CN207592775U - A kind of powder Sputting film-plating apparatus - Google Patents
A kind of powder Sputting film-plating apparatus Download PDFInfo
- Publication number
- CN207592775U CN207592775U CN201721830235.9U CN201721830235U CN207592775U CN 207592775 U CN207592775 U CN 207592775U CN 201721830235 U CN201721830235 U CN 201721830235U CN 207592775 U CN207592775 U CN 207592775U
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- CN
- China
- Prior art keywords
- plated film
- powder
- film cavity
- conveyance conduit
- export
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model is related to a kind of powder Sputting film-plating apparatus, including plated film cavity, the plated film cavity top is rotatably provided with separation turntable, side in the middle part of the plated film cavity is provided with sputter cathode, the plated film cavity bottom is connected with conveyance conduit input end, the port of export of the conveyance conduit is connected to the top of plated film cavity, and the port of export of the conveyance conduit is arranged on the offside of sputter cathode and rotatably sets flexible auger in the top of separation turntable, the conveyance conduit；The utility model is realized deposits various functions film layer in powder surface, increases its hardness, anticorrosive and surface is modified.
Description
Technical field
The utility model is related to plated film field more particularly to a kind of powder Sputting film-plating apparatus.
Background technology
At present, the mode for being usually used in vacuum powder plated film is that powder is atomized using the method for vibrations, then to mist
The powder of change carries out plated film, but uneven in powder quality is difficult to obtain uniform atomizing, and final is difficult to obtain so that all
Powder obtains uniform film layer, and yield rate is relatively low.In addition in a manner that vibrations are atomized, there is a fixed limit to being once packed into powder quantity
System, a large amount of powders are difficult once to be packed into.
Based on this, need it is a kind of can once prepare a large amount of powders, plating film uniformity be greatly improved, not by powder granular size
Limitation, the powder Sputting film-plating apparatus that simple in structure, performance is stable, easy to operate are devised.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, obtain it is a kind of can once prepare a large amount of powders,
Film uniformity is greatly improved, is not limited by powder granular size, is simple in structure, performance is stable for plating, the sputtering of easy to operate powder
Coating apparatus.
The utility model is to be achieved through the following technical solutions：
A kind of powder Sputting film-plating apparatus, including plated film cavity, the plated film cavity top is rotatably provided with separation and turns
Disk, the side in the middle part of the plated film cavity are provided with sputter cathode, and the plated film cavity bottom is connected with conveyance conduit input end,
The port of export of the conveyance conduit is connected to the top of plated film cavity, and the port of export of the conveyance conduit is arranged on sputter cathode
Offside and positioned at the top of separation turntable, rotatably sets flexible auger in the conveyance conduit.
Preferably, the bottom of the plated film cavity is conical structure, the area of section edge of conical structure goes out powder side
To being gradually reduced.
It is arranged in plated film cavity preferably, the port of export of the conveyance conduit stretches into, the port of export stretches into part
Lower part is porous structure.
Compared with prior art, the beneficial effects of the utility model are：The utility model is mainly used in powder body material
Surface is modified, its is made to obtain better corrosion resistance, hardness or weldability, by be provided with porous structure conveyance conduit and
Powder is delivered to free-falling at the top of cavity, in dropping process by the effect of its inner flexible auger from plated film cavity bottom
By the effect for detaching turntable so that powder is uniformly distributed simultaneously free-falling in the cavity；It, can basis by setting sputter cathode
It needs to assemble different sputtering target materials, target atom or molecule is made to be sputtered from target material surface under electric field and magnetic field double action
Come, collide and be deposited on the powder surface of free-falling, deposit various functions film layer so as to fulfill in powder surface, it is hard to increase it
Degree, anticorrosive and surface are modified.
Description of the drawings
Fig. 1 is the structure diagram of the utility model.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention is further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
Referring to Fig. 1, a kind of powder Sputting film-plating apparatus, including plated film cavity 2,2 top of plated film cavity is rotatable
Separation turntable 3 is provided with, the side at 2 middle part of plated film cavity is provided with sputter cathode 6,2 bottom of the plated film cavity connection
There is 4 input end of conveyance conduit, the port of export of the conveyance conduit 4 is connected to the top of plated film cavity 2, the conveyance conduit 4
The port of export is arranged on the offside of sputter cathode 6 and is rotatably provided in the top of separation turntable 3, the conveyance conduit 4
Flexible auger 5.
When it is implemented, the bottom of the plated film cavity 2 is conical structure, the area of section edge of conical structure goes out powder
Direction is gradually reduced, and the whereabouts of powder 1 is facilitated to concentrate.
When it is implemented, the port of export of the conveyance conduit 4 is stretched into and is arranged in plated film cavity 2, the extending portion of the port of export
The lower part divided is porous structure so that powder 1 is in even drop down state.
The operation principle of the present apparatus is：Powder 1 is packed into inside plated film cavity 2, the movement of powder 1 is to pass through conveyance conduit
4 and the effect of flexible auger 5, movement from bottom to top is realized inside plated film cavity 2, powder 1 is at 2 top of plated film cavity
During free-falling, under the action of turntable 3 is detached, being detached and uniformly fallen, dropping process is in free falling body state,
Plated film cavity 2 under vacuum conditions, sputtering target material on sputter cathode 6 after powered up target atom or molecule can sputter with
Powder 1 collides and is deposited on powder 1, and 2 bottom of plated film cavity uses conical structure, and the whereabouts of powder 1 is facilitated to concentrate,
Powder 1 rises to top from 2 bottom of plated film cavity to be realized by the effect of conveyance conduit 4 and flexible auger 5, conveyance conduit 4
Upper level pars infrasegmentalis use porous structure so that powder 1 is in even drop down state, and powder 1 falls behind under conveyance conduit 4
Under the action of detaching turntable 3, uniformly separation again, in atomization free-falling, dropping process does irregular movement, 1 surface of powder
The probability of face sputter cathode 6 is consistent everywhere so that coating film thickness is consistent everywhere.
The specific operation process of the present apparatus when in use is that powder 1 is packed into inside plated film cavity 2, and plated film cavity 2 utilizes
Included extract system carries out being evacuated to all pressure, starts flexible auger 5 and separation turntable 3, powder 1 is in plated film cavity 2
After inside is risen by conveyance conduit 4 and sputter cathode 6 is opened in free-falling, reciprocating motion, and plated film is carried out to powder 1,
Stop sputter cathode 6 after thickness needed for 1 surface coating of powder reaches, and deflate to plated film cavity 2, finally take out powder
1。
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (3)
1. a kind of powder Sputting film-plating apparatus, which is characterized in that including plated film cavity, the plated film cavity top is rotatably set
There is a separation turntable, the side in the middle part of the plated film cavity is provided with sputter cathode, and the plated film cavity bottom is connected with delivery pipe
Road input end, the port of export of the conveyance conduit are connected to the top of plated film cavity, and the port of export of the conveyance conduit is arranged on
The offside of sputter cathode and positioned at the top of separation turntable, rotatably sets flexible auger in the conveyance conduit.
2. a kind of powder Sputting film-plating apparatus according to claim 1, it is characterised in that：The bottom of the plated film cavity is
Conical structure, the area of section edge of conical structure go out powder direction and are gradually reduced.
3. a kind of powder Sputting film-plating apparatus according to claim 1, it is characterised in that：The port of export of the conveyance conduit
It stretches into and is arranged in plated film cavity, the lower part for stretching into part of the port of export is porous structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721830235.9U CN207592775U (en) | 2017-12-22 | 2017-12-22 | A kind of powder Sputting film-plating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721830235.9U CN207592775U (en) | 2017-12-22 | 2017-12-22 | A kind of powder Sputting film-plating apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207592775U true CN207592775U (en) | 2018-07-10 |
Family
ID=62766616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721830235.9U Expired - Fee Related CN207592775U (en) | 2017-12-22 | 2017-12-22 | A kind of powder Sputting film-plating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207592775U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021063998A1 (en) | 2019-09-30 | 2021-04-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Low-pressure coating system and method for coating separated powders or fibres by means of physical or chemical vapour phase deposition |
-
2017
- 2017-12-22 CN CN201721830235.9U patent/CN207592775U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021063998A1 (en) | 2019-09-30 | 2021-04-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Low-pressure coating system and method for coating separated powders or fibres by means of physical or chemical vapour phase deposition |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180710 Termination date: 20211222 |