KR101866824B1 - 취성 기판의 분단 방법 - Google Patents

취성 기판의 분단 방법 Download PDF

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Publication number
KR101866824B1
KR101866824B1 KR1020177011745A KR20177011745A KR101866824B1 KR 101866824 B1 KR101866824 B1 KR 101866824B1 KR 1020177011745 A KR1020177011745 A KR 1020177011745A KR 20177011745 A KR20177011745 A KR 20177011745A KR 101866824 B1 KR101866824 B1 KR 101866824B1
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KR
South Korea
Prior art keywords
line
brittle substrate
crack
forming
trench
Prior art date
Application number
KR1020177011745A
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English (en)
Korean (ko)
Other versions
KR20170067805A (ko
Inventor
히로시 소야마
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20170067805A publication Critical patent/KR20170067805A/ko
Application granted granted Critical
Publication of KR101866824B1 publication Critical patent/KR101866824B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
KR1020177011745A 2014-10-29 2015-08-26 취성 기판의 분단 방법 KR101866824B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014219929 2014-10-29
JPJP-P-2014-219929 2014-10-29
PCT/JP2015/073989 WO2016067728A1 (ja) 2014-10-29 2015-08-26 脆性基板の分断方法

Publications (2)

Publication Number Publication Date
KR20170067805A KR20170067805A (ko) 2017-06-16
KR101866824B1 true KR101866824B1 (ko) 2018-07-17

Family

ID=55857074

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177011745A KR101866824B1 (ko) 2014-10-29 2015-08-26 취성 기판의 분단 방법

Country Status (5)

Country Link
JP (1) JP6288293B2 (ja)
KR (1) KR101866824B1 (ja)
CN (1) CN107108322B (ja)
TW (1) TWI656102B (ja)
WO (1) WO2016067728A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018131179A1 (de) * 2018-12-06 2020-06-10 Schott Ag Glaselement mit geschnittener Kante und Verfahren zu dessen Herstellung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007331983A (ja) * 2006-06-15 2007-12-27 Sony Corp ガラスのスクライブ方法
JP2008201629A (ja) * 2007-02-21 2008-09-04 Epson Imaging Devices Corp 電気光学装置の製造方法、基板の分断方法、及び、基板分断装置
JP2012000793A (ja) * 2010-06-14 2012-01-05 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のスクライブ方法
JP2013010644A (ja) * 2011-06-28 2013-01-17 Mitsuboshi Diamond Industrial Co Ltd ガラス基板のスクライブ方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002104078A1 (fr) 2001-06-14 2002-12-27 Mitsuboshi Diamond Industrial Co., Ltd. Dispositif et procede de fabrication d'un ecran electroluminescent organique
TWI226877B (en) 2001-07-12 2005-01-21 Mitsuboshi Diamond Ind Co Ltd Method of manufacturing adhered brittle material substrates and method of separating adhered brittle material substrates
WO2004048058A1 (ja) * 2002-11-22 2004-06-10 Mitsuboshi Diamond Industrial Co.,Ltd. 基板分断方法およびその方法を用いたパネル製造方法
WO2004067243A1 (ja) * 2003-01-29 2004-08-12 Mitsuboshi Diamond Industrial Co., Ltd. 基板分断装置および基板分断方法
CN101296787B (zh) * 2005-10-28 2012-02-15 三星钻石工业股份有限公司 脆性材料基板的划线形成方法及划线形成装置
JP2007160811A (ja) * 2005-12-15 2007-06-28 Pioneer Electronic Corp 平面表示パネルの製造方法およびガラス板の分割方法
JP4885675B2 (ja) * 2006-09-27 2012-02-29 株式会社Ｎｓｃ 貼合せガラス板の切断分離方法
WO2009050938A1 (ja) * 2007-10-16 2009-04-23 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板のｕ字状溝加工方法およびこれを用いた除去加工方法およびくり抜き加工方法および面取り方法
JP5450964B2 (ja) * 2008-02-29 2014-03-26 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
KR101247571B1 (ko) * 2010-06-14 2013-03-26 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 스크라이브 방법
US9701043B2 (en) * 2012-04-24 2017-07-11 Tokyo Seimitsu Co., Ltd. Dicing blade
JP6039363B2 (ja) * 2012-10-26 2016-12-07 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法並びに分断装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007331983A (ja) * 2006-06-15 2007-12-27 Sony Corp ガラスのスクライブ方法
JP2008201629A (ja) * 2007-02-21 2008-09-04 Epson Imaging Devices Corp 電気光学装置の製造方法、基板の分断方法、及び、基板分断装置
JP2012000793A (ja) * 2010-06-14 2012-01-05 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のスクライブ方法
JP2013010644A (ja) * 2011-06-28 2013-01-17 Mitsuboshi Diamond Industrial Co Ltd ガラス基板のスクライブ方法

Also Published As

Publication number Publication date
KR20170067805A (ko) 2017-06-16
JPWO2016067728A1 (ja) 2017-07-06
JP6288293B2 (ja) 2018-03-07
TW201615579A (zh) 2016-05-01
CN107108322A (zh) 2017-08-29
CN107108322B (zh) 2020-01-14
WO2016067728A1 (ja) 2016-05-06
TWI656102B (zh) 2019-04-11

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