KR101866824B1 - 취성 기판의 분단 방법 - Google Patents
취성 기판의 분단 방법 Download PDFInfo
- Publication number
- KR101866824B1 KR101866824B1 KR1020177011745A KR20177011745A KR101866824B1 KR 101866824 B1 KR101866824 B1 KR 101866824B1 KR 1020177011745 A KR1020177011745 A KR 1020177011745A KR 20177011745 A KR20177011745 A KR 20177011745A KR 101866824 B1 KR101866824 B1 KR 101866824B1
- Authority
- KR
- South Korea
- Prior art keywords
- line
- brittle substrate
- crack
- forming
- trench
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014219929 | 2014-10-29 | ||
JPJP-P-2014-219929 | 2014-10-29 | ||
PCT/JP2015/073989 WO2016067728A1 (ja) | 2014-10-29 | 2015-08-26 | 脆性基板の分断方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170067805A KR20170067805A (ko) | 2017-06-16 |
KR101866824B1 true KR101866824B1 (ko) | 2018-07-17 |
Family
ID=55857074
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020177011745A KR101866824B1 (ko) | 2014-10-29 | 2015-08-26 | 취성 기판의 분단 방법 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6288293B2 (ja) |
KR (1) | KR101866824B1 (ja) |
CN (1) | CN107108322B (ja) |
TW (1) | TWI656102B (ja) |
WO (1) | WO2016067728A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018131179A1 (de) * | 2018-12-06 | 2020-06-10 | Schott Ag | Glaselement mit geschnittener Kante und Verfahren zu dessen Herstellung |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007331983A (ja) * | 2006-06-15 | 2007-12-27 | Sony Corp | ガラスのスクライブ方法 |
JP2008201629A (ja) * | 2007-02-21 | 2008-09-04 | Epson Imaging Devices Corp | 電気光学装置の製造方法、基板の分断方法、及び、基板分断装置 |
JP2012000793A (ja) * | 2010-06-14 | 2012-01-05 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板のスクライブ方法 |
JP2013010644A (ja) * | 2011-06-28 | 2013-01-17 | Mitsuboshi Diamond Industrial Co Ltd | ガラス基板のスクライブ方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002104078A1 (fr) | 2001-06-14 | 2002-12-27 | Mitsuboshi Diamond Industrial Co., Ltd. | Dispositif et procede de fabrication d'un ecran electroluminescent organique |
TWI226877B (en) | 2001-07-12 | 2005-01-21 | Mitsuboshi Diamond Ind Co Ltd | Method of manufacturing adhered brittle material substrates and method of separating adhered brittle material substrates |
WO2004048058A1 (ja) * | 2002-11-22 | 2004-06-10 | Mitsuboshi Diamond Industrial Co.,Ltd. | 基板分断方法およびその方法を用いたパネル製造方法 |
WO2004067243A1 (ja) * | 2003-01-29 | 2004-08-12 | Mitsuboshi Diamond Industrial Co., Ltd. | 基板分断装置および基板分断方法 |
CN101296787B (zh) * | 2005-10-28 | 2012-02-15 | 三星钻石工业股份有限公司 | 脆性材料基板的划线形成方法及划线形成装置 |
JP2007160811A (ja) * | 2005-12-15 | 2007-06-28 | Pioneer Electronic Corp | 平面表示パネルの製造方法およびガラス板の分割方法 |
JP4885675B2 (ja) * | 2006-09-27 | 2012-02-29 | 株式会社Nsc | 貼合せガラス板の切断分離方法 |
WO2009050938A1 (ja) * | 2007-10-16 | 2009-04-23 | Mitsuboshi Diamond Industrial Co., Ltd. | 脆性材料基板のu字状溝加工方法およびこれを用いた除去加工方法およびくり抜き加工方法および面取り方法 |
JP5450964B2 (ja) * | 2008-02-29 | 2014-03-26 | 三星ダイヤモンド工業株式会社 | スクライブ装置及びスクライブ方法 |
KR101247571B1 (ko) * | 2010-06-14 | 2013-03-26 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성 재료 기판의 스크라이브 방법 |
US9701043B2 (en) * | 2012-04-24 | 2017-07-11 | Tokyo Seimitsu Co., Ltd. | Dicing blade |
JP6039363B2 (ja) * | 2012-10-26 | 2016-12-07 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断方法並びに分断装置 |
-
2015
- 2015-08-26 CN CN201580058145.XA patent/CN107108322B/zh not_active Expired - Fee Related
- 2015-08-26 WO PCT/JP2015/073989 patent/WO2016067728A1/ja active Application Filing
- 2015-08-26 JP JP2016556408A patent/JP6288293B2/ja not_active Expired - Fee Related
- 2015-08-26 KR KR1020177011745A patent/KR101866824B1/ko active IP Right Grant
- 2015-08-31 TW TW104128694A patent/TWI656102B/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007331983A (ja) * | 2006-06-15 | 2007-12-27 | Sony Corp | ガラスのスクライブ方法 |
JP2008201629A (ja) * | 2007-02-21 | 2008-09-04 | Epson Imaging Devices Corp | 電気光学装置の製造方法、基板の分断方法、及び、基板分断装置 |
JP2012000793A (ja) * | 2010-06-14 | 2012-01-05 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板のスクライブ方法 |
JP2013010644A (ja) * | 2011-06-28 | 2013-01-17 | Mitsuboshi Diamond Industrial Co Ltd | ガラス基板のスクライブ方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20170067805A (ko) | 2017-06-16 |
JPWO2016067728A1 (ja) | 2017-07-06 |
JP6288293B2 (ja) | 2018-03-07 |
TW201615579A (zh) | 2016-05-01 |
CN107108322A (zh) | 2017-08-29 |
CN107108322B (zh) | 2020-01-14 |
WO2016067728A1 (ja) | 2016-05-06 |
TWI656102B (zh) | 2019-04-11 |
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A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |