CN108055766A (en) * | 2018-01-16 | 2018-05-18 | 生益电子股份有限公司 | A kind of PCB and its manufacturing method |
| CN108055765A (en) * | 2018-01-16 | 2018-05-18 | 生益电子股份有限公司 | The manufacturing method and PCB of a kind of PCB |
| CN108184308A (en) * | 2018-01-16 | 2018-06-19 | 生益电子股份有限公司 | The manufacturing method and PCB of a kind of PCB |
| CN109390648A (en) * | 2018-09-10 | 2019-02-26 | 中国电子科技集团公司第二十九研究所 | A kind of encapsulating structure and method of Multi-channel microwave-light transition components |
| CN112752389A (en) * | 2019-10-30 | 2021-05-04 | 无锡深南电路有限公司 | Copper-embedded printed circuit board and manufacturing method thereof |
| CN114900969A (en) * | 2022-06-01 | 2022-08-12 | 深圳市深联电路有限公司 | Printed circuit board and manufacturing method thereof |
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|---|---|---|---|---|
| US20020004124A1 (en) * | 2000-07-07 | 2002-01-10 | Yutaka Hirasawa | Copper foil circuit with a carrier, method for manufacturing printed wiring board using the same, and printed wiring board |
| CN201789685U (en) * | 2010-08-25 | 2011-04-06 | 深圳中富电路有限公司 | Copper block for board embedded with same |
| CN102123560A (en) * | 2011-03-01 | 2011-07-13 | 梅州博敏电子有限公司 | Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof |
| CN103781283A (en) * | 2012-10-19 | 2014-05-07 | 先丰通讯股份有限公司 | Circuit-board manufacturing method |
| CN104853523A (en) * | 2015-05-18 | 2015-08-19 | 惠州市金百泽电路科技有限公司 | Buried and embedded copper block PCB manufacturing method |
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2015
- 2015-12-18 CN CN201510964698.3A patent/CN105430922B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020004124A1 (en) * | 2000-07-07 | 2002-01-10 | Yutaka Hirasawa | Copper foil circuit with a carrier, method for manufacturing printed wiring board using the same, and printed wiring board |
| CN201789685U (en) * | 2010-08-25 | 2011-04-06 | 深圳中富电路有限公司 | Copper block for board embedded with same |
| CN102123560A (en) * | 2011-03-01 | 2011-07-13 | 梅州博敏电子有限公司 | Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof |
| CN102123560B (en) * | 2011-03-01 | 2012-10-03 | 博敏电子股份有限公司 | Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof |
| CN103781283A (en) * | 2012-10-19 | 2014-05-07 | 先丰通讯股份有限公司 | Circuit-board manufacturing method |
| CN104853523A (en) * | 2015-05-18 | 2015-08-19 | 惠州市金百泽电路科技有限公司 | Buried and embedded copper block PCB manufacturing method |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106132089A (en) * | 2016-06-30 | 2016-11-16 | 景旺电子科技(龙川)有限公司 | A kind of printed wiring board buries copper billet method |
| CN106132089B (en) * | 2016-06-30 | 2018-11-20 | 景旺电子科技(龙川)有限公司 | A kind of printed wiring board buries copper billet method |
| CN108055766A (en) * | 2018-01-16 | 2018-05-18 | 生益电子股份有限公司 | A kind of PCB and its manufacturing method |
| CN108055765A (en) * | 2018-01-16 | 2018-05-18 | 生益电子股份有限公司 | The manufacturing method and PCB of a kind of PCB |
| CN108184308A (en) * | 2018-01-16 | 2018-06-19 | 生益电子股份有限公司 | The manufacturing method and PCB of a kind of PCB |
| CN108184308B (en) * | 2018-01-16 | 2020-06-26 | 生益电子股份有限公司 | PCB manufacturing method and PCB |
| CN109390648A (en) * | 2018-09-10 | 2019-02-26 | 中国电子科技集团公司第二十九研究所 | A kind of encapsulating structure and method of Multi-channel microwave-light transition components |
| CN109390648B (en) * | 2018-09-10 | 2020-09-29 | 中国电子科技集团公司第二十九研究所 | Packaging structure and method of multichannel microwave-optical conversion assembly |
| CN112752389A (en) * | 2019-10-30 | 2021-05-04 | 无锡深南电路有限公司 | Copper-embedded printed circuit board and manufacturing method thereof |
| CN114900969A (en) * | 2022-06-01 | 2022-08-12 | 深圳市深联电路有限公司 | Printed circuit board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105430922B (en) | 2018-12-11 |
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