CN107108322B - 脆性衬底的分断方法 - Google Patents

脆性衬底的分断方法 Download PDF

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Publication number
CN107108322B
CN107108322B CN201580058145.XA CN201580058145A CN107108322B CN 107108322 B CN107108322 B CN 107108322B CN 201580058145 A CN201580058145 A CN 201580058145A CN 107108322 B CN107108322 B CN 107108322B
Authority
CN
China
Prior art keywords
line
brittle substrate
forming
groove
groove line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201580058145.XA
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English (en)
Chinese (zh)
Other versions
CN107108322A (zh
Inventor
曾山浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN107108322A publication Critical patent/CN107108322A/zh
Application granted granted Critical
Publication of CN107108322B publication Critical patent/CN107108322B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037Controlling or regulating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
CN201580058145.XA 2014-10-29 2015-08-26 脆性衬底的分断方法 Expired - Fee Related CN107108322B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-219929 2014-10-29
JP2014219929 2014-10-29
PCT/JP2015/073989 WO2016067728A1 (ja) 2014-10-29 2015-08-26 脆性基板の分断方法

Publications (2)

Publication Number Publication Date
CN107108322A CN107108322A (zh) 2017-08-29
CN107108322B true CN107108322B (zh) 2020-01-14

Family

ID=55857074

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580058145.XA Expired - Fee Related CN107108322B (zh) 2014-10-29 2015-08-26 脆性衬底的分断方法

Country Status (5)

Country Link
JP (1) JP6288293B2 (ja)
KR (1) KR101866824B1 (ja)
CN (1) CN107108322B (ja)
TW (1) TWI656102B (ja)
WO (1) WO2016067728A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11851361B2 (en) 2018-12-06 2023-12-26 Schott Ag Glass element with cut edge and method of producing same

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002104078A1 (fr) 2001-06-14 2002-12-27 Mitsuboshi Diamond Industrial Co., Ltd. Dispositif et procede de fabrication d'un ecran electroluminescent organique
TWI226877B (en) 2001-07-12 2005-01-21 Mitsuboshi Diamond Ind Co Ltd Method of manufacturing adhered brittle material substrates and method of separating adhered brittle material substrates
WO2004048058A1 (ja) * 2002-11-22 2004-06-10 Mitsuboshi Diamond Industrial Co.,Ltd. 基板分断方法およびその方法を用いたパネル製造方法
WO2004067243A1 (ja) * 2003-01-29 2004-08-12 Mitsuboshi Diamond Industrial Co., Ltd. 基板分断装置および基板分断方法
CN101296787B (zh) * 2005-10-28 2012-02-15 三星钻石工业股份有限公司 脆性材料基板的划线形成方法及划线形成装置
JP2007160811A (ja) * 2005-12-15 2007-06-28 Pioneer Electronic Corp 平面表示パネルの製造方法およびガラス板の分割方法
JP2007331983A (ja) * 2006-06-15 2007-12-27 Sony Corp ガラスのスクライブ方法
JP4885675B2 (ja) * 2006-09-27 2012-02-29 株式会社Nsc 貼合せガラス板の切断分離方法
JP2008201629A (ja) * 2007-02-21 2008-09-04 Epson Imaging Devices Corp 電気光学装置の製造方法、基板の分断方法、及び、基板分断装置
WO2009050938A1 (ja) * 2007-10-16 2009-04-23 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板のu字状溝加工方法およびこれを用いた除去加工方法およびくり抜き加工方法および面取り方法
JP5450964B2 (ja) * 2008-02-29 2014-03-26 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
KR101247571B1 (ko) * 2010-06-14 2013-03-26 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 스크라이브 방법
JP5210356B2 (ja) * 2010-06-14 2013-06-12 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
JP2013010644A (ja) * 2011-06-28 2013-01-17 Mitsuboshi Diamond Industrial Co Ltd ガラス基板のスクライブ方法
US9701043B2 (en) * 2012-04-24 2017-07-11 Tokyo Seimitsu Co., Ltd. Dicing blade
JP6039363B2 (ja) * 2012-10-26 2016-12-07 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法並びに分断装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11851361B2 (en) 2018-12-06 2023-12-26 Schott Ag Glass element with cut edge and method of producing same

Also Published As

Publication number Publication date
KR20170067805A (ko) 2017-06-16
JPWO2016067728A1 (ja) 2017-07-06
JP6288293B2 (ja) 2018-03-07
TW201615579A (zh) 2016-05-01
CN107108322A (zh) 2017-08-29
KR101866824B1 (ko) 2018-07-17
WO2016067728A1 (ja) 2016-05-06
TWI656102B (zh) 2019-04-11

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Granted publication date: 20200114

Termination date: 20210826