CN107108322B - 脆性衬底的分断方法 - Google Patents
脆性衬底的分断方法 Download PDFInfo
- Publication number
- CN107108322B CN107108322B CN201580058145.XA CN201580058145A CN107108322B CN 107108322 B CN107108322 B CN 107108322B CN 201580058145 A CN201580058145 A CN 201580058145A CN 107108322 B CN107108322 B CN 107108322B
- Authority
- CN
- China
- Prior art keywords
- line
- brittle substrate
- forming
- groove
- groove line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-219929 | 2014-10-29 | ||
JP2014219929 | 2014-10-29 | ||
PCT/JP2015/073989 WO2016067728A1 (ja) | 2014-10-29 | 2015-08-26 | 脆性基板の分断方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107108322A CN107108322A (zh) | 2017-08-29 |
CN107108322B true CN107108322B (zh) | 2020-01-14 |
Family
ID=55857074
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201580058145.XA Expired - Fee Related CN107108322B (zh) | 2014-10-29 | 2015-08-26 | 脆性衬底的分断方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6288293B2 (ja) |
KR (1) | KR101866824B1 (ja) |
CN (1) | CN107108322B (ja) |
TW (1) | TWI656102B (ja) |
WO (1) | WO2016067728A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11851361B2 (en) | 2018-12-06 | 2023-12-26 | Schott Ag | Glass element with cut edge and method of producing same |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002104078A1 (fr) | 2001-06-14 | 2002-12-27 | Mitsuboshi Diamond Industrial Co., Ltd. | Dispositif et procede de fabrication d'un ecran electroluminescent organique |
TWI226877B (en) | 2001-07-12 | 2005-01-21 | Mitsuboshi Diamond Ind Co Ltd | Method of manufacturing adhered brittle material substrates and method of separating adhered brittle material substrates |
WO2004048058A1 (ja) * | 2002-11-22 | 2004-06-10 | Mitsuboshi Diamond Industrial Co.,Ltd. | 基板分断方法およびその方法を用いたパネル製造方法 |
WO2004067243A1 (ja) * | 2003-01-29 | 2004-08-12 | Mitsuboshi Diamond Industrial Co., Ltd. | 基板分断装置および基板分断方法 |
CN101296787B (zh) * | 2005-10-28 | 2012-02-15 | 三星钻石工业股份有限公司 | 脆性材料基板的划线形成方法及划线形成装置 |
JP2007160811A (ja) * | 2005-12-15 | 2007-06-28 | Pioneer Electronic Corp | 平面表示パネルの製造方法およびガラス板の分割方法 |
JP2007331983A (ja) * | 2006-06-15 | 2007-12-27 | Sony Corp | ガラスのスクライブ方法 |
JP4885675B2 (ja) * | 2006-09-27 | 2012-02-29 | 株式会社Nsc | 貼合せガラス板の切断分離方法 |
JP2008201629A (ja) * | 2007-02-21 | 2008-09-04 | Epson Imaging Devices Corp | 電気光学装置の製造方法、基板の分断方法、及び、基板分断装置 |
WO2009050938A1 (ja) * | 2007-10-16 | 2009-04-23 | Mitsuboshi Diamond Industrial Co., Ltd. | 脆性材料基板のu字状溝加工方法およびこれを用いた除去加工方法およびくり抜き加工方法および面取り方法 |
JP5450964B2 (ja) * | 2008-02-29 | 2014-03-26 | 三星ダイヤモンド工業株式会社 | スクライブ装置及びスクライブ方法 |
KR101247571B1 (ko) * | 2010-06-14 | 2013-03-26 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성 재료 기판의 스크라이브 방법 |
JP5210356B2 (ja) * | 2010-06-14 | 2013-06-12 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のスクライブ方法 |
JP2013010644A (ja) * | 2011-06-28 | 2013-01-17 | Mitsuboshi Diamond Industrial Co Ltd | ガラス基板のスクライブ方法 |
US9701043B2 (en) * | 2012-04-24 | 2017-07-11 | Tokyo Seimitsu Co., Ltd. | Dicing blade |
JP6039363B2 (ja) * | 2012-10-26 | 2016-12-07 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断方法並びに分断装置 |
-
2015
- 2015-08-26 CN CN201580058145.XA patent/CN107108322B/zh not_active Expired - Fee Related
- 2015-08-26 WO PCT/JP2015/073989 patent/WO2016067728A1/ja active Application Filing
- 2015-08-26 JP JP2016556408A patent/JP6288293B2/ja not_active Expired - Fee Related
- 2015-08-26 KR KR1020177011745A patent/KR101866824B1/ko active IP Right Grant
- 2015-08-31 TW TW104128694A patent/TWI656102B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11851361B2 (en) | 2018-12-06 | 2023-12-26 | Schott Ag | Glass element with cut edge and method of producing same |
Also Published As
Publication number | Publication date |
---|---|
KR20170067805A (ko) | 2017-06-16 |
JPWO2016067728A1 (ja) | 2017-07-06 |
JP6288293B2 (ja) | 2018-03-07 |
TW201615579A (zh) | 2016-05-01 |
CN107108322A (zh) | 2017-08-29 |
KR101866824B1 (ko) | 2018-07-17 |
WO2016067728A1 (ja) | 2016-05-06 |
TWI656102B (zh) | 2019-04-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200114 Termination date: 20210826 |