CN205266012U - Copper base copper clad laminate drilling copper basilar part drapes over one's shoulders lamination at peak structure is improved - Google Patents
Copper base copper clad laminate drilling copper basilar part drapes over one's shoulders lamination at peak structure is improved Download PDFInfo
- Publication number
- CN205266012U CN205266012U CN201521071607.5U CN201521071607U CN205266012U CN 205266012 U CN205266012 U CN 205266012U CN 201521071607 U CN201521071607 U CN 201521071607U CN 205266012 U CN205266012 U CN 205266012U
- Authority
- CN
- China
- Prior art keywords
- copper
- paper
- copper base
- range
- clad laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model relates to a copper base copper clad laminate drilling copper basilar part drapes over one's shoulders lamination at peak structure is improved, including the range upon range of smooth aluminum plate who is in the same place, paper apron, paper gasket board and copper base plate four layers plate body, the range upon range of order top -down of this four layers plate body is in proper order: paper apron + copper base plate + light aluminum plate + paper gasket board. It adopt to fill up the operation of light aluminum plate, stacks up light aluminum plate, paper apron, paper gasket board with range upon range of mode in the copper substrate surface promptly before drilling, can effectively improve the problem that copper base copper clad laminate drilling copper basilar part draped over one's shoulders the peak to can retrieve after light aluminum plate uses up, can not increase the material cost, consequently not only improve production efficiency but also practiced thrift the cost.
Description
Technical field
The utility model belongs to printed wiring board manufacture technology field, is specifically related to one and improves copper baseThe laminate structure of copper-clad laminate (abbreviation copper base) boring copper basal part peak.
Background technology
Along with the fast development of current electron trade, the competition in industry is more and more fierce, major partHigh-end customer is all towards high-power plate development, and copper base generally all can be served as the first-selection of high-power plateMaterial, high because copper base has density, the hot bearing capacity of substrate self is strong, heat radiation, heat conduction effectThe feature that fruit is good. But copper base can cause copper basal part to have peak in Drilling operation process, and drapes over one's shouldersPeak must use abrasive band could grind totally, and after nog plate, peak is very easily rolled in hole, is difficult to cleaning,Waste time and energy. In industry, generally all can select diamond coating to bore to chew for solution boring peak problem addsWork, to reduce peak, but diamond coating bores that to chew cost high, and the 6-7 chewing for common brill is doubly.
Utility model content
For the deficiency of above-mentioned prior art, the utility model provides one can effectively improve copperThe laminate structure of base copper-clad laminate boring copper basal part peak.
The purpose of this utility model is achieved by the following technical programs:
A laminate structure of improving copper base copper-clad laminate boring copper basal part peak, comprises layerThe light aluminium sheet, paper cover plate, Paper baseplate and the copper base four laminate bodies that stack, this four laminates bodyLamination order is followed successively by from top to bottom: paper cover plate+copper base+light aluminium sheet+Paper baseplate.
Further, the thickness of described smooth aluminium sheet is 0.6mm.
Compared with prior art, the beneficial effects of the utility model are: the utility model adopts pad lightAluminium sheet operation, before boring in copper base surface with stacked mode pad glazing aluminium sheet, paper cover plate,Paper baseplate, can effectively improve the problem of copper base copper-clad laminate boring copper basal part peak, andAfter light aluminium sheet is finished, can reclaim, can not increase Material Cost, therefore not only improved production efficiency but alsoSave cost.
Brief description of the drawings
Fig. 1 is copper base boring laminate structure schematic diagram in the utility model.
Detailed description of the invention
The embodiment providing below in conjunction with accompanying drawing does further to say in detail to the utility modelBright.
As shown in Figure 1, a kind ofly improve the folded of copper base copper-clad laminate boring copper basal part peakPlate structure, comprises light aluminium sheet 1 stacked together, paper cover plate 2, Paper baseplate 3 and copper base 4 fourLaminate body, the lamination order of this four laminates body is followed successively by from top to bottom: paper cover plate 2+ copper base 4+ lightAluminium sheet 1+ Paper baseplate 3. Preferably, the thickness of light aluminium sheet is 0.6mm.
Principle of the present utility model be before boring in copper base surface with stacked mode pad glazing aluminiumPlate, paper cover plate and Paper baseplate, while boring like this, can effectively improve copper base copper basal part peakProblem.
Claims (2)
1. improve a laminate structure for copper base copper-clad laminate boring copper basal part peak, its spyLevy and be, comprise light aluminium sheet stacked together, paper cover plate, Paper baseplate and copper base four laminate bodies,The lamination order of this four laminates body is followed successively by from top to bottom: paper cover plate+copper base+light aluminium sheet+paper washerPlate.
2. one is improved copper base copper-clad laminate boring copper basal part and is draped over one's shoulders according to claim 1The laminate structure at peak, is characterized in that: the thickness of described smooth aluminium sheet is 0.6mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201521071607.5U CN205266012U (en) | 2015-12-18 | 2015-12-18 | Copper base copper clad laminate drilling copper basilar part drapes over one's shoulders lamination at peak structure is improved |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201521071607.5U CN205266012U (en) | 2015-12-18 | 2015-12-18 | Copper base copper clad laminate drilling copper basilar part drapes over one's shoulders lamination at peak structure is improved |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205266012U true CN205266012U (en) | 2016-05-25 |
Family
ID=56007509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201521071607.5U Active CN205266012U (en) | 2015-12-18 | 2015-12-18 | Copper base copper clad laminate drilling copper basilar part drapes over one's shoulders lamination at peak structure is improved |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN205266012U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107580417A (en) * | 2017-08-30 | 2018-01-12 | 奥士康精密电路(惠州)有限公司 | Copper-based plate hole prints mechanical lapping minimizing technology |
-
2015
- 2015-12-18 CN CN201521071607.5U patent/CN205266012U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107580417A (en) * | 2017-08-30 | 2018-01-12 | 奥士康精密电路(惠州)有限公司 | Copper-based plate hole prints mechanical lapping minimizing technology |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN203618240U (en) | Gasket for pressing stepped printed circuit board | |
CN102686029A (en) | Method for manufacturing blind slot of circuit board | |
CN106455291B (en) | A kind of copper-based printed board structure of high-cooling property metal and preparation method thereof | |
CN203446104U (en) | Insulating thermal conductive substrate | |
CN205266012U (en) | Copper base copper clad laminate drilling copper basilar part drapes over one's shoulders lamination at peak structure is improved | |
CN203562277U (en) | Reactor with graphene coatings | |
CN102407626B (en) | Pressing technology of aluminum base copper-clad plate | |
CN105916291B (en) | A kind of production method of high-density interconnected printed circuit board | |
CN103987211A (en) | Efficient cooling aluminum substrate based on enlarged aluminum-based face and manufacturing method thereof | |
CN211352967U (en) | Wireless shielding piece that charges | |
CN206775824U (en) | Thermoelectricity separates metal substrate | |
CN203984767U (en) | A kind of high capacity aluminum-based circuit board | |
CN207014886U (en) | A kind of heat conduction aluminium nitride substrate | |
CN202835273U (en) | Flexible and super-thin heat conduction aluminum base material | |
CN206341475U (en) | A kind of copper coin structure | |
CN202685435U (en) | Aluminum-based copper-clad laminate (CCL) with high withstand voltage and heat conduction | |
CN203399420U (en) | Auxiliary clamp improving laminating flatness of multilayer thick copper foil circuit board | |
CN202029487U (en) | Novel aluminum-based copper clad laminate lamination and arrangement structure | |
CN105517360B (en) | A method of improving copper-based copper-clad laminate and drills copper-based bottom peak | |
CN202934859U (en) | Electrical steel sheet | |
CN102148082A (en) | Manufacturing methods and equipment of laminated type ceramic electronic element and cover plate layer | |
CN208063576U (en) | A kind of thin plate core plate beats rivet fixture | |
CN206938106U (en) | A kind of copper-clad plate of high heat conduction | |
CN204968230U (en) | Inclined to one side structure of lamination in advance in layer is prevented to circuit board | |
CN204122323U (en) | A kind of gluing baffle arrangement for coating equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |