CN107645829B - Circuit board conductive liquid and preparation method and application thereof - Google Patents
Circuit board conductive liquid and preparation method and application thereof Download PDFInfo
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Abstract
The invention provides a circuit board conductive liquid and a preparation method and application thereof, wherein the circuit board conductive liquid comprises black hole liquid and silver nanowires.
Description
Technical Field
The invention belongs to the field of electroplating, and particularly relates to a circuit board conductive liquid, and a preparation method and application thereof.
Background
With the development of modern electronic devices, in addition to the functions of communication and display of electronic devices, people are always pursuing the value-added properties of lightness, thinness, portability, high strength and high flexibility, i.e. flexible printed electronic devices, which require flexible printed circuit boards to meet the requirements of electronic products on electrical performance, high-density wiring and the like. Wherein, the hole metallization is the heavier of the circuit board technology. At present, the hole metallization process of the flexible printed circuit board has more black hole flows, and has the advantages of simple production process, environmental protection and the like compared with the chemical copper plating process.
The black hole liquid is composed of conductive carbon black, a dispersing agent medium and other auxiliary agents, uniformly and stably dispersed conductive nano particles are obtained through mechanical grinding, and the conductive nano particles are attached to through holes of the circuit board through the adsorption principle. However, the poor conductivity of conductive carbon black limits its practical application to multilayer flexible sheets.
Silver nanowires are more and more concerned in recent years due to high conductivity and wide potential application, compared with materials such as ITO (indium tin oxide), the silver nanowires have better flexibility, and can be used for preparing transparent conductive films and industries such as flexible touch screens and organic light emitting diodes (O L ED).
The conductive liquid in the current market has poor conductivity, the performance of through holes on hole walls is poor, and obvious defects exist in flexible printed circuit boards. Therefore, a new conductive liquid for circuit boards needs to be developed to solve the existing problems.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a circuit board conductive liquid, and a preparation method and application thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, the invention provides a circuit board conductive liquid, which comprises a black hole liquid and silver nanowires.
In the invention, the silver nanowires are added into the black hole liquid to form the circuit board conductive liquid. The silver nanowires have the characteristic of high conductivity, so that the resistance of the black hole liquid is greatly reduced, and the conductive liquid has better conductivity on the hole wall as a whole; in addition, the silver nanowires have good flexibility and a special linear structure, can play a role in bridging in the whole, shorten a conductive path, macroscopically show the characteristic of reducing resistance, and have stable performance in a later electroplating process, so that the obtained product has high backlight level.
In the invention, the black pore liquid comprises the following components in percentage by mass:
preferably, the conductive carbon black is present in an amount of 1% to 5% by mass, and may be, for example, 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, or 5%.
Preferably, the surfactant is one or a combination of at least two of sodium dodecyl benzene sulfonate, sodium dodecyl sulfate, fatty alcohol-polyoxyethylene ether or nonylphenol polyoxyethylene ether, and the mass percentage of the surfactant can be 0.5%, 1%, 1.5%, 2%, 2.5% or 3%.
Preferably, the dispersant is one or a combination of at least two of fatty alcohol polyoxyethylene sulfate, potassium dodecyl phosphate, polyethylene glycol or polyvinylpyrrolidone, and the mass percentage may be 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5% or 5%.
Preferably, the pH regulator is one or a combination of at least two of potassium carbonate, potassium bicarbonate, ammonia water, or ethanolamine, and the mass percentage may be 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, or 5%.
Preferably, the binder is one or a combination of at least two of polyvinyl alcohol, sodium polyacrylate, polyacrylamide or potassium silicate, and the mass percentage may be 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9% or 1%.
Preferably, the dispersion medium is one or a combination of at least two of water, ethylene glycol, isopropanol or acetone, and the mass percentage may be 81%, 83%, 85%, 88%, 90%, 92%, 94% or 96.4%.
In the invention, the black hole liquid is prepared by the following method:
(1) uniformly mixing conductive carbon black, a surfactant, a dispersant, a pH regulator, a binder and a dispersion medium;
(2) and (2) fully grinding the mixture obtained in the step (1) to obtain the black pore liquid.
Preferably, the mixing time in step (1) is 1-2 hours, and may be, for example, 1 hour, 1.2 hours, 1.4 hours, 1.5 hours, 1.7 hours, 1.8 hours, or 2 hours.
Preferably, the milling time in step (2) is 2-10 hours, and may be, for example, 2 hours, 3 hours, 4 hours, 5 hours, 6 hours, 7 hours, 8 hours, 9 hours, or 10 hours.
The preparation method of the black hole liquid is simple and has excellent process.
In the invention, the raw materials for preparing the silver nanowires comprise a surfactant aqueous solution, silver nitrate dissolved in a reduction dispersion medium, a dispersing agent and a seed crystal.
Preferably, the surfactant aqueous solution has a concentration of 0.4% to 4% by mass, and may be, for example, 0.4%, 0.6%, 0.9%, 1.5%, 2%, 2.2%, 2.5%, 3%, 3.5%, or 4%.
Preferably, the mass percentage concentrations of the silver nitrate, the dispersing agent and the seed crystal in the reducing dispersion medium are as follows: 0.2% -2% silver nitrate (which may be, for example, 0.2%, 0.8%, 1.1%, 1.4%, 1.6%, 1.8% or 2%); 0.4% -4% dispersant (which may be, for example, 0.4%, 0.8%, 1%, 1.5%, 2%, 2.2%, 2.5%, 3%, 3.5% or 4%); 0.01% to 0.1% seed (which may be, for example, 0.01%, 0.03%, 0.05%, 0.06%, 0.08%, 0.09%, or 0.1%).
Preferably, the reducing dispersion medium is one or a combination of at least two of glycerol, propylene glycol, ethylene glycol or diethylene glycol.
In the invention, the reducing dispersion medium not only plays a role of a reducing agent to reduce silver ions in the solution, but also has a dispersion function, so that the solution has good stability.
Preferably, the dispersant is one or a combination of at least two of polyacrylamide, sodium polyacrylate or polyvinylpyrrolidone.
Preferably, the seed crystal is one or a combination of at least two of copper chloride, sodium chloride, ferric chloride or palladium chloride.
In the invention, a good crystal mechanism substance is added as the crystal seed, so that the crystallization speed can be accelerated, and a better crystal form can be formed.
Preferably, the surfactant is one or a combination of at least two of fatty alcohol polyoxyethylene ether sulfate, potassium dodecyl phosphate, sodium dodecyl benzene sulfonate or sodium dodecyl sulfate.
In the invention, the suspension of the silver nanowires is prepared by the following method:
(1) dissolving silver nitrate in a reduction dispersion medium to obtain a silver nitrate solution A;
(2) dissolving a dispersing agent and a seed crystal in a reduction dispersion medium to obtain a dispersing agent seed crystal solution B;
(3) dissolving a surfactant in water, and stirring to obtain a transparent solution C;
(4) stirring and heating the solution B obtained in the step (2), adding the heated solution B into the solution A obtained in the step (1) for reaction, preserving heat after reaction, and then centrifuging and washing the reaction solution to obtain silver nanowires;
(5) and (5) dispersing the silver nanowires in the step (4) in a surfactant aqueous solution C to obtain the silver nanowire suspension.
Preferably, the concentration of the solution a in step (1) is 0.2% to 2%, and may be, for example, 0.2%, 0.4%, 0.6%, 0.9%, 1.1%, 1.4%, 1.7%, 1.8%, or 2%.
Preferably, the concentration of the solution B in step (2) is 0.41% to 4.1%, and may be, for example, 0.41%, 0.7%, 1.2%, 1.6%, 1.9%, 2.2%, 2.7%, 3.1%, 3.5%, 4%, or 4.1%.
Preferably, the amount of water used in step (3) is 240g to 2490g, and may be, for example, 240g, 300g, 500g, 1000g, 1200g, 1500g, 1900g, 2200g or 2490g, relative to the amount of 10g of surfactant.
Preferably, the stirring rate in step (4) is 1000-.
Preferably, the temperature rise in step (4) is up to 150-.
Preferably, the solution B is subjected to heat preservation after the temperature is raised in the step (4), and the heat preservation time is 10-60min, for example, 10min, 20min, 30min, 40min, 50min or 60 min.
Preferably, the method of adding in step (4) is dropwise.
Preferably, the dropping rate is 0.1m L/min to 1m L/min, and may be, for example, 0.1m L0/min, 0.2m L1/min, 0.3m L/min, 0.4m L/min, 0.5m L/min, 0.6m L/min, 0.7m L/min, 0.8m L/min, 0.9m L/min, or 1m L/min.
Preferably, the time for the heat preservation in the step (4) is 30min-180min, for example, 30min, 50min, 80min, 100min, 120min, 140min, 160min or 180 min.
On the other hand, the invention provides a preparation method of the circuit board conductive liquid, which comprises the following steps: and mixing the black pore liquid and the silver nanowire suspension, and uniformly stirring to obtain the circuit board conductive liquid.
Preferably, the mass fraction of the silver nanowire suspension in the black pore liquid is 10% -30%, for example, 10%, 12%, 15%, 18%, 20%, 24%, 26%, 29% or 30%.
Preferably, the stirring speed is 500-.
The preparation method of the conductive liquid is very simple, is simple and convenient to operate, is convenient to produce, and reduces the cost.
The invention provides the application of the circuit board conductive liquid in electroplating of the printed circuit board.
Compared with the prior art, the invention has the following beneficial effects:
the conductive liquid of the circuit board obtained by adding the silver nanowires into the black hole liquid has the characteristic of high conductivity, and the resistance is greatly reduced.
According to the invention, the silver nanowires and the conductive carbon black are used as conductive substances, so that the resistance of the black pore liquid is reduced, and the black pore liquid has better through hole capacity on the pore wall. The conductive liquid composed of the silver nanowires and the black hole liquid has good flexibility, is excellent in conductivity and low in price, can be applied to a conventional electroplating process, can bear thermal shock, is stable in performance, is high in backlight grade of a product after the electroplating process, and has great advantages compared with other conductive substances such as silver nanoparticles, gold nanoparticles and graphene.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Example 1
The circuit board conductive liquid is prepared by the following method:
(1) preparing black hole liquid:
mixing 2.5% of conductive carbon black, 1.5% of sodium dodecyl sulfate, 2.5% of potassium dodecyl phosphate, 2.5% of potassium carbonate, 0.5% of polyvinyl alcohol and 90.5% of water by mass percent for 1.5 hours, and then grinding the uniform mixture for 6 hours to obtain the black pore liquid.
(2) Preparing silver nanowires:
dissolving silver nitrate in ethylene glycol to obtain a silver nitrate solution A with the mass percent concentration of silver nitrate of 1%; dissolving polyacrylamide and sodium chloride in ethylene glycol to obtain a dispersing agent seed crystal solution B with the mass percent concentration of 2.2 percent of dispersing agent and 0.05 percent of seed crystal; 10g of potassium dodecyl phosphate was dissolved in 490g of water to obtain a 2% by mass aqueous surfactant solution C.
Stirring the solution B at 1000 r/min, heating to 180 ℃, keeping the temperature for 30min after heating, dropwise adding the solution B into the solution A at the speed of 0.5m L/min for reaction, keeping the temperature for 100min after reaction, centrifuging and washing the reaction solution to obtain silver nanowires, and dispersing the suspension into the solution C to obtain silver nanowire suspension.
(3) Preparing a circuit board conductive liquid:
and mixing the black pore solution prepared in the above way with the silver nanowires, and uniformly stirring at the speed of 500 revolutions per minute to obtain the circuit board conductive solution with the mass fraction of the silver nanowire suspension in the black pore solution being 15%.
Example 2
The circuit board conductive liquid is prepared by the following method:
(1) preparing black hole liquid:
mixing 1% of conductive carbon black, 0.5% of fatty alcohol-polyoxyethylene ether, 1% of polyethylene glycol, 1% of potassium bicarbonate, 0.1% of sodium polyacrylate and 96.4% of water by mass percent for 2 hours, and then grinding the uniform mixture for 10 hours to obtain the black hole liquid.
(2) Preparing silver nanowires:
dissolving silver nitrate in glycerol to obtain a silver nitrate solution A with the mass percent concentration of the silver nitrate of 0.2%; dissolving polyacrylamide and sodium chloride in glycerol to obtain a dispersing agent seed crystal solution B with the mass percent concentration of 4% of a dispersing agent and the mass percent concentration of 0.1% of a seed crystal; 10g of sodium dodecyl sulfate was dissolved in 240g of water to obtain a surfactant aqueous solution C having a mass% concentration of 4%.
Stirring the solution B at 1000 r/min, heating to 200 ℃, keeping the temperature for 10min after heating, dropwise adding the solution B into the solution A at the speed of 1m L/min for reaction, keeping the temperature for 30min after reaction, centrifuging and washing the reaction solution to obtain silver nanowires, and dispersing the silver nanowires into the solution C to obtain silver nanowire suspension.
(3) Preparing a circuit board conductive liquid:
and mixing the black pore solution prepared in the above way with the silver nanowires, and uniformly stirring at the speed of 1000 r/min to obtain the circuit board conductive solution with the mass fraction of the silver nanowire suspension in the black pore solution being 30%.
Example 3
The circuit board conductive liquid is prepared by the following method:
(1) preparing black hole liquid:
mixing 5% of conductive carbon black, 3% of sodium dodecyl benzene sulfonate and nonyl phenol polyoxyethylene ether, 5% of polyvinylpyrrolidone and fatty alcohol polyoxyethylene sulfate, 5% of ethanolamine, 1% of sodium polyacrylate, potassium silicate and 81% of water for 1 hour, and then grinding the uniform mixture for 2 hours to obtain the black hole liquid.
(2) Preparing silver nanowires:
dissolving silver nitrate in acetone to obtain a silver nitrate solution A with the mass percent concentration of the silver nitrate of 2%; dissolving polyvinylpyrrolidone, polyacrylamide and ferric chloride in acetone to obtain a dispersing agent seed crystal solution B with the dispersion mass percentage concentration of 0.4% and the seed crystal mass percentage concentration of 0.01%; 10g of potassium dodecyl phosphate is dissolved in 2490g of water to obtain a surfactant aqueous solution C with the mass percent concentration of 0.4%.
Stirring the solution B at 2000 r/min, heating to 150 ℃, keeping the temperature for 60min after heating, dropwise adding the solution B into the solution A at the speed of 0.1m L/min for reaction, keeping the temperature for 180min after reaction, centrifuging and washing the reaction solution to obtain silver nanowires, and dispersing the silver nanowires into the solution C to obtain silver nanowire suspension.
(3) Preparing a circuit board conductive liquid:
and mixing the black pore solution prepared in the above way with the silver nanowires, and uniformly stirring at the speed of 700 r/min to obtain the circuit board conductive solution with the mass fraction of the silver nanowire suspension in the black pore solution being 10%.
Example 4
The circuit board conductive liquid is prepared by the following method:
(1) preparing black hole liquid:
mixing 4% of conductive carbon black, 2% of sodium dodecyl benzene sulfonate and sodium dodecyl sulfate, 2% of polyvinylpyrrolidone and polyethylene glycol, 4% of potassium carbonate and potassium bicarbonate, 0.6% of polyacrylamide and potassium silicate and 87.4% of water and isopropanol for 1.4 hours, and then grinding the uniform mixture for 7 hours to obtain the black hole liquid.
(2) Preparing silver nanowires:
dissolving silver nitrate in diethylene glycol to obtain a silver nitrate solution A with the mass percent concentration of silver nitrate of 1.6%; dissolving polyvinylpyrrolidone, sodium polyacrylate, sodium chloride and palladium chloride in diethylene glycol to obtain a dispersing agent seed crystal solution B with the dispersion mass percentage concentration of 3% and the seed crystal mass percentage concentration of 0.06%; 10g of fatty alcohol-polyoxyethylene ether sulfate is dissolved in 1990g of water to obtain a surfactant aqueous solution C with the mass percentage concentration of 0.5%.
Stirring the solution B at 1700 revolutions per minute, heating to 170 ℃, keeping the temperature for 40 minutes after heating, dropwise adding the solution B into the solution A at the speed of 0.6m L per minute for reaction, keeping the temperature for 140 minutes after reaction, centrifuging and washing the reaction solution to obtain silver nanowires, and dispersing the silver nanowires into the solution C to obtain silver nanowire suspension.
(3) Preparing a circuit board conductive liquid:
and mixing the black pore solution prepared in the above way with the silver nanowires, and uniformly stirring at a speed of 600 revolutions per minute to obtain the circuit board conductive solution with the mass fraction of the silver nanowire suspension in the black pore solution being 21%.
Example 5
The circuit board conductive liquid is prepared by the following method:
(1) preparing black hole liquid:
mixing 2% of conductive carbon black, 2% of sodium dodecyl sulfate and fatty alcohol-polyoxyethylene ether, 2% of potassium dodecyl phosphate and polyvinylpyrrolidone, 2% of ethanolamine and ammonia water, 0.7% of polyvinyl alcohol and 91.3% of water for 1.3 hours, and grinding the uniform mixture for 4 hours to obtain the black hole liquid.
(2) Preparing silver nanowires:
dissolving silver nitrate in propylene glycol and glycerol to obtain a silver nitrate solution A with the mass percent concentration of silver nitrate of 1.6%; dissolving polyacrylamide, sodium polyacrylate and copper chloride in propylene glycol and glycerol to obtain a dispersant seed crystal solution B with the dispersant mass percentage concentration of 3% and the seed crystal mass percentage concentration of 0.04%; 10g of sodium dodecyl sulfate and sodium dodecyl benzene sulfonate are dissolved in 990g of water to obtain a surfactant aqueous solution C with the mass percentage concentration of 1%.
Stirring the solution B at 1000 r/min, heating to 160 ℃, keeping the temperature for 20min after heating, dropwise adding the solution B into the solution A at the speed of 0.7m L/min for reaction, keeping the temperature for 80min after reaction, centrifuging and washing the reaction solution to obtain silver nanowires, and dispersing the silver nanowires into the solution C to obtain silver nanowire suspension.
(3) Preparing a circuit board conductive liquid:
and mixing the black pore solution prepared in the above way with the silver nanowires, and uniformly stirring at a speed of 600 revolutions per minute to obtain the circuit board conductive solution with the mass fraction of the silver nanowire suspension in the black pore solution being 22%.
Comparative example 1
This comparative example is different from example 1 in that it contains only the black pore liquid prepared in example 1 and does not contain silver nanowires.
Comparative example 2
The only difference between the comparative example and the example 1 is that the mass fraction of the silver nanowires in the black hole liquid is 9%.
Comparative example 3
The only difference between this comparative example and example 1 is that the mass fraction of the silver nanowires in the black pore liquid is 32%.
The above examples 1 to 5 and comparative examples 1 to 3 were tested and subjected to carbon pore treatment to test the resistance of the circuit board holes, and the specific results are shown in table 1 below:
TABLE 1
The experimental results shown in table 1 above can be used to conclude that the resistance of the conductive liquid (less than 2k Ω) is much lower than that of the similar products; in the conductive liquid without silver nanowires, the resistance value of the conductive liquid is almost the same as that of the like products, and the effect is poor; when the silver nanowire is contained, but the mass fraction of the silver nanowire is not within 10-30% of that of the silver nanowire, although the resistance is still lower than that of the similar product, the resistance is higher than that of the conductive liquid of the silver nanowire with the mass fraction of 10-30%. Therefore, the conductive liquid of the black-hole liquid circuit board containing 10-30% of the silver nanowires by mass has excellent conductive performance.
The above examples 1 to 5 and comparative examples 1 to 3 were subjected to thermal shock test, and each of the tests was subjected to thermal shock 5 times, and the specific test results are shown in the following table 2:
TABLE 2
The experimental results in the table 2 can conclude that the silver nanowires with a certain mass concentration are added into the black hole liquid, so that the black hole liquid has a good stabilizing effect and can bear thermal shock; the conductive liquid without the silver nanowires can not withstand 5 thermal shock experiments, and the conductive liquid is separated from the base material.
The above examples 1 to 5 and comparative examples 1 to 3 were subjected to conventional plating to obtain samples to be tested, and the results are shown in the following Table 3:
TABLE 3
The results in table 3 show that the conductive liquid for circuit boards prepared in the invention is applied to conventional electroplating, and the obtained product has high backlight grade and stable performance.
The applicant states that the present invention is described by the above embodiments, but the present invention is not limited to the above process steps, i.e. it does not mean that the present invention must rely on the above process steps to implement the present invention. It will be apparent to those skilled in the art that any modification of the present invention, equivalent substitutions of selected materials and additions of auxiliary components, selection of specific modes and the like, which are within the scope and disclosure of the present invention, are contemplated by the present invention.
Claims (28)
1. The circuit board conductive liquid is characterized by comprising black hole liquid and silver nanowires;
the black pore liquid comprises the following components in percentage by mass:
the preparation method of the circuit board conductive liquid comprises the following steps: mixing the black hole liquid and the silver nanowire suspension, and uniformly stirring to obtain the circuit board conductive liquid;
the mass fraction of the silver nanowire suspension in the black pore liquid is 10-30%.
2. The circuit board conductive solution of claim 1, wherein the surfactant is one or a combination of at least two of sodium dodecyl benzene sulfonate, sodium dodecyl sulfate, fatty alcohol-polyoxyethylene ether or nonyl phenol-polyoxyethylene ether.
3. The circuit board conductive solution of claim 1, wherein the dispersant is one or a combination of at least two of fatty alcohol polyoxyethylene sulfate, potassium dodecyl phosphate, polyethylene glycol, and polyvinylpyrrolidone.
4. The circuit board conductive solution of claim 1, wherein the pH regulator is one or a combination of at least two of potassium carbonate, potassium bicarbonate, ammonia water or ethanolamine.
5. The circuit board conductive liquid as claimed in claim 1, wherein the binder is one or a combination of at least two of polyvinyl alcohol, sodium polyacrylate, polyacrylamide or potassium silicate.
6. The circuit board conductive solution as claimed in claim 1, wherein the dispersion medium is one or a combination of at least two of water, ethylene glycol, isopropyl alcohol or acetone.
7. The circuit board conductive liquid according to claim 1, wherein the black hole liquid is prepared by the following method:
(1) uniformly mixing conductive carbon black, a surfactant, a dispersant, a pH regulator, a binder and a dispersion medium;
(2) and (2) fully grinding the mixture obtained in the step (1) to obtain the black pore liquid.
8. The circuit board conductive solution as claimed in claim 7, wherein the mixing time of step (1) is 1-2 hours.
9. The conductive liquid for circuit board according to claim 7, wherein the time for grinding in step (2) is 2-10 hours.
10. The circuit board conductive solution according to claim 1, wherein the raw materials for preparing the silver nanowires comprise a surfactant aqueous solution, and silver nitrate, a dispersing agent and seed crystals dissolved in a reducing dispersion medium;
the mass percentage concentration of the surfactant aqueous solution is 0.4-4%; the mass percentage concentrations of silver nitrate, a dispersing agent and seed crystals in the reducing dispersion medium are as follows: 0.2 to 2 percent of silver nitrate, 0.4 to 4 percent of dispersant and 0.01 to 0.1 percent of seed crystal.
11. The circuit board conductive solution of claim 10, wherein the reducing dispersion medium is one or a combination of at least two of glycerol, propylene glycol, ethylene glycol, or diethylene glycol.
12. The circuit board conductive liquid according to claim 10, wherein the dispersant is one or a combination of at least two of polyacrylamide, sodium polyacrylate or polyvinylpyrrolidone.
13. The circuit board conductive solution as claimed in claim 10, wherein the seed crystal is one or a combination of at least two of copper chloride, sodium chloride, ferric chloride or palladium chloride.
14. The circuit board conductive solution of claim 10, wherein the surfactant is one or a combination of at least two of fatty alcohol polyoxyethylene ether sulfate, potassium dodecyl phosphate, sodium dodecyl benzene sulfonate, or sodium dodecyl sulfate.
15. The circuit board conductive liquid according to claim 10, wherein the suspension of silver nanowires is prepared by the following method:
(1) dissolving silver nitrate in a reduction dispersion medium to obtain a silver nitrate solution A;
(2) dissolving a dispersing agent and a seed crystal in a reduction dispersion medium to obtain a dispersing agent seed crystal solution B;
(3) dissolving a surfactant in water, and stirring to obtain a transparent solution C;
(4) stirring and heating the solution B obtained in the step (2), adding the heated solution B into the solution A obtained in the step (1) for reaction, preserving heat after reaction, and then centrifuging and washing the reaction solution to obtain silver nanowires;
(5) and (5) dispersing the silver nanowires in the step (4) in a surfactant aqueous solution C to obtain a silver nanowire suspension.
16. The circuit board conductive solution as claimed in claim 15, wherein the concentration of the solution a in step (1) is 0.2% -2%.
17. The circuit board conductive solution as claimed in claim 15, wherein the concentration of the solution B in the step (2) is 0.41-4.1%.
18. The circuit board conductive solution as claimed in claim 15, wherein the amount of water used in step (3) is 240g to 2490g relative to 10g of surfactant.
19. The conductive liquid for circuit board as claimed in claim 15, wherein the stirring speed in step (4) is 1000-.
20. The conductive liquid for circuit board as claimed in claim 15, wherein the temperature rise in step (4) is 150-200 ℃.
21. The circuit board conductive liquid according to claim 15, wherein the solution B is subjected to heat preservation after the temperature is raised in the step (4), and the heat preservation time is 10-60 min.
22. The conductive liquid for circuit board according to claim 15, wherein the adding in step (4) is dropwise.
23. The conductive liquid of circuit board as claimed in claim 22, wherein the dropping rate is 0.1m L/min-1 m L/min.
24. The circuit board conductive solution of claim 15, wherein the time for the heat preservation in the step (4) is 30min to 180 min.
25. The method for preparing the circuit board conductive liquid as claimed in any one of claims 1 to 24, wherein the method comprises: and mixing the black pore liquid and the silver nanowire suspension, and uniformly stirring to obtain the circuit board conductive liquid.
26. The preparation method of claim 25, wherein the mass fraction of the silver nanowire suspension in the black pore liquid is 10% -30%.
27. The method as claimed in claim 25, wherein the stirring speed is 500-1000 rpm.
28. Use of the conductive liquid for circuit boards according to any one of claims 1 to 24 in electroplating of printed circuit boards.
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| CN108342128B (en) * | 2018-02-11 | 2020-04-07 | 深圳清华大学研究院 | Preparation method of low-haze transparent conductive conductor |
| CN108822974A (en) * | 2018-05-23 | 2018-11-16 | 昆山市线路板厂 | A kind of flexible electric circuit board conditioner |
| CN110923771B (en) * | 2019-12-16 | 2021-10-26 | 电子科技大学 | Through hole electroplating method of printed circuit board |
| CN112159997B (en) * | 2020-09-21 | 2022-03-15 | 广东硕成科技股份有限公司 | Metal-containing/carbon nanoparticle composition for rigid plate hole metallization |
| CN114466529A (en) * | 2021-12-31 | 2022-05-10 | 广东省科学院化工研究所 | Black hole liquid for electroplating through hole of printed circuit board and preparation method and application thereof |
| CN115594171A (en) * | 2022-07-29 | 2023-01-13 | 广东利尔化学有限公司（Cn） | Carbon pore process nano graphite dispersion liquid and preparation method thereof |
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| CN105081351B (en) * | 2015-10-09 | 2017-09-26 | 重庆文理学院 | A kind of preparation method of uniform high length-diameter ratio nano silver wire |
| CN106653141B (en) * | 2016-11-18 | 2018-06-29 | 珠海特普力高精细化工有限公司 | A kind of manufacture of water-soluble conducting nanometer silver carbon slurry and its application process |
| CN106498465B (en) * | 2016-11-18 | 2019-02-01 | 珠海特普力高精细化工有限公司 | A kind of water-soluble conducting carbon nano-metal slurry and electrical-conductive nanometer metal carbon film bushing pipe |
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