CN107316912A - 卷对卷柔性光伏组件的封装方法 - Google Patents
卷对卷柔性光伏组件的封装方法 Download PDFInfo
- Publication number
- CN107316912A CN107316912A CN201710685904.6A CN201710685904A CN107316912A CN 107316912 A CN107316912 A CN 107316912A CN 201710685904 A CN201710685904 A CN 201710685904A CN 107316912 A CN107316912 A CN 107316912A
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- Prior art keywords
- photovoltaic module
- volume
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- packing
- pressure
- Prior art date
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- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 43
- 238000012856 packing Methods 0.000 title claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 25
- 238000009413 insulation Methods 0.000 claims abstract description 12
- 238000005538 encapsulation Methods 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 15
- 238000001816 cooling Methods 0.000 claims description 14
- 238000003892 spreading Methods 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 230000006837 decompression Effects 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000004806 packaging method and process Methods 0.000 claims description 7
- 239000002313 adhesive film Substances 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 230000001360 synchronised effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000003475 lamination Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/044—PV modules or arrays of single PV cells including bypass diodes
- H01L31/0443—PV modules or arrays of single PV cells including bypass diodes comprising bypass diodes integrated or directly associated with the devices, e.g. bypass diodes integrated or formed in or on the same substrate as the photovoltaic cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
Abstract
Description
Claims (10)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710685904.6A CN107316912B (zh) | 2017-08-11 | 2017-08-11 | 卷对卷柔性光伏组件的封装方法 |
PCT/CN2018/094792 WO2019029301A1 (zh) | 2017-08-11 | 2018-07-06 | 光伏组件的封装方法 |
EP18187300.1A EP3442035A1 (en) | 2017-08-11 | 2018-08-03 | Packaging method for photovoltaic module |
CA3013382A CA3013382A1 (en) | 2017-08-11 | 2018-08-03 | Packaging method for photovoltaic module |
KR1020180091476A KR20190017666A (ko) | 2017-08-11 | 2018-08-06 | 광전지 모듈의 패키징 방법 |
AU2018213984A AU2018213984A1 (en) | 2017-08-11 | 2018-08-06 | Packaging Method For Photovoltaic Module |
JP2018147748A JP2019036722A (ja) | 2017-08-11 | 2018-08-06 | 太陽電池モジュールの封止方法 |
SG10201806736WA SG10201806736WA (en) | 2017-08-11 | 2018-08-08 | Packaging method for photovoltaic module |
US16/059,464 US20190051780A1 (en) | 2017-08-11 | 2018-08-09 | Packaging method for photovoltaic module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710685904.6A CN107316912B (zh) | 2017-08-11 | 2017-08-11 | 卷对卷柔性光伏组件的封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107316912A true CN107316912A (zh) | 2017-11-03 |
CN107316912B CN107316912B (zh) | 2018-10-16 |
Family
ID=60175723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710685904.6A Active CN107316912B (zh) | 2017-08-11 | 2017-08-11 | 卷对卷柔性光伏组件的封装方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US20190051780A1 (zh) |
EP (1) | EP3442035A1 (zh) |
JP (1) | JP2019036722A (zh) |
KR (1) | KR20190017666A (zh) |
CN (1) | CN107316912B (zh) |
AU (1) | AU2018213984A1 (zh) |
CA (1) | CA3013382A1 (zh) |
SG (1) | SG10201806736WA (zh) |
WO (1) | WO2019029301A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019029301A1 (zh) * | 2017-08-11 | 2019-02-14 | 北京铂阳顶荣光伏科技有限公司 | 光伏组件的封装方法 |
CN110581191A (zh) * | 2018-06-08 | 2019-12-17 | 君泰创新(北京)科技有限公司 | 一种光伏电池组件的制造方法 |
CN111403543A (zh) * | 2018-12-27 | 2020-07-10 | 龙焱能源科技(杭州)有限公司 | 一种光伏夹层玻璃封装方法、及光伏夹层玻璃 |
CN112201716A (zh) * | 2020-08-31 | 2021-01-08 | 重庆神华薄膜太阳能科技有限公司 | 一种用于柔性光伏组件的封装装置及方法 |
Citations (6)
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US20070163644A1 (en) * | 2004-02-19 | 2007-07-19 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer by use of chalcogen-containing vapor and inter-metallic material |
JP2011046046A (ja) * | 2009-08-26 | 2011-03-10 | Fujifilm Corp | 積層フィルムおよび複合フィルム |
US20110239450A1 (en) * | 2008-08-11 | 2011-10-06 | Basol Bulent M | Roll-to-roll manufacturing of flexible thin film photovoltaic modules |
CN102725865A (zh) * | 2010-01-26 | 2012-10-10 | 积水化学工业株式会社 | 太阳能电池用密封材料、太阳能电池保护片以及太阳能电池组件的制造方法 |
CN102856403A (zh) * | 2012-10-08 | 2013-01-02 | 深圳市创益科技发展有限公司 | 一种柔性太阳能电池组件阵列及其封装方法 |
CN104900755A (zh) * | 2015-04-15 | 2015-09-09 | 中节能太阳能科技(镇江)有限公司 | 太阳能电池双玻组件预封装方法及流水线 |
Family Cites Families (12)
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ES2072625T3 (es) * | 1990-10-01 | 1995-07-16 | United Solar Systems Corp | Metodo para estratificar estructuras compuestas para dispositivos fotovoltaicos. |
US5273608A (en) * | 1990-11-29 | 1993-12-28 | United Solar Systems Corporation | Method of encapsulating a photovoltaic device |
JP2000294815A (ja) * | 1999-04-09 | 2000-10-20 | Fuji Electric Co Ltd | 可撓性太陽電池モジュールの製造方法 |
US20090101204A1 (en) * | 2007-10-22 | 2009-04-23 | Biosolar, Inc. | Photovoltaic laminated module backsheet, films and coatings for use in module backsheet, and processes for making the same |
US20100031996A1 (en) * | 2008-08-11 | 2010-02-11 | Basol Bulent M | Structure and method of manufacturing thin film photovoltaic modules |
JP2011166075A (ja) * | 2010-02-15 | 2011-08-25 | Hitachi Ltd | 太陽電池モジュールの製造方法、太陽電池モジュールの製造装置及びロール状太陽電池モジュール |
US20110290296A1 (en) * | 2010-05-27 | 2011-12-01 | Palo Alto Research Center Incorporated | Flexible tiled photovoltaic module |
JP5075281B2 (ja) * | 2010-10-06 | 2012-11-21 | 積水化学工業株式会社 | フレキシブル太陽電池モジュール |
WO2012058053A2 (en) * | 2010-10-29 | 2012-05-03 | Applied Materials, Inc. | Monolithic module assembly using back contact solar cells and metal ribbon |
CN103889725A (zh) * | 2011-10-31 | 2014-06-25 | E.I.内穆尔杜邦公司 | 用于背接触式光伏组件的集成背板 |
CN104241442B (zh) * | 2013-06-21 | 2017-06-16 | 米尔鲍尔有限两合公司 | 用于制造太阳能电池模组链的方法及设备以及包括柔性太阳能电池的太阳能电池模组链 |
CN107316912B (zh) * | 2017-08-11 | 2018-10-16 | 北京铂阳顶荣光伏科技有限公司 | 卷对卷柔性光伏组件的封装方法 |
-
2017
- 2017-08-11 CN CN201710685904.6A patent/CN107316912B/zh active Active
-
2018
- 2018-07-06 WO PCT/CN2018/094792 patent/WO2019029301A1/zh active Application Filing
- 2018-08-03 CA CA3013382A patent/CA3013382A1/en not_active Abandoned
- 2018-08-03 EP EP18187300.1A patent/EP3442035A1/en not_active Withdrawn
- 2018-08-06 JP JP2018147748A patent/JP2019036722A/ja active Pending
- 2018-08-06 AU AU2018213984A patent/AU2018213984A1/en not_active Abandoned
- 2018-08-06 KR KR1020180091476A patent/KR20190017666A/ko not_active Application Discontinuation
- 2018-08-08 SG SG10201806736WA patent/SG10201806736WA/en unknown
- 2018-08-09 US US16/059,464 patent/US20190051780A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070163644A1 (en) * | 2004-02-19 | 2007-07-19 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer by use of chalcogen-containing vapor and inter-metallic material |
US20110239450A1 (en) * | 2008-08-11 | 2011-10-06 | Basol Bulent M | Roll-to-roll manufacturing of flexible thin film photovoltaic modules |
JP2011046046A (ja) * | 2009-08-26 | 2011-03-10 | Fujifilm Corp | 積層フィルムおよび複合フィルム |
CN102725865A (zh) * | 2010-01-26 | 2012-10-10 | 积水化学工业株式会社 | 太阳能电池用密封材料、太阳能电池保护片以及太阳能电池组件的制造方法 |
CN102856403A (zh) * | 2012-10-08 | 2013-01-02 | 深圳市创益科技发展有限公司 | 一种柔性太阳能电池组件阵列及其封装方法 |
CN104900755A (zh) * | 2015-04-15 | 2015-09-09 | 中节能太阳能科技(镇江)有限公司 | 太阳能电池双玻组件预封装方法及流水线 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019029301A1 (zh) * | 2017-08-11 | 2019-02-14 | 北京铂阳顶荣光伏科技有限公司 | 光伏组件的封装方法 |
CN110581191A (zh) * | 2018-06-08 | 2019-12-17 | 君泰创新(北京)科技有限公司 | 一种光伏电池组件的制造方法 |
CN111403543A (zh) * | 2018-12-27 | 2020-07-10 | 龙焱能源科技(杭州)有限公司 | 一种光伏夹层玻璃封装方法、及光伏夹层玻璃 |
CN112201716A (zh) * | 2020-08-31 | 2021-01-08 | 重庆神华薄膜太阳能科技有限公司 | 一种用于柔性光伏组件的封装装置及方法 |
CN112201716B (zh) * | 2020-08-31 | 2022-07-01 | 重庆神华薄膜太阳能科技有限公司 | 一种用于柔性光伏组件的封装装置及方法 |
Also Published As
Publication number | Publication date |
---|---|
AU2018213984A1 (en) | 2019-02-28 |
JP2019036722A (ja) | 2019-03-07 |
CN107316912B (zh) | 2018-10-16 |
CA3013382A1 (en) | 2019-02-11 |
KR20190017666A (ko) | 2019-02-20 |
WO2019029301A1 (zh) | 2019-02-14 |
EP3442035A1 (en) | 2019-02-13 |
US20190051780A1 (en) | 2019-02-14 |
SG10201806736WA (en) | 2019-03-28 |
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Effective date of registration: 20190507 Address after: 224051 Nanyang Town Sanjian Neighborhood Committee Group II (Hanneng Industrial Park) 4,5 blocks in Tinghu District, Yancheng City, Jiangsu Province Patentee after: Jiangsu Yancheng Grabao Equipment Technology Co., Ltd. Address before: 100176 Beijing Daxing District Beijing economic and Technological Development Zone Rongchang East Street 7 hospital 6 Building 3001 room. Patentee before: BEIJING BOYANG DINGRONG PHOTOVOLTAIC TECHNOLOGY CO., LTD. |
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Effective date of registration: 20210425 Address after: 518054 Room 201, building a, No.1 Qianwan 1st Road, Haishen Hong Kong cooperation zone, Shenzhen City, Guangdong Province Patentee after: Hongyi Technology Co.,Ltd. Address before: 224051 Nanyang Town Sanjian Neighborhood Committee Group II (Hanneng Industrial Park) 4,5 blocks in Tinghu District, Yancheng City, Jiangsu Province Patentee before: Jiangsu Yancheng Grabao Equipment Technology Co.,Ltd. |