CN107324041B - 用于片盒夹持的机械手及自动片盒搬运装置 - Google Patents

用于片盒夹持的机械手及自动片盒搬运装置 Download PDF

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CN107324041B
CN107324041B CN201610285759.8A CN201610285759A CN107324041B CN 107324041 B CN107324041 B CN 107324041B CN 201610285759 A CN201610285759 A CN 201610285759A CN 107324041 B CN107324041 B CN 107324041B
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film magazine
manipulator
end effector
clamping
flange
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CN107324041A (zh
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许琦欣
杜荣
李玲雨
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Shanghai Micro Electronics Equipment Co Ltd
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Shanghai Micro Electronics Equipment Co Ltd
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Priority to PCT/CN2017/082506 priority patent/WO2017186172A1/zh
Priority to JP2018556399A priority patent/JP6753950B2/ja
Priority to SG11201809553XA priority patent/SG11201809553XA/en
Priority to US16/097,550 priority patent/US11383940B2/en
Priority to TW106114272A priority patent/TWI637455B/zh
Priority to KR1020187034010A priority patent/KR20190002560A/ko
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Abstract

本发明提供了一种用于片盒夹持的机械手及自动片盒搬运装置,所述用于片盒夹持的机械手包括机械臂、设置于所述机械臂的末端的末端执行器以及设置于所述末端执行器上的视觉定位组件。本发明通过视觉定位组件定位所述片盒的法兰位置以实现对片盒的识别,即依据片盒本身特征进行识别,无需额外黏贴标记,提高了测量精度及抓取片盒的精准度;另一方面,末端执行器利用末端执行器上与所述片盒顶部法兰相适配的凹面夹持片盒顶部的法兰实现对片盒的搬运。

Description

用于片盒夹持的机械手及自动片盒搬运装置
技术领域
本发明涉及机械技术领域,特别涉及一种用于片盒夹持的机械手及自动片盒搬运装置。
背景技术
21世纪以来,自动化物流***已经在工业领域得到广泛应用,在IC行业前道工艺FAB厂产线中,特别是12寸产线中,已经普遍采用了自动物料搬送***(AMHS),具体包括Stocker、OHT或AGV等。例如首先通过MES***调度AMHS,直接将硅片片盒从Stocker直接搬送到各机台的接口上,然后命令机台进行自动化生产,改变了之前完全靠人工运输的低效率模式,大大提升先进IC工艺产线的自动化水平,有效地节约人力成本,提高产品产出,增加客户价值。
目前,世界范围内主要在前道工艺12寸半导体产线中已经采用了OHT***进行物料管理,但对于许多后道封装产线来说也面临物料自动化***更新的问题,而且12寸产品越来越占主导地位,满载荷的片盒重量约为7.5Kg,对于操作工来说较吃力,且有一定的风险;同时,劳动力在未来会严重短缺且劳动力成本越来越高,因此片盒运输机器人的需求量将会越来越大;此外,由于封装厂的规模和利润,无法支持诸如前道半导体产线的OHT***投资,因此,研发一种便利、经济的自动片盒搬送方案和设备成为当务之急。
在全球范围内,一些电子厂和半导体厂房已经在用AGV小车代替人工搬运,通过在产线上配置搬运机器人,节省大量的体力劳动。但这种自动物料搬送***产品的不足为:都是主要针对8寸片盒,不能满足12寸片盒的运输需求。
通常12寸片盒搬运设备只能携带一盒片盒,效率较低。此外该片盒搬运设备的片盒抓取方式不能适应从一般性的货架上抓取片盒的功能。其原因在于12寸片盒搬运设备的机械臂的臂长通常比较长,需要较大的搬运空间,而一般为了尽可能提高货架存储量,节省FAB内的空间,货架可能会做到3层,层间高度不超过450mm。这对于12寸片盒自动搬运设备而言,留给机械臂的空间非常有限。
为实现自动片盒搬运装置可以准确的搬运片盒,于片盒位置的识别起到至关重要作用。现有的解决方式大体为两种,其中一种,针对OHT***而言,OHT设备从Stocker内直接装载片盒,通过轨道直接到达机台的负载接口上方,通过伸缩绳索将片盒放置到机台上,由于这一过程是一个结构化的工况,片盒在stocker中的位置通过stocker的机械臂对各存储位置进行示教,OHT设备与片盒之间的位置关系通过轨道和机械定位保证,OHT设备将片盒放置到机台上时,其余负载接口的位置关系同样通过轨道和机台布局保证。
另一种方式,使用光电探测器探测货架上固定粘贴标记的方法,通过标记识别进行片盒定位。该方案受制于两点:
1.标记在长期使用过程中破损,影响测量精度,导致无法准确抓取片盒;
2.标记必须与放置片盒的定位板存在一定精度关系,增加了货架制造的成本。
发明内容
本发明的目的在于提供一种自动片盒搬运装置及自动片盒搬运装置,以解决现有技术中自动片盒搬运装置存在的不足。
为解决上述技术问题,本发明提供一种用于片盒夹持的机械手,所述用于片盒夹持的机械手包括:机械臂、设置于所述机械臂的末端的末端执行器以及设置于所述末端执行器上的视觉定位组件;
其中,所述视觉定位组件用于定位所述片盒顶部的法兰位置;
所述末端执行器包括一与所述片盒顶部法兰相适配的凹面,根据所述片盒的法兰位置所述末端执行器通过所述凹面夹持片盒顶部的法兰。
可选的,在所述的用于片盒夹持的机械手中,所述视觉定位组件包括:水平定位结构和垂向定位结构,所述水平定位结构用于捕捉所述片盒表面水平方向上的特征,所述垂向定位结构用于捕捉所述片盒表面垂直方向上的特征,根据所述片盒表面水平方向上的特征及所述片盒表面垂直方向上的特征定位所述片盒的法兰位置。
可选的,在所述的用于片盒夹持的机械手中,所述水平定位结构包括第一相机,所述第一相机的镜头垂直朝向所述末端执行器上的任意一侧支撑板。
可选的,在所述的用于片盒夹持的机械手中,所述垂向定位结构包括第二相机及反射镜,所述第二相机和所述反射镜均设置于所述末端执行器的一侧的侧壁上。
可选的,在所述的用于片盒夹持的机械手中,所述末端执行器为两侧带有支撑板的C字形半封闭结构。
可选的,在所述的用于片盒夹持的机械手中,所述末端执行器还包括设置于所述凹面前端的凸台,用于防止片盒滑落。
可选的,在所述的用于片盒夹持的机械手中,所述凹面上至少设有一个在位传感器,用于感知所述凹面是否夹持片盒。
可选的,在所述的用于片盒夹持的机械手中,还包括设置于所述末端执行器上的声呐传感器,用于对片盒搬运行程进行安全检测。
可选的,在所述的用于片盒夹持的机械手中,所述凹面上至少设有两个定位销,所述定位销与所述法兰的切口对位。
可选的,在所述的用于片盒夹持的机械手中,所述末端执行器与所述机械臂的末端呈倒L形。
可选的,在所述的用于片盒夹持的机械手中,所述末端执行器可绕所述机械臂的末端进行360度旋转运动。
可选的,在所述的用于片盒夹持的机械手中,所述机械臂的自由度为6个自由度。
本发明还提供一种自动片盒搬运装置,所述自动片盒搬运装置包括:自动导航小车、架设在所述自动导航小车上的运载框架及设置于所述运载框架上用于片盒夹持的机械手。
可选的,在所述的自动片盒搬运装置中,还包括设置于所述运载框架上的片盒放置机构,所述机械手相对所述片盒放置机构设置于所述运载框架的一角。
在本发明所提供的用于片盒夹持的机械手及自动片盒搬运装置中,所述用于片盒夹持的机械手包括机械臂、设置于所述机械臂的末端的末端执行器以及设置于所述末端执行器上的视觉定位组件。本发明通过视觉定位组件定位所述片盒的法兰位置以实现对片盒的识别,即依据片盒本身特征进行识别,无需额外黏贴标记,提高了测量精度及抓取片盒的精准度;另一方面,末端执行器利用末端执行器上与所述片盒顶部法兰相适配的凹面夹持片盒顶部的法兰实现对片盒的搬运;此外,在凹面夹持法兰的同时,凹面上的定位销与法兰的切口对位实现了片盒的自定心,进一步提高了片盒定位的精准度。
附图说明
图1是本发明一实施例中自动片盒搬运装置的结构示意图;
图2是本发明一实施例中末端执行器的结构示意图;
图3是本发明一实施例中末端执行器的凹面夹持片盒顶部的法兰的结构示意图;
图4是本发明一实施例中在位传感器的结构示意图。
图中:
1-机械臂;2-末端执行器;20-支撑板;21-凹面;22-凸台;23-在位传感器;24-声呐传感器;25-定位销;3-视觉定位组件;30-水平定位结构;300-第一相机;31-垂向定位结构;310-第二相机;311-反射镜;40-法兰;5-运载框架。
具体实施方式
以下结合附图和具体实施例对本发明提出的用于片盒夹持的机械手及自动片盒搬运装置作进一步详细说明。根据下面说明和权利要求书,本发明的优点和特征将更清楚。需说明的是,附图均采用非常简化的形式且均使用非精准的比例,仅用以方便、明晰地辅助说明本发明实施例的目的。
请参考图1,其为本发明的自动片盒搬运装置的结构示意图,如图1所示,所述的自动片盒搬运装置包括:自动导航小车、架设在所述自动导航小车上的运载框架5、设置于所述运载框架5上的用于片盒夹持的机械手以及设置于所述运载框架5上的片盒放置机构;所述机械手相对所述片盒放置机构设置于所述运载框架5的一角。优选的,所述片盒放置机构数量为两个,呈上下层分布。
本实施例中,所述机械手主要包括:机械臂1、设置于所述机械臂1的末端的末端执行器2以及设置于所述末端执行器2上的视觉定位组件3;其中,所述视觉定位组件3用于定位所述片盒顶部的法兰40位置;所述末端执行器2包括一与所述片盒顶部法兰40相适配的凹面21,根据所述片盒的法兰40位置所述末端执行器2通过所述凹面21夹持片盒顶部的法兰40。通过视觉定位组件3定位所述片盒的法兰40位置(属于片盒本身特征)以实现对片盒的识别,由于片盒都有固定的规格,在获取片盒的法兰40的位置后即可获知片盒摆放位置上承载有片盒的位置,无需额外黏贴标记,提高了测量精度及抓取片盒的精准度。接着,通过末端执行器2对片盒进行搬运,主要通过末端执行器2上的凹面21夹持片盒顶部的法兰40实现对片盒的搬运,由此可见,片盒的法兰40不仅起到识别的标定作用,还起到配合末端执行器2搬运片盒的作用。
请参考图1及图3,机械手搬运片盒的具体工程为:在抓取片盒时,末端执行器2从片盒顶部的法兰40与片盒主体之间的空间伸入后至一定位置后,垂直向上将片盒托起;在放置片盒时,将片盒放在自动片盒搬运装置上的片盒放置位置上后,末端执行器2沿垂直向下方向运动与片盒脱离后抽出。优选机械手的机械臂1为6自由度的机械臂1,所述末端执行器2可绕所述机械臂1的末端进行360度旋转运动,末端执行器2在工作时与机械臂1的末端关节呈倒L形,具体来说,伸入货架时,机械臂1最后一个关节位于末端执行器2下方,以最大程度上节省末端执行器2伸入对于货架每层高度空间的占用,同时降低对机械臂1末端的力矩。
本实施例中,所述凹面21上至少设有两个定位销25,所述定位销25与所述法兰40的切口对位,所述法兰40的切口为三角形或圆柱形,相应的,所述定位销25的位置需与片盒顶部法兰40的切口相配合且形状相吻合,所述定位销25的横截面不局限为三角形或圆柱形,只要定位销25能够容置于法兰40的切口中,且定位销25的中心与切口的几何中心重合即可。利用法兰40自身具有的切口与设置于凹面21上的定位销25对位,实现对抓取后的片盒的自定心,从而进一步提高了片盒定位的精准度。使片盒在末端执行器2上的位置在精密可控范围,便于片盒能够被准确放置到搬运车上。
如图2所示,所述末端执行器采用被动式无源方式,所述末端执行器2为两侧带有支撑板20的C字形半封闭结构,利用C字形半封闭结构可起到类似“斜拉桥”拉锁的功能。所述视觉定位组件3包括:水平定位结构30及垂向定位结构31,所述水平定位结构30用于捕捉所述片盒表面水平方向上的特征,所述垂向定位结构用于捕捉所述片盒表面垂直方向上的特征,根据所述片盒表面水平方向上的特征及所述片盒表面垂直方向上的特征定位所述片盒的法兰40位置,即确定法兰40的空间具***置,以便后续末端执行器2准确执行夹持搬运工作。
其中,所述水平定位结构30包括相机第一相机300,所述第一相机300设置于所述末端执行器2的中间,第一相机300的镜头垂直朝向末端执行器2上的任意一侧支撑板20;所述垂向定位结构31包括第二相机310及反射镜311,所述第二相机310和所述反射镜311均设置于所述末端执行器2的一侧的侧壁上,且安装在垂平向相机的镜头朝向相对一侧的支撑板20上。以实现最大程度上降低第二相机310与待测片盒的法兰40之间的间距,便于末端执行器2进入货架后对片盒顶部法兰40进行测量。
所述末端执行器2还包括凸台22及至少一个在位传感器23,所述凸台22设置于所述凹面21的前端,以避免机械手突然断电时,出现片盒滑落的危险;所述凹面21上至少设置有一个在位传感器23,优选的在位传感器23设置于所述凹面21上与所述法兰40接触的区域上的,用于感知所述凹面21是否夹持片盒。相应的,所述末端执行器2上还包括至少一个机械开关结构,当片盒自定心后,片盒触发触发机械开关,从而产生在位信号,所述机械开关结构具体请参考图4。
较佳的,本实施例中的机械手还包括设置于所述末端执行器2上的声呐传感器24,安装在末端执行器2上的任意一侧支撑板20上,做为搬运执行过程中的安全检测传感器,一旦声呐阈值范围内有物体被探测到,则机械臂1立即停止作业。
自动片盒搬运装置从三层货架(机械臂1末端高度从450mm~1350mm)上抓取片盒,优选的,所述底座为搬运车,在搬运车的两侧设置有垂向激光传感器,以实现对自动片盒搬运装置在高度方向上的障碍探测。
基于以上结构的自动片盒搬运车工作流程,主要包括:
针对货架不同层设置不同的停车位置;从侧面测量与抓取片盒;测量片盒顶部法兰40作为特征,先进行水平测量,通过切口侧面特征获取片盒的X、Y、Z、Rx,将第二相机310带入到顶部法兰40的切口位置,通过切口的俯视特征获取片盒的X、Y、Rz;从片盒顶部法兰40下方伸入末端执行器进行抓取。
实际工作时,使用自动片盒搬运装置的搬运***的工作过程如下:
1)远程调度:AGVC下发片盒搬运任务,包含:片盒ID、起始点、目的地等信息。调度服务器根据全厂区内自动运输车的位置及空闲情况,进行最优化调度,确定具体执行任务的自动片盒搬运装置,并发送片盒ID和起始点到该自动片盒搬运装置的控制***,该步骤执行后,自动片盒搬运装置已经完全清楚将要执行的任务信息。
2)移动至目标位置:底座为每一辆执行搬运任务的车辆规划最优路径,在行进间遇到障碍物时,进行自主避障绕行,自动片盒搬运装置根据所选择的工位位置以及片盒位置,计算出需要到达的地图坐标,抵达目标点后,搬运车调整朝向至设定的方向,将机械臂一侧靠近货架或机台,开始准备执行搬运任务.
3)片盒搬运。片盒搬运任务分为从货架/机台上取片盒,或将片盒放置到货架/机台上。提取片盒的操作如下:
a)由于片盒在货架三层不同的高度,以下简称高、中、低层,抓取片盒时,可采用底座停靠位置不同的策略,以合理的提高***的稳定性。如:当片盒在上层时,底座停靠在距离货架100mm的距离左右,以尽可能的接近货架,缩短操作臂的运动距离和抓取力矩,减小倾翻的可能,此时片盒在机械臂的安装平面上,具有较大的运动空间,规划末端运动轨迹,不会同底座碰撞或干涉。当片盒在下层时,底座停靠在距离货架400mm的距离左右,距离货架较远,此时片盒在机械臂的安装平面下,运动空间较小,规划末端运动轨迹避免同底座碰撞或干涉。当片盒在中层时,根据片盒在上层方案和片盒在下层方案的策略折中考虑设计。
b)将末端执行器上的第一相机300侧转向货架,使声呐传感器24和第一相机300的镜头面对片盒。在声呐安全范围内如发现有物体出现,应立即停止工作,同时应使第一相机300和第二相机310对准片盒的法兰40位置进行测量。
c)利用第一相机测量片盒距离第一相机的距离X,通过测量镜头的放大倍率可转换到X,其中f为第一相机的镜头焦距。
d)Y方向可通过从图像中检测法兰上切口的位置,来进行切口定位。识别切口的方法可以为基于轮廓或灰度的模板匹配算法、基于角点及其描述符的匹配、基于直线检测的算法等。使用Hough变换或类似的直线测量算法,检测法兰相对于第一相机的Z及Rx旋转。
e)机械臂根据所测量到的片盒法兰的X,Y,Z,Rx等姿态,将第二相机310带到片盒顶部法兰的切口的正上方。
f)通过图形匹配的方法测量法兰上两个以上切口,再结合法兰本身的名义尺寸,可以计算出法兰的X,Y,Rz位置。
g)在正常情况下(必要时可做x-y向搜索),相机可捕捉到片盒表面的特征点,如片盒的顶部法兰的切口,根据片盒特征点在相机下的位置,换算相机距离片盒顶部法兰的x,y,z向距离与旋转Rz,进而求得机械臂的末端执行器距离该法兰的距离。
h)机械臂末端旋转,将末端执行器面向片盒顶部法兰。
i)根据求得的距离,移动末端执行器,使之叉入法兰底部,法兰的切口与末端执行器上定位销配合,将片盒托起并自定心,同时出发片盒在位开关,搬运车感知到片盒已在位。
j)机械臂随后按一定轨迹将片盒放置到期自身的装载位置上,该轨迹应不超过底座宽度方向的空间投影范围。
k)在底座的两侧装有侧向声呐,在进行搬运时,声呐开启,当有感知到移动对象接近时,机械臂减速,以防伤人,并发出警报,提醒人员远离操作现场。
l)放置片盒至搬运车装载位置时,机械手放慢速度下降,直至放置到位。
m)片盒搬运到车载位置后,RFID传感器读取片盒信息,并记录整个片盒的搬运数据。
n)将片盒搬运数据反馈至MES***。
o)根据定义的任务序列执行下一项任务。
4)放置片盒。放置片盒的操作步骤如下:
a)底座到位:该步骤与提取片盒的步骤a)相同
b)将机械臂末端的相机侧转向货架(面向片盒的Facial Datum Plane)。
c)机械臂将相机带到机台的装载接口/货架片盒固定板上方,捕捉特征点(如标准机台的装载接口上的pin),确定其中心位置(用来与片盒的轮廓或固定pin中心进行配合,使片盒定位)。
d)根据机台的装载接口/货架片盒固定板特征点在相机下的位置,换算相机距离其中心的x,y,z,Rz向距离,进而求得机械臂的末端执行器相对于放置位置的偏差。
e)根据已知的片盒固定位置,将末端执行器叉入片盒顶部法兰的底部,并将片盒托起,机械臂方可带动片盒上升,即可以与片盒的定位销脱离(做x-y向运动)。
f)根据求得的距离,机械臂随后按一定轨迹将片盒放置到机台的装载接口或货架片盒放置板上,该轨迹不超过底座的空间投影范围。
g)在底座的两侧装有侧向声呐,在进行搬运时,声呐开启,当有感知到移动对象接近时,机械臂减速,以防伤人,并发出警报,提醒人员远离操作现场。
h)放置片盒至机台的装载接口/货架片盒放置机构上方时,机械手放慢速度下降,直至放置稳定。
i)片盒搬运完成后,并记录整个片盒的搬运数据。
j)将片盒搬运数据反馈至MES***(Optional)。
k)根据定义的任务序列执行下一项任务。
综上,在本发明所提供的用于片盒夹持的机械手中,所述用于片盒夹持的机械手包括机械臂、设置于所述机械臂的末端的末端执行器以及设置于所述末端执行器上的视觉定位组件。本发明通过视觉定位组件定位所述片盒的法兰位置以实现对片盒的识别,即依据片盒本身特征进行识别,无需额外黏贴标记,提高了测量精度及抓取片盒的精准度;另一方面,末端执行器利用末端执行器上与所述片盒顶部法兰相适配的凹面夹持片盒顶部的法兰实现对片盒的搬运;此外,在凹面夹持法兰的同时,凹面上的定位销与法兰的切口对位实现了片盒的自定心,进一步提高了片盒定位的精准度。
上述描述仅是对本发明较佳实施例的描述,并非对本发明范围的任何限定,本发明领域的普通技术人员根据上述揭示内容做的任何变更、修饰,均属于权利要求书的保护范围。

Claims (12)

1.一种用于片盒夹持的机械手,其特征在于,包括:机械臂、设置于所述机械臂的末端的末端执行器以及设置于所述末端执行器上的视觉定位组件;
其中,所述视觉定位组件用于定位所述片盒顶部的法兰位置,所述视觉定位组件包括:水平定位结构和垂向定位结构,所述水平定位结构用于捕捉所述片盒表面水平方向上的特征,所述垂向定位结构用于捕捉所述片盒表面垂直方向上的特征,根据所述片盒表面水平方向上的特征及所述片盒表面垂直方向上的特征定位所述片盒的法兰位置;
所述末端执行器包括一与所述片盒顶部法兰相适配的凹面,根据所述片盒的法兰位置所述末端执行器通过所述凹面夹持片盒顶部的法兰;
所述凹面上至少设有两个定位销,所述定位销与所述法兰的切口对位;
所述视觉定位组件分别获取所述切口的侧面特征和俯视特征,进而将所述末端执行器伸入所述法兰下方对抓取所述片盒。
2.如权利要求1所述的用于片盒夹持的机械手,其特征在于,所述水平定位结构包括第一相机,所述第一相机的镜头垂直朝向所述末端执行器上的任意一侧支撑板。
3.如权利要求1所述的用于片盒夹持的机械手,其特征在于,所述垂向定位结构包括第二相机及反射镜,所述第二相机和所述反射镜均设置于所述末端执行器的一侧的侧壁上。
4.如权利要求1所述的用于片盒夹持的机械手,其特征在于,所述末端执行器为两侧带有支撑板的C字形半封闭结构。
5.如权利要求1所述的用于片盒夹持的机械手,其特征在于,所述末端执行器还包括设置于所述凹面前端的凸台,用于防止片盒滑落。
6.如权利要求1所述的用于片盒夹持的机械手,其特征在于,所述凹面上至少设有一个在位传感器,用于感知所述凹面是否夹持片盒。
7.如权利要求1所述的用于片盒夹持的机械手,其特征在于,还包括设置于所述末端执行器上的声呐传感器,用于对片盒搬运行程进行安全检测。
8.如权利要求1所述的用于片盒夹持的机械手,其特征在于,所述末端执行器与所述机械臂的末端呈倒L形。
9.如权利要求1所述的用于片盒夹持的机械手,其特征在于,所述末端执行器可绕所述机械臂的末端进行360度旋转运动。
10.如权利要求1所述的用于片盒夹持的机械手,其特征在于,所述机械臂的自由度为6个自由度。
11.一种自动片盒搬运装置,其特征在于,包括:自动导航小车、架设在所述自动导航小车上的运载框架及设置于所述运载框架上如权利要求1-10中任一项所述的用于片盒夹持的机械手。
12.如权利要求11所述的自动片盒搬运装置,其特征在于,还包括设置于所述运载框架上的片盒放置机构,所述机械手相对所述片盒放置机构设置于所述运载框架的一角。
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Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109935543A (zh) * 2017-12-18 2019-06-25 上海微电子装备(集团)股份有限公司 片盒自动运输设备及运输方法
CN110039514A (zh) * 2018-01-15 2019-07-23 均豪精密工业股份有限公司 机械手臂装置及机械手臂装置的控制方法
TWI665616B (zh) * 2018-07-27 2019-07-11 張志陸 倉儲管理系統及其方法
US11348816B2 (en) * 2018-07-31 2022-05-31 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for die container warehousing
CN110962110A (zh) * 2018-09-30 2020-04-07 上海微电子装备(集团)股份有限公司 机械臂和自动搬运装置
CN109300830B (zh) * 2018-10-12 2021-07-30 上海大族富创得科技有限公司 物料传输***以及物料传输方法
CN111128796B (zh) * 2018-10-30 2023-10-20 台湾积体电路制造股份有限公司 用于搬运半导体部件承载器的设备及方法
US20200161161A1 (en) * 2018-10-30 2020-05-21 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and methods for handling semiconductor part carriers
CN111470308B (zh) * 2019-01-23 2022-04-01 上海微电子装备(集团)股份有限公司 一种夹持机械手及自动搬运装置
DE102019211245A1 (de) * 2019-07-29 2021-02-04 Kuka Deutschland Gmbh Transportbehältergreifer
JP7395967B2 (ja) 2019-11-05 2023-12-12 オムロン株式会社 自走式搬送装置
JP7421077B2 (ja) * 2019-12-27 2024-01-24 シンフォニアテクノロジー株式会社 搬送システム
CN113043321A (zh) * 2019-12-27 2021-06-29 上海微电子装备(集团)股份有限公司 机械臂和搬运装置
US11527425B2 (en) * 2019-12-31 2022-12-13 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for tray cassette warehousing
JP7380330B2 (ja) 2020-02-28 2023-11-15 オムロン株式会社 搬送システム及び搬送ロボット
CN115916481A (zh) * 2020-03-03 2023-04-04 朗姆研究公司 带有室对接***的移动推车上的协作机器人***
US12027397B2 (en) 2020-03-23 2024-07-02 Applied Materials, Inc Enclosure system shelf including alignment features
CN111606033B (zh) * 2020-05-19 2021-12-17 芜湖奇达动力电池***有限公司 新能源汽车动力电池模组摆放设备及摆放方法
USD954769S1 (en) * 2020-06-02 2022-06-14 Applied Materials, Inc. Enclosure system shelf
KR102583574B1 (ko) * 2020-10-30 2023-10-05 세메스 주식회사 캐리지 로봇 및 이를 포함하는 타워 리프트
TWI770726B (zh) * 2020-12-18 2022-07-11 財團法人工業技術研究院 搬運機控制方法、系統及非揮發性電腦可讀記錄媒體
CN118255159A (zh) * 2022-12-28 2024-06-28 群创光电股份有限公司 自动搬运载具及使用其搬运物品的方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1611331A (zh) * 2003-10-29 2005-05-04 中国科学院自动化研究所 移动机械手***
CN1668424A (zh) * 2002-07-17 2005-09-14 株式会社安川电机 搬运用机器人***和搬运用机器人的控制方法
CN1733579A (zh) * 2004-07-29 2006-02-15 发那科株式会社 搬运机器人***
CN104858854A (zh) * 2015-05-21 2015-08-26 北京信息科技大学 一种轻型物体搬运机械手
CN105143075A (zh) * 2013-01-20 2015-12-09 株式会社大福 用于从拖车和集装箱卸载/卸装产品的自动卡车卸载器

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0739281B2 (ja) 1986-04-08 1995-05-01 三菱電機株式会社 カセツト移送装置
JPH05146984A (ja) * 1991-07-08 1993-06-15 Murata Mach Ltd ウエハカセツト用ハンドリングロボツト
JPH11297786A (ja) * 1998-04-09 1999-10-29 Shin Meiwa Ind Co Ltd ウエハカセット搬送用ロボット
JP2001203251A (ja) * 2000-01-20 2001-07-27 Yaskawa Electric Corp ウェハ搬送フォーク
US6506009B1 (en) 2000-03-16 2003-01-14 Applied Materials, Inc. Apparatus for storing and moving a cassette
US6678583B2 (en) * 2001-08-06 2004-01-13 Seminet, Inc. Robotic storage buffer system for substrate carrier pods
US20030110649A1 (en) * 2001-12-19 2003-06-19 Applied Materials, Inc. Automatic calibration method for substrate carrier handling robot and jig for performing the method
US7233841B2 (en) * 2002-04-19 2007-06-19 Applied Materials, Inc. Vision system
US7085622B2 (en) 2002-04-19 2006-08-01 Applied Material, Inc. Vision system
US7684895B2 (en) * 2002-08-31 2010-03-23 Applied Materials, Inc. Wafer loading station that automatically retracts from a moving conveyor in response to an unscheduled event
US7611318B2 (en) * 2003-01-27 2009-11-03 Applied Materials, Inc. Overhead transfer flange and support for suspending a substrate carrier
JP3962705B2 (ja) * 2003-06-05 2007-08-22 東京エレクトロン株式会社 処理装置
US7409263B2 (en) * 2004-07-14 2008-08-05 Applied Materials, Inc. Methods and apparatus for repositioning support for a substrate carrier
JP2006332460A (ja) * 2005-05-27 2006-12-07 Hitachi High-Tech Control Systems Corp ウェーハの搬送装置
CN1891591B (zh) * 2005-07-06 2011-05-04 上海华虹Nec电子有限公司 一种机械手自动硅片取放***及方法
JP4607910B2 (ja) * 2007-01-16 2011-01-05 東京エレクトロン株式会社 基板搬送装置及び縦型熱処理装置
US7967543B2 (en) * 2007-05-23 2011-06-28 Wynright Corporation Automatic case loader and method for use of same
SG187402A1 (en) * 2007-12-27 2013-02-28 Lam Res Corp Systems and methods for calibrating end effector alignment in a plasma processing system
WO2011155001A1 (ja) * 2010-06-11 2011-12-15 ムラテックオートメーション株式会社 コンベアシステム
KR101964964B1 (ko) * 2012-05-08 2019-08-07 세메스 주식회사 기판 이송 로봇의 자동 티칭 장치를 구비하는 반도체 제조 설비 및 그의 티칭 방법
JP6088243B2 (ja) * 2012-12-28 2017-03-01 川崎重工業株式会社 エンドエフェクタ
CN104626147A (zh) * 2013-11-11 2015-05-20 沈阳芯源微电子设备有限公司 一种机械手自动示教***及方法
CN105252516A (zh) * 2014-07-14 2016-01-20 沈阳芯源微电子设备有限公司 一种机械手自动示教***及控制方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1668424A (zh) * 2002-07-17 2005-09-14 株式会社安川电机 搬运用机器人***和搬运用机器人的控制方法
CN1611331A (zh) * 2003-10-29 2005-05-04 中国科学院自动化研究所 移动机械手***
CN1733579A (zh) * 2004-07-29 2006-02-15 发那科株式会社 搬运机器人***
CN105143075A (zh) * 2013-01-20 2015-12-09 株式会社大福 用于从拖车和集装箱卸载/卸装产品的自动卡车卸载器
CN104858854A (zh) * 2015-05-21 2015-08-26 北京信息科技大学 一种轻型物体搬运机械手

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