CN111163250A - Camera module and electronic equipment - Google Patents
Camera module and electronic equipment Download PDFInfo
- Publication number
- CN111163250A CN111163250A CN201911426099.0A CN201911426099A CN111163250A CN 111163250 A CN111163250 A CN 111163250A CN 201911426099 A CN201911426099 A CN 201911426099A CN 111163250 A CN111163250 A CN 111163250A
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- camera
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The invention discloses a camera module and electronic equipment, wherein the camera module comprises a camera and a metal heat dissipation frame; wherein: the metal heat dissipation frame comprises a first plate body and a second plate body, the camera comprises a photosensitive chip, the photosensitive chip is attached to the second plate body, and the first plate body extends out of the second plate body and is attached to the side wall of the camera. In the camera module disclosed by the invention, the heat generated by the photosensitive chip is transferred to the first plate body and the second plate body, and the area of the first plate body and the second plate body covering the surface of the camera is larger, so that the heat dissipation area of the camera module is increased, the heat generated by the photosensitive chip can be dissipated in time and is not easy to gather on the camera module, and thus, the safety and the reliability of the camera module are improved, and the safety and the reliability of electronic equipment are further improved.
Description
Technical Field
The invention relates to the technical field of camera shooting, in particular to a camera module and electronic equipment.
Background
With the progress of technology and the development of electronic devices, electronic devices such as smart phones and wearable devices have become indispensable products in modern life. The electronic equipment is usually provided with a camera module to meet the requirements of users for shooting, video chatting and the like.
Along with the update of electronic equipment, the user is more and more high to the picture quality requirement of the shooting of electronic product and video chat, consequently, high resolution's sensitization chip is applied to in the camera module to improve the performance of camera module, and then satisfy user's demand.
However, because the high-resolution photosensitive chip generates more heat when working, the heat cannot be radiated out in time, and the heat may be gathered on the camera module, so that the camera module is burnt out, the safety and the reliability of the camera module are reduced, and the safety and the reliability of the electronic equipment are reduced.
Disclosure of Invention
The invention discloses a camera module and electronic equipment, and aims to solve the problem of low safety and reliability of the electronic equipment.
In order to solve the problems, the invention adopts the following technical scheme:
the embodiment of the invention discloses a camera module, which is applied to electronic equipment and comprises a camera and a metal heat dissipation frame; wherein:
the camera set up in on the metal heat dissipation frame, the metal heat dissipation frame includes first plate body and second plate body, the camera includes photosensitive chip, photosensitive chip with the second plate body is laminated mutually, first plate body certainly the second plate body extends out, and is attached the lateral wall of camera.
An electronic device comprises the camera module.
The technical scheme adopted by the invention can achieve the following beneficial effects:
in the camera module, the metal heat dissipation frame comprises the first plate body and the second plate body, the second plate body is attached to the photosensitive chip, the first plate body extends out of the second plate body and is attached to the side wall of the camera, at the moment, heat generated by the photosensitive chip is transferred to the first plate body and the second plate body, and the area of the surface of the camera covered by the first plate body and the second plate body is large, so that the heat dissipation area of the camera module is increased, the heat generated by the photosensitive chip can be dissipated timely, and is not easy to gather on the camera module, so that the safety and the reliability of the camera module are improved, and the safety and the reliability of electronic equipment are further improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view illustrating an assembly of a camera module and a first circuit board according to an embodiment of the present invention;
fig. 2 is a schematic view illustrating a camera module according to an embodiment of the present invention when detached from a first circuit board;
FIG. 3 is a partial cross-sectional view of FIG. 1;
fig. 4 is a schematic structural diagram of a camera module disclosed in the embodiment of the present invention;
fig. 5 is a schematic structural view of a camera module disclosed in the embodiment of the present invention at another angle;
fig. 6 is an exploded view of a camera module according to an embodiment of the present invention;
fig. 7 is a flowchart illustrating a process of manufacturing a metal heat sink of a camera module according to an embodiment of the present invention.
Description of reference numerals:
110-camera, 111-lens, 112-photosensitive chip, 120-metal heat dissipation frame, 121-first board, 122-second board, 123-third board, 124-fourth board, 125-fifth board, 126-sixth board, 127-seventh board, 130-second circuit board, 131-first electric connector,
200-first circuit board, 210-avoidance hole, 220-second electrical connector.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
As shown in fig. 1 to 7, an embodiment of the present invention discloses a camera module, which is applied to an electronic device, and the camera module may include a camera 110 and a metal heat dissipation frame 120.
The camera 110 is a main body of the camera module, the camera 110 specifically includes a lens 111 and a photosensitive chip 112, and light rays in an external environment enter the camera 110 through the lens 111 and are transmitted to the photosensitive chip 112, so as to be converted into image information. Optionally, the photosensitive chip 112 may be a high-resolution photosensitive chip, so that the camera module has better performance, and further the electronic device has better user experience. The photo-sensing chip 112 may be a CMOS (complementary metal Oxide Semiconductor) imaging chip.
The camera module is disposed on the metal heat dissipation frame 120, the metal heat dissipation frame 120 may include a first plate 121 and a second plate 122, the light sensing chip 112 of the camera 110 is attached to the second plate 122, and the first plate 121 extends from the second plate 122 and is attached to the side wall of the camera 110. Optionally, the metal heat dissipation frame 120 may be made of silver, copper, aluminum, steel, or other materials.
In the embodiment of the present invention, the heat generated by the photosensitive chip 112 is transferred to the first plate 121 and the second plate 122, and the area of the first plate 121 and the second plate 122 covering the surface of the camera 110 is large, so that the heat dissipation area of the camera module is increased, the heat generated by the photosensitive chip 112 can be dissipated in time, and is not easily accumulated on the camera module, so that the safety and reliability of the camera module are improved, and the safety and reliability of the electronic device are further improved.
In order to further improve the heat dissipation performance of the camera module, in an optional embodiment, the metal heat dissipation frame 120 may further include a third plate 123, the third plate 123 is connected to the first plate 121 through the second plate 122, the third plate 123 extends out from the second plate 122 and is attached to a sidewall of the camera 110, and the first plate 121 and the third plate 123 are disposed in parallel. This scheme makes the area that metal heat dissipation frame 120 covers the surface of camera 110 bigger to make the heat radiating area of camera module bigger, and then improved the heat dispersion of camera module.
In an optional embodiment, the metal heat sink 120 may further include a fourth board 124, the fourth board 124 is disposed between the first board 121 and the third board 123, the third board 123 is connected to the first board 121 through the fourth board 124, and the fourth board 124 is connected to the second board 122. This mode has further increased the heat radiating area of camera module to the radiating efficiency of camera module has further been improved. Meanwhile, the side wall of the camera 110 is wrapped by three surfaces of the metal heat dissipation frame 120, which is equivalent to a metal shell sleeved on the camera 110, so that the camera 110 is prevented from being scratched, and the safety of the camera module is improved.
The electronic apparatus may further include a first circuit board 200, and the camera module is disposed on the first circuit board 200 and electrically connected to the first circuit board 200. However, since the stacking height of the camera module and the first circuit board 200 is larger, the camera module and the first circuit board 200 occupy a larger space of the housing of the electronic device, so that the thickness of the electronic device is larger, and the lightness and thinness of the electronic device are reduced. In another embodiment, the first circuit board 200 is provided with an avoidance hole 210, and part of the camera modules are arranged in the avoidance space. At this time, a part of the camera module is hidden in the first circuit board 200, so that the stacking height of the first circuit board 200 and the camera module is reduced, and the lightness and thinness of the electronic device are improved.
Specifically, the first circuit board 200 may be a main board of the electronic device or a sub-board of the electronic device, and in the embodiment of the present invention, the first circuit board 200 may be a rigid circuit board or a flexible circuit board. For example, the first circuit board 200 may be a printed circuit board, or may be a rigid-flex board, or the first circuit board 200 includes a flexible circuit board and a stiffener that are attached to each other. Of course, other configurations may be used, and are not limited herein.
The camera module is provided with the mounting bracket near the position of camera lens, and the edge overlap joint of mounting bracket is on the circuit board. This just makes the equipment part quantity of camera module more for the equipment process of camera module is more, thereby makes the manufacturing cost of camera module higher, and production efficiency is lower. In another embodiment, the metal heat dissipation frame 120 may further include a third plate 123, a fifth plate 125 and a sixth plate 126, the third plate 123 is connected to the first plate 121 through the second plate 122, the third plate 123 extends from the second plate 122 and is attached to a side wall of the camera 110, and the first plate 121 and the third plate 123 are disposed in parallel.
The fifth board 125 extends from the first board 121, the fifth board 125 is connected to the first circuit board 200 in an overlapping manner, the sixth board 126 extends from the third board 123, and the sixth board 126 is connected to the first circuit board 200 in an overlapping manner. At this time, the metal heat dissipation frame 120 is equivalent to a mounting frame, so that the first circuit board 200 is fixedly connected to the camera module.
Meanwhile, heat can also be transmitted to the first circuit board 200 through the fifth board body 125 and the sixth board body 126, and the first circuit board 200 can also be used as a heat dissipation component of the camera module, so that the heat dissipation area of the camera module is further increased, and the heat dissipation efficiency of the camera module is further improved.
Further, the metal heat sink 120 may further include a fourth plate 124 and a seventh plate 127, the fourth plate 124 is disposed between the first plate 121 and the third plate 123, the third plate 123 is connected to the first plate 121 through the fourth plate 124, and the fourth plate 124 is connected to the second plate 122.
The seventh board 127 extends from the fourth board 124, and the seventh board 127 is connected to the first circuit board 200. At this moment, the fifth board body 125, the sixth board body 126 and the seventh board body 127 are all lapped on the first circuit board 200, so that the connection between the camera module and the first circuit board 200 is more stable, the camera module is not easy to shake on the first circuit board 200, and the safety of the electronic device is ensured. Simultaneously, can also further increase the heat radiating area of camera module, and then improve the radiating efficiency. In addition, some cameras 110 are wrapped up in metal heat dissipation frame 120, have been equivalent to established metal casing for camera 110 cover to the effectual wearing and tearing of first circuit board 200 to camera 110 that have prevented has improved the security of camera module.
In the above embodiment, the first plate 121, the second plate 122, the third plate 123, the fourth plate 124, the fifth plate 125, the sixth plate 126, and the seventh plate 127 may be connected by welding. However, a plurality of plate bodies are welded, so that the workload of operators is increased, time and labor are wasted, the welding precision cannot be guaranteed when the plurality of plate bodies are welded, in addition, the number of welding seams is large, and interference with other parts can occur during assembly. Therefore, in an alternative embodiment, the first plate 121, the second plate 122, the third plate 123, the fourth plate 124, the fifth plate 125, the sixth plate 126, and the seventh plate 127 may be integrally formed. At this moment, the metal heat dissipation frame 120 has a simple processing technology, is convenient to operate, and has high processing precision, in addition, the metal heat dissipation frame 120 has no welding seam, so that the metal heat dissipation frame is not easy to interfere with other components, the metal heat dissipation frame 120 is integrally formed, the connection among the plate bodies is tight, the manufacturing materials are the same, and the heat conduction efficiency among the plate bodies is high. Optionally, the metal heat dissipation frame 120 may be manufactured by a bending process, and a specific process flow thereof is shown in fig. 7.
The camera module is provided with the second circuit board 130, the second circuit board 130 needs to be electrically connected with the first circuit board 200, because the joint of the second circuit board 130 and the camera 110 is hidden in the avoiding hole 210, at this time, the connecting position of the second circuit board 130 and the camera 110 needs to be changed, and the connecting position is moved out of the avoiding hole 210, so that the second circuit board 130 and the first circuit board 200 can be electrically connected, in this way, the layout of the circuit structure inside the camera module needs to be changed, thereby increasing the difficulty of the production and manufacture of the camera module, therefore, in an optional embodiment, an opening is formed between the first board body 121 and the third board body 123, one end of the second circuit board 130 is connected with the camera 110, and the other end of the second circuit board 130 penetrates through the opening and is electrically connected with the first circuit board 200. At this time, the metal heat dissipation frame 120 reserves an opening so that the second circuit board 130 can penetrate out and be electrically connected with the first circuit board 200, so that the first circuit board 200 and the second circuit board 130 can be electrically connected without changing the circuit structure of the camera module, and the difficulty of manufacturing the camera module is low. Optionally, one end of the second circuit board 130 is provided with a first electrical connector 131, the first circuit board 200 is provided with a second electrical connector 220, and the first electrical connector 131 is electrically connected to the second electrical connector 220 in an inserting manner, so that the second circuit board 130 is electrically connected to the first circuit board 200.
In the above embodiment, the heat of the camera 110 is transferred to the metal heat dissipation frame 120, and the heat is dissipated by the natural convection of the outside air, however, the heat dissipation efficiency is low. In order to further improve the heat dissipation efficiency of the camera module, in an alternative embodiment, at least a portion of the metal heat dissipation frame 120 may be a temperature equalization plate. The phase-change medium is filled in the temperature-equalizing plate, the temperature-equalizing plate is provided with an evaporation area and a condensation area, the temperature of the evaporation area is increased, and the phase-change medium on one side of the temperature-equalizing plate, which is close to the evaporation area, absorbs heat to evaporate and carries away a large amount of heat. The working medium of evaporation reachs the condensation zone, because the temperature of condensation zone is lower, the steam of phase change medium can be rapid condense into liquid and release the heat to realize the high-efficient heat dissipation of camera module, at this moment, through the high-efficient heat dispersion of samming board self, can improve the radiating efficiency of camera module. Since the specific structure of the vapor chamber is known in the art, it is not described herein in detail.
Based on the camera module according to any one of the embodiments of the present invention, an embodiment of the present invention further discloses an electronic device, and the disclosed electronic device has the camera module according to any one of the embodiments.
The electronic device disclosed by the embodiment of the invention can be a smart phone, a tablet computer, an electronic book reader or a wearable device. Of course, the electronic device may also be other devices, and the embodiment of the present invention is not limited thereto.
In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. A camera module is applied to electronic equipment and is characterized by comprising a camera (110) and a metal heat dissipation frame (120); wherein:
camera (110) set up in on metal heat dissipation frame (120), metal heat dissipation frame (120) include first plate body (121) and second plate body (122), camera (110) are including sensitization chip (112), sensitization chip (112) with second plate body (122) are laminated mutually, first plate body (121) certainly second plate body (122) extend out, and it is attached the lateral wall of camera (110).
2. The camera module according to claim 1, wherein the metal heat sink (120) further comprises a third plate (123), the third plate (123) is connected to the first plate (121) through the second plate (122), the third plate (123) extends from the second plate (122) and is attached to a sidewall of the camera (110), and the first plate (121) and the third plate (123) are disposed in parallel.
3. The camera module according to claim 2, wherein the metal heat sink (120) further comprises a fourth board body (124), the fourth board body (124) is disposed between the first board body (121) and the third board body (123), the third board body (123) is connected to the first board body (121) through the fourth board body (124), and the fourth board body (124) is connected to the second board body (122).
4. The camera module according to claim 1, wherein the electronic device comprises a first circuit board (200), the first circuit board (200) is provided with an avoiding hole (210), and a part of the camera module is disposed in the avoiding hole (210).
5. The camera module according to claim 4, wherein the metal heat sink (120) further comprises a third plate (123), a fifth plate (125) and a sixth plate (126), the third plate (123) is connected to the first plate (121) through the second plate (122), the third plate (123) extends from the second plate (122) and is attached to a side wall of the camera (110), and the first plate (121) and the third plate (123) are disposed in parallel;
the fifth plate body (125) extends from the first plate body (121), the fifth plate body (125) is in lap joint with the first circuit board (200), the sixth plate body (126) extends from the third plate body (123), and the sixth plate body (126) is in lap joint with the first circuit board (200).
6. The camera module according to claim 5, wherein the metal heat sink (120) further comprises a fourth plate (124) and a seventh plate (127), the fourth plate (124) is disposed between the first plate (121) and the third plate (123), the third plate (123) is connected to the first plate (121) through the fourth plate (124), and the fourth plate (124) is connected to the second plate (122);
the seventh board body (127) extends from the fourth board body (124), and the seventh board body (127) is overlapped with the first circuit board (200).
7. The camera module according to claim 6, wherein the first plate (121), the second plate (122), the third plate (123), the fourth plate (124), the fifth plate (125), the sixth plate (126) and the seventh plate (127) are integrally formed.
8. The camera module according to claim 5, wherein a second circuit board (130) is disposed, an opening is formed between the first board (121) and the third board (123), one end of the second circuit board (130) is connected to the camera (110), and the other end of the second circuit board (130) passes through the opening and is electrically connected to the first circuit board (200).
9. The camera module of claim 1, wherein at least a portion of the metal heat sink (120) is a vapor chamber.
10. An electronic device, comprising the camera module of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911426099.0A CN111163250B (en) | 2019-12-31 | 2019-12-31 | Camera module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911426099.0A CN111163250B (en) | 2019-12-31 | 2019-12-31 | Camera module and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111163250A true CN111163250A (en) | 2020-05-15 |
| CN111163250B CN111163250B (en) | 2022-07-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911426099.0A Active CN111163250B (en) | 2019-12-31 | 2019-12-31 | Camera module and electronic equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN111163250B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111929970A (en) * | 2020-08-31 | 2020-11-13 | 维沃移动通信有限公司 | Electronic equipment and camera module thereof |
| CN112887542A (en) * | 2021-01-21 | 2021-06-01 | 维沃移动通信有限公司 | Electronic device |
| CN113949791A (en) * | 2020-07-16 | 2022-01-18 | Oppo广东移动通信有限公司 | Electronic equipment |
| EP4083953A3 (en) * | 2021-04-29 | 2023-02-08 | Carefusion 303 Inc. | Medical device with a surveillance camera mounted to it. |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113949791A (en) * | 2020-07-16 | 2022-01-18 | Oppo广东移动通信有限公司 | Electronic equipment |
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| CN111929970B (en) * | 2020-08-31 | 2022-02-01 | 维沃移动通信有限公司 | Electronic equipment and camera module thereof |
| CN112887542A (en) * | 2021-01-21 | 2021-06-01 | 维沃移动通信有限公司 | Electronic device |
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| US11995964B2 (en) | 2021-04-29 | 2024-05-28 | Carefusion 303, Inc. | Surveillance camera |
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| Publication number | Publication date |
|---|---|
| CN111163250B (en) | 2022-07-01 |
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