CN107426914B - 印制电路板或印制电路板的中间成品 - Google Patents
印制电路板或印制电路板的中间成品 Download PDFInfo
- Publication number
- CN107426914B CN107426914B CN201710570832.0A CN201710570832A CN107426914B CN 107426914 B CN107426914 B CN 107426914B CN 201710570832 A CN201710570832 A CN 201710570832A CN 107426914 B CN107426914 B CN 107426914B
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- Prior art keywords
- electronic component
- printed circuit
- conductive layer
- circuit board
- layer
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- 239000013067 intermediate product Substances 0.000 title abstract description 28
- 239000011810 insulating material Substances 0.000 claims abstract description 13
- 239000011888 foil Substances 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 12
- 239000011889 copper foil Substances 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims 1
- 230000001419 dependent effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 32
- 239000010410 layer Substances 0.000 description 160
- 239000012790 adhesive layer Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000002313 adhesive film Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60T—VEHICLE BRAKE CONTROL SYSTEMS OR PARTS THEREOF; BRAKE CONTROL SYSTEMS OR PARTS THEREOF, IN GENERAL; ARRANGEMENT OF BRAKING ELEMENTS ON VEHICLES IN GENERAL; PORTABLE DEVICES FOR PREVENTING UNWANTED MOVEMENT OF VEHICLES; VEHICLE MODIFICATIONS TO FACILITATE COOLING OF BRAKES
- B60T5/00—Vehicle modifications to facilitate cooling of brakes
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60T—VEHICLE BRAKE CONTROL SYSTEMS OR PARTS THEREOF; BRAKE CONTROL SYSTEMS OR PARTS THEREOF, IN GENERAL; ARRANGEMENT OF BRAKING ELEMENTS ON VEHICLES IN GENERAL; PORTABLE DEVICES FOR PREVENTING UNWANTED MOVEMENT OF VEHICLES; VEHICLE MODIFICATIONS TO FACILITATE COOLING OF BRAKES
- B60T17/00—Component parts, details, or accessories of power brake systems not covered by groups B60T8/00, B60T13/00 or B60T15/00, or presenting other characteristic features
- B60T17/18—Safety devices; Monitoring
- B60T17/22—Devices for monitoring or checking brake systems; Signal devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F16D—COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F16D—COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
- F16D65/00—Parts or details
- F16D65/02—Braking members; Mounting thereof
- F16D65/12—Discs; Drums for disc brakes
- F16D65/128—Discs; Drums for disc brakes characterised by means for cooling
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F16D65/00—Parts or details
- F16D65/78—Features relating to cooling
- F16D65/80—Features relating to cooling for externally-engaging brakes
- F16D65/807—Features relating to cooling for externally-engaging brakes with open cooling system, e.g. cooled by air
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F16D69/02—Composition of linings ; Methods of manufacturing
- F16D69/025—Compositions based on an organic binder
- F16D69/026—Compositions based on an organic binder containing fibres
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
- H05K1/187—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16D—COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
- F16D65/00—Parts or details
- F16D65/78—Features relating to cooling
- F16D2065/783—Features relating to cooling cooling control or adjustment
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F16D—COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
- F16D66/00—Arrangements for monitoring working conditions, e.g. wear, temperature
- F16D2066/001—Temperature
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F16D—COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
- F16D69/00—Friction linings; Attachment thereof; Selection of coacting friction substances or surfaces
- F16D2069/004—Profiled friction surfaces, e.g. grooves, dimples
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F16D—COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
- F16D2200/00—Materials; Production methods therefor
- F16D2200/006—Materials; Production methods therefor containing fibres or particles
- F16D2200/0073—Materials; Production methods therefor containing fibres or particles having lubricating properties
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F16D—COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
- F16D2250/00—Manufacturing; Assembly
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- F16D2250/0046—Coating
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- F16D2300/00—Special features for couplings or clutches
- F16D2300/10—Surface characteristics; Details related to material surfaces
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/25—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors
- H01L2224/251—Disposition
- H01L2224/2518—Disposition being disposed on at least two different sides of the body, e.g. dual array
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- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
- H05K2203/1469—Circuit made after mounting or encapsulation of the components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Transportation (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
在将至少一个电子元件(31)集成到印制电路板或印制电路板的中间成品(37)中的方法中,提供了以下步骤:‑提供层(32),用于至少暂时支承该电子元件(31),‑将该电子元件(31)固定到该层(32)上,‑将导电层(35)布置到该支承层(32)上,而该导电层带有至少一个切口(38),其与要被固定的电子元件(31)的维度相对应,‑以绝缘物料(36)至少部分地包住或覆盖固定在该支承层(32)上的元件(31),‑露出该电子元件(31)和至少该导电层(35)的部分区域,其邻近该元件(31)并被布置在该支承层(32)上;以及‑该电子元件(31)和邻近该元件的导电层(35)之间至少有部分接触。此外,亦提供了带有已集成的电子元件(31)的印制电路板(37)和印制电路板的中间成品。
Description
本专利申请为分案申请;其原申请的申请日为2012年1月24日,申请号为201280006766.X,发明名称为“将电子元件集成到印制电路板或印制电路板的中间成品中的方法,以及印制电路板或印制电路板的中间成品”。原申请是国际申请,其国际申请号为PCT/AT2012/000011,国际申请日为2012年1月24日,进入中国国家阶段日为2013年7月26日。
技术领域
本发明涉及将至少一个电子元件集成到印制电路板或印制电路板的中间成品中的方法,以及涉及印制电路板或印制电路板的中间成品。
背景技术
在装有电子元件的装置的产品功能不断增长、这些电子元件日趋微型化以及要安装到印制电路板上的电子元件数目上升的情况下,现已采用日益强大的带有数个电子元件的类似箱状或阵列结构的部件或套件,而其带有多个触点或连接点,这些触点之间的间距亦越来越小。固定或连接这些元件越来越有需要使用高度布线的印制电路板,其中可设想到的是,同时将产品大小以及所用元件和印制电路板缩小,在这些构件的厚度和面积这两个方面,意味着以在印制电路板上所需的多个接触点的方式安装或布置这些电子元件将成问题,或这些触点可有的解决方案已达到极限。
因此,为了解决此问题,已有人提出将至少一些电子元件集成到印制电路板中,而在这方面,参照例如WO 03/065778、WO 03/065779或WO 2004/077902。然而,这些将电子元件或零件集成到印制电路板中的已知方法或实施例的缺点是,相应的凹槽或孔洞必须设于印制电路板的基底构件中,以容纳这些电子元件或零件,其中在将元件布置在这样的孔洞中之前,须形成额外的导体线路。为了与该些元件接触,采用了焊锡工艺和结合技术,其中接触点通常会在该些导体线路的构件和该些电子元件的触点或连接点的不同物料之间产生。特别是,当在温差大或温度变化范围大的环境中使用这样的***,按照不同的热膨胀系数而在该些触点或连接点区域中使用不同物料,会导致机械和/或热应力,而其可导致至少一个触点或连接点破裂,因而引致该元件故障。此外,可设想的是用于产生接触表面额外所需的钻孔,特别是激光钻孔,致使该些组件的压力更大。同样不利的是,让该些嵌入将生产的凹槽或凹陷处中的元件通过焊膏或焊线的方式与导体线路和接触表面接触是更为困难的,特别是在温度荷载波动下使用时,或不能可靠地实现。另外,缺点是在印制电路板的生产过程中或须有的高压和高温,会为该些已嵌入和连接的元件带来压力。此外,可能会加载较多电子元件,其散热或会有问题。
发明内容
因此,本发明的目的为使得在将至少一个电子元件集成到印制电路板中期间的所述问题(特别是上述类型)尽量减少或消除的方法,以及印制电路板或印制电路板的中间成品,其中可使用简单的方法步骤,得以实现在印制电路板中或在印制电路板的中间成品中简单而可靠地安装这些电子元件,同时提供特别简单的对齐方式而被生产的印制电路板或印制电路板的中间成品的厚度变薄。
因此为了实现这些目的,上述类型的方法实质上包含以下步骤:
-提供层,以至少暂时支承该电子元件;
-将该电子元件固定至该层,其中该电子元件的触点或置于该电子元件表面的导电层的方向朝向该支承层;
-将带有至少一个间隙的导电层以该电子元件的触点或该电子元件表面的导电层的高度置于该支承层上,该间隙按照要被固定的电子元件维度而定,其中邻近该元件的导电层是由金属箔形成的,优选为铜箔;
-以绝缘物料,例如半固化膜和/或树脂,至少部分地包住或覆盖固定在该支承层上的元件和至少该导电层的某些区域,其邻近该元件并被置于该支承层上;
-在移除该支承层后或通过将其移除,露出该电子元件的触点或该导电层和至少该导电层的某些区域,其邻近该元件并被置于该支承层上;以及
-该电子元件的触点或导电层和邻近该元件的导电层之间至少有部分接触。
通过将导电层置于该支承层上,该导电层带有至少一个间隙,其按照要被固定的电子元件维度而定,本发明使这样的导电层能够被置成与要嵌入的电子元件的导电层或触点同高度,进一步使在这导电层和该已集成电子元件之间的接触得以简化。将这导电层置成与其后被露出的电子元件表面同高度,容许被生产的印制电路板或被生产的印制电路板的中间成品的整体高度降低。此外,将该导电层置成实质上与被露出的元件表面同高度的方式,更简单地简化该元件和该导电层的邻近区域之间的接触;这提供印制电路板或印制电路板中间层的要被集成的电子元件布置整体上简化或改良,以及其电气连接亦变得简化。另外,由于该导电层的间隙或凹槽,致使该电子元件的对齐或朝向方式可在安装或固定该电子元件期间简化或促成。因此,为了简化在邻近被容纳或支承的元件的区域中提供或布置该导电层的方式,本发明另外提议的是,邻近该元件的导电层由金属箔形成,优选为铜箔。可以合适的厚度提供这样的金属箔,优选为铜箔,可使用已知用于生产印制电路板的简单方法而将其放置,并可被连接至这样的印制电路板或印制电路板的中间成品的其他层或构件。
因此,为了以简单而可靠的方式固定要被集成的电子元件,如本发明所述方法的一个优选实施例预想的是该电子元件通过粘合剂、粘合膜、该元件的粘合涂层或类似物的方式而被固定至该支承层,其中该粘合层会连同该支承层被移除。特别是,按照接下来的处理步骤,会因而有可能提供多个用于将该电子元件固定至该支承层的方法,其中适当的较小厚度不仅有可能使这些方法可用,更容许在包住该导电层和被集成的元件的触点后能简单而可靠地露出。
特别是在被生产的印制电路板或印制电路板的中间成品的整体厚度变薄的方面,另一优选实施例建议,该粘合层或膜或涂层的厚度不多于15μm,优选约0.1至10μm。因此如本发明所述,粘合层或膜的厚度相对较小或已足够,使尽管粘合层或膜的厚度较小,但该电子元件仍得以可靠地粘合或固定至该支承层上。
因此,为了以特别简单而可靠的方式添加该粘合层,另外提出了通过喷墨、柔版、凹版或平版印刷的方式施加粘合层,而其与如本发明所述方法的另一优选实施例相对应。
特别是,视乎被集成的电子元件的拟定用途和/或该元件的导电层或触点相对于该支承层的朝向,一个另一优选实施例建议,该金属箔,优选为铜箔,被特别地配置成作为导电结构,其厚度不多于15μm,优选约0.1至10μm。该金属箔,优选为铜箔,在较小的厚度下,使用薄的(特别是结构化的)导电层,提供与被集成的电子元件的简单而可靠的电气连接。
若在被集成的电子元件的侧面或边缘区域中的散热须为良好,特别是被集成的元件具有高功率的情况下,在其使用或操作期间发出的相对大量热力须被消散,则如本发明所述方法的经修改和优选实施例预想的是,特别是为了散热,该金属箔,优选为铜箔,其厚度不多于500μm,较优选约35至400μm。这样的相对较高的厚度容许被集成的电子元件实质上被带有良好导热性的金属箔包围其整个周围,使得由被集成的电子元件生成的热力可分布到该印制电路板或该印制电路板的中间成品的较大范围或区域上。
如上文所述,在被集成的电子元件和额外的导电层之间可简单而可靠地接触,该额外导电层实质上被置于被集成的电子元件的触点的高度或水平,而在这方面另一优选实施例建议,邻近该元件的导电层由结构化的层形成,其中该导电层优选在层压后被结构化。
为了特别简单而可靠地电气连接被嵌入的电子元件邻近的导电层,一个另一特别优选的实施例提出,在该电子元件指向该支承层的触点的情况下,在移除该支承层后,在该些触点和该结构化的导电层之间会有接触,或该些触点会与该结构化的导电层电气连接。
正如上文经已指出,邻近该元件的导电层的厚度通常会相对较高,以实现良好的散热,以及用于使该导电层和该电子元件之间接触,在操作期间会生成大量热力,该电子元件带有邻近的导电层,建议在露出该电子元件的导电层后,使该邻近的导电层大体上整个表面进行接触,而其与如本发明所述方法的另一优选实施例相对应。
在这方面,为了达到想要的散热效果,优选的提案为由以传导性物料,特别是导热物料,制成的层形成全表面接触。
特别是在生产印制电路板的中间成品时,其中在露出被集成的电子元件后,以简单而可靠的方式与相应的额外层接触,为了完成印制电路板这一目的,建议在露出该导电层或该电子元件的触点后并在与该邻近导电层接触后,形成或提供额外层和/或印制电路板构造。
如本发明所述方法的一个另外优选实施例预想的是,按照在被集成的电子元件的区域中的组成物,并特别是用于将该电子元件和/或与其连接的构件嵌入到要被生产的印制电路板中,该印制电路板的至少一个额外层在该已集成的电子元件的区域中设有凹槽或凹陷处。
因此,为了达成上述目的,上述种类的印制电路板或印制电路板的中间成品另外主要包含电子元件,其至少部分地被例如半固化膜和/或树脂的绝缘物料包住或覆盖,以及导电层,其被置于该电子元件的触点或该电子元件表面的导电层的高度并邻近该元件,其中邻近该元件的导电层带有至少一个间隙,其按照要被固定的电子元件的维度而定,而其中该电子元件的触点或置于该电子元件表面上的导电层被连接至或可被连接至邻近该元件的导电层,其中邻近该元件的导电层是由金属箔形成的,优选为铜箔,而其中固定至该支承层的元件和至少邻近该元件并被置于该支承层上的导电层的某些区域被绝缘物料,例如半固化膜和/或树脂,至少部分地包住或覆盖。如上文所述,这将达到简单而可靠地生产这样的印制电路板或印制电路板的中间成品,其中优选地,邻近该元件并带有至少一个间隙(其按照要被固定的电子元件的维度而定)的层容许简单而可靠地对齐或安装要被集成的电子元件,以及使生产出来的印制电路板或印制电路板的中间成品的整体高度降低或降到最低,而被集成的电子元件的露出表面可轻易地进行电气连接。
为了确保与被集成的电子元件的触点简单而可靠地电气连接,另外提议的是,邻近该元件的导电层是由金属箔形成的,优选为铜箔。
特别是,视乎被集成的电子元件的所拟用途和/或被集成的电子元件的触点或其导电层的触点相对于该支承层的朝向而定,一个另一优选实施例预想的是,特别是作为导电结构,该金属箔,优选为铜箔,其厚度不多于15μm,而更优选约0.1至10μm。这使设有的导电结构的厚度为较薄,而这有助于使被生产的印制电路板以及印制电路板的中间成品的整体高度进一步降低或降到最低。
虽然可使用合适地薄的箔以提供结构化的导电层,用于与被集成的元件的触点电气连接,但在操作或使用电子元件期间,其可生成大量热力,将因而生成的热力分布到较大范围或区域是有需要或理想的;因此,在这方面并特别是为了散热,建议该金属箔,优选为铜箔,其厚度不多于500μm,优选约35至400μm,而这如本发明所述印制电路板或如本发明所述印制电路板的中间成品的另一优选实施例相对应。
为了可靠地连接至被集成的电子元件指向该支承层的触点,如另一优选实施例所述,邻近该元件的导电层由结构化的导电层形成,以便连接至该电子元件的触点或与其接触。
与此相反,在使用电子元件期间或会生成大量热力,为了简单而可靠地从该电子元件散热,如另一经修改和优选实施例所述,该邻近的导电层进行大体上全表面的接触,以便连接至该电子元件的导电层或与其接触。
进一步优选地建议的是,该全表面接触由以传导性物料制成的层形成,特别是导热物料,以便支援可靠的散热。
附图说明
下文将参照示例性实施例而更详细地说明本发明,该些实施例通过在附图中而示意性地显示。在该些附图中:
图1显示了如本发明所述方法的示意性方法步骤,用于将至少一个电子元件集成到如本发明所述的印制电路板或如本发明所述的印制电路板的中间成品中;
图2的表示方式与图1类似,显示了如本发明所述的经修改方法的个别方法步骤,用于将电子元件集成到如本发明所述的印制电路板或如本发明所述的印制电路板的中间成品中,其中与图1的表示方式不同,在如图2所述的实施例中,其中被集成的电子元件的导电层指向支承层,被集成的电子元件设有触点,其指向该支承层;
图3表示了如本发明所述印制电路板或如本发明所述印制电路板的中间成品的另一经修改实施例,其中在被集成的电子元件旁、在该支承层上设有相对较厚的导电层,特别是用于散热;
图4显示了与图2所示类似的方法的仅两个方法步骤,其中同样地,被集成的电子元件的触点指向该支承层;以及
图5a和5b表示了用于生产如本发明所述印制电路板或如本发明所述印制电路板的中间成品的方法的另一经修改实施例,其中在该些层彼此连接之前作出了个别标记。
一般来说,在附图方面,须注意个别层的相对厚度以及这些层的维度非按真实比例(特别是相对于被集成的电子元件而言),而是在一些情况下为作说明之用,厚度或维度有所夸大。此外,整体来说,与电子元件通常包含相对大量触点相比,仅显示了少量被集成的电子元件的这些触点。
具体实施方式
在图1中的方法步骤(a)中,安装或固定了元件,其一般以附图标记1标示,集成到被生产的印制电路板或到印制电路板的中间成品中,其中该电子元件1被支承或固定在支承层2上,而粘合层3设于该支承层2上,用于固定。
在图1所示的实施例中,电子元件1的导电层4指向该支承层2或该粘合层3。此外,从步骤(a)显然可见,导电层,特别是金属箔或铜箔5,亦被固定在该支承层2上,该箔以按照被安装或集成的电子元件1的维度而定的凹槽或间隙实现。
就如该些层的厚度非按真实比例,相对被容纳或嵌入的电子元件1的维度而言,该层5的间隙或凹槽6的横向距离亦作夸大示出。
例如通过使用粘合剂,将该电子元件1固定在该导电层4上方和固定该邻近导电层或金属箔5均得以实现,该粘合剂的相应的小的厚度例如少于15μm,而更优选为少于5μm。举例来说,可使用喷墨、柔版、凹版或平版印刷的方法来施加这样的粘合层。
在该电子元件1和该导电层或箔5均被置于该支承层2上或固定至该支承层后,根据步骤(b),以例如多个半固化膜的非导电物料制成的多个层7(示意性标示)置于其上,其中亦另外标示了额外导电层8。
在将多个层7和8布置成包围该电子元件1或叠加于其上后,根据步骤(c),被嵌入的电子元件1会被层压并被完全包住,其中在层压步骤(c)中,该些个别层7被连接,以便得出以绝缘物料制成的共同层9。
在被嵌入的电子元件1因而根据步骤(c)而被包住后,在步骤(d)中,移除该支承层2和该粘合层3,不仅露出该导电层5,亦露出该已集成的电子元件1的导电层4。
在此,特别显然易见的是,该导电层4的面向远离该电子元件的触点10,位于与该导电层5大体上相同的高度或相同的平面,使得在方法步骤(d)中,被集成的电子元件1的表面被完全露出。
在该已集成的电子元件1的导电层4和该导电层或金属箔5均已露出后,施加额外导电层12和13,以便进一步制造印制电路板或印制电路板的中间成品,其由附图标记11示意性地标记,其中在方法步骤(e)中,显示了通过接触结构,例如导电物料填充的钻孔14,而与该已嵌入的电子元件1的触点10作出额外接触。
从如图1的表述中可显然易见,例如为了散热或排热良好,该已集成的电子元件1的导电层4大体上横跨该整个表面而连接至该额外导电层12,且为了将热力分布到较大区域,其亦与邻近该导电层或金属箔5的该些区域全表面连接,而该些区域位于相同高度的位置。
图2显示了用于将电子元件嵌入的方法的经修改实施例,其中在同样以(a)标记的第一方法步骤中,被嵌入的电子元件21通过置于中间的粘合层23的方式而被固定至支承层22。
与如图1所述的实施例不同,被集成的电子元件21指向该支承层22,通过触点24的方式而被固定至该支承层22或该粘合层23。
与如图1所述的实施例类似,导电层或金属箔25同样设于该支承层22或该粘合层23上,该层或箔包含间隙或凹槽26,其按照被集成的电子元件21的外部维度而定。
在图2中,方法步骤以与图1的步骤(c)类似的方式以(c)标记;据此,在通过例如层压工艺而施加多个以绝缘物料制成的层(未显示)后,该已集成的电子元件21被完全嵌入到以绝缘物料制成的外壳27中,其中就如图1的实施例般,标示了导电层28。
在该电子元件21如图2的步骤(c)所述被嵌入后,同样该已集成的电子元件21的触点24和该邻近的导电层或金属箔25均已以与如步骤(d)所述的前述实施例类似的方式露出。同样,该些触点24以及该导电并特别是结构化的层25位于大体上相同的高度或相同的水平,使得与该前述实施例类似,同样露出了该已集成的电子元件的表面,而在这情况下其包含该些触点24,并露出该导电层或金属箔25亦变得可能。
在以(e)标记的步骤中,就如通过孔隙和钻孔31和32以及通过与该已集成的电子元件21的触点24接触所示,施加和结构化额外导电层29和30。
图3显示了与图1的方法步骤(c)类似的经修改实施例,其中显然可见,与如图1所述实施例中厚度相比为小的层或箔5不同,带有间隙38的导电层或金属箔35的厚度较为大,并邻近以附图标记31标记的已集成电子元件或与其抵接,而在该实施例所示,其实质上相当于整个该已集成的电子元件31的高度,即高度为例如数百μm。
在如图3所示,由以绝缘物料制成的层(以附图标记36标记)包住该电子元件31后,同样该已集成的电子元件31的导电层34和该厚度较厚的邻近层35均已如图1所述实施例类似的方式露出,其中可通过施加如图1所示的额外导电层,将热力良好地分布到该印制电路板或该印制电路板的中间成品37的大区域。
与图2所述的实施例类似,在如图4所述的示图中,安装或固定被集成的电子元件41,其带有指向支承层42的触点43,其中标示了粘合层44,用于固定之用。
额外施加到该支承层42的导电层或金属箔45设有多个凹槽或间隙46,其按照被集成的电子元件41的触点43而定。使得在安装或固定该电子元件41期间,该些触点42如该箭头47所示进入该导电层45的凹槽或间隙46。
此外,从图4显然可见,从该些前述图1和2省去了数个中间步骤,在该被集成的电子元件41嵌入到以绝缘物料制成的层48中并移除该支承层42后,该元件41的触点43和该邻近的导电层或金属箔45均会露出。其结果是,与如图2所述的实施例类似,可通过其后施加或放置额外的导电层并将该些导电层结构化,可简单而可靠地与该已集成的电子元件41的触点43接触。邻近该电子元件41的导电层或金属箔45同样位于与该被集成的电子元件41的触点43相同的高度,而其会在移除该支承层42后露出。
在图5a和5b所示的实施例中,被集成的电子元件51同样被支承在支承层52上,其中该元件51的触点并未详细显示。与该些前述实施例类似,可同样使用粘合剂来将该电子元件51固定至该层52。
导电层或金属箔53同样设有间隙或凹槽60,其按照该被集成的电子元件51的维度而定,其中,与该些前述实施例类似,额外地,将以绝缘物料制成的层54置于该导电层53之上,该层54亦带有间隙,其适应该元件51的维度。被生产的该印制电路板或该印制电路板的中间成品的额外层以附图标记55和56标记,其中该层55与层54类似,以非导电金属制成,例如半固化片,而该层56则以导电物料或导电箔制成。
图5b显示的是,如在该些前述实施例中般,为了集成该被集成的元件51,在该些触点(并未详细显示)进行电气连接后设有额外层57,其带有按照所设结构或建构而定的凹槽59,而该所设结构或建构由例如该支承层52或取代这支承层52的层以及示意性示出的额外层58形成,以便能够将设于该元件51区域中的结构完全集成到该被生产的印制电路板61或该印制电路板的中间成品中。
为了固定该些被集成的电子元件1、21、31、41、51,除了如该些附图所示的粘合剂或该些粘合层之外,亦可使用例如水溶性膜或水溶性箔,其设于该被集成的元件指向该支承层的表面上,以便暂时固定该元件。
Claims (11)
1.印制电路板,其包含电子元件(1、21、31、41、51),
以及第二导电层(5、25、35、45、53),该第二导电层的顶部是与该电子元件(21、41)的触点(24、43)的顶部和在间隙中的绝缘物料的顶部是在同一平面,或者该第二导电层的顶部是与该电子元件(1、31)表面的第一导电层(4、34)的顶部和在间隙中的绝缘物料的顶部是在同一平面,并邻近该电子元件,使得该电子元件(21、41)的触点(24、43)或置于该电子元件(1、31)表面上的第一导电层(4、34),通过在印制电路板形成和被结构化的额外的导电层(12、13、29、30、57)连接至邻近该电子元件(1、21、31、41、51)的第二导电层(5、25、35、45),
其中邻近该电子元件的第二导电层(5、25、35、45、53)带有至少一个间隙(6、26、38、46、60),其按照要被固定的电子元件(1、21、31、41、51)的维度而定,
其中邻近该电子元件(1、21、31、41、51)的该第二导电层(5、25、35、45、53)是由金属箔形成的,而
其中该电子元件(1、21、31、41、51)和至少邻近该电子元件(1、21、31、41、51)的该第二导电层(5、25、35、45、53)的某些区域被绝缘物料(7、9、27、36、48、54、55),至少部分地包住或覆盖,绝缘物料包含半固化膜和/或树脂,
其中以贯通该额外导电层的孔隙和钻孔以及通过与集成的电子元件的触点接触,施加和结构化该额外的导电层。
2.如权利要求1所述的印制电路板,其特征在于该绝缘物料为半固化膜和/或树脂。
3.如权利要求1所述的印制电路板,其特征在于作为导电结构,该第二导电层(25、45)的厚度为0.1μm至15μm。
4.如权利要求1所述的印制电路板,其特征在于作为导电结构,该第二导电层(25、45)的厚度为0.1μm至10μm。
5.如权利要求1所述的印制电路板,其特征在于为了散热,该第二导电层(35)的厚度为35μm至500μm。
6.如权利要求1所述的印制电路板,其特征在于为了散热,该第二导电层(35)的厚度为35μm至400μm。
7.如权利要求1所述的印制电路板,其特征在于该金属箔是由铜箔制成的。
8.如权利要求1所述的印制电路板,其特征在于邻近该电子元件(21、41)的该第二导电层(25,45)由结构化的导电层(24、45)形成,以便连接至该电子元件(21、41)的触点(24、43)或与其接触。
9.如权利要求1所述的印制电路板,其特征在于通过传导性物料提供了邻近的第二导电层(5、35)进行全表面接触,以便连接至该电子元件(1、31)的第一导电层(4、34)或与其接触。
10.如权利要求9所述的印制电路板,其特征在于以导热物料作该全表面接触。
11.如权利要求9所述的印制电路板,其特征在于该全表面接触由以导热物料制成的层形成。
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CN203206586U (zh) * | 2013-02-27 | 2013-09-18 | 奥特斯(中国)有限公司 | 用于生产印制电路板的半成品 |
AT514074B1 (de) | 2013-04-02 | 2014-10-15 | Austria Tech & System Tech | Verfahren zum Herstellen eines Leiterplattenelements |
AT514564B1 (de) * | 2013-07-04 | 2015-02-15 | Austria Tech & System Tech | Verfahren zum Ankontaktieren und Umverdrahten |
EP3075006A1 (de) | 2013-11-27 | 2016-10-05 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Leiterplattenstruktur |
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JP2015146346A (ja) * | 2014-01-31 | 2015-08-13 | イビデン株式会社 | 多層配線板 |
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