CN107671690A - A kind of burnishing device and technique of ceramic tile arranged in rows grinding head for polishing - Google Patents
A kind of burnishing device and technique of ceramic tile arranged in rows grinding head for polishing Download PDFInfo
- Publication number
- CN107671690A CN107671690A CN201711014745.3A CN201711014745A CN107671690A CN 107671690 A CN107671690 A CN 107671690A CN 201711014745 A CN201711014745 A CN 201711014745A CN 107671690 A CN107671690 A CN 107671690A
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- China
- Prior art keywords
- ceramic tile
- polishing
- bistrique
- grinding head
- crossbeam
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0092—Grinding attachments for lathes or the like
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The invention discloses a kind of burnishing device and technique of ceramic tile arranged in rows grinding head for polishing, and width of the ceramic tile surface along ceramic tile is divided into several polishing areas, often arranges a polishing area of grinding head polishing ceramic tile.Relative to prior art, moved outside middle homogeneous area, tiles edges are effectively processed, the second non-uniform areas superposition of two neighboring polishing area, the uniformity processing of synthesis ceramic tile whole surface.The transverse beam system of burnishing device includes at least two crossbeams being be arranged in parallel along ceramic tile direction of feed, and grinding head system is at least two groups, sets some bistriques to be used for polished glazed tile on grinding head system.After the above method and device polishing, the Efficient Coverage Rate of bistrique can be increased substantially, effectively reduce leakage and throw and improve ceramic tile surface processing uniformity, it is big to solve prior art processes flow floor space, using equipment is more, grinding tool consumes big, production cost height, leaks technological deficiency and the problems such as throwing, processing uniformity difference.
Description
Technical field
The present invention relates to ceramic tile field, and in particular to a kind of burnishing device and technique of ceramic tile arranged in rows grinding head for polishing.
Background technology
In existing ceramic tile industry mostly based on the ceramic tile of small dimension size, but due to caused by the ceramic tile of small dimension
Pollute it is larger, influenceed to caused by environment it is very big, so the large-sized tile product of development ＆ production is extremely important, and in specification
Breakthrough, can arbitrarily cut sizes during the actual paving of ceramic tile, application is flexible and changeable, and the scope of application is wider；Big chi simultaneously
Very little to mean less seam, the complete style of paving effect highlights that room air is high-end, and the reduction in gap is also more convenient cleaning and beaten
Reason.
The glossing and equipment of the existing big plate of processing ceramic, it is exactly simply to widen ceramic polishing equipment, with reply
The big plate epoch broken with tremendous force.Existing glossing is still using traditional polishing machine, what adobe conveyed on driving belt
Meanwhile bistrique 21 rotates at a high speed and swung with crossbeam, on the one hand the abrading block being installed on bistrique is swung around swing rod, make it
It is in linear contact lay with adobe surface, while is revolved round the sun with mill, with crossbeam swing.The superposition of multiple motions is formed continuously to adobe surface
Attrition process, finally make adobe obtain flat smooth surface.
Single bistrique is as shown in Figure 1 in the machining locus of ceramic tile surface.Ceramic tile 13 transmits to the right, and bistrique 21 is in the table of ceramic tile 13
Face reciprocally swinging, in the big plate of processing ceramic, traditional ceramic tile glossing and equipment will highlight its defect, and single bistrique 21 is right
Brick face can not effectively be covered, and the region for leaking throwing is increasing, it is necessary to configure more bistriques 21 to increase covering, but simultaneously
Also adobe center section excessive polishing, the length of production line and installed power is caused to be continuously increased.
After brick face is widened, because crossbeam swing stroke lengthens, the frequency and linear velocity of swing can not possibly be improved infinitely, so as to
Cause single line yield reduction, adobe leakage throwing and overground contradiction also more prominent.In addition to it can produce and Lou throw, porcelain can be also produced
The surface of brick 13 polishes the defects of uneven.Existing ceramic polishing mode is that crossbeam swing formula polishes mode, this polishing side
Formula, the inhomogeneities for causing the surface of ceramic tile 13 to polish.The number being polished along among the width ceramic tile 13 of ceramic tile 13 is more than
Edge, and in bistrique 21 in swing process, be bound to form a polishing homogeneous band in the intermediate region of ceramic tile 13.
As shown in Fig. 2 the polished amount of the intermediate region of ceramic tile 13 is more, the polished amount of ceramic tile 13 on both sides is few.And from edge to
Centre is a gradual increased process.Polishing among ceramic tile 13 is more relatively uniform.By the ceramic tile 13 after polishing along width
Direction is divided into three regions：First non-uniform areas 22, the non-uniform areas 24 of middle homogeneous area 23 and second, first is uneven
Even region 22, the second non-uniform areas 24 are the edge non-uniform areas of ceramic tile, and the two region ceramic polishing amounts are few, more past
Edge, polishing number are fewer.Polish uneven.Middle homogeneous area 23 is located at the intermediate region of ceramic tile 13, region polishing time
Number is more, and polishing is relatively uniform.Middle homogeneous area 23 is that best region is polished in whole ceramic tile.
As can be seen from Figure 3, the pattern of a pan is presented in the ceramic tile surface after polishing, and middle low, both sides are high.It is big in polishing
During plate, because amplitude of fluctuation lengthens, swing the frequency and be forced to reduce, leakage is thrown and overground phenomenon is more prominent, the abrading block of same mesh number
Sometimes need the bistrique for configuring more than four just to can guarantee that once to cover, the inhomogeneities polishing that can not also eliminate of big plate surface causes
Pan pattern.
The content of the invention
In order to solve the above-mentioned technical problem, one of the object of the invention is to provide a kind of throwing of ceramic tile arranged in rows grinding head for polishing
Electro-optical device, by the ceramic polishing brick surface process equipment of scientific design, both improve productivity ratio and product quality, and effectively drop
Low energy consumption.For achieving the above object, the technical scheme that the present invention takes is as follows：
A kind of burnishing device of ceramic tile arranged in rows grinding head for polishing, including ceramic tile feed system, the ceramic tile feed system
In frame, length direction feeding of the ceramic tile feed system driving ceramic tile along ceramic tile, burnishing device also includes crossbeam
System and grinding head system, the transverse beam system are arranged in frame, and the transverse beam system includes at least two along ceramic tile feeding side
To the crossbeam be arrangeding in parallel, the grinding head system is at least two groups, and grinding head system described in every group is arranged on a crossbeam,
Some bistriques are set to be used for polished glazed tile on the grinding head system.
Preferably, the quantity of the crossbeam is more than the group number of the grinding head system, and the grinding head system is arranged on adjacent
On the crossbeam.According to the ceramic tile of different specification size, it can realize that bistrique is complete by increasing or decreasing the group number of grinding head system
Mirror polish ceramic tile surface.
Preferably, the transverse beam system also includes weighing support base, cross beam support plate and crossbeam drive system, the crossbeam
Support base includes first crossbeam support base and second cross beam support base, first crossbeam support base and the second cross beam support base point
Not An Zhuan both sides of the frame along ceramic tile direction of feed, the cross beam support plate is installed on the cross beam support seat, it is described
Crossbeam is arranged between two cross beam support plates, and the crossbeam drive system is connected the driving crossbeam pendulum with the crossbeam
It is dynamic.
Preferably, the bottom surface of the cross beam support seat sets sliding equipment to coordinate with the chute in the frame and slided, institute
Sliding equipment is stated as the one or more in slide rail, pulley or crawler belt.
Preferably, the grinding head system includes bistrique motor and bistrique, and some abrading blocks are installed on the bistrique；Every group
Direction of feed of the bistrique along the ceramic tile in the grinding head system is divided into left bistrique group and right bistrique group, the left bistrique
Group and right bistrique group are symmetrical along the circumferential center line of the crossbeam, so design be in order to reduce the deflection deformation of crossbeam,
Make crossbeam load-bearing more uniform.
Preferably, each bistrique connects a bistrique motor.
Preferably, the bistrique and the bistrique motor are all arranged on the crossbeam, the bistrique motor
The direction of installation is parallel, the i.e. feeding in the direction and ceramic tile of bistrique motor and bistrique connection with the direction that ceramic tile is fed
Direction is horizontal, so sets bistrique motor to reduce the width of crossbeam, convenient to install bistrique abrading block, facilitates the dimension of equipment
Shield maintenance, facilitates operation, simple in construction, compact-sized.
Preferably, the bistrique and the bistrique motor are all arranged on the crossbeam, the bistrique motor
The direction of installation is vertical, the i.e. feeding in the direction and ceramic tile of bistrique motor and bistrique connection with the direction that ceramic tile is fed
Direction is vertical, and bistrique motor is protruded from and installed outside crossbeam, so sets bistrique motor to reduce crossbeam
Length.
It is a further object of the present invention to provide a kind of glossing of ceramic tile arranged in rows grinding head for polishing, by ceramic tile surface edge
The width of ceramic tile is divided into several polishing areas, often arranges a polishing area of grinding head polishing ceramic tile.Relative to existing
Technology, middle homogeneous area are moved outside, and tiles edges are effectively processed, and described the second of two neighboring polishing area is uneven
Region is superimposed.Finally, the processing of ceramic tile whole surface uniformity is synthesized.After being polished through the above method, mill can be increased substantially
The Efficient Coverage Rate of head, it can effectively reduce and Lou throw and improve ceramic tile surface processing uniformity, effectively solve prior art processes stream
Journey floor space is big, using equipment is more, grinding tool consumes big, production cost height, leaks technological deficiency and the difficulties such as throwing, processing uniformity difference
Topic.For achieving the above object, the technical scheme that the present invention takes is as follows：
A kind of glossing of ceramic tile arranged in rows grinding head for polishing, comprises the following steps：
(1) width of the machining area of ceramic tile surface along ceramic tile is divided into several polishing areas, the polishing by
Region at least two；
(2) directions of feed of the along ceramic tile uses double or plurality of rows of arrangement mode cloth in the transverse beam system of burnishing device
Put bistrique；
(3) bistriques of the in the transverse beam system is according to rectangle or triangular arrangement；
(4) quantity of polishing area described in is identical with the row of the bistrique, often arranges the bistrique and polishes an institute respectively
Polishing area is stated, the bistrique is often arranged and extends polishing to the fringe region of the adjacent polishing area in polishing.
Preferably, width of the polishing area along ceramic tile after polishing is divided into middle homogeneous area and positioned at centre
The edge non-uniform areas of homogeneous area both sides, the edge non-uniform areas of the two neighboring polishing area are mutually folded
Add.
Relative to prior art, the present invention achieves beneficial technique effect：
The present invention is by using the polishing method and its device of a kind of ceramic tile arranged in rows grinding head for polishing to different size
Adobe surface carries out most economical, maximally effective working process, increases substantially the Efficient Coverage Rate of bistrique, can effectively reduce and Lou throw
And lack of homogeneity phenomenon.It is big effectively to solve prior art processes flow floor space, using equipment is more, grinding tool consumption is big, production
The problems such as cost is high, leakage throwing, processing uniformity difference.Low energy consumption and grinding tool loss are finally reached, improves production efficiency and product matter
Amount, reduce the purpose of production cost.
Brief description of the drawings
Fig. 1 is that existing polishing machine single grinding head processes ceramic tile track；
Fig. 2 is that existing ceramic tile polisher full width swings polishing uniformity schematic diagram；
Fig. 3 is whole ceramic tile surface region polishing rule after the polishing of existing ceramic tile polisher；
Fig. 4 is that bistrique swings polishing uniformity by a small margin on the left of ceramic tile；
Fig. 5 is that bistrique swings polishing uniformity by a small margin on the right side of ceramic tile；
Fig. 6 is superposition schematic diagram of the second non-uniform areas of ceramic tile two side areas in the middle part of ceramic tile；
Fig. 7 is ceramic tile arranged in rows grinding head for polishing polishing principle schematic；
Fig. 8 is a kind of burnishing device top view of ceramic tile arranged in rows grinding head for polishing of embodiment 1；
Fig. 9 is a kind of burnishing device front view of ceramic tile arranged in rows grinding head for polishing of embodiment 1；
Figure 10 is a kind of burnishing device top view of ceramic tile arranged in rows grinding head for polishing of embodiment 2；
Figure 11 is a kind of burnishing device front view of ceramic tile arranged in rows grinding head for polishing of embodiment 2.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to embodiments to the present invention
It is further elaborated, but the scope of protection of present invention is not limited to following specific embodiments.
A purpose of the invention is to provide a kind of burnishing device of ceramic tile arranged in rows grinding head for polishing, passes through scientific design
Ceramic polishing brick surface process equipment, productivity ratio and product quality are both improved, effectively reduces energy consumption again.To realize above-mentioned hair
Improving eyesight, the technical scheme that the present invention takes is as follows：
Embodiment 1：
A kind of burnishing device of ceramic tile arranged in rows grinding head for polishing, including ceramic tile feed system, the installation of ceramic tile feed system
In frame 3, ceramic tile feed system drives length direction feeding of the ceramic tile 13 along ceramic tile 13, and burnishing device also includes transverse beam system
And grinding head system, transverse beam system are arranged in frame 13, transverse beam system be arranged in parallel including at least two along ceramic tile direction of feed
Crossbeam 10 (11), grinding head system is at least two groups, and every group of grinding head system is arranged on 10 (11) on a crossbeam, on grinding head system
Some bistriques 21 are set to be used for polished glazed tile 13.The quantity of crossbeam 10 (11) is more than the group number of grinding head system, and grinding head system is set
On adjacent crossbeam 10 (11).According to the ceramic tile of different specification size, can by increasing or decreasing the group number of grinding head system,
Realize the comprehensive polished glazed tile surface of bistrique.
Ceramic tile feed system is by driven pulley 1, feed belt 2, frame 3, ceramic tile feed change case 14, ceramic tile Feed servo system
Motor 15, shaft coupling 16, driving pulley 17 form.Driven pulley 1 and driving pulley 17 are arranged in frame 3, and ceramic tile feeding becomes
Fast case 14 couples and is fixed together with ceramic tile Feed servo system motor 15, and driving pulley 17 couples ceramic tile by shaft coupling 16 and fed
Gearbox 14.Feed belt 2 is enclosed on driven pulley 1 and driving pulley 17, and ceramic tile 13 is placed on feed belt 2.
Client is according to output it needs to be determined that the feed speed of ceramic tile, starts ceramic tile Feed servo system motor 15, ceramic tile enters
To motor 15 after the speed change of ceramic tile feed change case 14, motion and power are passed into main belt by shaft coupling 16
Wheel 17.Driving pulley 17 will be moved further through feed belt 2 and power is transmitted to driven pulley 1, so as to drive driven pulley 1, master
Movable belt pulley 17 rotates.And then feed belt 2 and the ceramic tile 13 being placed on it is driven to move in parallel.
Transverse beam system also includes weighing support base, cross beam support plate 5 and crossbeam drive system, and cross beam support seat includes first
Cross beam support seat 4 and second cross beam support base 12, first crossbeam support base 4 and second cross beam support base 12 are separately mounted to frame
3 along the both sides of the direction of feed of ceramic tile 13, cross beam support plate 5 are installed on cross beam support seat, crossbeam 10 (11) is arranged on two crossbeams
Between supporting plate 5, crossbeam drive system is connected with crossbeam 10 (11) and drives crossbeam 10 (11) to swing.The bottom surface of cross beam support seat
Set sliding equipment with the chute in frame 3 to coordinate to slide, sliding equipment is the one or more in slide rail, pulley or crawler belt.
Grinding head system includes bistrique motor and bistrique 21, and some abrading blocks are installed on bistrique 21；In every group of grinding head system
Direction of feed of the bistrique 21 along ceramic tile be divided into left bistrique group 18 and right bistrique group 19, left bistrique group 18 and right bistrique group 19 are along horizontal stroke
The circumferential center line of beam 10 (11) is symmetrical, and so design is to reduce the deflection deformation of crossbeam 10 (11), makes crossbeam 10
(11) load-bearing is more uniform.
The grinding head system of the present invention also includes bistrique motor 25, and bistrique 21 and bistrique motor 25 are all arranged on horizontal stroke
On beam 10 (11), direction that bistrique motor 25 is installed is parallel, i.e. bistrique motor with the direction that ceramic tile 13 is fed
25 and the direction of feed of direction and ceramic tile 13 that connects of bistrique 21 it is horizontal, so setting bistrique motor 25 can reduce crossbeam
The width of 10 (11), it is convenient that abrading block is installed, facilitate the maintenance and repair of equipment, facilitate operation, it is simple in construction, it is compact-sized.
The preferable crossbeam 10 (11) of the present embodiment is two, including rear cross beam 10 and front beam 11, rear cross beam 10 and preceding horizontal stroke
Beam 11 has spacing between installing, and this spacing is determined by the specification of processing ceramic tile.Rear cross beam 10 and front beam 11 install and fix
On cross beam support plate 5, the support of cross beam support plate 5 is arranged on first crossbeam support base 4 and second cross beam support base 12.Crossbeam
Drive system includes crossbeam swing motor 20, and crossbeam swing motor 20 is drive on cross beam support plate 5
Rear cross beam 10 and front beam 11 are swung along the sliding equipment on first crossbeam support base 4 and second cross beam support base 12.
It is respectively mounted grinding head system on rear cross beam 10 and front beam 11, the grinding head system on front beam 11 includes left bistrique group
18 and right bistrique group 19.Left bistrique group 18, right bistrique group 19 are symmetrical along the circumferential center line of front beam 11.Left bistrique group 18,
Right bistrique group 19 is driven by bistrique motor, a left side for left bistrique group 18 and right bistrique group 19 processing ceramic tile on front beam 11
Side region, the right side area of the grinding head system processing ceramic tile 13 on rear cross beam 10, the bistrique in polishing process on front beam 11
System is overlapped with burnishing surface of the grinding head system on rear cross beam 10 in the intermediate region of ceramic tile 13.
Embodiment 2：
As shown in FIG. 10 and 11, the embodiment only describes the difference with above-described embodiment, remaining technical characteristic with it is upper
It is identical to state embodiment.Bistrique 21 and bistrique motor 25 are all arranged on crossbeam 10 (11), what bistrique motor 25 was installed
Direction is vertical with the direction that ceramic tile 13 is fed, i.e., the direction that bistrique motor 25 and bistrique 21 connect is entered with ceramic tile 13
Vertical to direction, bistrique motor 25 protrudes to be installed outside crossbeam 10 (11), so sets bistrique motor 25
The length of crossbeam 10 (11) can be reduced.
It is a further object of the present invention to provide a kind of glossing of ceramic tile arranged in rows grinding head for polishing, including following step
Suddenly：
(1) width of the machining area on the surface of ceramic tile 13 along ceramic tile is divided into several polishing areas, the throwing by
Light region at least two；
(2) directions of feed of the along ceramic tile 13 uses double or plurality of rows of arrangement mode in the transverse beam system of burnishing device
Arrange bistrique 21；
(3) bistriques of the in the transverse beam system is according to rectangle or triangular arrangement；
(4) quantity of polishing area described in is identical with the row of the bistrique 21, often arranges the bistrique 21 and polishes one respectively
The individual polishing area, often arrange the bistrique 21 and extend polishing to the fringe region of the adjacent polishing area in polishing.
Width of the polishing area along ceramic tile 13 after polishing is divided into middle homogeneous area 23 and positioned at middle equal
The edge non-uniform areas of the even both sides of region 23, the edge non-uniform areas of the two neighboring polishing area are mutually folded
Add.
As shown in figs. 4-7, it is preferred that glossing scheme comprises the following steps：
(1) width of the machining area on the surface of ceramic tile 13 along ceramic tile 13 is uniformly divided into two by；
(2) directions of feed of the along ceramic tile 13 arranges bistrique in the transverse beam system of burnishing device using double mode；
(3) bistriques 21 of the in the transverse beam system is according to rectangle or triangular arrangement；
(4) two polishing areas in the polishing step of bistriques 21 (1), bistrique 21 is in the left side area of polished glazed tile 13
The fringe region extension polishing of side region to the right during domain；Client adjusts the amplitude of fluctuation of bistrique 21 according to the specification of ceramic tile 13, with
It is that the coverage that bistrique 21 is processed is the half of ceramic tile 13 and covering is another in the region of the half of ceramic tile 13 to ensure bistrique 21
Half fringe region, makes every row's bistrique 21 process the half region of ceramic tile and the fringe region in second half region respectively.
Width of the polishing area along ceramic tile 13 after polishing is inwardly divided into from the edge on the surface of ceramic tile 13
First non-uniform areas 22, the non-uniform areas 24 of middle homogeneous area 23 and second, the first non-uniform areas 22 and second are uneven
Even region 24 is edge non-uniform areas.
Wherein, the step (4) specifically includes：
Step (41) one of which bistrique is processed in the left field along the width of ceramic tile 13.
From the analysis of technical background, bistrique 21 is processed during ceramic tile 13, and bistrique 21 is in the surface of ceramic tile 13 not same district
The polishing number in domain is different, shows that polishing of the bistrique 21 on ceramic tile 13 is uneven.In order to realize the surface of ceramic tile 13
The uniformity of processing, Lou throwing phenomenon is occurred without, of the invention divides polishing method realization equally using ceramic tile.Its principle is as follows：Entirely
It is the most uniformly middle homogeneous area 23 that ceramic tile 13, which polishes, in order to realize the uniformity of the whole brick mirror polish of ceramic tile 13, by Fig. 2
In, middle homogeneous area 23 is moved to the first non-uniform areas 22, the second non-uniform areas 24 when original single bistrique is processed
Position get on.
As shown in figure 4, concretely comprise the following steps：The surface of swing polished glazed tile 13 of the no longer whole range of bistrique 21, but by a small margin
Swing the surface of polished glazed tile 13.Because the amplitude of fluctuation of bistrique 21 is small, can only polished glazed tile 13 left field, therefore, bistrique
Three regions that polished glazed tile surface is formed are swung just to move toward the left side of ceramic tile 13.
One group of bistrique 21 polishes by a small margin in the left side of ceramic tile 13.Middle homogeneous area 23 is just toward the left field of ceramic tile 13
Edge is moved, and is covered the first non-uniform areas 22 during single bistrique processing, is improved the throwing of the edge of ceramic tile 13
Light number and coverage rate, the polishing of the edge of ceramic tile 13 are just more uniform.
Step (42), another group of bistrique are processed in the right side area along the width of ceramic tile 13,
As shown in figure 5, polishing method of another group of bistrique in the right side area of ceramic tile 13 is identical with left field, bistrique
21 realize the by a small margin swing equal with left field in the right side area of ceramic tile 13, realize the movement of middle homogeneous area 23.By
It is small in the amplitude of fluctuation of bistrique 21, can only polished glazed tile 13 right side area, therefore, bistrique 21 swing the surface shape of polished glazed tile 13
Into three regions just toward ceramic tile 13 right side move.Middle homogeneous area 23 is just toward the edge of the right side area of ceramic tile 13
It is mobile, cover the first non-uniform areas 22 during single bistrique processing, improve the edge of ceramic tile 13 polishing number and
Coverage rate, the polishing of the edge of ceramic tile 13 are just more uniform.
Step (43), the second non-uniform areas 24 of left field are superimposed with the second non-uniform areas 24 of right side area：
As shown in Figure 6,7, because the middle homogeneous area 23 of ceramic tile left field and right side area is toward the side of ceramic tile 12
Edge moves, and the edge of ceramic tile 12 realizes uniformity polishing, due to bistrique 21 in the left field of polished glazed tile 12 to the right
The fringe region extension polishing in region, makes edge non-uniform areas all be moved to the middle part of ceramic tile, i.e., ceramic tile left field and
Second non-uniform areas 24 of right side area is all moved to the middle part of ceramic tile 12, realizes two the second non-uniform areas 24 and exists
The superposition at the middle part of ceramic tile 12.
As shown in fig. 6, be the superposition of edge non-uniform areas when bistrique 21 carries out edge polishing at the middle part of ceramic tile 13, superposition
Afterwards, the polished glazed tile 13 at the middle part of ceramic tile 13 and the polishing number in the edge polishing region of ceramic tile 13 are similar.
Ceramic tile using the present invention divides polishing processing method equally, and the uniformity polishing area of ceramic tile surface almost covers whole
Individual surface.The polishing number in tiles edges region is improved, glossiness is high, also reduces and Lou throws, and improves ceramic tile surface polishing
Uniformity.
The announcement and teaching of book according to the above description, those skilled in the art in the invention can also be to above-mentioned embodiment party
Formula is changed and changed.Therefore, the invention is not limited in embodiment disclosed and described above, to the one of invention
A little modifications and changes should also be as falling into the scope of the claims of the present invention.In addition, although used in this specification
Some specific terms, but these terms are merely for convenience of description, do not form any restrictions to invention.
Claims (10)
1. a kind of burnishing device of ceramic tile arranged in rows grinding head for polishing, including ceramic tile feed system, the ceramic tile feed system peace
In frame, length direction feeding of the ceramic tile feed system driving ceramic tile along ceramic tile, it is characterised in that also including crossbeam
System and grinding head system, the transverse beam system are arranged in frame, and the transverse beam system includes at least two along ceramic tile feeding side
To the crossbeam be arrangeding in parallel, the grinding head system is at least two groups, and grinding head system described in every group is arranged on a crossbeam,
Some bistriques are set to be used for polished glazed tile on the grinding head system.
A kind of 2. burnishing device of ceramic tile arranged in rows grinding head for polishing according to claim 1, it is characterised in that the horizontal stroke
The quantity of beam is more than the group number of the grinding head system, and the grinding head system is arranged on the adjacent crossbeam.
A kind of 3. burnishing device of ceramic tile arranged in rows grinding head for polishing according to claim 1, it is characterised in that the horizontal stroke
Girder system system, which also includes measurement support base, cross beam support plate and crossbeam drive system, the cross beam support seat, includes first crossbeam branch
Support seat and second cross beam support base, the first crossbeam support base and second cross beam support base are separately mounted to the frame along porcelain
The both sides of brick direction of feed, the cross beam support plate is installed on the cross beam support seat, the crossbeam is arranged on two horizontal strokes
Between beam supporting plate, the crossbeam drive system is connected the driving crossbeam swing with the crossbeam.
A kind of 4. burnishing device of ceramic tile arranged in rows grinding head for polishing according to claim 3, it is characterised in that the horizontal stroke
The bottom surface of beam support base sets sliding equipment to coordinate with the chute in the frame and slided, and the sliding equipment is slide rail, pulley
Or the one or more in crawler belt.
A kind of 5. burnishing device of ceramic tile arranged in rows grinding head for polishing according to claim 1, it is characterised in that the mill
Head system includes bistrique motor and bistrique, and some abrading blocks are installed on the bistrique；It is described in grinding head system described in every group
Direction of feed of the bistrique along the ceramic tile is divided into left bistrique group and right bistrique group, and the left bistrique group and right bistrique group are along the horizontal stroke
The circumferential center line of beam is symmetrical.
A kind of 6. burnishing device of ceramic tile arranged in rows grinding head for polishing according to claim 5, it is characterised in that Mei Gesuo
State bistrique and all connect a bistrique motor.
A kind of 7. burnishing device of ceramic tile arranged in rows grinding head for polishing according to claim 5 or 6, it is characterised in that institute
State bistrique and the bistrique motor to be all arranged on the crossbeam, the direction of the bistrique motor installation is entered with ceramic tile
The direction given is parallel.
A kind of 8. burnishing device of ceramic tile arranged in rows grinding head for polishing according to claim 5 or 6, it is characterised in that institute
State bistrique and the bistrique motor to be all arranged on the crossbeam, the direction of the bistrique motor installation is entered with ceramic tile
The direction given is vertical.
9. a kind of glossing of ceramic tile arranged in rows grinding head for polishing, it is characterised in that comprise the following steps：
(1) width of the machining area of ceramic tile surface along ceramic tile is divided into several polishing areas, the polishing area by
At least two；
(2) directions of feed of the along ceramic tile is ground in the transverse beam system of burnishing device using double or plurality of rows of arrangement mode arrangement
Head；
(3) bistriques of the in the transverse beam system is according to rectangle or triangular arrangement；
(4) quantity of polishing area described in is identical with the row of the bistrique, often arranges the bistrique and polishes a throwing respectively
Light region, often arrange the bistrique and extend polishing to the fringe region of the adjacent polishing area in polishing.
A kind of 10. glossing of ceramic tile arranged in rows grinding head for polishing according to claim 9, it is characterised in that polishing
Width of the polishing area along ceramic tile afterwards is divided into middle homogeneous area and positioned at the edge of middle homogeneous area both sides
Non-uniform areas, the edge non-uniform areas of the two neighboring polishing area are overlapped mutually.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711014745.3A CN107671690A (en) | 2017-10-26 | 2017-10-26 | A kind of burnishing device and technique of ceramic tile arranged in rows grinding head for polishing |
| PCT/CN2018/100127 WO2019080597A1 (en) | 2017-10-26 | 2018-08-11 | Ceramic tile polishing apparatus having a multiple-row arrangement of polishing abrasive heads, and technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711014745.3A CN107671690A (en) | 2017-10-26 | 2017-10-26 | A kind of burnishing device and technique of ceramic tile arranged in rows grinding head for polishing |
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| Publication Number | Publication Date |
|---|---|
| CN107671690A true CN107671690A (en) | 2018-02-09 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711014745.3A Pending CN107671690A (en) | 2017-10-26 | 2017-10-26 | A kind of burnishing device and technique of ceramic tile arranged in rows grinding head for polishing |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107671690A (en) |
| WO (1) | WO2019080597A1 (en) |
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| Publication number | Publication date |
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| WO2019080597A1 (en) | 2019-05-02 |
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